Film abnormal state monitoring alarm device and film production apparatus

Abstract

The utility model discloses a kind of film abnormal state monitoring alarm device and film production equipment, it is related to film production equipment technical field, wherein, film abnormal state monitoring alarm device is applied to film production equipment, film abnormal state monitoring alarm device includes shell and circuit board installed in the inside of shell, integrated with sensor unit, alarm unit and microcontroller on circuit board, sensor unit and alarm unit are electrically connected with microcontroller, microcontroller is used to receive and handle the detection signal collected by sensor unit, and alarm unit is controlled to alarm.The technical scheme provided by the utility model is by integrating sensor unit, alarm unit and microcontroller on the same circuit board, simplify the structure of alarm device.

Description

Technical Field

[0001] This utility model relates to the field of thin film production equipment technology, and in particular to a thin film abnormality monitoring and alarm device and a thin film production equipment. Background Technology

[0002] In the film production process, it is usually necessary to monitor the condition of the film in real time to ensure product quality. When abnormalities such as abnormal temperature or thickness deviation occur, an alarm device should be activated in a timely manner so that operators can respond and handle the situation quickly.

[0003] In existing technologies, alarm devices generally include sensors for collecting membrane state parameters and alarm components for outputting alarm signals. These components are typically located in different positions and electrically connected via external wires. While this structure can achieve basic monitoring and alarm functions, the numerous cables required for interconnection between components result in a relatively complex overall structure. Utility Model Content

[0004] The main purpose of this invention is to propose a film abnormality monitoring and alarm device and film production equipment, aiming to simplify the structure of the film abnormality monitoring and alarm device.

[0005] To achieve the above objectives, the present invention proposes a film abnormality monitoring and alarm device, which is applied to film production equipment. The film abnormality monitoring and alarm device includes a housing and a circuit board installed inside the housing. The circuit board integrates a sensor unit, an alarm unit, and a microcontroller. The sensor unit and the alarm unit are both electrically connected to the microcontroller. The microcontroller is used to receive and process the detection signals collected by the sensor unit and control the alarm unit to sound an alarm.

[0006] In one embodiment, the housing has a first accommodating cavity and a second accommodating cavity separated inside. The circuit board has a first functional area located in the first accommodating cavity and a second functional area located in the second accommodating cavity in its length direction. The sensor unit includes a laser thickness sensor located in the first functional area and an infrared temperature sensor located in the second functional area. The housing has an optical window corresponding to the laser thickness sensor and an infrared transmission window corresponding to the infrared temperature sensor.

[0007] In one embodiment, the circuit board further has a third functional area disposed between the first functional area and the second functional area along its length, and the third functional area is located within the first receiving cavity, with the microcontroller disposed in the third functional area.

[0008] In one embodiment, the inner or outer wall of the first receiving cavity is provided with a heat dissipation structure.

[0009] In one embodiment, a heat insulation structure is provided between the first receiving cavity and the second receiving cavity.

[0010] In one embodiment, the sensor unit further includes a humidity sensor, which is located at the end of the second functional area away from the first functional area, and the housing has a vent hole corresponding to the humidity sensor.

[0011] In one embodiment, the housing includes a first housing portion and a second housing portion joined together. The first housing portion has a partition portion located between the first receiving cavity and the second receiving cavity. The partition portion abuts against one side of the circuit board. The second housing portion forms a receiving groove corresponding to the second receiving cavity. The alarm unit is located on the side of the circuit board away from the second functional area and is received in the receiving groove.

[0012] In one embodiment, the alarm unit includes a light-emitting element and a sound-emitting element. The second housing portion has a light-transmitting area in its circumference corresponding to the light-emitting element and a sound-emitting hole corresponding to the sound-emitting element.

[0013] In one embodiment, the inner peripheral wall of the first shell portion is provided with a support portion, the support portion is provided with a first positioning post facing the second shell portion, the second shell portion is provided with a second positioning post facing the first shell portion, one side of the circuit board abuts against the support portion and is provided with a positioning hole corresponding to the first positioning post, and the second positioning post abuts against the other side of the circuit board.

[0014] This utility model also proposes a thin film production equipment, including a frame and a mounting bracket installed on the frame, and the aforementioned thin film abnormality monitoring and alarm device, wherein the thin film abnormality monitoring and alarm device is installed on the mounting bracket.

[0015] The technical solution of this utility model integrates the sensor unit, alarm unit, and microcontroller onto the same circuit board and encapsulates them within a housing. Internal connections are made via circuit board wiring, while external connections to external devices require only a few interfaces (such as power and communication interfaces). This reduces the number of external cables and significantly lowers wiring complexity during assembly. This not only simplifies the structure of the thin-film abnormality monitoring and alarm device but also facilitates its installation and maintenance. In essence, by concentrating all functional modules within a single housing, a standardized and modular thin-film abnormality monitoring and alarm device is formed. During installation, simply fixing the entire device in a suitable position significantly reduces installation difficulty and improves efficiency. Maintenance also makes it easier to locate problems, requiring attention only to the internal circuit board or a few external interfaces, greatly improving maintenance efficiency and reducing subsequent maintenance costs. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0017] Figure 1 A schematic diagram of the structure of an embodiment of the film production equipment provided by this utility model;

[0018] Figure 2 A schematic diagram of an embodiment of the membrane abnormality monitoring and alarm device provided by this utility model;

[0019] Figure 3 for Figure 2 A cross-sectional view of the thin film abnormality monitoring and alarm device along line M1-M1;

[0020] Figure 4 for Figure 2 A cross-sectional view of the abnormal condition monitoring and alarm device for the thin film along line M2-M2;

[0021] Figure 5 for Figure 3 Top view of one side of the circuit board;

[0022] Figure 6 for Figure 3 A top view of the other side of the circuit board.

[0023] Explanation of icon numbers:

[0024] 10. Alarm device; 20. Frame; 30. Mounting bracket; 100. Housing; 200. Circuit board; 300. Sensor unit; 400. Alarm unit; 500. Microcontroller; 600. Heat dissipation structure; 700. Heat insulation structure; 110. First housing part; 111. First receiving cavity; 112. Second receiving cavity; 113. Support part; 114. First positioning post; 115. Optical window; 116. Infrared transmission window; 117. Vent hole; 120. Second housing part; 121. Receiving groove; 122. Second positioning post; 123. Light transmission area; 124. Sound emitting hole; 130. Separator; 210. Positioning hole; 310. Laser thickness sensor; 320. Infrared temperature sensor; 330. Humidity sensor; 410. Light-emitting element; 420. Sound-emitting element.

[0025] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0027] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0028] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0029] This invention proposes a membrane abnormality monitoring and alarm device.

[0030] Please see Figures 1 to 3 In one embodiment of this utility model, the film abnormality monitoring and alarm device 10 is applied to film production equipment. The film abnormality monitoring and alarm device 10 includes a housing 100 and a circuit board 200 installed inside the housing 100. The circuit board 200 integrates a sensor unit 300, an alarm unit 400, and a microcontroller 500. The sensor unit 300 and the alarm unit 400 are both electrically connected to the microcontroller 500. The microcontroller 500 is used to receive and process the detection signals collected by the sensor unit 300 and control the alarm unit 400 to sound an alarm.

[0031] The film abnormality monitoring and alarm device 10 is an intelligent monitoring system applied in film production equipment. It is used to detect abnormalities that may occur during the film production process in real time and to issue an alarm in a timely manner when an abnormality is detected.

[0032] Specifically, the housing 100 is the external protective structure of the entire thin-film abnormality monitoring and alarm device 10, serving to install and protect the internal components. The housing 100 can be made of materials such as alloys or engineering plastics to adapt to the industrial environment of the thin-film production line. The circuit board 200 is installed inside the housing 100, and integrates multiple functional modules, including a sensor unit 300, an alarm unit 400, and a microcontroller 500. Both the sensor unit 300 and the alarm unit 400 are electrically connected to the microcontroller 500 through circuits on the circuit board 200. The circuitry is integrated on the circuit board 200, reducing connectors and exposed wires, and lowering the risk of poor contact and open circuits.

[0033] The sensor unit 300 is responsible for real-time acquisition of key status parameters during the film production process. Depending on the monitoring requirements, the sensor unit 300 can be a thickness sensor for monitoring film thickness deviation, a temperature sensor for monitoring whether the film production equipment or film temperature is abnormal, a humidity sensor 330 for monitoring the ambient humidity in the film production process, or a speed sensor for tracking production line speed fluctuations, etc. The microcontroller 500, as the core control unit, receives the electrical signals from the sensor unit 300, processes and analyzes the signals using a built-in algorithm, and compares the processed signal parameters with preset thresholds (such as thickness tolerance, upper temperature limit, humidity range, etc.) to determine whether the current state deviates from the preset normal range. If an abnormality is detected, an alarm signal is sent to the alarm unit 400; it can also be connected to a host computer for remote monitoring. The alarm unit 400 is triggered by the microcontroller 500 and can be an audible and visual alarm, such as a buzzer, LED indicator, or display screen, used to issue a clear warning signal in the form of sound, light, or text prompts when the film abnormality monitoring alarm device 10 detects an abnormal signal, reminding operators to intervene in a timely manner. In addition, communication modules (such as RS485, Wi-Fi, Bluetooth) can be integrated on the circuit board 200 to upload data to a PLC (Programmable Logic Controller) or a central control system to achieve intelligent management.

[0034] The technical solution of this utility model integrates the sensor unit 300, alarm unit 400, and microcontroller 500 onto the same circuit board 200 and encapsulates them within a housing 100. Internal connections are made via wiring on the circuit board 200, while external connections to external devices (such as PLCs) require only a few interfaces (e.g., power and communication interfaces), reducing the number of external cables and significantly lowering wiring complexity during assembly. This not only simplifies the structure of the thin-film abnormality monitoring and alarm device 10 but also facilitates its installation and maintenance. Understandably, by concentrating all functional modules within a housing 100, a standardized and modular thin-film abnormality monitoring and alarm device 10 is formed. During installation, simply fixing the entire device in a suitable position significantly reduces installation difficulty and improves installation efficiency. Maintenance also makes it easier to locate problems, requiring only attention to the internal circuit board 200 or a few external interfaces, greatly improving maintenance efficiency. Even replacing the entire module is more efficient than troubleshooting each circuit individually, thus reducing future maintenance costs.

[0035] Furthermore, the integration of the sensor unit 300, alarm unit 400, and microcontroller 500 onto the same circuit board 200 makes the thin film abnormality monitoring and alarm device 10 smaller and more suitable for the space-constrained requirements of modern thin film production lines. The modular structure of the thin film abnormality monitoring and alarm device 10 facilitates mass production and standardized assembly, improving product consistency. The thin film abnormality monitoring and alarm device 10 can be installed as a standard module in different types of thin film production equipment, enhancing its versatility.

[0036] Furthermore, in related technologies, the sensor unit 300, alarm unit 400, and microcontroller 500 communicate via external wires. Signal transmission requires traversing multiple lines, which may cause data delays due to line impedance or interference, affecting the speed of abnormal response. For example, the temperature signal collected by the sensor needs to be transmitted to the controller via a long wire, and then triggered by another wire.

[0037] This invention directly connects the microcontroller 500 to the sensor and alarm unit 400 via electrical connection. Through high-speed communication within the circuit board 200, it eliminates signal transmission delays from external cables, ensuring rapid response throughout the entire process of monitoring data acquisition, processing, and alarm.

[0038] In one implementation, please refer to Figures 3 to 5 The housing 100 has a first receiving cavity 111 and a second receiving cavity 112 separated inside. The circuit board 200 has a first functional area located in the first receiving cavity 111 and a second functional area located in the second receiving cavity 112 in its length direction. The sensor unit 300 includes a laser thickness sensor 310 located in the first functional area and an infrared temperature sensor 320 located in the second functional area. The housing 100 has an optical window 115 corresponding to the laser thickness sensor 310 and an infrared transmission window 116 corresponding to the infrared temperature sensor 320.

[0039] The interior of the housing 100 is divided into independent first receiving cavity 111 and second receiving cavity 112 by partitions or protrusions. The circuit board 200 passes through the first receiving cavity 111 and the second receiving cavity 112, and has a first functional area and a second functional area along its length.

[0040] The first functional area, located within the first receiving cavity 111, integrates a laser thickness sensor 310. Based on the principle of laser triangulation or coherent detection technology, the laser thickness sensor 310 calculates the thickness deviation of the thin film by emitting a laser beam and receiving reflected light from the film surface. An optical window 115, corresponding to the position of the laser thickness sensor 310, can be made of optical glass or quartz. Its function is to allow the emitted light from the laser thickness sensor 310 to penetrate the housing 100, illuminate the film surface, and receive the reflected light back to the sensor, ensuring complete transmission of the laser signal.

[0041] The second functional area, located within the second receiving cavity 112, integrates an infrared temperature sensor 320. The infrared temperature sensor 320 calculates the temperature value by receiving infrared radiation energy (proportional to temperature) from the thin film surface and applying Planck's law. An infrared transmission window 116 is provided corresponding to the position of the infrared temperature sensor 320 and can be made of germanium glass or zinc sulfide (which has high transmittance in the infrared band). Its function is to allow infrared radiation emitted from the thin film surface to penetrate the housing 100 and be received by the detector of the infrared temperature sensor 320, preventing the housing 100 material from blocking the infrared signal.

[0042] The laser thickness sensor 310 generates considerable heat during operation, and the infrared temperature sensor 320 is susceptible to fluctuations in ambient temperature. By designing the first receiving cavity 111 and the second receiving cavity 112 as independent chambers, the risk of heat from the first receiving cavity 111 being directly transferred to the second receiving cavity 112 can be reduced. Furthermore, a heat insulation structure 700, such as heat insulation cotton, can be provided between the first receiving cavity 111 and the second receiving cavity 112 to ensure a stable operating temperature for the infrared temperature sensor 320. Alternatively, a heat dissipation structure 600 can be provided in the first receiving cavity 111.

[0043] The film abnormality monitoring and alarm device 10 integrates a laser thickness sensor 310 and an infrared temperature sensor 320 into a single housing 100 through an integrated design. Only one mounting location is needed on the film production line (such as a monitoring point near the winding machine) to simultaneously monitor both thickness and temperature. Furthermore, the compartmentalized design allows for a more compact connection between the sensor and the circuit board 200 (internal PCB traces replace external cables). During maintenance, only the cover of the corresponding chamber needs to be opened to inspect a single sensor, eliminating the need to disassemble the entire device, significantly reducing maintenance time and labor costs.

[0044] Furthermore, in film production, thickness anomalies and temperature anomalies are often correlated; for example, excessively high temperatures can cause the film to stretch and thin. The film anomaly monitoring and alarm device 10 integrates a laser thickness sensor 310 and an infrared temperature sensor 320 in separate cavities, enabling simultaneous acquisition of film thickness and temperature data, which are then analyzed by a microcontroller 500. This multi-parameter collaborative monitoring mode not only avoids the limitations of traditional single-parameter monitoring (such as the inability to identify temperature-related anomalies when only thickness is monitored) but also improves the accuracy of anomaly detection through data correlation.

[0045] In other embodiments, the housing 100 may have only one receiving cavity inside, and the circuit board 200 may have only one sensor integrated, or multiple low-power sensors integrated.

[0046] In one implementation, please refer to Figures 3 to 5 The circuit board 200 also has a third functional area located between the first functional area and the second functional area along its length, and the third functional area is located within the first receiving cavity 111, and the microcontroller 500 is located in the third functional area.

[0047] Along the length of the circuit board 200, a first functional area, a third functional area, and a second functional area are sequentially distributed. The third functional area and the first functional area are both located within the first receiving cavity 111, while the second functional area is independently located within the second receiving cavity 112. The first receiving cavity 111 accommodates the first and third functional areas. The laser thickness sensor 310, which generates a significant amount of heat, and the microcontroller 500 are integrated within the first receiving cavity 111, while the infrared temperature sensor 320, which generates less heat, is independently integrated within the second receiving cavity 112. The microcontroller 500 and the laser sensor are the main heat sources in the thin-film abnormality monitoring and alarm device 10. Concentrating them within the first receiving cavity 111 facilitates unified thermal management and prevents the heat generated by the laser thickness sensor 310 and the microcontroller 500 from affecting the measurement accuracy of the infrared temperature sensor 320.

[0048] Furthermore, a heat sink or thermally conductive silicone pad can be installed in the first receiving cavity 111 to concentrate and dissipate heat, preventing high temperatures from causing a performance degradation of the microcontroller 500 chip. In addition, the microcontroller 500 is positioned between the laser thickness sensor 310 and the infrared temperature sensor 320, resulting in shorter connection lines between the microcontroller 500 and each sensor. This reduces signal transmission delay and interference, improves data acquisition and processing efficiency, enhances the real-time monitoring capability of the thin-film abnormality monitoring and alarm device 10, and strengthens the response sensitivity of the thin-film abnormality monitoring and alarm device 10.

[0049] In other embodiments, a third receiving cavity is also formed inside the housing 100. The third receiving cavity is located between the first receiving cavity 111 and the second receiving cavity 112, and is independent of the first receiving cavity 111 and the second receiving cavity 112. The third functional area is provided corresponding to the third receiving cavity.

[0050] In one implementation, please refer to Figure 3 and Figure 4 The inner or outer wall of the first receiving cavity 111 is provided with a heat dissipation structure 600.

[0051] The heat dissipation structure 600 is designed to allow heat to be dissipated from the first cavity 111 in a timely manner, preventing the microcontroller 500 from being degraded or damaged by the laser thickness sensor 310 due to local overheating. This improves the operational reliability of the thin film abnormality monitoring and alarm device 10 and extends its service life. The heat dissipation structure 600 can take various forms. For example, heat sinks (such as aluminum alloy, copper alloy, or graphite sheets) can be welded or pasted onto the inner wall of the first receiving cavity 111. The other side of the heat sink abuts against the side of the circuit board 200 away from the first functional area. By increasing the contact area with the heat-generating area, the high thermal conductivity of the heat sink can be used to quickly conduct heat. Alternatively, high thermal conductivity silicone can be filled between the heat-generating area and the inner wall of the cavity. One side of the thermally conductive silicone abuts against the side of the circuit board 200 away from the first functional area, and the other side abuts against the inner wall of the housing 100 to fill the gap between the inner wall of the housing 100 and the circuit board 200, thereby improving heat conduction efficiency. A fin-like structure can also be designed on the outer wall of the first receiving cavity 111 of the housing 100 to increase the contact area with the external air and accelerate heat dissipation. Heat dissipation holes can also be opened to form air convection channels and promote heat exchange between the inside and outside of the first receiving cavity 111.

[0052] In one implementation, please refer to Figure 3 and Figure 4 A heat insulation structure 700 is provided between the first receiving cavity 111 and the second receiving cavity 112.

[0053] The heat insulation structure 700 is used to block the heat transfer path between the first receiving cavity 111 and the second receiving cavity 112, which helps to reduce the interference of heat in the first receiving cavity 111 on the components in the second receiving cavity 112, thereby improving the independence and stability of the infrared temperature sensor 320 and ensuring the measurement accuracy of the infrared temperature sensor 320. The heat insulation structure 700 can serve as a partition 130 located inside the housing 100 to separate the first receiving cavity 111 and the second receiving cavity 112. Alternatively, the first receiving cavity 111 and the second receiving cavity 112 can also be additionally provided with a partition 130, and the heat insulation structure 700 can cover the partition 130. The thermal insulation structure 700 can be made by pasting or spraying a material with low thermal conductivity (such as polyurethane foam, ceramic fiber felt, or aerogel) onto the partition 130, which blocks heat transfer through the low thermal conductivity of the material itself; it can also be made by creating a closed air gap in the partition 130, which utilizes the low thermal conductivity of air to form a natural thermal insulation layer; it can also be a composite thermal insulation structure 700 that first coats the partition 130 with a layer of material with low thermal conductivity and then leaves an air gap, which further improves the thermal insulation performance; or it can be thermal insulation cotton fixed to the surface of the partition 130.

[0054] In one implementation, please refer to Figures 3 to 5 The sensor unit 300 also includes a humidity sensor 330, which is located at the end of the second functional area away from the first functional area. The housing 100 has a vent hole 117 corresponding to the humidity sensor 330.

[0055] During film production, ambient humidity has a certain impact on film performance. For example, high humidity may cause water vapor to adsorb on the film surface, leading to adhesion, decreased tensile strength, or poor coating adhesion in printing and lamination processes; low humidity environments are prone to static electricity, causing the film to attract dust, break during winding, or ignite due to friction with equipment; drastic fluctuations in humidity may cause film dimensional instability, affecting the accuracy of subsequent processing.

[0056] The humidity sensor 330 of this invention collects humidity data of the surrounding environment of the film in real time through the vent 117 and transmits it to the microcontroller 500 for processing. It analyzes the data in conjunction with temperature and thickness data. If the humidity exceeds the set range, the alarm unit 400 is triggered to issue an alarm. Operators can take measures such as ventilation, dehumidification or humidification according to the prompts to ensure stable production.

[0057] The humidity sensor 330 is located at the end of the second functional area away from the first functional area. This layout places the humidity sensor 330 adjacent to the infrared temperature sensor 320 in the second functional area, but isolates it from the laser thickness sensor 310 in the first functional area and the microcontroller 500 in the third functional area, thus preventing the heat generated by the microcontroller 500 and the laser thickness sensor 310 from affecting the accuracy of humidity measurement.

[0058] The vent 117 can be a tiny round hole or a multi-hole array, allowing external air or moisture around the film to enter the second receiving cavity 112 through the vent 117 and directly contact the sensing element of the humidity sensor 330 (such as a capacitive humidity-sensitive resistor or a resistive humidity-sensitive element) to achieve real-time acquisition of ambient humidity.

[0059] It's worth noting that the vent 117 is not simply an opening, but rather a design that balances the conflict between "humidity sensing" and "dust and water resistance." The diameter (e.g., 0.5mm-1mm) and number (e.g., 3-5) of the vent 117 need to be small enough to prevent large dust particles from entering, while ensuring airflow (airflow velocity ≥0.1m / s) so that the humidity sensor 330 can respond quickly to environmental changes. Furthermore, a composite structure combining a waterproof and breathable membrane with a dustproof mesh (e.g., a GORE membrane combined with a sintered stainless steel mesh) can be installed at the vent 117, allowing water vapor to pass through while blocking liquid water and dust.

[0060] In one implementation, please refer to Figures 4 to 6 The housing 100 includes a first housing portion 110 and a second housing portion 120 that are spliced ​​together. The first housing portion 110 has a partition portion 130 located between the first receiving cavity 111 and the second receiving cavity 112. The partition portion 130 abuts against one side of the circuit board 200. The second housing portion 120 has a receiving groove 121 corresponding to the second receiving cavity 112. The alarm unit 400 is located on the side of the circuit board 200 away from the second functional area and is housed in the receiving groove 121.

[0061] The housing 100 includes a first housing part 110 and a second housing part 120, which are assembled by means of snap-fit ​​connection, bolt fixing, or welding. By disassembling the complex integral housing 100 into two or more simple parts, the processing difficulty of the housing 100, such as injection molding and stamping, can be reduced; during maintenance, only the housing part corresponding to the problem area needs to be disassembled, such as only opening the second housing part 120 to inspect the alarm unit 400, without the need for an overall disassembly device; according to the installation space of the production line equipment, the size or shape of the first housing part 110 and the second housing part 120 can be flexibly adjusted, for example, in narrow areas or irregular installation positions, the shape of the first housing part 110 and the second housing part 120 can be adapted to be L-shaped or arc-shaped, etc.

[0062] The first housing 110 has a partition 130 located inside between the first receiving cavity 111 and the second receiving cavity 112, and one end face of the partition 130 is in close contact with the circuit board 200. By abutting against the side of the circuit board 200, the partition 130 can fix the position of the circuit board 200, providing support and limiting for the circuit board 200, preventing it from shaking inside the housing 100, and ensuring the installation accuracy of the sensor unit 300, microcontroller 500, and alarm unit 400. The partition 130 also serves to physically isolate the first receiving cavity 111 and the second receiving cavity 112.

[0063] The alarm unit 400 is integrated into the receiving groove 121 of the second housing 120 and corresponds to the second receiving cavity 112. That is, the alarm unit 400 is located away from the microcontroller 500 and the laser thickness sensor 310, reducing the impact of heat generated by the microcontroller 500 and the laser thickness sensor 310 on the performance of the alarm unit 400. Simultaneously, the alarm unit 400 is located on the side of the circuit board 200 away from the second functional area. That is, the alarm unit 400, along with the infrared temperature sensor 320 and humidity sensor 330 located in the second functional area, are located on opposite sides of the circuit board 200. The substrate of the circuit board 200 itself can be used as an electromagnetic shielding layer to reduce the electromagnetic interference of the alarm unit 400 on the sensor unit 300, thereby ensuring the accuracy of the sensor unit 300's measurements. This also avoids problems such as pin crossing and pad overlap causing component crowding.

[0064] In other embodiments, the alarm unit 400 may also be located in the second functional area.

[0065] In one implementation, please refer to Figures 2 to 4 The alarm unit 400 includes a light-emitting element 410 and a sound-emitting element 420. The second housing 120 has a light-transmitting area 123 in its circumferential direction corresponding to the light-emitting element 410, and a sound-emitting hole 124 corresponding to the sound-emitting element 420.

[0066] The alarm unit 400 improves alarm response efficiency and enhances warning effects through a combination of sound and light. The light-emitting element 410, in conjunction with the circumferential light-transmitting area 123, provides omnidirectional visible light alarm, preventing alarms from being missed due to angle. The sound-emitting element 420, combined with the sound-emitting hole 124, ensures clear and accurate sound transmission, improving alarm sensitivity. The light-emitting element 410 can use indicator lights of various colors. With the light-transmitting area 123 aligned with the light-emitting element 410, light emitted through the light-transmitting area 123 forms a clear "light spot" or "light band," guiding operators to quickly locate abnormalities. The sound-emitting holes 124 can be arranged in a ring, allowing operators to hear the alarm sound from all directions; alternatively, they can be arranged in a single-sided array, directing the sound towards the control panel where the operator stands, preventing sound from spreading outwards and being difficult to detect in time. The light-transmitting area 123 is made of transparent or semi-transparent material, allowing light from the light-emitting element 410 to pass through while preventing moisture and dust from the production line from entering the housing 100 and affecting light transmittance. The sound-emitting hole 124 is equipped with a metal mesh or plastic baffle, which can intercept larger particles and prevent them from entering the housing 100 and clogging the sound-emitting element 420, without affecting the sound transmission.

[0067] The alarm unit 400 can be electrically connected to a host system (computer) and implement tiered alarms. For example, in case of a minor anomaly, a yellow LED indicator light will illuminate, and the computer screen will display the abnormal parameters and location; in case of a moderate anomaly, the yellow LED indicator light will flash, an intermittent low-frequency buzzer will sound, and the screen will scroll to display detailed anomaly information; in case of a severe anomaly, the red LED indicator light will flash rapidly, a high-frequency buzzer will sound continuously, and an emergency alarm message can be sent to the host system through a preset communication interface.

[0068] In other embodiments, the alarm unit 400 may include only the light-emitting element 410 or only the sound-emitting element 420.

[0069] In one implementation, please refer to Figures 3 to 5 The inner peripheral wall of the first shell 110 is provided with a support 113. The support 113 is provided with a first positioning post 114 facing the second shell 120, and the second shell 120 is provided with a second positioning post 122 facing the first shell 110. One side of the circuit board 200 abuts against the support 113 and is provided with a positioning hole 210 corresponding to the first positioning post 114. The second positioning post 122 abuts against the other side of the circuit board 200.

[0070] A support portion 113 is disposed on the inner peripheral wall of the first housing portion 110, and may be an annular protrusion or a strip-shaped boss. The support portion 113 abuts against one side of the circuit board 200, providing support for the circuit board 200. A first positioning post 114 is disposed on the support portion 113, facing the second housing portion 120, and is used to insert into the positioning hole 210 on the circuit board 200, restricting the lateral displacement of the circuit board 200 and achieving preliminary positioning of the circuit board 200. A second positioning post 122 is disposed on the second housing portion 120, facing the first housing portion 110, and abuts against the other side of the circuit board 200. Together with the support portion 113, it firmly clamps and limits the circuit board 200, restricting the longitudinal displacement of the circuit board 200.

[0071] The bidirectional positioning (lateral and longitudinal) design of the first positioning post 114 and the second positioning post 122 effectively prevents the circuit board 200 from shifting or loosening due to vibration, ensuring the normal operation of the sensor unit 300, microcontroller 500, and alarm unit 400 on the circuit board 200, improving system stability, and extending the service life of the thin-film abnormal state monitoring alarm device 10. Simultaneously, the cooperation between the positioning hole 210 and the first positioning post 114 enables rapid alignment and installation of the circuit board 200, improving assembly efficiency and preventing poor connections or contact failures due to assembly errors.

[0072] In other embodiments, the inner peripheral wall of the first housing 110 may be provided with a slot, and the edge of the circuit board 200 may be placed in the slot to position and fix the circuit board 200.

[0073] This utility model also proposes a film production equipment, which includes a frame 20, a mounting bracket 30 installed on the frame 20, and a film abnormality monitoring and alarm device 10. The specific structure of the film abnormality monitoring and alarm device 10 is as described in the above embodiments. Since this film production equipment adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here. The film abnormality monitoring and alarm device 10 is installed on the mounting bracket 30.

[0074] Please see Figure 1The frame 20 is the basic support structure of the film production equipment, typically a metal frame, providing stability and load-bearing capacity. A mounting bracket 30 is fixed to the frame 20 and is used to install the film abnormality monitoring and alarm device 10. The film abnormality monitoring and alarm device 10 is used to monitor parameters such as film thickness, temperature, and humidity in real time, and issues an alarm when abnormalities occur. The film abnormality monitoring and alarm device 10 is fixed to the frame 20 via the mounting bracket 30, which can be adjusted in angle or height according to actual needs to adapt to different film running paths. The film abnormality monitoring and alarm device 10 is usually located near the film's travel path for easy monitoring of the film's condition.

[0075] The above description is merely an exemplary embodiment of the present utility model and does not limit the scope of protection of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the scope of protection of the present utility model.

Claims

1. A film abnormal state monitoring alarm device applied to a film production equipment, characterized in that, The thin-film abnormality monitoring and alarm device includes a housing and a circuit board installed inside the housing. The circuit board integrates a sensor unit, an alarm unit, and a microcontroller. The sensor unit and the alarm unit are both electrically connected to the microcontroller. The microcontroller is used to receive and process the detection signals collected by the sensor unit and control the alarm unit to sound an alarm.

2. The membrane abnormality monitoring and alarm device as described in claim 1, characterized in that, The housing has a first accommodating cavity and a second accommodating cavity separated inside. The circuit board has a first functional area located in the first accommodating cavity and a second functional area located in the second accommodating cavity along its length. The sensor unit includes a laser thickness sensor located in the first functional area and an infrared temperature sensor located in the second functional area. The housing has an optical window corresponding to the laser thickness sensor and an infrared transmission window corresponding to the infrared temperature sensor.

3. The membrane abnormality monitoring and alarm device as described in claim 2, characterized in that, The circuit board also has a third functional area located between the first functional area and the second functional area along its length, and the third functional area is located within the first receiving cavity, with the microcontroller located in the third functional area.

4. The membrane abnormality monitoring and alarm device as described in claim 2, characterized in that, The inner or outer wall of the first receiving cavity is provided with a heat dissipation structure.

5. The membrane abnormality monitoring and alarm device as described in claim 2, characterized in that, A heat insulation structure is provided between the first accommodating cavity and the second accommodating cavity.

6. The membrane abnormality monitoring and alarm device as described in claim 2, characterized in that, The sensor unit also includes a humidity sensor, which is located at the end of the second functional area away from the first functional area, and the housing has a vent hole corresponding to the humidity sensor.

7. The membrane abnormality monitoring and alarm device as described in claim 2, characterized in that, The housing includes a first housing portion and a second housing portion that are spliced ​​together. The first housing portion has a partition portion located between the first receiving cavity and the second receiving cavity. The partition portion abuts against one side of the circuit board. The second housing portion has a receiving groove corresponding to the second receiving cavity. The alarm unit is located on the side of the circuit board away from the second functional area and is received in the receiving groove.

8. The membrane abnormality monitoring and alarm device as described in claim 7, characterized in that, The alarm unit includes a light-emitting element and a sound-emitting element. The second housing has a light-transmitting area in its circumference corresponding to the light-emitting element, and a sound-emitting hole corresponding to the sound-emitting element.

9. The membrane abnormality monitoring and alarm device as described in claim 7, characterized in that, The inner peripheral wall of the first shell is provided with a support portion, the support portion is provided with a first positioning post facing the second shell portion, the second shell portion is provided with a second positioning post facing the first shell portion, one side of the circuit board abuts against the support portion and is provided with a positioning hole corresponding to the first positioning post, and the second positioning post abuts against the other side of the circuit board.

10. A thin film production equipment, characterized in that, The device includes a frame and a mounting bracket mounted on the frame, and a membrane abnormality monitoring and alarm device as described in any one of claims 1 to 9, wherein the membrane abnormality monitoring and alarm device is mounted on the mounting bracket.

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