Temperature sensing device for high frequency induction heating power supply based on sic devices

Abstract

The utility model discloses a high frequency induction heating power temperature sensing device based on sic device relates to power temperature sensing device field, the utility model discloses a heating power and temperature sensing device, the both sides of heating power are through the installation mechanism and temperature sensing device dismounting connection, through setting collapsible installation mechanism, wherein under the equipment working condition, through the installation mechanism of unfolding, realized the firm fixing and flexible adjustment of temperature sensing device position and angle, make infrared temperature sensor's emission head accurate, dead angle -freely aim at the key heating part such as SiC device of heating power, effectively realized real -time accurate monitoring to temperature, and this kind of stable installation mode has guaranteed that sensing device does not occur shift or slack in the equipment operation process, provides reliable guarantee for the safe operation of sensitive device under high temperature environment.

Description

Technical Field

[0001] This utility model relates to the field of power supply temperature sensing devices, specifically a high-frequency induction heating power supply temperature sensing device based on SiC devices. Background Technology

[0002] High-frequency induction heating power supplies based on SiC devices utilize the superior properties of silicon carbide, such as its high breakdown electric field. They can efficiently convert electrical energy at high frequencies, providing power for industrial production processes such as metal heating, improving efficiency and quality while reducing losses and size, representing a future technological trend. To ensure stable operation, an infrared temperature sensor is installed. While SiC devices offer advantages in high-frequency operation, they generate a significant amount of heat. If not monitored accurately and promptly, this heat can accelerate aging and damage, affecting power supply operation. Infrared temperature sensors offer non-contact measurement, fast response, and high accuracy, providing real-time and precise temperature feedback, offering reliable data for temperature control systems.

[0003] Currently, infrared temperature sensors and SiC-based high-frequency induction heating power supplies are separate components, requiring additional mounting brackets during assembly. However, if the provided mounting bracket is incompatible or forgotten, the infrared temperature sensor may fail to install. This not only severely delays the assembly of the high-frequency induction heating power supply, disrupting the already tight production schedule and increasing time costs and production management difficulties, but also, if the sensor is not installed or is improperly installed only after the equipment is already operational, it will affect the real-time and accurate monitoring of the SiC device temperature. Consequently, abnormal temperature conditions may not be detected in time, potentially leading to overheating damage to the SiC device, equipment failure, and production interruption. Utility Model Content

[0004] Based on this, the purpose of this utility model is to provide a temperature sensing device for a high-frequency induction heating power supply based on SiC devices, in order to solve the technical problems of existing infrared temperature sensors and high-frequency induction heating power supplies based on SiC devices being set up separately, requiring additional mounting brackets, and being unable to install the sensor due to incompatible mounting brackets or not having them, thus delaying the assembly progress, affecting the production plan, increasing management difficulty, and after the equipment is in operation, the sensor installation problem may prevent the real-time accurate monitoring of the SiC device temperature, leading to device damage and equipment failure.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a high-frequency induction heating power supply temperature sensing device based on SiC devices, comprising a heating power supply and a temperature sensing device, wherein the two sides of the heating power supply are connected to the temperature sensing device for installation and detachment through an installation mechanism.

[0006] The installation mechanism includes a mounting base, which is fixedly connected to a heating power source by bolts. A first telescopic sleeve is provided on one side of the mounting base, and a first pull rod is engaged and slidably mounted on one side of the first telescopic sleeve. A telescopic rod is provided on one side of the first pull rod, and a second pull rod is engaged and slidably mounted on the top of the telescopic rod. A storage groove is provided on the second pull rod, and a fourth telescopic sleeve is rotatably connected to the storage groove through a damping shaft. A third pull rod is engaged and slidably mounted on one side of the fourth telescopic sleeve, and a temperature sensing device is screwed to the end of the third pull rod.

[0007] By adopting the above technical solution, the problems of complex installation and difficult adaptation caused by the separate installation of infrared sensors and heating power supplies are solved. The proprietary installation mechanism enables quick assembly and disassembly and precise positioning of the temperature sensing device without the need for additional supports; furthermore, this mechanism can be folded into an integrated handle, eliminating the need for separate handling tools and improving equipment portability and operational efficiency.

[0008] Furthermore, when the mounting mechanism is unfolded, it can be used to install a temperature sensing device and facilitate the temperature sensing device to detect the heating power supply.

[0009] By adopting the above technical solution, the multi-stage telescopic structure in the unfolded state enables the temperature sensing device to cover the temperature measurement needs of different areas of the heating power supply, ensuring that the infrared sensor emitter can flexibly align with key heat points such as SiC devices, and eliminating monitoring blind spots.

[0010] Furthermore, the mounting mechanism can be folded to form a handle, making it easy to pick up and transport the heating power source.

[0011] By adopting the above technical solution, the folded mechanism forms an ergonomic handle, which uses its own metal components to bear the load, avoiding equipment damage or operational risks caused by gripping the power supply casing during handling.

[0012] Furthermore, the temperature sensing device includes a universal ball joint, which is screwed to the third pull rod.

[0013] By adopting the above technical solution, the screw connection structure between the universal ball seat and the third pull rod allows the temperature sensing device to be quickly installed and removed, while providing multi-dimensional angle adjustment capabilities to adapt to detection surfaces with different orientations.

[0014] Furthermore, an infrared temperature sensor is fixedly connected to the mounting end of the universal ball seat by bolts, and an emitting head is provided at the bottom of the infrared temperature sensor.

[0015] By adopting the above technical solution, the infrared temperature sensor is fixed to the universal ball joint with bolts, ensuring the stability of the sensor during universal adjustment and avoiding vibration and displacement.

[0016] Furthermore, the heating power supply includes a power supply body, and a display screen is provided on one side of the outer surface of the power supply body.

[0017] By adopting the above technical solution, the external display screen of the power supply unit allows operators to read temperature data in real time, avoiding interference with the extension and retraction adjustment of the installation mechanism due to obstructed observation.

[0018] Furthermore, one side of the display screen is provided with an indicator light and a first heat dissipation hole. The first heat dissipation hole is laterally distributed to reserve space for the extension path of the installation mechanism and prevent hot airflow from directly blowing on the sensor and affecting the temperature measurement accuracy.

[0019] Furthermore, the back of the power supply unit is provided with an AC input port, a cooling water pipe interface, a high-frequency output port, a power switch, a function line interface, and a second heat dissipation hole.

[0020] By adopting the above technical solution, all functional interfaces and the second heat dissipation hole are centrally located at the back, ensuring that there is no risk of pipeline entanglement when the installation mechanism is deployed on the side of the equipment, and maintaining the freedom of movement of the mechanism.

[0021] In summary, the present invention has the following main advantages:

[0022] This invention features a foldable and retractable mounting mechanism. When the equipment is in operation, the unfolded mechanism securely fixes and flexibly adjusts the position and angle of the temperature sensing device. This allows the infrared temperature sensor's emitter to accurately and without blind spots align with critical heat-generating components of the heating power supply, such as SiC devices, effectively achieving real-time and accurate temperature monitoring. This stable mounting method ensures that the sensing device does not shift or loosen during equipment operation, providing reliable protection for the safe operation of sensitive devices in high-temperature environments. Furthermore, when the equipment needs to be moved or transported, the mounting mechanism integrates into a sturdy and portable handle by folding and retracting the retractable components. This makes equipment handling easy and efficient, avoiding delays caused by heavy equipment, difficulty in gripping, or the need for additional tools. It provides sufficient convenience and redundancy for production line space adjustments and equipment maintenance, ensuring the continuity and efficiency of the production process and preventing production stoppages due to difficulties in transporting the equipment or inconvenient installation of the temperature measuring device. Attached Figure Description

[0023] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0024] Figure 2 This is a rear-view three-dimensional structural diagram of the present invention;

[0025] Figure 3 This utility model Figure 1 Enlarged structural diagram at point A;

[0026] Figure 4 This utility model Figure 2 A magnified structural diagram at point B in the middle.

[0027] In the diagram: 1. Heating power supply; 101. Power supply body; 102. Display screen; 103. Indicator light; 104. First heat dissipation hole; 105. AC input port; 106. Cooling water pipe interface; 107. High frequency output port; 108. Power switch; 109. Function line interface; 110. Second heat dissipation hole; 2. Mounting mechanism; 201. Mounting base; 202. Bolt; 203. First telescopic sleeve; 204. First pull rod; 205. Telescopic sleeve; 206. Second pull rod; 207. Storage slot; 208. Fourth telescopic sleeve; 209. Third pull rod; 3. Temperature sensing device; 301. Universal ball joint; 302. Infrared temperature sensor; 303. Transmitter head. Detailed Implementation

[0028] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0029] Temperature sensing device for high-frequency induction heating power supply based on SiC device, such as Figure 1-4 As shown, it includes a heating power supply 1 and a temperature sensing device 3. The two sides of the heating power supply 1 are detachably connected to the temperature sensing device 3 through the mounting mechanism 2.

[0030] The mounting mechanism 2 includes a mounting base 201, which is fixedly connected to the heating power supply 1 by bolts 202. A first telescopic sleeve 203 is provided on one side of the mounting base 201, and a first pull rod 204 is engaged and slidably mounted on one side of the first telescopic sleeve 203. A telescopic rod 205 is provided on one side of the first pull rod 204, and a second pull rod 206 is engaged and slidably mounted on the top of the telescopic rod 205. A storage groove 207 is provided on the second pull rod 206, and a fourth telescopic sleeve 208 is rotatably connected to the storage groove 207 via a damping shaft. A third pull rod 209 is engaged and slidably mounted on one side of the fourth telescopic sleeve 208, and the end of the third pull rod 209... A temperature sensing device 3 is screwed to the end, and the heating power supply 1 and the mounting mechanism 2 are stably connected by the bolts 202 of the mounting base 201. By utilizing the engagement and sliding of the first telescopic sleeve 203 and the first pull rod 204, the telescopic adjustment of the telescopic sleeve 205 and the second pull rod 206, and the coordinated action of the fourth telescopic sleeve 208 and the third pull rod 209 connected by the damping shaft in the storage slot 207, the temperature sensing device 3 is provided with multi-degree-of-freedom position adjustment capability in the unfolded state, ensuring accurate sensor positioning. When folded, the components are retracted to form a rigid handle structure, realizing the self-supporting transport function of the equipment and completely eliminating the reliance on additional mounting brackets and handling tools.

[0031] See Figure 1 , Figure 4 When the mounting mechanism 2 is unfolded, it can be used to install the temperature sensing device 3 and facilitate the temperature sensing device 3 to detect the heating power supply 1. When the mounting mechanism 2 is fully unfolded, the first pull rod 204 slides and extends from the first telescopic sleeve 203, the second pull rod 206 is displaced at the top of the telescopic sleeve 205, and the fourth telescopic sleeve 208 unfolds from the storage groove 207 with damping rotation, forming a three-dimensional adjustable support structure. This allows the detection direction and distance of the temperature sensing device 3 to be flexibly adjusted according to the actual position of the SiC device inside the power supply body 101, ensuring that the infrared temperature sensor 302 emitter 303 is aligned with the high-heat risk area without any blind spots.

[0032] See Figure 3 , Figure 4 When the mounting mechanism 2 is folded, it forms a handle, making it easy to pick up and transport the heating power supply 1. By pushing the third pull rod 209 into the fourth telescopic sleeve 208, rotating the fourth telescopic sleeve 208 into the storage groove 207 of the second pull rod 206, sliding the second pull rod 206 into the telescopic sleeve 205, and retracting the first pull rod 204 into the first telescopic sleeve 203, the exposed parts of the mounting base 201, the first telescopic sleeve 203, and the first pull rod 204 form a gripping part that conforms to the curvature of the palm. The weight of the equipment is transmitted to the bolt 202 fixing point of the mounting base 201 through each nested structure, preventing the outer shell from being deformed by force during transportation.

[0033] See Figure 1 , Figure 2 The temperature sensing device 3 includes a universal ball joint 301, which is screwed to the third pull rod 209. The universal ball joint 301 and the threaded connection at the end of the third pull rod 209 enable the temperature sensing device 3 to be installed and removed in a plug-and-play manner. Under the action of damping friction, the ball joint structure of the universal ball joint 301 allows the infrared temperature sensor 302 to rotate freely along the pitch, yaw and roll axes and lock the angle, so that the transmitter head 303 is precisely perpendicular to the surface of the SiC device at any tilt angle inside the heating power supply 1, eliminating the reflectivity measurement error caused by the non-horizontal surface of the measured surface.

[0034] See Figure 1 An infrared temperature sensor 302 is fixedly connected to the mounting end of the universal ball joint 301 by bolts, and an emitting head 303 is provided at the bottom of the infrared temperature sensor 302. The mounting end of the infrared temperature sensor 302 is rigidly connected to the universal ball joint 301 by bolts. During the multi-angle adjustment of the emitting head 303, the bolt preload provides anti-vibration support to prevent the sensor position from shifting due to the loosening of the ball joint rotation, thus ensuring the continuity of temperature signal acquisition.

[0035] See Figure 3 , Figure 4 The heating power supply 1 includes a power supply body 101. A display screen 102 is provided on one side of the outer surface of the power supply body 101. By placing the display screen 102 in a prominent position on the outer surface of the power supply body 101, the operator can clearly read the real-time temperature value fed back by the infrared temperature sensor 302 without having to get close to the equipment during the adjustment process of the installation mechanism 2. This avoids the operator from touching the telescopic components such as the first telescopic sleeve 203 and the first pull rod 204, which could cause structural displacement or misoperation, thus ensuring adjustment efficiency and safety.

[0036] See Figure 1 , Figure 2 The display screen 102 is provided with an indicator light 103 and a first heat dissipation hole 104 on one side. The indicator light 103 located on the same side of the display screen 102 provides a visual warning function for the equipment status, such as over-temperature alarm. The first heat dissipation hole 104 is set to avoid the movement trajectory of the mounting mechanism 2, so that the hot air inside the power supply body 101 is discharged from the side, avoiding the high temperature airflow from being conducted to the temperature sensing device 3 or the direct-blowing transmitter 303 through the first telescopic sleeve 203, telescopic rod 205 and other metal components, thus eliminating the risk of inaccurate temperature measurement caused by thermal radiation interference.

[0037] See Figure 1 , Figure 2As shown in the figure, the back of the power supply body 101 is equipped with an AC input port 105, a cooling water pipe interface 106, a high-frequency output port 107, a power switch 108, a function line interface 109, and a second heat dissipation hole 110. The AC input port 105, cooling water pipe interface 106, high-frequency output port 107, power switch 108, function line interface 109, and second heat dissipation hole 110 are all integrated into the back of the power supply body 101, so that the position of the mounting mechanism 2 on the side of the equipment is kept unobstructed by interfaces, ensuring that the lateral pulling of the first pull rod 204, the longitudinal displacement of the second pull rod 206, and the rotation and unfolding of the fourth telescopic sleeve 208 are not obstructed by cables / water pipes; at the same time, the back air outlet design of the second heat dissipation hole 110 prevents hot air from affecting the temperature sensing device 3 working on the side.

[0038] The implementation principle of this embodiment is as follows: First, when it is necessary to monitor the temperature of the heating power supply 1, the installation mechanism 2 is unfolded: the operator pulls the first pull rod 204 to slide it outward along the first telescopic sleeve 203, adjusts the length of the telescopic sleeve 205, then pulls out the second pull rod 206 to move it along the slide rail at the top of the telescopic sleeve 205, then flips out the fourth telescopic sleeve 208 damping shaft from the storage slot 207 to provide rotation positioning resistance, then pulls out the third pull rod 209 to slide it along the fourth telescopic sleeve 208, and finally positions the temperature sensing device 3 screwed to the end of the third pull rod 209 to the area to be monitored. At this time, the angle of the infrared temperature sensor 302 is adjusted by the universal ball seat 301 to ensure that its emitter 303 is accurately aligned with the heating point of the SiC device of the heating power supply 1, so as to realize real-time temperature detection.

[0039] When the equipment needs to be moved, the mounting mechanism 2 is folded: the third pull rod 209 is pushed into the fourth telescopic sleeve 208 in sequence, the fourth telescopic sleeve 208 is rotated and completely retracted into the storage groove 207, the second pull rod 206 is pushed into the telescopic sleeve 205, the telescopic sleeve 205 is retracted, and finally the first pull rod 204 is pushed into the first telescopic sleeve 203. After folding, the mounting base 201, the first telescopic sleeve 203, the first pull rod 204 and the telescopic sleeve 205 together form a rigid handle structure, which is convenient for gripping and moving the heating power supply 1.

[0040] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the present invention and are not intended to limit the invention. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the present invention, provided that such modifications, substitutions, and variations are within the scope of the claims of the present invention and are protected by patent law.

Claims

1. A high-frequency induction heating power supply temperature sensing device based on SiC devices, characterized in that: It includes a heating power supply (1) and a temperature sensing device (3), wherein the two sides of the heating power supply (1) are detachably connected to the temperature sensing device (3) through a mounting mechanism (2); The installation mechanism (2) includes a mounting base (201), which is fixedly connected to the heating power supply (1) by bolts (202). A first telescopic sleeve (203) is provided on one side of the mounting base (201), and a first pull rod (204) is engaged and slidably attached to one side of the first telescopic sleeve (203). A telescopic sleeve rod (205) is provided on one side of the first pull rod (204), and a second pull rod (206) is engaged and slidably attached to the top of the telescopic sleeve rod (205). A storage groove (207) is provided on the second pull rod (206), and a fourth telescopic sleeve (208) is rotatably connected to the storage groove (207) through a damping shaft. A third pull rod (209) is engaged and slidably attached to one side of the fourth telescopic sleeve (208), and a temperature sensing device (3) is screwed to the end of the third pull rod (209).

2. The high-frequency induction heating power supply temperature sensing device based on SiC device according to claim 1, characterized in that: When the mounting mechanism (2) is unfolded, it can be used to install the temperature sensing device (3) and facilitate the temperature sensing device (3) to detect the heating power supply (1).

3. The high-frequency induction heating power supply temperature sensing device based on SiC device according to claim 1, characterized in that: The mounting mechanism (2) can be folded to form a handle, making it easy to pick up and transport the heating power supply (1).

4. The high-frequency induction heating power supply temperature sensing device based on SiC device according to claim 1, characterized in that: The temperature sensing device (3) includes a universal ball seat (301), which is screwed to the third pull rod (209).

5. The high-frequency induction heating power supply temperature sensing device based on SiC device according to claim 4, characterized in that: The mounting end of the universal ball seat (301) is fixedly connected to an infrared temperature sensor (302) by bolts, and an emitter (303) is provided at the bottom of the infrared temperature sensor (302).

6. The high-frequency induction heating power supply temperature sensing device based on SiC device according to claim 1, characterized in that: The heating power supply (1) includes a power supply body (101), and a display screen (102) is provided on one side of the outer surface of the power supply body (101).

7. The high-frequency induction heating power supply temperature sensing device based on SiC device according to claim 6, characterized in that: The display screen (102) is provided with an indicator light (103) and a first heat dissipation hole (104) on one side.

8. The high-frequency induction heating power supply temperature sensing device based on SiC device according to claim 6, characterized in that: The power supply unit (101) has an AC input port (105), a cooling water pipe interface (106), a high-frequency output port (107), a power switch (108), a function line interface (109), and a second heat dissipation hole (110) on its back.

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