A liquid-cooled server

Abstract

The disclosure provides a liquid-cooled server, comprising: a first cabinet, the first cabinet containing a mainboard and a cooling pipeline; the cooling pipeline is in contact with the mainboard; a second cabinet is arranged opposite to the first cabinet; the second cabinet contains a heat dissipation assembly, the heat dissipation assembly is in communication with the cooling pipeline to form a medium loop, and cooling medium circulates in the medium loop; wherein in the medium loop, the cooling medium in the cooling pipeline exchanges heat with the heat load generated by the mainboard, the heat-exchanged cooling medium is input into the heat dissipation assembly to be cooled, and the cooled cooling medium is input into the cooling pipeline again.

Description

Technical Field

[0001] This disclosure relates to server technology, and in particular to a liquid-cooled server. Background Technology

[0002] The heat load generated by the server during operation needs to be effectively managed through a liquid cooling system to ensure stable server performance.

[0003] Currently, liquid cooling systems rely on external cooling devices for cooling. Servers cannot be integrated with external cooling devices, resulting in high operating costs and large space requirements. Utility Model Content

[0004] This disclosure provides a liquid-cooled server, comprising: a first chassis containing a motherboard and cooling pipes; the cooling pipes contacting the motherboard; a second chassis disposed opposite to the first chassis; the second chassis containing a heat dissipation assembly, the heat dissipation assembly being connected to the cooling pipes to form a medium loop, wherein a cooling medium circulates in the medium loop; wherein, in the medium loop, the cooling medium in the cooling pipes exchanges heat with the heat load generated by the motherboard, the cooled medium after heat exchange is input into the heat dissipation pipes for cooling, and the cooled medium is input back into the cooling pipes.

[0005] In some embodiments, the heat dissipation assembly includes: a water pump and a heat dissipation pipe connected to the water pump; the water pump, the heat dissipation pipe, and the cooling pipe form the medium circuit; wherein, in the medium circuit, the water pump controls the input of the cooling medium after heat exchange into the heat dissipation assembly for cooling, and controls the input of the cooled cooling medium back into the cooling pipe.

[0006] In some embodiments, the heat dissipation pipe includes: at least two heat dissipation sub-pipes, the at least two heat dissipation sub-pipes are connected in parallel, and each of the at least two heat dissipation sub-pipes is connected to a water pump; wherein, in the medium circuit, the water pump controls the cooling medium after heat exchange to be simultaneously input into the at least two heat dissipation sub-pipes for cooling, and controls the cooled cooling medium to be input into the cooling pipe again.

[0007] In some embodiments, the heat dissipation pipe includes: a heat dissipation pipe body and heat dissipation fins sleeved on the outer periphery of the heat dissipation pipe body; wherein, the cooling medium after heat exchange is input into the heat dissipation pipe body and undergoes secondary heat exchange with the outside air through the heat dissipation fins.

[0008] In some embodiments, the first chassis has an outlet and an inlet; both ends of the cooling pipe are connected to the outlet and the inlet respectively; the liquid-cooled server further includes an inlet pipe and an outlet pipe; one end of the inlet pipe is connected to the outlet, and the other end is connected to the first end of the heat dissipation pipe; one end of the outlet pipe is connected to the inlet, and the other end is connected to the second end of the heat dissipation pipe; the inlet pipe, the water pump, the heat dissipation pipe, the outlet pipe and the cooling pipe form a medium loop; wherein, the cooling medium after heat exchange is input into the heat dissipation pipe through the outlet and the inlet pipe; the cooled cooling medium is input into the cooling pipe again through the outlet and the inlet pipe.

[0009] In some embodiments, the first chassis is formed by a first top plate, a first bottom plate, and a plurality of first side plates connecting the first top plate and the first bottom plate, and a water outlet and a water inlet are provided on the first back plate of the plurality of first side plates; the second chassis includes: a second bottom plate and a plurality of second side plates, wherein the plurality of second side plates are connected end to end to form a ring structure, the first end of the plurality of second side plates is connected to the second bottom plate, and the second end of the plurality of second side plates is connected to the first bottom plate; the second back plate of the plurality of second side plates is provided with a first through hole and a second through hole; wherein the water inlet pipe passes through the first through hole and is connected to the water outlet, and the water outlet pipe passes through the second through hole and is connected to the water inlet.

[0010] In some embodiments, the second chassis further includes a heat-spreading top plate, wherein the heat-spreading top plate is attached to the first bottom plate, and the second ends of the plurality of second side plates are connected to the first bottom plate by connecting the heat-spreading top plate.

[0011] In some embodiments, the second chassis has an assembly hole; at least one fan is installed in the assembly hole, and the air outlet of each of the at least one fan faces the heat dissipation component; wherein, the air in the second chassis is heated after heat exchange with the cooling medium in the heat dissipation component, and the fan cools the heated air in the second chassis.

[0012] In some embodiments, the first chassis also houses a power supply module, which is connected to the water pump and the fan; the power supply module supplies power to the water pump and / or the fan.

[0013] In some embodiments, the liquid-cooled server further includes: a temperature detection module disposed in a first chassis or a second chassis; and controlling the power of the fan according to the temperature detected by the temperature detection module.

[0014] The embodiments disclosed herein have the following beneficial effects:

[0015] In this embodiment, a medium loop is formed between a first chassis and a second chassis positioned opposite each other. A cooling medium circulates within this loop, absorbing the heat load generated by the motherboard in the first chassis and transferring it to the second chassis for elimination by a heat dissipation component. This ensures a consistently stable operating temperature for the motherboard, allowing the liquid cooling system to be directly integrated into the liquid-cooled server. This optimizes the layout and structure of the liquid-cooled server, resulting in a smaller overall size and higher space utilization. Furthermore, it reduces the complexity of the liquid cooling system, making its maintenance easier and less costly.

[0016] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0017] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0018] Figure 1 This is a schematic diagram of the first liquid-cooled server provided in the embodiments of this disclosure;

[0019] Figure 2 This is a schematic diagram of a second type of liquid-cooled server provided in an embodiment of this disclosure;

[0020] Figure 3 This is a schematic diagram of the first type of second chassis provided in the embodiments of this disclosure;

[0021] Figure 4 This is a schematic diagram of a second type of second chassis provided in an embodiment of this disclosure;

[0022] Figure 5 This is a schematic diagram of a third type of second chassis provided in an embodiment of this disclosure.

[0023] Explanation of reference numerals in the attached figures:

[0024] 10. Liquid-cooled server; 11. First chassis; 111. Water outlet; 112. Water inlet; 113. First back panel; 12. Second chassis; 121. Heat dissipation pipe; 1211. First heat dissipation sub-pipe; 1212. Second heat dissipation sub-pipe; 122. Water pump; 123. Second back panel; 124. Fan; 125. Second front panel; 126. Ventilation opening; 127. Heat spreader top plate; 13. Water inlet pipe; 14. Water outlet pipe. Detailed Implementation

[0025] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses consistent with some aspects of this disclosure as detailed in the appended claims.

[0026] Liquid cooling systems rely on external cooling equipment, such as dry cooling towers and wet cooling towers, for cooling. Therefore, when using liquid-cooled servers, users need to configure additional external cooling equipment to build the liquid cooling system and maintain stable operation. This cooling solution, where the server cannot be integrated with external cooling equipment, suffers from high costs and large space requirements.

[0027] To address the aforementioned technical problems, this disclosure provides a liquid-cooled server that integrates the liquid cooling system directly into the server's interior. This optimizes the layout and structure of the liquid-cooled server, resulting in a smaller overall size and higher space utilization. Furthermore, it reduces the complexity of the liquid cooling system, making maintenance easier and less costly.

[0028] Figure 1 This is a schematic diagram of the first liquid-cooled server provided in the embodiments of this disclosure. Figure 2 This is a schematic diagram of the second type of liquid-cooled server provided in this disclosure embodiment. Figure 3 This is a schematic diagram of a first type of second chassis provided in an embodiment of this disclosure. For example... Figures 1 to 3 As shown, the liquid-cooled server 10 may include a first chassis 11 and a second chassis 12, with the first chassis 11 and the second chassis 12 disposed opposite to each other. In one embodiment, the first chassis 11 may be disposed opposite to the second chassis 12 at the top, bottom, left, right, or other positions, etc., and this embodiment does not specifically limit this.

[0029] In some embodiments, the first chassis 11 provides safety protection for the normal operation of components such as the motherboard and cooling pipes. The first chassis 11 can be a box formed by enclosing a structure such as a shell or a flat plate. In one embodiment, the first chassis 11 has a cuboid shape. The first chassis 11 has good rigidity and strength, as well as good electromagnetic isolation, ventilation, and heat dissipation performance.

[0030] In one embodiment, the first chassis 11 may have a preset height. Here, the height of the chassis can be represented by the letter U (unit). For example, 1U equals 4.45 centimeters, and the height of the first chassis 11 can be 2U, or 8.9 centimeters. Similarly, the first chassis 11 may have a preset width and length. For example, the width of the first chassis 11 may be 48.26cm (equal to 19 inches).

[0031] It should be noted that in the embodiments of this disclosure, the directions such as top, bottom, left, and right refer to the relative positions of various components or structures of the liquid-cooled server in actual use. Specifically, height corresponds to the direction of travel from top to bottom, width corresponds to the direction of travel from left to right, and length corresponds to the direction perpendicular to the corresponding directions of height and width.

[0032] In some embodiments, the first chassis 11 houses a motherboard and cooling pipes, with the cooling pipes in contact with the motherboard. The motherboard may include a computing board, a control board, a power board, etc. In one embodiment, the computing board is the core component of the liquid-cooled server 10 used for high-performance computing, typically equipped with a high-performance graphics processing unit (GPU), field-programmable gate array (FPGA), or other dedicated computing chips. The computing board generates a large amount of heat, requiring focused cooling in the liquid-cooled server 10. In one embodiment, the control board is responsible for the overall management and control functions of the server, including system startup, power management, hardware monitoring, etc. In one embodiment, the power board provides a stable power supply to the entire server, typically including an AC / DC converter, a power distribution unit (PDU), a voltage regulator module (VRM), etc.

[0033] In some embodiments, a cooling pipe refers to a pipe for the cooling medium in the liquid-cooled server 10. A medium flow path exists within the cooling pipe, which is the flow path of the cooling medium. The cooling pipe is used to conduct the heat load generated by the motherboard to the cooling medium, thereby cooling the motherboard. Here, depending on the heat dissipation requirements of the motherboard, the cooling pipe can be configured corresponding to the motherboard, and there are various ways to configure it; this disclosure does not specifically limit this. In one embodiment, the cooling pipe can be configured at a position in contact with the motherboard; in another embodiment, the cooling pipe can be configured near the motherboard.

[0034] In one embodiment, the cooling pipe may include a cooling pipe body and heat dissipation fins, the heat dissipation fins being connected to the surface of the cooling pipe body. In one embodiment, the cooling pipe body may include a pipe inlet, a pipe outlet, and the pipe body itself, with the pipe inlet and outlet located at opposite ends of the pipe body. In one embodiment, the cooling pipe may be made of a corrosion-resistant metallic material (such as copper or aluminum alloy) or plastic.

[0035] In one embodiment, the cooling pipe can be bent to form a cooling coil that contacts the motherboard, thereby increasing the contact area between the cooling pipe and the motherboard, increasing the flow path of the cooling medium, and improving the heat exchange performance of the heat load generated by the cooling medium and the motherboard.

[0036] In some embodiments, the second chassis 12 is used to provide safety protection for the normal operation of the heat dissipation components. The structure of the second chassis 12 can refer to the structure of the first chassis 11 described above, and will not be repeated here for the sake of brevity.

[0037] In some embodiments, by improving the heat dissipation efficiency of the heat dissipation component, the volume of the heat dissipation component can be increased, thereby enhancing the heat dissipation capacity of the liquid-cooled server 10. Thus, the height of the second chassis 12 can be greater than the height of the first chassis 11. In one embodiment, the height of the second chassis 12 can be 4U, or 17.8 cm.

[0038] In some embodiments, the second chassis 12 houses a heat dissipation assembly. The heat dissipation assembly is connected to a cooling pipe to form a medium loop. That is, there is a medium flow path in the heat dissipation assembly, which is connected to the medium flow path in the cooling pipe, thereby forming a medium loop.

[0039] Understandably, the cooling medium circulates in the media loop. Specifically, the cooling medium in the cooling pipes exchanges heat with the heat load generated by the motherboard, causing it to heat up. The heated cooling medium then flows in the media loop and is input into the heat dissipation components for cooling. The cooled cooling medium then returns to the cooling pipes. In this cycle, the heat load generated by the motherboard exchanges heat with the cooling medium, thereby cooling the motherboard and maintaining the stable operation of the server.

[0040] In some embodiments, the connection between the heat dissipation component and the cooling pipe can be achieved through a pipe. In some embodiments, the material, shape, location, size, and other parameters of the pipe can be set according to actual needs, and the embodiments disclosed herein do not impose specific limitations on this.

[0041] In some embodiments, the heat dissipation component is used to cool the cooling medium. The heat dissipation component can cool the cooling medium through various methods such as air cooling, liquid cooling, and heat pipe cooling, and the embodiments disclosed herein do not specifically limit the method.

[0042] In one embodiment, the working principle of the heat dissipation component can be that the cooling medium in the heat dissipation component exchanges heat with the air outside the heat dissipation component to reduce the temperature of the cooling medium.

[0043] In one embodiment, a heat dissipation component can be connected to a cooling pipe to form a heat pipe. The heat dissipation component can constitute the condensation section of the heat pipe, and the cooling pipe can constitute the evaporation section. A medium loop is formed between the condensation section and the evaporation section. Specifically, the cooling medium at the evaporation section absorbs the heat load from the motherboard and vaporizes into steam. The steam reaches the condensation section under a small pressure difference. Upon encountering cooling in the condensation section, the steam releases its latent heat of vaporization and condenses back into liquid. The condensed liquid then flows back to the evaporation section by capillary force or gravity. This cycle continues, and the cooling medium in the heat pipe cools the motherboard.

[0044] In one embodiment, the cooling medium can be ultrapure water, deionized water, distilled water, or other similar working fluids, or it can be methanol, ethanol, or Freon (such as dichlorofluoromethane (R22) or difluoromethane (R32)). In another embodiment, the cooling medium may also include an antifreeze. Examples of antifreeze include ethylene glycol-based antifreeze and propylene glycol-based antifreeze.

[0045] In this embodiment, a medium loop is formed between a first chassis and a second chassis positioned opposite each other. A cooling medium circulates within this loop, absorbing the heat load generated by the motherboard in the first chassis and transferring it to the second chassis for elimination by a heat dissipation component. This ensures a consistently stable operating temperature for the motherboard, allowing the liquid cooling system to be directly integrated into the liquid-cooled server. This optimizes the layout and structure of the liquid-cooled server, resulting in a smaller overall size and higher space utilization. Furthermore, it reduces the complexity of the liquid cooling system, making its maintenance easier and less costly.

[0046] In some embodiments, such as Figures 1 to 3 As shown, the heat dissipation assembly includes: a water pump 122 and a heat dissipation pipe 121 connected to the water pump 122; the water pump 122, the heat dissipation pipe 121 and the cooling pipe form a medium circuit.

[0047] Understandably, the cooling pipes, heat dissipation pipes 121, and water pump 122 form a closed media loop. In this loop, the cooling medium in the cooling pipes exchanges heat with the heat load generated by the motherboard, causing it to heat up. The water pump 122 controls the cooling medium after heat exchange to be input into the heat dissipation pipes 121 for cooling, and also controls the cooled cooling medium to be input back into the cooling pipes. In this cycle, the water pump 122 can control the efficiency of the cooling medium in cooling the motherboard, maintaining the stable operation of the server.

[0048] In one embodiment, the heat dissipation pipe 121 can be made of a material with good thermal conductivity (such as copper, aluminum, etc.). In one embodiment, the working principle of the heat dissipation pipe 121 can be that the cooling medium in the heat dissipation component exchanges heat with the air outside the heat dissipation component to reduce the temperature of the cooling medium.

[0049] In one embodiment, the water pump 122 can be connected to the cooling pipe and the heat dissipation pipe 121 via a pipe interface. In one embodiment, the water pump 122 can be located between the outlet of the cooling pipe and the inlet of the heat dissipation pipe 121, with the cooling medium flowing sequentially through the cooling pipe, the water pump 122, and the heat dissipation pipe 121. In another embodiment, the water pump 122 can be located between the outlet of the heat dissipation pipe 121 and the inlet of the cooling pipe, with the cooling medium flowing sequentially through the cooling pipe, the heat dissipation pipe 121, and the water pump 122.

[0050] Understandably, the water pump 122 provides power for the circulation of the cooling medium, thereby achieving effective heat transfer and dissipation. The water pump 122 can also regulate the flow rate of the cooling medium, thus affecting the cooling efficiency.

[0051] In this embodiment, the heat dissipation pipes, cooling pipes, and water pump work together to form a liquid cooling heat dissipation circulation system, thereby cooling the motherboard in the liquid-cooled server and meeting the user's usage needs.

[0052] In some embodiments, such as Figures 1 to 3 As shown, the heat dissipation pipe 121 includes at least two heat dissipation sub-pipes, which are connected in parallel, and each of the at least two heat dissipation sub-pipes is connected to a water pump.

[0053] It is understood that the heat dissipation pipe 121 may include at least two heat dissipation sub-pipes. The structure of each of the at least two heat dissipation sub-pipes may be the same or different, and this embodiment does not specifically limit this. Each of the at least two heat dissipation sub-pipes is connected in parallel, such that the at least two heat dissipation sub-pipes together form a medium flow path, and the water pump 122, the at least two heat dissipation sub-pipes, and the cooling pipe form a medium loop. In the medium loop, the water pump 122 controls the simultaneous input of the cooled medium after heat exchange into the at least two heat dissipation sub-pipes for cooling. The cooled medium can merge, and the water pump 122 also controls the cooled medium to be input again into the cooling pipe. Here, each heat dissipation sub-pipe constituting the medium loop can cool the cooled medium after heat exchange.

[0054] In one embodiment, the water pump 122 may be connected to the inlet of each heat dissipation sub-pipe.

[0055] In some embodiments, each of the at least two heat dissipation sub-pipes can be arranged in different positions within the second chassis 12, thereby avoiding the problem of wasting internal space of the second chassis 12 if a single heat dissipation pipe 121 is placed in the second chassis 12.

[0056] In one embodiment, at least two heat dissipation sub-pipes include a first heat dissipation sub-pipe 1211 and a second heat dissipation sub-pipe 1212. The arrangement of the first heat dissipation sub-pipe 1211 and the second heat dissipation sub-pipe 1212 can be set according to requirements. In one embodiment, the first heat dissipation sub-pipe 1211 and the second heat dissipation sub-pipe 1212 can be arranged in the width direction. In one embodiment, the first heat dissipation sub-pipe 1211 and the second heat dissipation sub-pipe 1212 can be arranged in the height direction. In one example, the first heat dissipation sub-pipe 1211 and the second heat dissipation sub-pipe 1212 can be arranged in the width direction and form a certain included angle.

[0057] In some embodiments, each of the at least two heat dissipation sub-pipes is connected sequentially, and the water pump 122 is disposed between any two of the at least two heat dissipation sub-pipes. The water pump 122 and the heat dissipation sub-pipes are arranged in series.

[0058] Understandably, each heat dissipation sub-pipe forms a medium flow path. Each heat dissipation sub-pipe, when connected sequentially, can connect to the water pump 122 and the cooling pipe, thus forming a medium loop with each heat dissipation sub-pipe, water pump 122, and cooling pipe. Here, the water pump 122 can be connected between any two heat dissipation sub-pipes to ensure that the cooling medium is evenly distributed to each heat dissipation sub-pipe, avoiding localized overheating and insufficient heat dissipation.

[0059] Understandably, in the media loop, the cooling medium in the cooling pipes exchanges heat with the heat load generated by the motherboard, causing it to heat up. The water pump 122 pumps the cooled medium from the cooling pipes after the heat exchange to the first of at least two heat dissipation sub-pipes. The medium cools down in the first to the last of the at least two heat dissipation sub-pipes, and then returns to the main cooling pipe through the last heat dissipation sub-pipe. This cycle enables the water pump 122 to control the efficiency of the cooling medium in cooling the motherboard, maintaining the stable operation of the server.

[0060] In one embodiment, the water pump 122 can be connected to two adjacent heat dissipation sub-pipes via a pipe interface.

[0061] In one embodiment, at least two heat dissipation sub-pipes include a first heat dissipation sub-pipe 1211 and a second heat dissipation sub-pipe 1212. A water pump 122 is connected between the first heat dissipation sub-pipe 1211 and the second heat dissipation sub-pipe 1212, and the water pump 122 can ensure that the cooling medium is evenly distributed in the first heat dissipation sub-pipe 1211 and the second heat dissipation sub-pipe 1212.

[0062] In this embodiment, multiple heat dissipation sub-pipes are arranged inside the second chassis, thereby making full use of the space inside the second chassis and improving the cooling efficiency of the liquid-cooled server.

[0063] In some embodiments, such as Figures 1 to 3 As shown, the heat dissipation pipe 121 includes a heat dissipation pipe body and heat dissipation fins sleeved on the outer periphery of the heat dissipation pipe body. The heat dissipation fins are closely arranged on the surface of the heat dissipation pipe body, which greatly increases the heat dissipation area and significantly improves the heat dissipation efficiency.

[0064] Understandably, after heat exchange, the cooling medium within the heat sink body undergoes secondary heat exchange with the outside air through the heat dissipation fins to achieve cooling. Specifically, the cooled medium after heat exchange is introduced into the heat sink body, and heat is transferred to the heat dissipation fins through the heat sink body. The heat-absorbing fins then exchange heat with the outside air, dissipating the heat into the surrounding environment.

[0065] Understandably, the cooling medium heats up after the first heat exchange with the motherboard's heat load in the cooling pipes, and then cools down after the second heat exchange with the air in the heat dissipation pipes 121. In this way, the cooling medium can be circulated in the cooling circuit.

[0066] In some embodiments, the heat sink fins may be made of metal materials such as copper, aluminum, or stainless steel.

[0067] In this embodiment of the disclosure, heat dissipation fins are provided on the outer periphery of the heat pipe body to meet the heat dissipation requirements of the liquid-cooled server.

[0068] In some embodiments, such as Figures 1 to 3 As shown, the first chassis 11 has a water outlet 111 and a water inlet 112. The liquid-cooled server 10 also includes a water inlet pipe 13 and a water outlet pipe 14; one end of the water inlet pipe 13 is connected to the water outlet 111, and the other end is connected to the first end of the heat dissipation pipe 121; one end of the water outlet pipe 14 is connected to the water inlet 112, and the other end is connected to the second end of the heat dissipation pipe 121.

[0069] Understandably, the two ends of the cooling pipe can be connected to the outlet 111 and inlet 112 respectively on the first chassis 11. The heat dissipation component can be connected to the cooling pipe through the outlet 111 and inlet 112 to form a medium loop. Here, the outlet 111 can be connected to one end of the inlet pipe 13, and the other end of the inlet pipe 13 can be connected to the first end (the inlet end of the heat dissipation pipe 121). The inlet 112 can be connected to one end of the inlet pipe 13, and the other end of the inlet pipe 13 can be connected to the second end (the outlet end of the heat dissipation pipe 121). In this way, through the outlet 111 and inlet 112, the inlet pipe 13, outlet pipe 14, heat dissipation pipe 121, water pump 122 and cooling pipe form a medium loop.

[0070] Understandably, in the medium circuit, the cooling medium in the cooling pipes exchanges heat with the heat load generated by the motherboard, causing it to heat up. The water pump 122 controls the cooling medium after heat exchange to enter the heat dissipation pipe 121 through the outlet 111 and the inlet pipe 13, and controls the cooling medium after cooling to enter the cooling pipe again through the outlet pipe 14 and the inlet 112.

[0071] In some embodiments, the outlet 111 can be connected to one end of the inlet pipe 13, and the other end of the inlet pipe 13 can be connected to the first end (the inlet end of the heat dissipation pipe 121) of the heat dissipation pipe 121 via the water pump 122. The inlet 112 can be connected to one end of the inlet pipe 13, and the other end of the inlet pipe 13 can be directly connected to the second end (the outlet end of the heat dissipation pipe 121).

[0072] For example, Figure 4 This is a schematic diagram of the second type of second chassis provided in the embodiments of this disclosure. Figure 5 This is a schematic diagram of a third type of second chassis provided in this disclosure. See also... Figures 3 to 5 As shown, the inlet pipe 13 can be connected to the inlet of the water pump 122, the outlet of the water pump 122 is connected to the inlet of the first heat dissipation sub-pipe 1211 and the second heat dissipation sub-pipe 1212, and the outlet of the first heat dissipation sub-pipe 1211 and the second heat dissipation sub-pipe 1212 is connected to the outlet pipe 14.

[0073] In some embodiments, the positions of the water outlet 111 and the water inlet 112 can be set according to actual needs. The water outlet 111 and the water inlet 112 can be located on the same surface in the first housing 11 or on different surfaces in the first housing 11.

[0074] In one embodiment, the positions of the water outlet 111 and the water inlet 112 can be set according to the positional relationship between the first chassis 11 and the second chassis 12. For example, the water outlet 111 and the water inlet 112 can be located on the first chassis 11 near the second chassis 12. In another embodiment, the positions of the water outlet 111 and the water inlet 112 can be set according to the operating direction of the liquid-cooled server 10. For example, the water outlet 111 and the water inlet 112 can be located on the back of the first chassis 11 of the liquid-cooled server 10.

[0075] In some embodiments, the inlet pipe 13 and the outlet pipe 14 may be made of materials such as metal or alloy. In one embodiment, the inlet pipe 13 and the outlet pipe 14 pass through the second chassis 12, with one end connected to a cooling pipe and the other end connected to a heat dissipation pipe 121. In one embodiment, the inlet pipe 13 and the outlet pipe 14 may be bent to facilitate the connection between the cooling pipe and the heat dissipation pipe 121.

[0076] In this embodiment, the cooling pipe and the heat dissipation pipe are connected by an inlet pipe and an outlet pipe, which has the advantages of simple structure, convenient installation, easy maintenance, low cost and high reliability.

[0077] In some embodiments, such as Figures 1 to 5 As shown, the first chassis 11 is formed by a first top plate, a first bottom plate, and multiple first side plates connecting the first top plate and the first bottom plate. A first back plate 113 among the multiple first side plates has a water outlet 111 and a water inlet 112. The second chassis 12 includes a second bottom plate and multiple second side plates, wherein the multiple second side plates are connected end-to-end to form a ring structure. The first ends of the multiple second side plates are connected to the second bottom plate, and the second ends of the multiple second side plates are connected to the first bottom plate. The second bottom plate, the ring structure, and the first bottom plate enclose a second accommodating cavity, and a heat dissipation assembly is housed within the second accommodating cavity. A second back plate 123 among the multiple second side plates has a first through hole and a second through hole. A water inlet pipe 13 passes through the first through hole and is connected at one end to the water outlet 111, and at the other end to the heat dissipation assembly. A water outlet pipe 14 passes through the second through hole and is connected at one end to the water inlet 112, and at the other end to the heat dissipation assembly.

[0078] Understandably, the first top plate, the first bottom plate, and multiple first side plates enclose a first receiving cavity, within which the motherboard and cooling pipes are housed. The two ends of the cooling pipes are connected to the outlet 111 and the inlet 112, respectively. The first end of the annular structure formed by the multiple second side plates in the second chassis 12 is connected to the second bottom plate in the second chassis 12, and the second end is connected to the first bottom plate in the first chassis 11. Thus, the second bottom plate, the annular structure, and the first bottom plate enclose a second receiving cavity, which contains a heat dissipation assembly. It is evident that the first chassis 11 and the second chassis 12 can share the first bottom plate to separate the first and second receiving cavities. On one hand, this reduces the fabrication of the top plate in the second chassis 12, saving costs; on the other hand, it allows the second chassis 12 to be stacked with the first chassis 11, thereby increasing the integration density of the liquid-cooled server 10 and reducing its footprint.

[0079] In one embodiment, the first backplate 113 and the second backplate 123 are surfaces away from the user during the use of the liquid-cooled server, thereby making the surfaces of the liquid-cooled server closer to the user more aesthetically pleasing during use.

[0080] In this embodiment, the water outlet and water inlet are located on the first backplate of the first chassis, thereby facilitating the assembly of heat dissipation components and cooling pipes to form a medium circuit through the water inlet and water outlet pipes.

[0081] In some embodiments, such as Figures 1 to 5 As shown, the second chassis 12 also includes a heat-spreading top plate 127, which is attached to the first bottom plate, and the second ends of the multiple side plates are connected to the first bottom plate by connecting the heat-spreading top plate 127.

[0082] Understandably, the vapor chamber 127 can be a hollow flat plate structure. The vapor chamber 127 can conduct heat from the first housing 11, ensuring a uniform heat distribution within the first housing 11. Specifically, the working principle of the vapor chamber 127 is based on a phase change heat transfer mechanism. When heat from the first housing 11 is conducted to the evaporation zone of the vapor chamber 127, the working fluid (such as ultrapure water) within the vapor chamber 127 rapidly absorbs heat and vaporizes into steam. Under pressure difference, the steam diffuses from the high-temperature zone to the low-temperature zone and condenses into liquid upon contact with the cooler inner wall, releasing the previously absorbed heat. The condensed liquid flows back to the evaporation zone through capillary action, completing a heat conduction cycle. In this way, the vapor chamber 127 can quickly conduct heat from the first housing 11 to the second housing 12 and uniformly distribute heat across the entire vapor chamber 127, thereby effectively reducing the temperature within the first housing 11 and preventing localized overheating.

[0083] In some embodiments, the orthographic projection of the first chassis 11 coincides with the orthographic projection of the second chassis 12, so that the length and width of the first chassis 11 and the second chassis 12 are the same. This ensures that the liquid-cooled server 10 has a more reasonable spatial layout. In particular, when the liquid-cooled server 10 is used in a server room or data center, multiple liquid-cooled servers 10 can be neatly stacked together, which is convenient for management and heat dissipation.

[0084] In some embodiments, such as Figures 1 to 5 As shown, the second chassis 12 has an assembly hole; at least one fan 124 is installed in the assembly hole, and the air outlet of each of the at least one fan 124 faces the heat dissipation component.

[0085] Understandably, mounting holes can be provided on any surface of the second chassis 12. At least one fan 124 can be mounted at the location of the mounting hole. Here, the air outlet of each fan 124 faces the heat dissipation component, and each fan 124 is used to blow air onto the heat dissipation component through the air outlet.

[0086] Understandably, the heat dissipation component is located inside the second chassis 12. The air inside the second chassis 12 heats up after exchanging heat with the cooling medium in the heat dissipation component. The fan 124 blows air into the second chassis 12 to cool the air. By blowing air through the fan 124, the temperature of the air inside the second chassis 12 can be lowered, facilitating heat exchange between the cooling medium in the heat dissipation component and the air, thus improving the cooling efficiency of the liquid-cooled server 10. Furthermore, the fan can increase the airflow rate inside the second chassis 12, accelerating air cooling.

[0087] In some embodiments, the second back plate 123 has mounting holes, and the fan 124 is mounted on the second back plate 123. The second panel 125 of the second housing 12 has ventilation openings 126, and the second back plate 123 is disposed opposite to the second panel 125. In some embodiments, the shape, number, and size of the ventilation openings 126 can be set according to actual needs, and this disclosure does not limit this. In one example, the fan 124 can be a fan, air cooler, etc.

[0088] In this embodiment of the disclosure, a fan is provided on the second chassis, which can improve the heat exchange rate inside the second chassis and improve the overall cooling efficiency of the liquid-cooled server.

[0089] In some embodiments, the first chassis 11 also houses a control device and a power supply module, the power supply module being connected to the water pump 122 and the fan 124.

[0090] Understandably, the liquid-cooled server 10 may also include a control device and a power supply module. The control device can be connected to components such as the power supply module, water pump 122, and fan 124, and the power supply module can be connected to components such as the water pump 122 and fan 124. The control device and power supply module can be housed within the first chassis 11 to meet their cooling requirements.

[0091] In some embodiments, the cooling pipe is close to or in contact with the control device and the power supply module, and the cooling medium in the cooling pipe can exchange heat with the heat load generated by the control device and the heat load generated by the power supply module, so that the control device and the power supply module can be cooled down.

[0092] In one embodiment, the control device may be a combination of software and / or hardware that implements a predetermined function. In some embodiments, the control device may be a processor in the form of a hardware decoding processor, programmed to perform control of the first and second medium loops. For example, the processor in the form of a hardware decoding processor may employ one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), programmable logic devices (PLDs), complex programmable logic devices (CPLDs), field-programmable gate arrays (FPGAs), or other electronic components, which are not specifically limited in this disclosure. In one embodiment, the control device may be integrated onto the motherboard. In one embodiment, the power supply module may be integrated onto the motherboard.

[0093] In some embodiments, the power supply module is used to supply power to the water pump 122 and / or the fan 124, and the control device is used to control the power supply module to supply power to the water pump 122 and / or the fan 124.

[0094] Understandably, the control module can control the power supply module to supply power to the water pump 122 and / or the fan 124 according to the cooling requirements. After the water pump 122 and / or the fan 124 are powered on, the liquid cooling system in the liquid-cooled server 10 begins to work and cools the motherboard.

[0095] In one embodiment, when cooling demand is low, the control device controls the power supply module to supply power to the water pump 122; in another embodiment, when cooling demand is high, the control device controls the power supply module to supply power to both the water pump 122 and the fan 124. In one embodiment, the control device controls the power supply module to supply power only to the fan 124. At this time, since the water pump 122 is not operating, the flow rate of the cooling medium in the medium circuit is slow, and the heat exchange efficiency between the cooled medium after heat exchange in the heat dissipation assembly and the air is lower than the heat exchange efficiency when the power supply module supplies power to both the water pump 122 and the fan 124. In one embodiment, the control device controls the power supply module to supply power only to the fan 124. Both the heat spreader 127 and the fan 124 in the second chassis 12 can accelerate the heat exchange efficiency between the cooled medium after heat exchange in the first chassis 11 and the air.

[0096] In this embodiment of the disclosure, the control device can control the power supply module to supply power to different components, thereby meeting the cooling requirements under different usage scenarios.

[0097] In some embodiments, the liquid-cooled server 10 further includes a temperature detection module, which is disposed in the first chassis 11 or the second chassis 12.

[0098] Understandably, the liquid-cooled server 10 can also be equipped with a temperature detection module, which is used to detect the temperature inside the chassis of the liquid-cooled server 10. The temperature detection module can be arbitrarily located inside either the first chassis 11 or the second chassis 12.

[0099] Understandably, the control device can obtain the temperature detected by the temperature detection module. The control device is also used to control the operating power of the fan 124 based on the temperature detected by the temperature detection module. When the cooling demand is low, the control device controls the fan 124 to operate at low power; at this time, the fan 124 rotates at a slower speed, and the cooling efficiency of the liquid-cooled server 10 is lower. When the cooling demand is high, the control device controls the fan 124 to operate at high power; at this time, the fan 124 rotates at a faster speed, and the cooling efficiency of the liquid-cooled server 10 is higher.

[0100] In some embodiments, the temperature detection module is disposed within the first chassis 11, close to the motherboard, thereby enabling more accurate determination of the motherboard's cooling requirements. In one embodiment, the temperature detection module may be integrated onto the motherboard.

[0101] In this embodiment of the disclosure, the control device can control the power of the fan to meet the cooling requirements under different usage scenarios.

[0102] The following is a specific example illustrating the liquid-cooled server in the embodiments of this disclosure.

[0103] See Figures 1 to 5As shown, the liquid-cooled server 10 includes a first chassis 11, a second chassis 12, a water inlet pipe 13, and a water outlet pipe 14. The first chassis 11 includes a first top plate, a first bottom plate, and multiple first side plates connecting the first top plate and the first bottom plate. The first top plate, the first bottom plate, and the multiple first side plates enclose a first accommodating cavity, within which the motherboard, control device, power supply module, temperature detection device, and cooling pipes are housed. Among the multiple first side plates is a first back plate 113, on which a water outlet 111 and a water inlet 112 are provided. The water outlet 111 is connected to one end of the cooling pipe, and the water inlet 112 is connected to the other end of the cooling pipe. The first back plate 113 also includes a power interface, an external power switch, and a control device interface.

[0104] The second chassis 12 includes a heat dissipation top plate 127, a second bottom plate, and multiple second side plates. The first ends of the multiple second side plates are connected to the second bottom plate, and the second ends of the multiple second side plates are connected to the heat dissipation top plate 127. The heat dissipation top plate 127 is in contact with the first bottom plate. The second bottom plate, the multiple second side plates, and the heat dissipation top plate 127 together form a second accommodating cavity, within which a heat dissipation assembly is housed. The heat dissipation assembly includes a water pump 122 and a first heat dissipation sub-pipe 1211 and a second heat dissipation sub-pipe 1212 connected to the water pump 122. The first heat dissipation sub-pipe 1211 and the second heat dissipation sub-pipe 1212 are connected in parallel. Among the multiple second side plates is a second back plate 123, whose orientation is the same as that of the first back plate 113. The second back plate 123 has mounting holes, within which a set (3) of fans are mounted. The fan outlets face the heat dissipation assembly (or the second panel 125). The second back panel 123 is also provided with a first through hole and a second through hole. One end of the water inlet pipe 13 is connected to the water outlet 111, and the other end passes through the first through hole and is connected to the water pump 122, the water inlet of the first heat dissipation sub-pipe 1211, and the water inlet of the second heat dissipation sub-pipe 1212. One end of the water outlet pipe 14 is connected to the water inlet 112, and the other end passes through the second through hole and is connected to the water outlet of the first heat dissipation sub-pipe 1211 and the water outlet of the second heat dissipation sub-pipe 1212. A vent 126 is provided on the second panel 125 opposite to the second back panel 123.

[0105] Understandably, the cooling pipes, inlet pipe 13, water pump 122, first heat dissipation sub-pipe 1211, second heat dissipation sub-pipe 1212, and outlet pipe 14 are connected to form a medium loop, in which cooling medium circulates. In the medium loop, the cooling medium in the cooling pipes exchanges heat with the heat load generated by the motherboard. The water pump 122 controls the cooled medium after heat exchange to reach the first heat dissipation sub-pipe 1211 and the second heat dissipation sub-pipe 1212 through the outlet 111 and inlet pipe 13. After heat exchange, the cooled medium exchanges heat with the air inside the second chassis 12 in the first heat dissipation sub-pipe 1211 and the second heat dissipation sub-pipe 1212 and is cooled down. The water pump 122 controls the cooled medium to be reintroduced into the cooling pipes through the outlet pipe 14 and inlet 112, thus circulating the cycle.

[0106] Understandably, the outlet 111 and inlet 112 on the first chassis are located on the first backplate 113, and the first through hole and the second through hole on the second chassis 12 are located on the second backplate 123. This ensures that the inlet pipe 13 and outlet pipe 14 do not affect the heat dissipation top plate 127 in the second chassis 12 during the process of connecting the heat dissipation components and cooling pipes, thereby enabling the liquid-cooled server to be compatible with multiple liquid cooling solutions.

[0107] In this embodiment, the liquid-cooled server comes with a liquid cooling system, which can maintain stable operation in different application scenarios, thereby effectively reducing equipment costs and saving space.

[0108] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0109] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A liquid-cooled server, characterized in that, include: The first chassis contains a motherboard and cooling pipes; The cooling pipe is in contact with the motherboard; A second chassis is disposed opposite to the first chassis; the second chassis contains a heat dissipation component, which is connected to the cooling pipe to form a medium loop, and a cooling medium circulates in the medium loop; In the medium circuit, the cooling medium in the cooling pipe exchanges heat with the heat load generated by the motherboard. After heat exchange, the cooling medium is input into the heat dissipation component for cooling. After cooling, the cooling medium is input back into the cooling pipe.

2. The liquid-cooled server according to claim 1, characterized in that, The heat dissipation component includes: a water pump and a heat dissipation pipe connected to the water pump; the water pump, the heat dissipation pipe, and the cooling pipe form the medium circuit; In the medium circuit, the water pump controls the input of the cooling medium after heat exchange into the heat dissipation pipe for cooling, and controls the input of the cooled medium back into the cooling pipe after cooling.

3. The liquid-cooled server according to claim 2, characterized in that, The heat dissipation pipe includes at least two heat dissipation sub-pipes, which are connected in parallel, and each of the at least two heat dissipation sub-pipes is connected to the water pump. In the medium circuit, the water pump controls the cooling medium after heat exchange to be simultaneously input into the at least two heat dissipation sub-pipes for cooling, and controls the cooled cooling medium to be input into the cooling pipe again after cooling.

4. The liquid-cooled server according to claim 2 or 3, characterized in that, The heat dissipation pipe includes: a heat dissipation pipe body and heat dissipation fins sleeved on the outer periphery of the heat dissipation pipe body; The cooling medium after heat exchange is input into the heat dissipation pipe body, and undergoes secondary heat exchange with the outside air through the heat dissipation fins.

5. The liquid-cooled server according to claim 2 or 3, characterized in that, The first chassis is provided with a water outlet and a water inlet; the two ends of the cooling pipe are respectively connected to the water outlet and the water inlet; The liquid-cooled server further includes: an inlet pipe and an outlet pipe; one end of the inlet pipe is connected to the outlet, and the other end is connected to the first end of the heat dissipation pipe; one end of the outlet pipe is connected to the inlet, and the other end is connected to the second end of the heat dissipation pipe; the inlet pipe, the water pump, the heat dissipation pipe, the outlet pipe, and the cooling pipe form the medium circuit; The cooling medium after heat exchange is input into the heat dissipation pipe through the outlet and the inlet; the cooling medium after cooling is input into the cooling pipe again through the outlet and the inlet.

6. The liquid-cooled server according to claim 5, characterized in that, The first chassis is formed by a first top plate, a first bottom plate and a plurality of first side plates connecting the first top plate and the first bottom plate, and the water outlet and the water inlet are provided on the first back plate of the plurality of first side plates; The second chassis includes: a second base plate and a plurality of second side plates, wherein the plurality of second side plates are connected end to end to form a ring structure, the first end of the plurality of second side plates is connected to the second base plate, and the second end of the plurality of second side plates is connected to the first base plate; a first through hole and a second through hole are provided on the second back plate of the plurality of second side plates; The inlet pipe passes through the first through hole and is connected to the outlet, while the outlet pipe passes through the second through hole and is connected to the inlet.

7. The liquid-cooled server according to claim 6, characterized in that, The second chassis further includes a heat-spreading top plate, wherein the heat-spreading top plate is attached to the first bottom plate, and the second ends of the plurality of second side plates are connected to the first bottom plate by connecting the heat-spreading top plate.

8. The liquid-cooled server according to claim 1, characterized in that, The second chassis has an assembly hole; at least one fan is installed in the assembly hole, and the air outlet of each of the at least one fan faces the heat dissipation component; The air inside the second chassis exchanges heat with the cooling medium in the heat dissipation component and is heated, and the fan cools the heated air inside the second chassis.

9. The liquid-cooled server according to claim 1, characterized in that, The first chassis also houses a power supply module, which is connected to the water pump and the fan; The power supply module supplies power to the water pump and / or fan.

10. The liquid-cooled server according to claim 9, characterized in that, The liquid-cooled server further includes a temperature detection module, which is disposed in the first chassis or the second chassis. The power of the fan is controlled based on the temperature detected by the temperature detection module.

Images