Optical module

Abstract

The application discloses an optical module, comprising: a shell and a circuit board. The shell comprises a first shell and a second shell, and the first shell and the second shell surround a receiving cavity; the circuit board is arranged in the receiving cavity; wherein the first shell comprises a first side wall and a first bottom wall connected with each other, and a glue containing part is arranged on the first side wall; the circuit board has a first surface, a second surface and a side surface; an adhesive is arranged in the glue containing part, and the adhesive is located between the glue containing part and the side surface of the circuit board, so as to fixedly connect the first side wall and the circuit board. The optical module of the application fixes the circuit board by arranging the glue containing part on the first side wall and using the adhesive, increases the support point of the circuit board, makes the optical module better resist mechanical vibration and impact, and improves the service life and signal transmission quality of the optical module. Meanwhile, the adhesive is bonded with the side surface of the circuit board, and the adhesive does not occupy the area of the circuit board for layout of electronic devices.

Description

Technical Field

[0001] This application relates to the field of optical communication technology, specifically to an optical module. Background Technology

[0002] Optical modules are widely used in various communication devices. As optical communication technology develops towards higher speeds and higher densities, the integration level of optical modules has significantly increased. To meet performance requirements, the area of ​​their internal circuit boards (PCBs) is constantly expanding, and the layout density of electronic components (such as DSP chips, laser drivers, TIAs, etc.) is continuously increasing. This results in a significant amount of space being occupied by electronic components within the housing. In this situation, the problem of insufficient support points gradually becomes prominent. Due to the increased circuit board area and the inability to correspondingly increase the number of support points, the stability of the circuit board within the housing is severely affected. During actual operation, optical modules face various complex working environments, among which mechanical vibration and impact are common interference factors. When an optical module is subjected to mechanical vibration or impact, due to insufficient support points, the circuit board cannot receive effective support and buffering, easily leading to displacement, deformation, or even breakage. This, in turn, results in unstable circuit connections, damage to electronic components, and seriously affects the signal transmission quality and lifespan of the optical module. Utility Model Content

[0003] This application provides an optical module that solves the problem of insufficient circuit board support points in existing optical modules, improves the optical module's ability to resist mechanical vibration and impact, and ensures stable and reliable operation of the optical module.

[0004] This application provides an optical module, including:

[0005] The housing includes a first housing and a second housing, the first housing and the second housing surrounding a receiving cavity;

[0006] A circuit board, wherein the circuit board is disposed in the receiving cavity;

[0007] The first housing includes a first side wall and a first bottom wall that are connected to each other, and the first side wall is provided with an adhesive-containing portion;

[0008] The circuit board has a first side and a second side opposite to each other, and a side side connecting the first side and the second side. The first side is disposed facing the first bottom wall, and the side side is disposed facing the first side wall.

[0009] The adhesive is provided in the adhesive-containing part and is located between the adhesive-containing part and the side of the circuit board to fix the first sidewall to the circuit board.

[0010] In some embodiments, the adhesive portion has a groove bottom, a first groove wall, a second groove wall, a third groove wall, and an opening facing the circuit board. The second groove wall is located on the side of the groove bottom away from the circuit board, and the first groove wall and the third groove wall are respectively located on both sides of the groove bottom in the length direction of the optical module. The adhesive fixes the circuit board and the first sidewall together by bonding the circuit board and at least one of the groove bottom, the first groove wall, the second groove wall, and the third groove wall.

[0011] In some embodiments, in the thickness direction of the optical module, a first side of the circuit board is located below the bottom of the groove of the adhesive portion, and a second side of the circuit board is located above the bottom of the groove of the adhesive portion.

[0012] In some embodiments, in the thickness direction of the optical module, the first groove wall, the second groove wall, and the third groove wall extend to the top surface of the first sidewall facing the second housing.

[0013] In some embodiments, in the thickness direction of the optical module, the adhesive is flush with the top surface of the first sidewall facing the second housing, or the adhesive is located below the top surface of the first sidewall facing the second housing.

[0014] In some embodiments, in the width direction of the optical module, the width of the adhesive portion is W, satisfying: 0.2mm≤W≤0.4mm;

[0015] In the longitudinal direction of the optical module, the length of the adhesive portion is L, which satisfies: 4mm≤L≤6mm;

[0016] In the thickness direction of the optical module, the height of the first sidewall is H1, which satisfies: 3.25mm≤H1≤5.25mm;

[0017] In the thickness direction of the optical module, the depth of the adhesive portion is D, which satisfies: 0.5mm≤D≤1.2mm, and the depth of the adhesive portion is the extension distance of the adhesive portion in the thickness direction of the optical module;

[0018] In the width direction of the optical module, the single-sided gap between the first sidewall and the side is G, which satisfies: 0.05mm≤G≤0.12mm.

[0019] In some embodiments, a support is provided within the receiving cavity, the support being positioned between the housing and the circuit board to limit the position of the circuit board within the receiving cavity.

[0020] In some embodiments, there are multiple supports, which are spaced apart circumferentially along the housing, and the adhesive portion is disposed between two adjacent supports.

[0021] In some embodiments, the support body includes a first support body, a second support body, and a third support body disposed therebetween. The first support body is disposed on the first bottom wall of the first housing, the second support body is disposed on the side of the second housing facing the circuit board, and the third support body is disposed on the second side of the circuit board. The second support body is pressed onto the third support body.

[0022] In the thickness direction of the optical module, the first support is located below the adhesive portion, and the distance between the bottom of the adhesive portion and the upper surface of the first support is H2, which satisfies: 0.1mm≤H2≤0.8mm.

[0023] In some embodiments, at least one of the second support and the third support is an elastic body; and / or,

[0024] The adhesive is glue.

[0025] Beneficial Effects: Compared with the prior art, the optical module provided in this application increases the connection points between the circuit board and the housing by providing an adhesive portion on the first sidewall of the first housing and using adhesive to fix the circuit board, thus increasing the support points of the circuit board. This method of increasing connection points effectively solves the problem of insufficient support points for the circuit board in existing optical modules, enabling the optical module to better resist mechanical vibration and impact, avoiding displacement, deformation, or even breakage of the circuit board, ensuring stable and reliable operation of the optical module in complex working environments, and improving the service life and signal transmission quality of the optical module. Simultaneously, the adhesive adheres to the side of the circuit board, and the adhesive does not occupy the area on the circuit board used for laying out electronic components, thus not affecting the layout of electronic components on the circuit board. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a three-dimensional structural schematic diagram of one embodiment of the optical module of this application;

[0028] Figure 2 yes Figure 1 The diagram shows the exploded structure of the optical module.

[0029] Figure 3 yes Figure 2 A magnified schematic diagram of the local structure at point A;

[0030] Figure 4 This is a three-dimensional structural schematic diagram of another embodiment of the optical module of this application;

[0031] Figure 5 yes Figure 4 The diagram shows the exploded structure of the optical module.

[0032] Figure 6 This is a schematic diagram of the planar structure of an embodiment of the optical module of this application;

[0033] Figure 7 It is along Figure 6 Schematic diagram of the cross section of line AA in the middle;

[0034] Figure 8 yes Figure 7 A magnified schematic diagram of the structure at point B in the middle.

[0035] Explanation of reference numerals in the attached figures:

[0036] 100. Optical module; 1. Housing; 11. First housing; 111. First sidewall; 1111. Adhesive portion; 1112. Opening; 1113. Slot bottom; 1114. First slot wall; 1115. Second slot wall; 1116. Third slot wall; 1117. Top surface; 112. First bottom wall; 113. First mounting hole; 114. Positioning post; 12. Second housing; 121. Second sidewall; 122. Second bottom wall; 123. Second mounting hole; 13. Receiving cavity; 14. Support body; 141. First support body; 142. Second support body; 143. Third support body; 2. Circuit board; 21. First surface; 22. Second surface; 23. Side surface; 24. Positioning port; X, width direction; Y, length direction; Z, thickness direction. Detailed Implementation

[0037] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, unless otherwise stated, directional terms such as "up," "down," "left," and "right" generally refer to up, down, left, and right in the actual use or working state of the device, specifically the drawing directions in the accompanying drawings.

[0038] In this application, unless otherwise expressly specified and limited, the terms "connected," "linked," "stacked," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two elements or the interaction between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0039] This application provides an optical module, which will be described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments of this application. Furthermore, the descriptions of each embodiment have their own emphasis; parts not described in detail in a certain embodiment can be referred to in the relevant descriptions of other embodiments.

[0040] Reference Figure 1 and Figure 2 One embodiment of this application provides an optical module 100. The optical module 100 includes a housing 1, a circuit board 2, and electronic components (not shown). The electronic components may be, for example, a DSP chip (digital signal processing chip), a laser driver, a TIA (transimpedance amplifier), etc. The circuit board 2 and the electronic components are mounted inside the housing 1, and the electronic components are electrically connected to the circuit board 2. Please refer to [the relevant documentation / reference] as well. Figure 3 The housing 1 has an adhesive-containing section 1111 inside. The adhesive-containing section 1111 is used to hold adhesive (not shown), which is used to fix the housing 1 to the circuit board 2.

[0041] Please refer to the details as well. Figure 4 and Figure 5 The housing 1 includes a first housing 11 and a second housing 12. The first housing 11 and the second housing 12 can be made of metal, or other materials. The first housing 11 and the second housing 12 enclose a receiving cavity 13. The circuit board 2 and electronic components are mounted within the receiving cavity 13. The first housing 11 may include a first sidewall 111 and a first bottom wall 112 connected to each other. The circuit board 2 has a first surface 21 and a second surface 22 disposed opposite to each other, and a side surface 23 connecting the first surface 21 and the second surface 22 (e.g., ...). Figure 8 (As shown). Side 23 is disposed facing the first sidewall 111, first surface 21 is disposed facing the first sidewall 111 of the first housing 11, and second surface 22 is disposed facing the second housing 12. Electronic components may be disposed on the first surface 21 and / or the second surface 22 of the circuit board 2.

[0042] When the first housing 11 is the upper housing of the optical module 100, the second housing 12 can be used as the lower housing of the optical module 100. When the first housing 11 is the lower housing of the optical module 100, the second housing 12 can be used as the upper housing of the optical module 100. Figure 1 and Figure 2 This illustrates a configuration where the first housing 11 of the optical module 100 is at the bottom, and the second housing 12 is at the top. Figure 4 and Figure 5 The illustration shows the optical module 100 with its first housing 11 on top and its second housing 12 on the bottom. In this application, the illustration will be based on the example of the first housing 11 being the upper housing of the optical module 100 and the second housing 12 being the lower housing of the optical module 100.

[0043] Reference Figure 2 and Figure 3 The first sidewall 111 has an adhesive-containing portion 1111. The adhesive-containing portion 1111 contains adhesive used to fix the first sidewall 111 to the circuit board 2. As an example, when assembling the optical module 100, the circuit board 2 is first installed in the first housing 11, and then adhesive is filled into the adhesive-containing portion 1111. The adhesive is, for example, glue. After the glue cures, the first sidewall 111 is fixedly connected to the circuit board 2. The glue can be UV glue or hot melt glue, etc. In this embodiment, the glue is UV glue. UV glue can be cured by UV light. UV glue has a short curing time, which helps to speed up the production pace and thus increase production capacity.

[0044] Reference Figure 2 and Figure 3 The adhesive portion 1111 has a groove bottom 1113, a first groove wall 1114, a second groove wall 1115, a third groove wall 1116, and an opening 1112 facing the circuit board 2. The second groove wall 1115 is located on the side of the groove bottom 1113 away from the circuit board 2. The first groove wall 1114 and the third groove wall 1116 are respectively located on both sides of the groove bottom 1113 in the longitudinal direction Y of the optical module 100. The adhesive fixes the circuit board 2 and the first sidewall 111 together by bonding the circuit board 2 to at least one of the groove bottom 1113, the first groove wall 1114, the second groove wall 1115, and the third groove wall 1116.

[0045] The adhesive-containing portion 1111 can be connected to the top surface 1117 of the first sidewall 111 facing the second housing 12. In this case, the adhesive-containing portion 1111 is formed by the groove bottom 1113, the first groove wall 1114, the second groove wall 1115, and the third groove wall 1116. When dispensing adhesive using a needle, the needle can dispense adhesive from the top surface 1117 of the first sidewall 111, thus facilitating operation. In some embodiments, the adhesive-containing portion 1111 is located below the top surface 1117 of the first sidewall 111, and the adhesive-containing portion 1111 is not connected to the top surface 1117 of the first sidewall 111 facing the second housing 12. That is, the adhesive-containing portion 1111 also has a groove top (not shown). In the thickness direction Z of the optical module 100, the groove top is located above the groove bottom 1113. At this time, the adhesive container 1111 is formed by the bottom of the tank 1113, the top of the tank, the first tank wall 1114, the second tank wall 1115 and the third tank wall 1116.

[0046] In this application, the adhesive increases the connection points between the circuit board 2 and the housing 1, thus increasing the support points for the circuit board 2 and effectively solving the problem of insufficient support points for the circuit board 2 in existing optical modules 100. The optical module 100 can better resist mechanical vibration and impact, preventing displacement, deformation, or even breakage of the circuit board 2, ensuring stable and reliable operation of the optical module 100 in complex working environments, and improving the service life and signal transmission quality of the optical module 100. Simultaneously, the adhesive adheres to the side 23 of the circuit board 2, without occupying the area on the circuit board 2 used for laying out electronic components, and does not affect the layout of electronic components on the circuit board 2. More space is available above and below the circuit board 2 for arranging electronic components and wiring, maximizing the use of the limited space within the housing 1, and contributing to the miniaturization and integration design of the optical module 100.

[0047] The first housing 11 and the second housing 12 are detachably connected, for example, by means of snap-fit ​​or screw locking. (Refer to...) Figure 2 and Figure 5 The first housing 11 has a first mounting hole 113, and the second housing 12 has a corresponding second mounting hole 123. Screws (not shown) can be used to mount the first housing 11 to the first mounting hole 113 and the second housing 123 to securely connect them. The first mounting hole 113 can be a non-through hole, i.e., a blind hole. The first mounting hole 113 is located on the inner surface of the first housing 11, ensuring the aesthetic appearance of the outer surface of the first housing 11. The second mounting hole 123 can be a through hole, i.e., a through-hole. One end of the screw can pass through the second mounting hole 123 and be fixed to the first mounting hole 113.

[0048] Reference Figure 2The first housing 11 and / or the second housing 12 are provided with positioning posts 114, and the circuit board 2 is correspondingly provided with positioning openings 24. The positioning posts 114 and positioning openings 24 cooperate with each other to restrict the movement of the circuit board 2. For example, the movement of the circuit board 2 in the horizontal direction can be restricted, that is, the movement of the circuit board 2 in the width direction X and the length direction Y of the optical module 100 can be restricted. As an example, the positioning posts 114 are provided on the first housing 11. When the circuit board 2 is installed on the first housing 11, the positioning posts 114 and positioning openings 24 can not only restrict the movement of the circuit board 2 in the horizontal direction, but also have a guiding function to ensure the accuracy of the installation position of the circuit board 2. The positioning posts 114 can be coaxially arranged with the first mounting hole 113. While ensuring performance, the area occupied by the positioning posts 114 and the first mounting hole 113 can be reduced to improve the space utilization efficiency of the housing 1.

[0049] In one specific implementation, please refer to the following: Figures 6 to 8 The side 23 is projected onto the first side wall 111 and overlaps with the adhesive portion 1111. This ensures that at least a portion of the side 23 of the circuit board 2 can contact the adhesive, thereby ensuring the bonding effect of the adhesive.

[0050] In the thickness direction Z of the optical module 100, the first surface 21 of the circuit board 2 can be flush with the bottom 1113 of the groove of the adhesive portion 1111; or, the first surface 21 of the circuit board 2 can be located above the bottom 1113 of the groove of the adhesive portion 1111; or, the first surface 21 of the circuit board 2 can be located below the bottom 1113 of the groove of the adhesive portion 1111, and the second surface 22 of the circuit board 2 can be located above the bottom 1113 of the groove of the adhesive portion 1111 (e.g., ...). Figure 8 (As shown). In these three cases, the side surface 23, projected onto the first side wall 111, is at least partially aligned with the adhesive portion 1111 in the thickness direction Z.

[0051] In the thickness direction Z of the optical module 100, the height of the side surface 23 of the circuit board 2 is less than or equal to the depth of the adhesive portion 1111, that is, the thickness of the circuit board 2 is less than or equal to the depth of the adhesive portion 1111. Furthermore, the position of the side surface 23 of the circuit board 2 corresponding to the adhesive portion 1111 is projected onto the first sidewall 111 and coincides with or is located within the adhesive portion 1111, thereby increasing the contact area between the side surface 23 of the circuit board 2 and the adhesive, thus improving the bonding effect of the adhesive. In some embodiments, a portion of the adhesive may also be located on the first surface 21 and / or the second surface 22 of the circuit board 2, as long as it does not affect the electronic components on the circuit board 2. This not only increases the contact area between the adhesive and the circuit board 2 but also reduces the manufacturing process difficulty and facilitates production.

[0052] In the thickness direction Z of the optical module 100, the adhesive is flush with the top surface 1117 of the first sidewall 111 facing the second housing 12, or the adhesive is located below the top surface 1117 of the first sidewall 111 facing the second housing 12. This prevents the adhesive from sticking to the second housing 12, ensuring that the first housing 11 and the second housing 12 can be assembled and disassembled normally. In this embodiment, when the adhesive portion 1111 connects to the top surface 1117 of the first sidewall 111 facing the second housing 12, the second surface 22 of the circuit board 2 is located below the top surface 1117 of the first sidewall 111, that is, the second surface 22 of the circuit board 2 is a certain distance from the top surface 1117 of the first sidewall 111, leaving sufficient space for the adhesive to fill, which can prevent the adhesive from sticking to the top surface 1117 of the first sidewall 111 and affecting the assembly and disassembly between the first housing 11 and the second housing 12.

[0053] As an example, refer to Figure 2 and Figure 3In the width direction X of the optical module 100, the width of the adhesive portion 1111 is W, which satisfies: 0.2mm≤W≤0.4mm. For example, the width W of the adhesive portion 1111 can be any value among 0.20mm, 0.21mm, 0.22mm, 0.23mm, 0.24mm, 0.25mm, 0.26mm, 0.27mm, 0.28mm, 0.29mm, 0.30mm, 0.31mm, 0.32mm, 0.33mm, 0.34mm, 0.35mm, 0.36mm, 0.37mm, 0.38mm, 0.39mm, 0.40mm, etc. In the longitudinal direction Y of the optical module 100, the length of the adhesive portion 1111 is L, which satisfies: 4mm≤L≤6mm. For example, the length L of the adhesive portion 1111 can be any value among 4.0mm, 4.1mm, 4.2mm, 4.3mm, 4.4mm, 4.5mm, 4.6mm, 4.7mm, 4.8mm, 4.9mm, 5.0mm, 5.1mm, 5.2mm, 5.3mm, 5.4mm, 5.5mm, 5.6mm, 5.7mm, 5.8mm, 5.9mm, 6.0mm, etc. In the thickness direction Z of the optical module 100, the height of the first sidewall 111 is H1, which satisfies: 3.25mm≤H1≤5.25mm. For example, the height H1 of the first sidewall 111 can be any value among 3.25mm, 3.45mm, 3.65mm, 3.85mm, 4.05mm, 4.25mm, 4.45mm, 4.65mm, 4.85mm, 5.05mm, 5.25mm, etc. In the thickness direction Z of the optical module 100, the depth of the adhesive portion 1111 is D, satisfying: 0.5mm ≤ D ≤ 1.2mm. The depth of the adhesive portion 1111 is the extension distance of the adhesive portion 1111 in the thickness direction Z of the optical module 100. For example, the depth D of the adhesive portion 1111 can be any value among 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1.0mm, 1.1mm, 1.2mm, etc. (Refer to...) Figure 8 In the width direction X of the optical module 100, the single-sided gap G between the first sidewall 111 and the side surface 23 satisfies: 0.05mm ≤ G ≤ 0.12mm. For example, the single-sided gap G between the first sidewall 111 and the side surface 23 can be any value among 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.1mm, 0.11mm, 0.12mm, etc. In some embodiments, the length L, width W, and depth D of the adhesive portion 1111 can be set according to the dimensions of the first housing 11, the second housing 12, and the circuit board 2.

[0054] Reference Figure 2 and Figure 5A support body 14 can be disposed within the receiving cavity 13. The support body 14 extends along the thickness direction Z of the optical module 100 and is positioned between the housing 1 and the circuit board 2. Specifically, the support body 14 provides support points for the circuit board 2, thus limiting its position within the receiving cavity 13. When the first housing 11 and the second housing 12 are connected, the support body 14 can apply a pressing force to the circuit board 2, restricting its movement. For example, it can restrict the movement of the circuit board 2 along the thickness direction Z of the optical module 100. The support body 14 provides more stable support for the circuit board 2, reducing stress concentration and further improving the performance and lifespan of the optical module 100.

[0055] Reference Figure 2 and Figure 5 There are multiple support bodies 14. These support bodies 14 are spaced apart circumferentially along the housing 1. The positions of the support bodies 14 correspond to the corner positions of the circuit board 2. Adhesive portions 1111 are disposed between adjacent support bodies 14. When the distance between two adjacent support bodies 14 is large, the support bodies 14 can be positioned closer to the middle of the two adjacent support bodies 14, or the adhesive portions 1111 can be positioned closer to some important electronic components to ensure the stable and reliable operation of the optical module 100. In some embodiments, multiple adhesive portions 1111 can also be disposed between two adjacent support bodies 14, which can be set according to actual needs.

[0056] Specifically, refer to Figure 2 and Figure 5 The support body 14 includes a first support body 141, a second support body 142, and a third support body 143, which are correspondingly arranged. The first support body 141 is disposed on the first bottom wall 112 of the first housing 11. The second housing 12 may include a second side wall 121 and a second bottom wall 122 facing the receiving cavity 13. The second support body 142 is disposed on the second bottom wall 122 of the second housing 12. The third support body 143 is disposed on the second surface 22 of the circuit board 2, and the second support body 142 is pressed onto the third support body 143. When the first housing 11 and the second housing 12 are connected to each other, the first support body 141, the second support body 142, and the third support body 143 are coaxially arranged, thereby ensuring the stability of the support provided by the first support body 141, the second support body 142, and the third support body 143.

[0057] Reference Figure 2 and Figure 5In the thickness direction Z of the optical module 100, the first support 141 is located below the adhesive-containing portion 1111. The distance H2 between the bottom 1113 of the adhesive-containing portion 1111 and the upper surface of the first support 141 satisfies: 0.1mm ≤ H2 ≤ 0.8mm. For example, the distance H2 between the bottom 1113 of the adhesive-containing portion 1111 and the upper surface of the first support 141 can be any value among 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, and 0.8mm. As an example, when the depth of the adhesive-containing portion 1111 is 0.5mm, the distance between the bottom 1113 of the adhesive-containing portion 1111 and the upper surface of the first support 141 is 0.8mm. When the depth of the adhesive-containing part 1111 is 1.2mm, the distance between the bottom 1113 of the adhesive-containing part 1111 and the upper surface of the first support 141 is 0.1mm.

[0058] At least one of the second support 142 and the third support 143 is an elastic body. The elastic body can be made of elastic materials (such as silicone or polyurethane) or elastic structures (such as spring sheets). The elastic body can absorb assembly tolerances through compression deformation, and the compression of the elastic body generates a continuous pressing force, which can limit the movement of the circuit board 2 and ensure the stability of the position of the circuit board 2.

[0059] As an example, refer to Figure 2 and Figure 5 The first support 141 has a rigid structure and can be integrally formed with the first housing 11. The second support 142 has a rigid structure and can be integrally formed with the second housing 12. The third support 143 is an elastic body and can be attached to the second surface 22 of the circuit board 2 by means of bonding or other methods. When the first housing 11 and the second housing 12 are connected, the second support 142 can be pressed onto the third support 143. The compression deformation of the third support 143 can not only absorb assembly tolerances, but also generate a continuous pressing force, which can restrict the movement of the circuit board 2 and ensure the stability of the circuit board 2 position.

[0060] The above provides a detailed description of an optical module provided by this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. An optical module characterized by comprising: include: The housing includes a first housing and a second housing, the first housing and the second housing surrounding a receiving cavity; A circuit board, wherein the circuit board is disposed in the receiving cavity; The first housing includes a first side wall and a first bottom wall that are connected to each other, and the first side wall is provided with an adhesive-containing portion; The circuit board has a first side and a second side opposite to each other, and a side side connecting the first side and the second side. The first side is disposed facing the first bottom wall, and the side side is disposed facing the first side wall. The adhesive is provided in the adhesive-containing part and is located between the adhesive-containing part and the side of the circuit board to fix the first sidewall to the circuit board.

2. The optical module according to claim 1, characterized by The adhesive portion has a bottom, a first wall, a second wall, a third wall, and an opening facing the circuit board. The second wall is located on the side of the bottom away from the circuit board, and the first wall and the third wall are located on opposite sides of the bottom in the length direction of the optical module. The adhesive fixes the circuit board and the first sidewall together by bonding the circuit board to at least one of the bottom, the first wall, the second wall, and the third wall.

3. The optical module according to claim 2, characterized in that, In the thickness direction of the optical module, the first side of the circuit board is located below the bottom of the groove of the adhesive portion, and the second side of the circuit board is located above the bottom of the groove of the adhesive portion.

4. The optical module according to claim 2, characterized by In the thickness direction of the optical module, the first groove wall, the second groove wall and the third groove wall extend to the top surface of the first sidewall facing the second housing.

5. The optical module according to claim 1, characterized by In the thickness direction of the optical module, the adhesive is flush with the top surface of the first sidewall facing the second housing, or the adhesive is located below the top surface of the first sidewall facing the second housing.

6. The optical module according to claim 1, characterized in that, In the width direction of the optical module, the width of the adhesive portion is W, which satisfies: 0.2mm≤W≤0.4mm; In the longitudinal direction of the optical module, the length of the adhesive portion is L, which satisfies: 4mm≤L≤6mm; In the thickness direction of the optical module, the height of the first sidewall is H1, which satisfies: 3.25mm≤H1≤5.25mm; In the thickness direction of the optical module, the depth of the adhesive portion is D, which satisfies: 0.5mm≤D≤1.2mm, and the depth of the adhesive portion is the extension distance of the adhesive portion in the thickness direction of the optical module; In the width direction of the optical module, the single-sided gap between the first sidewall and the side is G, which satisfies: 0.05mm≤G≤0.12mm.

7. The optical module of claim 1, wherein, A support is provided inside the receiving cavity, which is supported between the housing and the circuit board to restrict the position of the circuit board inside the receiving cavity.

8. The optical module according to claim 7, characterized by The number of supports is multiple, and the multiple supports are arranged at intervals along the circumference of the shell, with the adhesive portion disposed between two adjacent supports.

9. The optical module of claim 7, wherein, The support body includes a first support body, a second support body, and a third support body that are disposed correspondingly. The first support body is disposed on the first bottom wall of the first housing, the second support body is disposed on the side of the second housing facing the circuit board, and the third support body is disposed on the second side of the circuit board. The second support body is pressed onto the third support body. In the thickness direction of the optical module, the first support is located below the adhesive portion, and the distance between the bottom of the adhesive portion and the upper surface of the first support is H2, which satisfies: 0.1mm≤H2≤0.8mm.

10. The optical module according to claim 9, characterized by At least one of the second support and the third support is an elastic body; and / or, The adhesive is glue.

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