A compact on-board computing unit

Abstract

The application discloses a compact airborne computing unit and relates to the technical field of edge computing devices, and aims to solve the problems of large volume, poor heat dissipation and poor anti-overload performance of the computing unit in the prior art. The compact airborne computing unit comprises an outer frame, a mainboard unit and a heat dissipation assembly, the heat dissipation assembly is connected with the outer frame and forms a cavity structure with the outer frame, and the mainboard unit is arranged in the cavity. The outer frame comprises an interface plate, a connecting plate, a side plate and a bottom plate, the interface plate is connected with the connecting plate and the bottom plate, the bottom plate is connected with the side plate, and a frame structure is formed. The compact airborne computing unit has good sealing performance and small volume, so that the compact airborne computing unit is convenient to use on devices such as unmanned aerial vehicles.

Description

Technical Field

[0001] This invention relates to the field of edge computing device technology, and more particularly to a compact airborne computing unit. Background Technology

[0002] In today's field of unmanned mobile robots, drones and ground robots already play important roles. To achieve intelligent functions such as autonomous operation, environmental perception, and real-time decision-making in unmanned mobile robots, edge computing devices have become a major solution.

[0003] In existing technologies, edge computing devices are often large in size, have poor heat dissipation, and are poor in resisting solid and liquid intrusion as well as external impacts or overloads. Summary of the Invention

[0004] Based on the above analysis, the present invention aims to provide a compact airborne computing unit to solve the problems of large size, poor heat dissipation and overload resistance of computing units in the prior art.

[0005] The objective of this invention is mainly achieved through the following technical solutions:

[0006] The present invention discloses a compact airborne computing unit, including an outer frame, a motherboard unit and a heat dissipation component. The heat dissipation component is connected to the outer frame and forms a cavity structure with the outer frame. The motherboard unit is disposed in the cavity of the cavity structure.

[0007] Furthermore, the outer frame includes an interface plate, a connecting plate, a side plate, and a bottom plate. The interface plate is connected to the connecting plate and the bottom plate, and the bottom plate is connected to the side plate.

[0008] Furthermore, the interface board, the connecting plate, the side plate, and the bottom plate adopt a countersunk hole design and are connected by countersunk screws.

[0009] Furthermore, the heat dissipation assembly includes a first heat dissipation plate and a second heat dissipation plate, which are connected to the outer frame to form a closed cavity.

[0010] Furthermore, both the first heat sink and the second heat sink are contact-type heat sinks.

[0011] Furthermore, a sealing strip is provided within the closed cavity formed by the first heat sink, the second heat sink, and the outer frame.

[0012] Furthermore, the motherboard unit is disposed between the first heat sink and the second heat sink.

[0013] Furthermore, the motherboard unit includes a motherboard and a connecting post, and the motherboard is connected to the first heat sink and the second heat sink via the connecting post.

[0014] Furthermore, the motherboard unit also includes a heat-conducting block, which is in contact with the motherboard and the second heat sink.

[0015] Furthermore, it also includes an active cooling fan, which is connected to the first heat sink and / or the second heat sink.

[0016] Furthermore, it also includes a connecting assembly, which includes a fixing plate, a first positioning rod, and a second positioning rod. The fixing plate is fixedly connected to the drone or other external equipment, and the first and second positioning rods are fixed on the connecting plate. Both the first and second positioning rods are connected to the fixing plate.

[0017] Furthermore, the first positioning rod and the second positioning rod are arranged in a triangle.

[0018] Furthermore, a slot is provided on the fixed plate, a first connector is provided on the first positioning rod, and a second connector is provided on the second positioning rod. The first connector and the second connector can be fixed to the connection between the connecting plate and the fixed plate by entering the slot.

[0019] Furthermore, a spring pin is provided on the first positioning rod, and a pin hole is provided on the fixing plate. The pin hole cooperates with the spring pin, and the spring pin entering the pin hole can prevent the first connector from shifting.

[0020] Furthermore, it also includes an overload protection unit, which includes a connecting frame and an overload protection component. The connecting frame is connected to the heat dissipation component and the outer frame, and the overload protection component is disposed between the connecting frame and the heat dissipation component and the outer frame.

[0021] Furthermore, the connecting frame is configured as a cavity structure, and the closed structure formed by the first heat sink, the second heat sink, and the outer frame is set inside the cavity of the connecting frame.

[0022] Furthermore, the overload protection component includes a slide rod, a slider, a first compression spring, and a second compression spring. The slider is mounted on the slide rod and can move along the slide rod. One end of the slide rod connected to the connecting frame is connected to the slider via the second compression spring, and the other end is connected to the slider via the first compression spring.

[0023] Furthermore, a spring ball pin is provided on the other end of the slide rod that connects to the connecting frame. Connecting ball holes are provided on the first heat dissipation plate, the second heat dissipation plate, the connecting plate, and the side plate. The spring ball pin cooperates with the connecting ball hole so that the spring ball pin can enter the connecting ball hole.

[0024] Furthermore, the overload protection unit also includes a disassembly component, which is disposed in the cavity of the connecting frame. The disassembly component contacts the first heat sink and the second heat sink. A spring is provided on the disassembly component, and the disassembly component is connected to the connecting frame by the spring.

[0025] Furthermore, the assembly / disassembly parts are also equipped with fixing heads and pull rods, and fixing grooves are provided on the first and second heat dissipation plates, allowing the fixing heads to be inserted into the fixing grooves.

[0026] Furthermore, when the fixing head is inserted into the fixing slot, the spring is in a compressed state.

[0027] Furthermore, a movable block is provided on the assembly / disassembly component, and a sliding groove is provided inside the cavity of the connecting frame, allowing the movable block to move within the connecting frame.

[0028] Compared with the prior art, the present invention can achieve at least one of the following beneficial effects:

[0029] (1) The compact airborne computing unit provided by the present invention can achieve high computing power in a small volume by setting a motherboard unit, thereby reducing the volume of the computing unit and making it easy to combine the computing unit with drones or robots; by setting a variety of interfaces, the versatility and adaptability of the computing unit are increased, and the application range of the computing unit is expanded; by setting a heat dissipation component and an active cooling fan, the motherboard unit can be cooled in time to prevent the motherboard unit from overheating and damaging the circuit; by setting a first partition, a second partition and a sealing strip, the dustproof and liquid-proof capability of the compact airborne computing unit is increased, preventing dust and liquid from entering the cavity and damaging the motherboard unit. It has good sealing performance and small volume, thus making it easy to use in drones and other equipment.

[0030] (2) The compact airborne computing unit provided by this invention can be connected to other external devices such as drones by setting a connecting component. A fixing plate is connected to the drone or other external device. A slot is provided on the fixing plate. A first positioning rod and a second positioning rod are fixed to the connecting plate. A first connector is provided on the first positioning rod, and a second connector is provided on the second positioning rod. The slot engages with the first and second connectors, allowing them to enter the slot, thereby connecting the connecting plate to the fixing plate. A spring pin on the first positioning rod prevents displacement of the first connector, thus preventing the first and second connectors from sliding out of the slot. When it is necessary to connect or disconnect the computing unit, simply pressing the spring pin allows the first and second connectors to be pulled out of the slot, thus completing the connection and disconnection of the computing unit. The structure is simple, the operation is convenient, and the use is easy.

[0031] (3) The compact airborne computing unit provided by the present invention can reduce the risk of impact overload by setting an overload protection unit. The overload protection unit includes a connecting frame and an overload protection component. The connecting frame is set as a cavity structure to avoid affecting the disassembly of the base plate and the use function of the computing unit. The overload protection component plays a role in offsetting part of the impact force on the compact airborne computing unit. When the compact airborne computing unit is maneuvering at high speed or is impacted by an external force, the slider moves along the slider and is subjected to the elastic force of the first compression spring and the second compression spring to generate a force opposite to the inertial force on the compact airborne computing unit, thereby offsetting part of the impact force on the compact airborne computing unit, effectively reducing the risk of overload on the compact airborne computing unit and providing protection for the computing unit.

[0032] (4) The compact airborne computing unit provided by the present invention further includes a disassembly component for the overload protection unit. The overload protection unit is connected to the heat dissipation assembly and the outer frame through the disassembly component, thereby facilitating the disassembly of the overload protection unit. When it is necessary to separate the overload protection unit from the heat dissipation assembly, the pull rod is moved away from the first heat dissipation plate and the second heat dissipation plate, causing the spring to be further compressed. At the same time, the fixing head is moved out of the fixing groove, and the overload protection unit is moved away from the outer frame, causing the spring ball pin to be moved out of the connecting ball hole, thereby separating the overload protection unit from the heat dissipation assembly. By setting the disassembly component, the overload protection unit can be detachably connected to the first heat dissipation plate and the second heat dissipation plate. When there is no risk of overload, the overload protection unit can be removed, reducing the size and weight of the compact airborne computing unit. It is simple to operate and convenient to use.

[0033] In this invention, the above-described technical solutions can be combined with each other to achieve more preferred combinations. Other features and advantages of this invention will be set forth in the following description, and some advantages may become apparent from the description or be learned by practicing the invention. The objects and other advantages of this invention can be realized and obtained through the embodiments described and the accompanying drawings, which are particularly pointed out. Attached Figure Description

[0034] The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Throughout the drawings, the same reference numerals denote the same parts.

[0035] Figure 1 This is a schematic diagram of the overall structure of the compact airborne computing unit according to Embodiment 1 of the present invention;

[0036] Figure 2 This is a schematic diagram of the motherboard unit and heat dissipation assembly according to Embodiment 1 of the present invention;

[0037] Figure 3This is a schematic diagram of the mainboard unit according to Embodiment 1 of the present invention;

[0038] Figure 4 This is a schematic diagram of the overall structure of the compact airborne computing unit according to Embodiment 2 of the present invention;

[0039] Figure 5 A schematic diagram of the connection component in Embodiment 2 of the present invention;

[0040] Figure 6 This is a schematic diagram of the overload protection unit according to Embodiment 3 of the present invention;

[0041] Figure 7 This is a schematic diagram of the overload protection component according to Embodiment 3 of the present invention;

[0042] Figure 8 This is a schematic diagram of the connection between the overload protection unit, the heat dissipation component, and the outer frame in Embodiment 3 of the present invention;

[0043] Figure 9 This is a schematic diagram of the connection between the overload protection unit, the heat dissipation component, and the outer frame in Embodiment 4 of the present invention;

[0044] Figure 10 This is a structural schematic diagram of the disassembly and assembly components of Embodiment 4 of the present invention.

[0045] Figure label:

[0046] 1-Outer frame; 11-Interface board; 12-Connecting board; 2-Main board unit; 21-Main board; 22-First partition; 23-Connecting column; 24-Second partition; 25-Heat conduction block; 3-Heat dissipation assembly; 31-First heat sink; 32-Second heat sink; 4-Active cooling fan; 5-Connecting assembly; 51-Fixing plate; 52-First positioning rod; 53-Second positioning rod; 6-UAV; 7-Overload protection unit; 71-Connecting frame; 711-Slide groove; 72-Disassembly / assembly component; 721-Fixing head; 722-Pull rod; 723-Spring; 724-Moving block; 73-Overload protection assembly; 731-Slide rod; 7311-Spring ball pin; 732-Sliding ball; 733-First compression spring; 734-Second compression spring. Detailed Implementation

[0047] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, which form part of the present invention and are used together with the invention to illustrate the principles of the invention.

[0048] Example 1

[0049] This embodiment provides a compact airborne computing unit, such as Figures 1-2As shown, it includes an outer frame 1, a motherboard unit 2 and a heat dissipation component 3. The heat dissipation component 3 is connected to the outer frame 1 and forms a cavity structure with the outer frame 1. The motherboard unit 2 is disposed in the cavity of the cavity structure.

[0050] like Figure 1 As shown, the outer frame 1 includes an interface board 11, a connecting board 12, a side plate, and a bottom plate. The interface board 11 is connected to the connecting board 12 and the bottom plate, and the bottom plate is connected to the side plate. The interface board 11 is equipped with multiple different interfaces according to the application scenario, such as an integrated communication and power supply interface and a video input interface. The connecting board 12 can be connected to external devices such as robots and drones.

[0051] Preferably, the interface board 11, the connecting plate 12, the side plate and the bottom plate adopt a countersunk hole design and are connected by countersunk screws, thereby improving the flatness of the outer surface of the compact airborne computing unit.

[0052] like Figure 2 As shown, the heat dissipation component 3 includes a first heat dissipation plate 31 and a second heat dissipation plate 32. The first heat dissipation plate 31 and the second heat dissipation plate 32 are connected to the outer frame 1 to form a closed cavity. The main board unit 2 is disposed in the cavity of the cavity structure.

[0053] Preferably, a sealing strip is provided in the cavity formed by the first heat sink 31, the second heat sink 32 and the outer frame 1, thereby increasing the dust and liquid resistance of the compact airborne computing unit and preventing dust and liquid from entering the cavity and damaging the motherboard unit 2.

[0054] like Figures 2-3 As shown, the motherboard unit 2 includes a motherboard 21 and a connecting post 23. The motherboard 21 is connected to the first heat sink 31 and the second heat sink 32 via the connecting post 23. The motherboard 21 includes a data acquisition card and a communication module. For example, the motherboard 21 includes modules such as an SDI data acquisition card, a TTL to 422 module, and a TTL to 232 module, giving the motherboard 21 high computing power, small size, and rich interface capabilities. The motherboard 21 is prior art and will not be described in detail here.

[0055] For example, the connecting post 23 is made of materials such as copper or stainless steel.

[0056] Preferably, there are four connecting posts 23, which can provide four-point support for the motherboard 21 and increase the stability of the motherboard 21 connection.

[0057] The motherboard unit 2 also includes a first partition 22 and a second partition 24. One end of the first partition 22 is connected to the first heat sink 31, and the other end is connected to the second heat sink 32. The first partition 22 has multiple first interfaces and is positioned to mate with the base plate; removing the base plate exposes the first interfaces. One end of the second partition 24 is connected to the first heat sink 31, and the other end is connected to the second heat sink 32. The second partition 24 has multiple second interfaces and is positioned to mate with the side plate; removing the side plate exposes the second interfaces. External devices can be connected to the motherboard 21 through the first and second interfaces. The first partition 22 and the second partition 24 prevent large foreign objects from entering the cavity and damaging the motherboard 21 during device debugging.

[0058] For example, the first interface is an HDMI interface, and the second interface is a USB interface.

[0059] Preferably, both the first heat sink 31 and the second heat sink 32 are contact-type heat sinks, which dissipate heat from the motherboard 21 and the acquisition card on the motherboard 21 by contacting them.

[0060] For example, the first heat sink 31 is a CPU heat sink, and the second heat sink 32 is a data acquisition card heat sink.

[0061] Preferably, the motherboard unit 2 further includes a heat-conducting block 25. The data acquisition card on the motherboard 21 contacts the second heat sink 32 through the heat-conducting block 25, which plays a role in conducting heat and raising the data acquisition card, thereby increasing the heat dissipation and structural stability of the motherboard 21.

[0062] Preferably, grooves are provided on the first heat sink 31 and the second heat sink 32, and protrusions are provided on the first partition 22 and the second partition 24. The protrusions cooperate with the grooves, thereby connecting the first partition 22 and the second partition 24 to the first heat sink 31 and the second heat sink 32 respectively.

[0063] Preferably, a light guide hole is provided on the first heat sink 31, and the position of the light guide hole corresponds to the position of the indicator light on the motherboard 21, thereby indicating the working status of the motherboard 21.

[0064] Preferred, such as Figure 1 As shown, the compact airborne computing unit also includes an active cooling fan 4, which is connected to the first heat sink 31 and / or the second heat sink 32 to enhance the heat dissipation effect.

[0065] Example 2

[0066] This embodiment provides a compact airborne computing unit, such as Figures 4-5 As shown, it also includes a connection component 5, which connects the connection plate 12 to the drone 6 or the robot.

[0067] like Figure 4 As shown, taking the UAV 6 as an example, the connecting component 5 includes a fixing plate 51, a first positioning rod 52 and a second positioning rod 53. The fixing plate 51 is fixedly connected to the UAV 6. The first positioning rod 52 and the second positioning rod 53 are fixed on the connecting plate 12. Both the first positioning rod 52 and the second positioning rod 53 are connected to the fixing plate 51, thereby connecting the compact airborne computing unit to the UAV 6.

[0068] Preferably, multiple second positioning rods 53 are provided to increase the stability of the connection between the connecting plate 12 and the fixing plate 51.

[0069] Preferably, the first positioning rod 52 and the second positioning rod 53 are arranged in a triangle to increase the stability of the connection between the connecting plate 12 and the fixing plate 51.

[0070] Furthermore, such as Figure 5 As shown, a slot 511 is provided on the fixing plate 51, a first plug 521 is provided on the first positioning plug 52, and a second plug 531 is provided on the second positioning plug 53. The slot 511 cooperates with the first plug 521 and the second plug 531, so that the first plug 521 and the second plug 531 enter the slot 511, thereby connecting the fixing plate 12 and the fixing plate 51.

[0071] Furthermore, a spring pin 522 is provided on the first positioning rod 52, and a pin hole is provided on the fixing plate 51. The pin hole cooperates with the spring pin 522. The spring pin 522 entering the pin hole can prevent the first connector 521 from shifting, thereby preventing the first connector 521 and the second connector 531 from sliding out of the slot 511.

[0072] When the compact airborne computing unit needs to be connected to the UAV 6, the first connector 521 and the second connector 531 are inserted into the slot 511, and the spring pin 522 is pressed to enter the pin hole 512, thereby preventing the first connector 521 from shifting and keeping the first connector 521 and the second connector 531 always in the slot 511; when the compact airborne computing unit needs to be separated from the UAV 6, the spring pin 522 is pressed to leave the pin hole 512, the connecting plate 12 is moved, and the first connector 521 and the second connector 531 are moved out of the slot 511, thereby separating the compact airborne computing unit from the UAV 6.

[0073] By setting up the connection component 5, the compact airborne computing unit can be quickly connected and disconnected from the UAV 6. The structure is simple, the operation is easy, and the use is convenient.

[0074] Example 3

[0075] This embodiment provides a compact airborne computing unit, such as Figure 6 As shown, the difference from Embodiment 1 and Embodiment 2 is that it also includes an overload protection unit 7, which is connected to the heat dissipation component 3 and the outer frame 1, and is used to reduce the risk of the compact airborne computing unit being subjected to impact overload.

[0076] like Figures 6-8 As shown, the overload protection unit 7 includes a connecting frame 71 and an overload protection component 73. The connecting frame 71 is connected to the heat dissipation component 3 and the outer frame 1. The connecting frame 71 is configured as a cavity structure to avoid affecting the disassembly of the base plate. The outer frame 1 is set inside the cavity of the connecting frame 71. Multiple overload protection components 72 are configured and are set between the connecting frame 71 and the heat dissipation component 3 or the outer frame 1 to buffer the impact on the compact airborne computing unit.

[0077] For example, the connecting frame 71 is connected to the first heat sink 31, the second heat sink 32, the connecting plate 12 and the side plate by bolts.

[0078] like Figure 7 As shown, the overload protection assembly 73 includes a slide rod 731, a slider 732, a first compression spring 733, and a second compression spring 734. The slider 732 is mounted on the slide rod 731 and can move along the slide rod 731. One end of the slide rod 731 is connected to the connecting frame 71, and the other end is provided with a spring ball pin 7311. The first heat sink 31, the second heat sink 32, the connecting plate 12, and the side plate are all provided with connecting ball holes. The spring ball pin 7311 cooperates with the connecting ball hole, allowing the spring ball pin 7311 to enter the connecting ball hole, thereby connecting the connecting frame 71 to the first heat sink 31, the second heat sink 32, the connecting plate 12, and the side plate through the overload protection assembly 73. The end of the slide rod 731 connected to the connecting frame 71 is connected to the slider 732 through the second compression spring 734, and the other end is connected to the slider 732 through the first compression spring 733.

[0079] When the compact airborne computing unit is maneuvering at high speed or subjected to external impact, the slider 732 moves along the slider 731. The first compression spring 733 and the second compression spring 734 generate forces in the opposite direction to the inertial force on the compact airborne computing unit under the movement of the slider 732, thereby offsetting part of the impact force on the compact airborne computing unit and reducing the risk of overload of the compact airborne computing unit.

[0080] Example 4

[0081] This embodiment provides a compact airborne computing unit, such as Figures 9-10As shown, the difference from Embodiment 3 is that the overload protection unit 7 further includes a disassembly / assembly component 72, which connects the overload protection unit 7 to the heat dissipation assembly 3. The disassembly / assembly component 72 is disposed in the cavity of the connecting frame 71, and contacts the first heat dissipation plate 31 and the second heat dissipation plate 32. A spring 723 is provided on the disassembly / assembly component 72, and the disassembly / assembly component 72 is connected to the connecting frame 71 through the spring 723.

[0082] Furthermore, the disassembly / assembly component 72 is also equipped with a fixing head 721 and a pull rod 722. The first heat sink 31 and the second heat sink 32 are provided with fixing grooves, and the fixing head 721 can be inserted into the fixing grooves, thereby connecting the overload protection unit 7 to the heat dissipation assembly 3. When the fixing head 721 is inserted into the fixing groove, the spring 723 is in a compressed state.

[0083] Preferably, as shown, the disassembly / assembly component 72 is further provided with a moving block 724, and the cavity of the connecting frame 71 is further provided with a sliding groove 711. The moving block 724 can move within the connecting frame 71, thereby allowing the disassembly / assembly component 72 to move along the sliding groove 711, increasing the stability of the movement of the disassembly / assembly component 72 and preventing the disassembly / assembly component 72 from shifting.

[0084] When it is necessary to connect the overload protection unit 7 to the heat dissipation assembly 3, the pull rod 722 is moved away from the first heat dissipation plate 31 and the second heat dissipation plate 32, so that the spring 723 is further compressed. The connecting frame 71 is moved until the fixing head 721 is in position with the fixing groove. The pull rod 722 is released, and the fixing head 721 enters the fixing groove under the action of the spring 723, thereby connecting the overload protection unit 7 to the heat dissipation assembly 3. When it is necessary to separate the overload protection unit 7 from the heat dissipation assembly 3, the pull rod 722 is moved away from the first heat dissipation plate 31 and the second heat dissipation plate 32, so that the spring 723 is further compressed. At the same time, the fixing head 721 is moved out of the fixing groove. The overload protection unit 7 is moved away from the outer frame 1, so that the spring ball pin 7311 is moved out of the connecting ball hole, thereby separating the overload protection unit 7 from the heat dissipation assembly 3.

[0085] By setting the detachable assembly 72, the overload protection unit 7 can be detachably connected to the first heat sink 31 and the second heat sink 32. When there is no risk of overload, the overload protection unit 7 can be removed, thereby reducing the size and weight of the compact airborne computing unit. It is easy to operate and use.

[0086] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention.

Claims

1. A compact airborne computing unit, characterized in that, It includes an outer frame (1), a motherboard unit (2) and a heat dissipation component (3). The heat dissipation component (3) is connected to the outer frame (1) and forms a cavity structure with the outer frame (1). The motherboard unit (2) is disposed in the cavity of the cavity structure.

2. The compact airborne computing unit according to claim 1, characterized in that, The outer frame (1) includes an interface plate (11), a connecting plate (12), a side plate, and a bottom plate. The interface plate (11) is connected to the connecting plate (12) and the bottom plate, and the bottom plate is connected to the side plate.

3. The compact airborne computing unit according to claim 2, characterized in that, The interface plate (11), the connecting plate (12), the side plate and the bottom plate adopt a countersunk hole design and are connected by countersunk screws.

4. The compact airborne computing unit according to claim 1, characterized in that, The heat dissipation component (3) includes a first heat dissipation plate (31) and a second heat dissipation plate (32), which are connected to the outer frame (1) to form a closed cavity.

5. The compact airborne computing unit according to claim 4, characterized in that, Both the first heat sink (31) and the second heat sink (32) are contact type heat sinks.

6. The compact airborne computing unit according to claim 4, characterized in that, A sealing strip is provided in the closed cavity formed by the first heat sink (31) and the second heat sink (32) and the outer frame (1).

7. The compact airborne computing unit according to claim 4, characterized in that, The motherboard unit (2) is disposed between the first heat sink (31) and the second heat sink (32).

8. The compact airborne computing unit according to claim 7, characterized in that, The motherboard unit (2) includes a motherboard (21) and a connecting post (23). The motherboard (21) is connected to the first heat sink (31) and the second heat sink (32) through the connecting post (23).

9. The compact airborne computing unit according to claim 8, characterized in that, The motherboard unit (2) further includes a heat-conducting block (25), which is in contact with the motherboard (21) and the second heat sink (32).

10. The compact airborne computing unit according to any one of claims 4-9, characterized in that, It also includes an active cooling fan (4), which is connected to the first heat sink (31) and / or the second heat sink (32).

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