Anti-static structure and notebook computer

Abstract

This utility model relates to the field of laptop computer technology, and more particularly to an antistatic structure and a laptop computer. The antistatic structure includes a signal line; insulating ink coated on the signal line; a conductive part disposed on top of the insulating ink; and a flexible circuit board, at least partially covering the insulating ink, with the conductive part conductively connected to a grounding component of the flexible circuit board. This antistatic structure and laptop computer can solve the problem of insufficient antistatic capability in existing laptop computers.

Description

Technical Field

[0001] This application relates to the field of notebook computer technology, and in particular to an antistatic structure and a notebook computer. Background Technology

[0002] As the laptop industry continues to demand higher standards for product performance stability, product reliability standards are also rising. Consequently, reliability testing conditions for laptops are becoming increasingly stringent, with anti-static capability testing being a key component. Static electricity occurs frequently in daily life and can severely damage electronic devices. With the increasingly complex and extreme environments in which electronic products are used, laptops are facing even greater demands for anti-static capabilities.

[0003] Currently, the commonly used anti-static design solution in the industry involves routing ground wires around the signal lines and coating the surface of the signal lines with insulating ink to reduce damage from static electricity. While this setup can protect the signal lines to some extent, in environments with higher static energy and harsher conditions, ground wires and insulating ink alone are insufficient to effectively protect the signal lines. This can lead to electrostatic discharge damage, resulting in reduced touch performance in laptops and even false alarms. Utility Model Content

[0004] In view of this, the purpose of this application is to provide an antistatic structure and a laptop computer to solve the problem of insufficient antistatic capability of existing laptop computers.

[0005] According to a first aspect of the present invention, an antistatic structure is provided, wherein the antistatic structure comprises: a signal line; an insulating ink coated on the signal line; a conductive portion disposed on top of the insulating ink; and a flexible circuit board at least partially covering the insulating ink, wherein the conductive portion is conductively connected to a grounding component of the flexible circuit board.

[0006] Preferably, the bottom of the flexible circuit board has a window at the position corresponding to the conductive part, and the grounding component is exposed in the window.

[0007] Preferably, the grounding component is a grounding copper foil, which is disposed inside the flexible circuit board, and the conductive part is electrically connected to the grounding copper foil through the opening.

[0008] Preferably, the conductive part is bonded to the grounded copper foil using conductive double-sided adhesive.

[0009] Preferably, the flexible circuit board is provided with an electromagnetic shielding film on its exterior, and the electromagnetic shielding film avoids the opening.

[0010] Preferably, the conductive portion is disposed along the extension path of the insulating ink, and the conductive portion is located on the periphery of the signal line in the horizontal direction.

[0011] Preferably, the conductive part is a conductive metal layer.

[0012] Preferably, the conductive part is screen-printed silver paste.

[0013] According to a second aspect of the present invention, a laptop computer is provided, wherein the laptop computer includes the antistatic structure described above.

[0014] Preferably, the laptop computer includes a touch screen area and a grounding line, the conductive part is disposed around the outer periphery of the touch screen area, and the grounding component of the flexible circuit board is conductively connected to the grounding line.

[0015] The antistatic structure and laptop computer of this invention feature an insulating ink coating on the signal lines. A conductive portion is disposed on top of the insulating ink, with a flexible circuit board portion covering the insulating ink. The conductive portion is conductively connected to the grounding component of the flexible circuit board, allowing the conductive portion to directly guide static electricity to the grounding component of the flexible circuit board after static electricity is generated. This protects the signal lines from electrostatic discharge and significantly improves the antistatic performance of the laptop computer. This effectively solves the problem of insufficient antistatic capability in existing laptop computers.

[0016] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the conductive part of the antistatic structure according to the present invention.

[0019] Figure 2 This is a schematic diagram of the antistatic structure according to the present invention.

[0020] Reference numerals: 1-Signal line; 2-Insulating ink; 3-Conductive part; 4-Flexible circuit board; 40-Opening; 41-Grounding component; 5-Touch screen area. Detailed Implementation

[0021] The following detailed embodiments are provided to help the reader gain a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will be apparent after understanding the disclosure of this application. For example, the order of operations described herein is merely illustrative and is not limited to the order set forth herein; changes that will be apparent after understanding the disclosure of this application are possible, except for operations that must occur in a specific order. Furthermore, for clarity and brevity, descriptions of features known in the art may be omitted.

[0022] The features described herein may be implemented in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein have been provided merely to illustrate some of the many feasible ways of implementing the methods, apparatus, and / or systems described herein that will be apparent upon understanding the disclosure of this application.

[0023] Throughout the specification, when an element (such as a layer, region, or substrate) is described as being "on" another element, "connected to" another element, "bonded to" another element, "on" another element, or "covering" another element, it may be directly "on" another element, "connected to" another element, "bonded to" another element, "on" another element, or "covering" another element, or there may be one or more other elements in between. In contrast, when an element is described as being "directly on" another element, "directly connected to" another element, "directly bonded to" another element, "directly on" another element, or "directly covering" another element, there may be no other elements in between.

[0024] As used herein, the term “and / or” includes any one of the relevant items listed and any combination of any two or more items.

[0025] Although terms such as “first,” “second,” and “third” may be used herein to describe individual components, assemblies, regions, layers, or parts, these components, assemblies, regions, layers, or parts are not limited by these terms. Rather, these terms are used only to distinguish one component, assembly, region, layer, or part from another. Therefore, without departing from the teachings of the examples described herein, the first component, assembly, region, layer, or part referred to as the second component, assembly, region, layer, or part may also be referred to as the second component, assembly, region, layer, or part.

[0026] For ease of description, spatial relation terms such as “above,” “upper,” “below,” and “lower” are used herein to describe the relationship between one element and another, as shown in the accompanying drawings. Such spatial relation terms are intended to include not only the orientation depicted in the drawings but also different orientations of the device during use or operation. For example, if the device in the drawings is flipped, an element described as being “above” or “upper” relative to another element will subsequently be “below” or “lower” relative to that other element. Therefore, the term “above” includes both “above” and “below” orientations depending on the spatial orientation of the device. The device may also be positioned in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relation terms used herein will be interpreted accordingly.

[0027] The terminology used herein is for the purpose of describing various examples only and is not intended to limit the examples. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. The terms “comprising,” “including,” and “having” enumerate the stated features, quantities, operations, components, elements, and / or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.

[0028] Variations in the shapes shown in the accompanying drawings may occur due to manufacturing techniques and / or tolerances. Therefore, the examples described herein are not limited to the specific shapes shown in the accompanying drawings, but include changes in shape that may occur during manufacturing.

[0029] The features of the examples described herein can be combined in various ways that will be apparent upon understanding the disclosure of this application. Furthermore, although the examples described herein have a wide variety of constructions, other constructions are possible, as will be apparent upon understanding the disclosure of this application.

[0030] like Figure 1 and Figure 2 As shown, according to a first aspect of the present invention, an antistatic structure is provided, which includes a signal line 1, an insulating ink 2, a conductive part 3, and a flexible circuit board 4.

[0031] In the following description, reference will be made to Figure 1 and Figure 2 The specific structure of the aforementioned components of the antistatic structure and the connection relationship of the aforementioned components are described in detail.

[0032] like Figure 1 and Figure 2As shown, in this embodiment, the laptop computer has a large number of signal lines 1 in the touchscreen area 5 to enable the touch function of the laptop's touchscreen. To prevent the signal lines 1 from being damaged by electrostatic discharge (ESD) and thus reducing the laptop's touch performance, the laptop computer has an anti-static structure. Insulating ink 2 can be coated on the signal lines 1 to provide insulation and protection, preventing the signal lines 1 from being directly affected by ESD. A conductive part 3 can be disposed on top of the insulating ink 2, i.e., the conductive part 3 can be stacked on top of the insulating ink 2. A flexible circuit board 4 is also provided in the laptop computer, at least partially covering the insulating ink 2, such that at least a portion of the flexible circuit board 4 overlaps with the conductive part 3. The conductive part 3 can be conductively connected to the grounding component 41 of the flexible circuit board 4. This configuration allows the conductive part 3 to directly guide the ESD to the grounding component 41 of the flexible circuit board 4 after static electricity is generated in the touchscreen area 5 of the laptop computer, thereby protecting the signal lines 1 and preventing excessively high ESD energy from breaking down the insulating ink 2 and causing ESD damage to the signal lines 1. This greatly improves the anti-static effect of the laptop computer.

[0033] Preferred, such as Figure 1 and Figure 2 As shown, in this embodiment, the flexible circuit board 4 can be a plate-like structure, and the flexible circuit board 4 is disposed inside the laptop. The flexible circuit board 4 may be provided with a grounding component 41 to realize the grounding function of the flexible circuit board 4. Further, preferably, the grounding component 41 can be disposed inside the flexible circuit board 4 to avoid accidental contact between the grounding component 41 and other components in the laptop, which would cause other components in the laptop to be grounded.

[0034] Preferred, such as Figure 1 and Figure 2 As shown, in this embodiment, the flexible circuit board 4 may include a first surface and a second surface disposed opposite to each other. The first surface may be the upper surface of the flexible circuit board 4 (i.e., as shown in the image). Figure 1 The first surface of the flexible circuit board 4 shown (facing the reader) can be positioned away from the insulating ink 2. The second surface can be the lower surface of the flexible circuit board 4 (i.e., as shown in the diagram). Figure 1 The flexible circuit board 4 shown (with the back of the board facing the reader) has a second board surface that can be positioned close to the insulating ink 2. The second board surface can be a horizontal board surface to facilitate contact and mating with the conductive part 3, while the first board surface can be positioned parallel to the second board surface, making the structure of the flexible circuit board 4 more stable and its appearance more aesthetically pleasing.

[0035] Further optimized, such as Figure 1 and Figure 2As shown, in this embodiment, a window 40 may be provided on the second board surface. Specifically, the window 40 of the flexible circuit board 4 may be provided corresponding to the position of the conductive part 3, that is, the window 40 may be opened directly above the conductive part 3 in the vertical direction, so that the conductive part 3 can cooperate with the internal structure of the flexible circuit board 4 through the window 40. The grounding part 41 is provided inside the flexible circuit board 4, and at least part of the structure of the grounding part 41 is provided at the position of the window 40. This allows the bottom of the grounding part 41 to be exposed through the window 40 (it should be further explained that this exposure does not mean that the grounding part 41 extends out of the flexible circuit board 4 through the window 40, but rather that the second board does not block the grounding part 41 at the position of the window 40), and the conductive part 3 can be electrically connected to the grounding part 41 through the window 40.

[0036] Furthermore, preferably, such as Figure 1 As shown, in this embodiment, the window 40 can be a rectangular opening formed on the second board surface. The size of the grounding component 41 can be larger than the size of the window 40. In this case, only a portion of the grounding component 41 is exposed through the window 40, and the conductive components 3 can be electrically connected to the exposed portion of the grounding component 41 through the window 40. This arrangement avoids the window 40 being too large, which could affect the structural strength of the flexible circuit board 4.

[0037] However, this is not the only option. The rectangular opening of the window 40 and the larger size of the grounding component 41 than the window 40 are merely preferred embodiments. As long as the function of exposing the grounding component 41 through the window 40 can be achieved, the window 40 can be configured in other ways. For example, the window can be a circular opening, with the size of the grounding component exactly equal to the size of the window; or multiple windows can be arranged at intervals along the direction of the insulating ink, with the grounding component simultaneously exposed in multiple windows, allowing multiple positions of the grounding component to simultaneously connect to the conductive part, thereby improving the electrostatic conduction effect.

[0038] Preferred, such as Figure 1 As shown, in this embodiment, the actual width of the opening 40 can be determined based on the width of the conductive parts 3. Specifically, the width of the opening 40 can be greater than the width of the conductive parts 3, and the width of the grounding part 41 can be greater than the width of the opening 40. This arrangement allows the grounding part 41 to cover the upper part of the conductive parts 3, achieving a better conductivity effect. The length of the opening 40 can be set according to actual needs. When the expected static electricity is large, the length of the opening 40 can be longer to increase the conductive contact area between the grounding part 41 and the conductive parts 3; conversely, the length of the opening 40 can be reduced to improve the structural strength of the flexible circuit board 4.

[0039] Further optimized, such as Figure 1As shown, in this embodiment, the grounding component 41 can be a grounding copper foil. That is, the grounding copper foil is disposed inside the flexible circuit board 4, and the lower surface of the grounding copper foil can be exposed through the opening 40, thereby enabling the grounding copper foil to be electrically connected to the conductive part 3. The grounding copper foil can be a plate-like structure, and the bottom surface of the grounding copper foil can be a horizontal plane. This arrangement allows for a larger contact area between the grounding component 41 and the conductive part 3, facilitating a stable connection between the grounding component 41 and the conductive part 3. However, this is not the only possibility. Setting the grounding component 41 as a grounding copper foil is only a preferred case in this embodiment. As long as the grounding function of the flexible circuit board 4 can be achieved, the grounding component 41 can also be configured in other ways, such as: the grounding component being a grounded line, and the conductive part being electrically connected to the grounded line.

[0040] Furthermore, preferably, such as Figure 1 As shown, in this embodiment, the conductive part 3 and the grounding copper foil can be bonded together using conductive double-sided adhesive. That is, conductive double-sided adhesive can be applied to the exposed portion of the lower surface of the grounding copper foil at the opening 40, and the conductive part 3 is then bonded and fixed to the grounding copper foil using conductive double-sided adhesive. This ensures a stable connection between the conductive part 3 and the grounding copper foil, and further improves the conductivity between the conductive part 3 and the grounding copper foil.

[0041] In addition, preferred, such as Figure 1 As shown, in this embodiment, an electromagnetic shielding film can be provided on the outside of the flexible circuit board 4 to achieve electromagnetic wave shielding, thereby solving the problem of electromagnetic interference. The electromagnetic shielding film can be positioned to avoid the opening 40, that is, no electromagnetic shielding film is provided at the opening 40 position, to avoid interference between the electromagnetic shielding film and the connection between the grounding component 41 and the conductive component 3. Specifically, the flexible circuit board 4 can have part of the electromagnetic shielding film removed during the wiring design to form the opening 40, through which the grounding copper foil can be exposed.

[0042] Preferred, such as Figure 1 As shown, in this embodiment, the conductive part 3 can be a conductive metal layer. Specifically, the conductive part 3 can be made of materials with good conductivity, such as gold, silver, or copper, to achieve a better conductivity effect. Further, preferably, in this embodiment, the conductive part 3 can be screen-printed silver paste. Insulating ink 2 can be screen-printed on the signal line 1 first to insulate the signal line 1. Then, silver paste is screen-printed on the insulating ink 2. The screen-printed silver paste is conductively connected to the grounding component 41, thereby enabling the static electricity to be guided to the flexible circuit board 4 to prevent the signal line 1 from being damaged by electrostatic discharge.

[0043] Further optimized, such as Figure 1 and Figure 2As shown, in this embodiment, the conductive part 3 can be disposed along the extension path of the insulating ink 2, that is, the extension direction of the screen-printed silver paste is the same as the extension direction of the insulating ink 2. There are multiple signal lines 1, which are arranged closely in the touchscreen area 5. After the insulating ink 2 is applied to the signal lines 1, a first portion of the insulating ink 2 covers directly above the signal lines 1, and a second portion of the insulating ink 2 is located on the outer periphery of the signal lines 1 in the horizontal direction (i.e., the second portion of the insulating ink 2 is located on the outer periphery of the touchscreen area 5). The conductive part 3 can be disposed above the second portion of the insulating ink 2. This arrangement ensures that the conductive part 3 is located on the outer periphery of the signal lines 1 in the horizontal direction, thereby enabling the immediate conduction of static electricity to the flexible circuit board 4.

[0044] In addition, such as Figure 1 and Figure 2 As shown, according to a second aspect of the present invention, a laptop computer is provided, the laptop computer including the antistatic structure as described above.

[0045] Preferred, such as Figure 1 and Figure 2 As shown, in this embodiment, the laptop computer may include a touchscreen area 5 and a grounding line. The touchscreen area 5 contains a large number of signal lines 1, and conductive parts 3 can be arranged around the outer periphery of the touchscreen area 5 to guide static electricity to the flexible circuit board 4 immediately, preventing electrostatic discharge from damaging the signal lines 1. The grounding line can be conductively connected to the ground wire of the laptop computer's power supply. The grounding component 41 of the flexible circuit board 4 is conductively connected to the grounding line, thereby conducting static electricity away through the power supply's ground wire.

[0046] During use, insulating ink 2 is coated on signal line 1, and conductive part 3 is disposed on top of insulating ink 2. Flexible circuit board 4 at least partially covers the insulating ink 2. Conductive part 3 is conductively connected to grounding part 41 of flexible circuit board 4, so that when static electricity is generated in the touch screen area 5 of the laptop, conductive part 3 can directly guide the static electricity to grounding part 41 of flexible circuit board 4, thereby protecting signal line 1 and preventing excessive static energy from breaking through insulating ink 2, causing signal line 1 to be damaged by static electricity. This greatly improves the anti-static effect of the laptop.

[0047] Finally, it should be noted that the above embodiments are merely specific implementations of this application, used to illustrate the technical solutions of this application, and not to limit them. The protection scope of this application is not limited thereto. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or easily conceive of changes to the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features, within the technical scope disclosed in this application. Such modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be covered within the protection scope of this application. Therefore, the protection scope of this application should be determined by the protection scope of the claims.

Claims

1. An antistatic structure, characterized in that, The antistatic structure includes: Signal line; Insulating ink is applied to the signal lines; A conductive portion is disposed on top of the insulating ink; and A flexible circuit board, at least partially covered by the insulating ink, wherein the conductive portion is electrically connected to the grounding component of the flexible circuit board.

2. The antistatic structure according to claim 1, characterized in that, The bottom of the flexible circuit board has a window at the position corresponding to the conductive part, and the grounding component is exposed through the window.

3. The antistatic structure according to claim 2, characterized in that, The grounding component is a grounding copper foil, which is disposed inside the flexible circuit board. The conductive part is electrically connected to the grounding copper foil through the opening.

4. The antistatic structure according to claim 3, characterized in that, The conductive part is bonded to the grounded copper foil with conductive double-sided adhesive.

5. The antistatic structure according to claim 3, characterized in that, The flexible circuit board is provided with an electromagnetic shielding film on its exterior, and the electromagnetic shielding film avoids the opening.

6. The antistatic structure according to claim 1, characterized in that, The conductive portion is disposed along the extension path of the insulating ink, and the conductive portion is located on the periphery of the signal line in the horizontal direction.

7. The antistatic structure according to any one of claims 1 to 6, characterized in that, The conductive part is a conductive metal layer.

8. The antistatic structure according to claim 7, characterized in that, The conductive part is made of screen-printed silver paste.

9. A laptop computer, characterized in that, The laptop computer includes the antistatic structure according to any one of claims 1 to 8.

10. The laptop computer according to claim 9, characterized in that, The laptop computer includes a touch screen area and a grounding line. The conductive part is arranged around the outer periphery of the touch screen area, and the grounding component of the flexible circuit board is conductively connected to the grounding line.

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