Heat sink and current transformer

Abstract

This application relates to a heat dissipation device and a converter. The heat dissipation device includes a heat sink, a heat transfer component, and a vapor chamber. The contact side of the heat transfer component is used to contact the device to be cooled. The vapor chamber has mounting positions on its mounting side, the number of which is the same as the number of heat transfer components. The heat-conducting side of the heat transfer component is located at the mounting position, and the vapor chamber conducts heat from each mounting position. The heat-conducting side of the vapor chamber is located on the heat sink, which dissipates the heat conducted by the vapor chamber. This heat transfer component can quickly conduct the heat generated by the device to be cooled (such as a power device) from the contact side to the vapor chamber in contact with the heat-conducting side. The vapor chamber can evenly distribute the heat conducted from the heat transfer component, preventing localized heat concentration on the power device, and can also transfer heat to the heat sink, which quickly dissipates the heat to the surrounding environment. This achieves rapid heat dissipation for the power device, improving the performance degradation or failure of the power device caused by high temperatures.

Description

Technical Field

[0001] This application relates to the field of device heat dissipation technology, and in particular to a heat dissipation device and a converter. Background Technology

[0002] With the development of technology, converters are gradually moving towards higher power density and higher space utilization. This trend has greatly improved the performance and efficiency of converters, while also placing higher demands on their heat dissipation capabilities.

[0003] In applications such as photovoltaic power generation, electric vehicles, and industrial frequency conversion, power devices in converters, such as insulated-gate bipolar transistors (IGBTs) and metal-oxide-semiconductor field-effect transistors (MOSFETs), generate a large amount of heat during high-speed operation. Currently, converters often use natural convection for heat dissipation. Natural convection relies mainly on the natural flow of air to remove heat. While it is simple in structure and low in cost, its heat dissipation efficiency is limited and cannot meet the heat dissipation requirements of power devices. When the temperature of power devices exceeds the safe range or localized overheating occurs, it will reduce the performance of the power devices, shorten their lifespan, or even cause them to fail directly, thus affecting the reliability of the converter.

[0004] Therefore, improving the heat dissipation efficiency of power devices is an urgent problem to be solved. Utility Model Content

[0005] Therefore, it is necessary to provide a heat dissipation device and converter that can improve heat dissipation efficiency.

[0006] A heat dissipation device, comprising:

[0007] heat sink;

[0008] A heat transfer assembly having a contact side and a heat-conducting side, the contact side being used to contact the device to be cooled;

[0009] A heat spreader plate has a conductive side and a mounting side. The mounting side is provided with mounting positions, the number of which is the same as the number of heat transfer components. The heat-conducting side of one heat transfer component is located at one of the mounting positions. The conductive side of the heat spreader plate is located on the radiator.

[0010] The heat exchange plate is used to conduct heat from each of the mounting positions, and the heat sink is used to dissipate the heat conducted by the heat exchange plate.

[0011] In one embodiment, the heat transfer assembly includes a base and a plurality of heat pipes. The base has a first side and a second side opposite to each other. The evaporation section of each heat pipe is disposed on the first side of the base, and the condensation section of each heat pipe serves as the heat-conducting side of the heat transfer assembly. The second side of the base serves as the contact side of the heat transfer assembly.

[0012] In one embodiment, a mounting position is provided with a plurality of mounting holes, and in a heat transfer assembly, the condensation section of each heat pipe is provided one-to-one with each of the mounting holes.

[0013] In one embodiment, the heat exchange plate includes a plate body and capillary structures. The plate body has a first side and a second side facing each other. The plate body encloses a receiving cavity, and the capillary structures are wavy and arranged in parallel at intervals within the receiving cavity. The first side of the plate body is provided with the mounting position, and the second side of the plate body serves as the conductive side of the heat exchange plate.

[0014] In one embodiment, the heat spreader is further provided with a plurality of sealing components, each of which is disposed one-to-one in each of the mounting holes.

[0015] In one embodiment, the heat sink includes a substrate and a plurality of heat dissipation fins; a first side of the substrate is used to mount the heat spreader, and each of the heat dissipation fins is arranged parallel to the second side of the substrate.

[0016] In one embodiment, a mounting groove is provided on the first side of the substrate of the heat sink, and the heat spreader is embedded in the mounting groove.

[0017] In one embodiment, the heat dissipation device further includes a controller and a fan connected to it, the fan being disposed on the heat sink, and the controller being used to control the rotation of the fan.

[0018] In one embodiment, the heat dissipation device further includes a temperature detection component connected to the controller, the temperature detection component being used to detect the temperature of each of the mounting positions and output the temperature parameters corresponding to each of the mounting positions to the controller;

[0019] The controller is also used to control the operating power of the fan according to the temperature parameters corresponding to each of the mounting positions, so as to reduce the temperature difference between the mounting positions.

[0020] In one embodiment, the number of fans is the same as the number of mounting positions, and the fans are set corresponding to the mounting positions; the controller is further configured to determine the temperature difference between each mounting position based on the temperature parameters corresponding to each mounting position, and control the operating power of each fan based on the temperature difference.

[0021] A converter includes power devices and a heat dissipation device as described above.

[0022] The aforementioned heat dissipation device and converter include a heat sink, a heat transfer component, and a vapor chamber. The contact side of the heat transfer component is used to contact the device to be cooled. The vapor chamber has mounting positions on its mounting side, the number of which is the same as the number of heat transfer components. The heat-conducting side of the heat transfer component is located at the mounting position, and the vapor chamber is used to conduct heat from each mounting position. The heat-conducting side of the vapor chamber is located on the heat sink, and the heat sink is used to dissipate the heat conducted by the vapor chamber. Thus, the heat transfer component can quickly conduct the heat generated by the device to be cooled (such as a power device) from the contact side to the vapor chamber in contact with the heat-conducting side. The vapor chamber can, on the one hand, evenly distribute the heat conducted from the heat transfer component, avoiding localized heat concentration on the power device; on the other hand, it can transfer the heat to the heat sink, which then quickly dissipates the heat to the surrounding environment. This achieves rapid heat dissipation for the power device, improving the performance degradation or failure of the power device caused by high temperature, and thus improving the operational reliability of the converter. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of a heat dissipation device according to one embodiment;

[0025] Figure 2 This is a schematic diagram of the structure of a heat transfer component according to one embodiment;

[0026] Figure 3 This is a schematic diagram of the structure of a heat spreader according to one embodiment;

[0027] Figure 4 This is a schematic diagram of the internal structure of a heat spreader according to one embodiment;

[0028] Figure 5 This is a schematic diagram of the structure of a heat sink according to one embodiment;

[0029] Figure 6 This is an exploded view of a heat dissipation device according to one embodiment;

[0030] Figure 7 This is a three-dimensional structural schematic diagram of a heat dissipation device according to an embodiment;

[0031] Figure 8 This is a schematic diagram showing the location of a temperature detection component according to one embodiment;

[0032] Figure 9 This is a schematic diagram of the circuit structure of a heat dissipation device according to one embodiment;

[0033] Figure 10 This is a schematic diagram of the control logic of a converter according to one embodiment. Detailed Implementation

[0034] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0035] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0036] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0037] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0038] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0039] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0040] This application provides a heat dissipation device, such as... Figure 1 As shown, the heat dissipation device includes a radiator 1, a heat spreader 2, and a heat transfer component 3.

[0041] The heat transfer component 3 has a contact side and a heat-conducting side, with the contact side used to contact the device 4 to be cooled. The contact method between the contact side of the heat transfer component 3 and the device 4 to be cooled is not limited. For example, the contact side of the heat transfer component 3 is attached to the device 4 to be cooled, or the device 4 to be cooled is mounted on the contact side of the heat transfer component 3, so that heat can be quickly and efficiently conducted from the device 4 to the heat transfer component 3.

[0042] The number of heat transfer components 3 can be set according to specific circumstances. Figure 1 In the embodiment shown, the number of heat dissipation devices 4 is 3, the number of heat transfer components 3 is equal to the number of heat dissipation devices 4, and the contact side of one heat transfer component 3 contacts one heat dissipation device 4 to achieve a one-to-one heat dissipation effect.

[0043] The type of the device to be cooled 4 is not limited. For example, it can be a power device such as an IGBT or MOSFET. The heat transfer component 3 is in contact with the heat-generating part of the power device to quickly conduct and disperse the heat generated by the power device during operation.

[0044] The heat spreader 2 has a conductive side and a mounting side. The mounting side of the heat spreader 2 is provided with mounting positions, the number of which is the same as the number of heat transfer components 3. The conductive side of each heat transfer component 3 is located at one mounting position. This allows the heat conducted by the heat transfer components 3 to be quickly and evenly distributed to the heat spreader 2.

[0045] The heat spreader 2 is used to conduct heat from each installation location. The heat conducted by the heat transfer component 3 diffuses inside the heat spreader 2, making the temperature of the heat spreader 2 more uniform.

[0046] The heat exchange plate 2 is disposed on the heat sink 1 to further conduct the heat distributed on the heat exchange plate 2 to the heat sink 1. The heat sink 1 is used to dissipate the heat conducted by the heat exchange plate 2.

[0047] When the power of the power device fluctuates significantly, it may cause instantaneous temperature differences in the heat spreader 2. By further dissipating heat through the heat sink 1, the local heat accumulation in the heat spreader 2 can be improved, allowing the temperature of the heat spreader 2 to return to a uniform state more quickly, thereby accelerating the cooling of the power device.

[0048] The aforementioned heat dissipation device includes a radiator 1, a heat spreader 2, and a heat transfer assembly 3. The contact side of the heat transfer assembly 3 is used to contact the device 4 to be cooled. The mounting side of the heat spreader 2 is provided with mounting positions, the number of which is the same as the number of heat transfer assemblies 3. The heat conduction side of the heat transfer assembly 3 is located at the mounting positions, and the heat spreader 2 is used to conduct heat from each mounting position. The conduction side of the heat spreader 2 is located at the radiator 1, and the radiator 1 is used to dissipate the heat conducted by the heat spreader 2. Thus, the heat transfer assembly 3 can quickly conduct the heat generated by the device 4 to be cooled from the contact side to the heat spreader 2 in contact with the heat conduction side. The heat spreader 2 can, on the one hand, evenly distribute the heat conducted by the heat transfer assembly 3, avoiding local heat concentration in the power device, and on the other hand, transfer the heat to the radiator 1, which then quickly dissipates the heat to the surrounding environment. This achieves rapid heat dissipation of the power device, improves the performance degradation or failure of the power device caused by high temperature, and thus improves the operational reliability of the converter including the power device.

[0049] In some embodiments, such as Figure 2 As shown, the heat transfer assembly 3 includes a base 31 and multiple heat pipes 32. The base 31 has a first side and a second side facing each other. The evaporation section of each heat pipe 32 is disposed on the first side of the base 31, and the condensation section of each heat pipe 32 serves as the heat-conducting side of the heat transfer assembly 3, that is, the side where the condensation section of the heat pipe is located is the heat-conducting side of the heat transfer assembly 3. The second side of the base 31 serves as the contact side of the heat transfer assembly 3.

[0050] Heat pipe 32 is a high-efficiency phase change heat transfer element that achieves rapid heat conduction through an evaporation-condensation cycle. The evaporation section of heat pipe 32 is located on the first side of base 31, in close contact with base 31, absorbing the heat transferred from the device 4 to be cooled through base 31. The condensation section of heat pipe 32 serves as the heat-conducting side of heat transfer assembly 3, contacting the mounting position of vapor chamber 2 and transferring heat to vapor chamber 2.

[0051] In some embodiments, the axial direction of the heat pipe 32 is perpendicular to the plane of the base 31. After heat is conducted from the contact side to the evaporation section of the heat pipe 32, it is rapidly transferred to the condensation section in a vertical direction. As an example, multiple heat pipes 32 are inserted into the base 31 in a parallel and equally spaced manner or are close to the heat-conducting side surface of the base 31 to form a heat pipe array.

[0052] In this embodiment, when the power device is running, the heat generated is first conducted to the heat pipe array of the heat transfer component 3. The heat is then quickly transferred to the heat spreader 2 by utilizing the high thermal conductivity of the heat pipe array, thereby accelerating heat dissipation.

[0053] In some embodiments, such as Figure 3 As shown, a mounting position is provided with multiple mounting holes 23. In a heat transfer assembly 3, the condensation section of each heat pipe 32 is provided one-to-one with each mounting hole 23.

[0054] Understandable. Figure 3 In the embodiment shown, the heat spreader 2 has 3 mounting positions. Each set of mounting holes on the plate 21 forms a mounting position, and the number of mounting holes 23 in each mounting position is the same as the number of heat pipes 32 in the heat transfer assembly 3.

[0055] In actual implementation, the heat pipe array in the heat transfer assembly 3 is directly inserted into the mounting holes 23 in the mounting position. By directly embedding the condensing section of the heat pipe 32 into the mounting holes 23, the interfacial thermal resistance during heat transfer can be reduced, allowing heat to be conducted more efficiently from the heat transfer assembly 3 to the heat spreader 2, resulting in a more uniform heat distribution on the heat spreader 2. Moreover, the multi-point fixing method achieved by embedding the heat pipe 32 into the mounting holes 23 greatly enhances the mechanical connection strength between the two, reducing the problem of loosening and reduced heat dissipation efficiency due to vibration or other factors.

[0056] In some embodiments, the vapor chamber 2 is filled with a phase change material. When the condenser section of the heat pipe 32 is disposed in the mounting hole 23, the condenser section of the heat pipe 32 is in contact with the phase change material.

[0057] In this embodiment, the mounting hole 23 penetrates the surface of the heat exchanger 2 and comes into contact with the internal phase change material. The condensation section of the heat pipe 32 can directly release heat into the phase change material. The phase change material absorbs a large amount of heat through the phase change process, accelerating the heat absorption rate. Moreover, after absorbing heat, the phase change material achieves uniform heat distribution through liquid diffusion, avoiding local hot spots and improving the temperature uniformity of the heat exchanger 2.

[0058] The phase change material can be selected according to specific needs. As an example, a phase change material is a high thermal conductivity material such as calcium chloride hexahydrate CaCl2·6H2O.

[0059] Specifically, such as Figure 4 As shown, the heat exchanger 2 includes a plate body 21 and capillary structures 24. The plate body 21 has a first side and a second side facing each other. The plate body 21 encloses a receiving cavity, and the capillary structures 24 are wavy and arranged in parallel at intervals within the receiving cavity. Phase change material is filled in the capillary structures 24. A mounting position is provided on the first side of the plate body 21, and the second side of the plate body 21 serves as the conductive side of the heat exchanger 2.

[0060] In this embodiment, the capillary structure 24 has a continuous wavy thin sheet cross-section, with microchannels formed between the crests and troughs. The capillary structures 24 are fixed in a parallel, spaced-apart arrangement within the receiving cavity, forming a uniform gap between adjacent wavy thin sheets. The gap width can be set according to the parameters of the phase change material and actual needs.

[0061] The wave-shaped structure can increase the contact area between the phase change material and the capillary structure 24, improve the thermal conductivity of the phase change material, and thus improve the thermal conductivity and temperature uniformity of the heat exchanger 2.

[0062] In some embodiments, the capillary structure 24 is in the form of micropores (tiny holes) or microgrooves (tiny channels). This structure can help the phase change material maintain a uniform distribution in the cavity through capillary action or physical constraint, avoiding local aggregation or voids, thereby improving the heat dissipation performance of the heat spreader 2.

[0063] In some embodiments, the plate 21 is made of a high thermal conductivity metal material such as copper or aluminum to improve heat dissipation efficiency.

[0064] In some embodiments, the heat spreader 2 is further provided with a plurality of sealing components 22, and the sealing components 22 are provided one-to-one in each mounting hole 23.

[0065] Each mounting hole 23 is equipped with a sealing component 22. The sealing component 22 forms a physical barrier at the opening of the mounting hole 23 to prevent foreign objects such as dust, moisture, and particulate matter from entering the internal cavity of the heat exchange plate 2 through the mounting hole 23. This avoids blockage of the capillary structure 24, contamination or leakage of the phase change material, thereby improving the reliability of the heat exchange plate 2.

[0066] The form of the sealing component 22 is not limited. As an example, the sealing component 22 is a sealing plug that undergoes elastic deformation under pressure, filling the gap between the mounting hole 23 and the heat pipe 32 to form a leak-free seal. In other embodiments, the sealing component 22 may also be a sealing cap or other forms.

[0067] In some embodiments, such as Figure 5 As shown, the heat sink 1 includes a substrate 13 and a plurality of heat dissipation fins 12; the first side of the substrate 13 is used to set the heat exchange plate 2, and each heat dissipation fin 12 is arranged in parallel on the second side of the substrate 13.

[0068] The substrate 13 can be made of a high thermal conductivity metal material (such as copper, aluminum, or copper-aluminum alloy) to quickly conduct heat from the heat spreader 2 to the heat dissipation fins 12. Each heat dissipation fin 12 is arranged in parallel on the second side of the substrate 13 to form a regular fin array, maximizing the heat dissipation area.

[0069] In this embodiment, the substrate 13 is in direct contact with the heat spreader 2, and the heat is conducted through the substrate 13 to the root of the heat dissipation fins 12. The heat dissipation fins 12 increase the heat dissipation area and accelerate the transfer of heat to the environment.

[0070] The method in which the heat spreader 2 is disposed on the heat sink 1 is not unique. In some embodiments, such as... Figure 1 As shown, the conductive side of the heat spreader 2 is attached to the heat sink 1. In other embodiments, such as... Figure 5 As shown, a mounting groove 11 is provided on the first side of the substrate of the heat sink 1, and the heat spreader 2 is embedded in the mounting groove 11.

[0071] The shape and size of the mounting groove 11 match the conductive side of the heat spreader 2, allowing the heat spreader 2 to be directly embedded within the mounting groove 11. The tight enclosure and contact of the mounting groove 11 improves the thermal conductivity and stability of the heat spreader 2.

[0072] Furthermore, the heat spreader 2 is embedded in the mounting groove 11 of the heat sink 1, and the space between the heat spreader 2 and the surface of the mounting groove 11 is filled with thermally conductive silicone grease to reduce thermal resistance.

[0073] In some embodiments, such as Figures 6-7 As shown, the heat dissipation device also includes a fan 5 and a controller (not shown), with the fan 5 mounted on the heat sink 1. The controller and fan 5 are electrically connected, and the controller is used to control the fan's rotation.

[0074] By setting the fan 5 to force air cooling and accelerate airflow, the convective heat transfer coefficient between the heat sink fins 12 and the air can be improved, heat can be quickly removed, and heat dissipation efficiency can be improved.

[0075] The controller is used to regulate the operating status of fan 5, such as controlling fan 5 to start rotating, stop rotating, and adjust the speed, so as to achieve a balance between heat dissipation efficiency and energy consumption.

[0076] In some embodiments, the heat dissipation device further includes a temperature detection component connected to the controller. The temperature detection component is used to detect the temperature of each mounting position and output the temperature parameters corresponding to each mounting position to the controller. The controller is also used to control the operating power of the fan 5 according to the temperature parameters corresponding to each mounting position, so as to reduce the temperature difference between the mounting positions.

[0077] It is understandable that the purpose of the heat spreader 2 is to make the temperature distribution as uniform as possible. However, in actual operation, there may still be slight temperature differences. There are two reasons for this: First, the power of the heat source (such as power devices) fluctuates greatly, which will cause instantaneous temperature differences. Second, the external heat dissipation is insufficient. For example, if the efficiency of the heat dissipation fins 12 is not high enough, it will lead to local heat accumulation.

[0078] The temperature detection component includes a temperature sensor electrically connected to the controller. Specifically, temperature acquisition points can be set inside the heat spreader 2. The number and location of these temperature acquisition points correspond to the number of devices 4 to be cooled, and each temperature acquisition point is equipped with a temperature sensor. As an example, such as... Figure 8 As shown, the vapor chamber has three temperature acquisition points: point A (shown as point A in the diagram), point B (shown as point B in the diagram), and point C (shown as point C in the diagram). These three temperature acquisition points are located in the middle of mounting positions A, B, and C, respectively, and correspond to the positions of the three power devices. Each temperature acquisition point is equipped with a temperature sensor, which can detect and output the temperature parameters at each mounting position to the controller. The arrows indicate the direction of heat diffusion.

[0079] The controller determines the temperature difference on the heat exchanger 2 based on the temperature parameters at each installation location, and adjusts the operating power of the fan 5 accordingly to regulate its speed. For example, if the temperature difference on the heat exchanger 2 is determined to be large, the controller increases the operating power of the fan 5, thereby increasing its speed and accelerating heat dissipation, thus reducing the temperature difference on the heat exchanger 2.

[0080] In this embodiment, temperature acquisition points are set in multiple areas inside the heat exchanger 2 to monitor the temperature parameters of each installation position in real time and feed them back to the controller for temperature difference analysis. When the controller detects a large temperature difference (such as 5°C, 8°C, etc.) on the heat exchanger 2, it dynamically adjusts the operating power of the fan 5 to accelerate heat dissipation in the high-temperature area, thereby quickly reducing the temperature difference on the heat exchanger 2 and ensuring uniform temperature distribution. This effectively addresses the problem of localized heat accumulation caused by instantaneous fluctuations in heat source power or insufficient external heat dissipation (such as the heat sink fins 12). Moreover, by dynamically adjusting the operating power of the fan 5, energy efficiency can be effectively considered.

[0081] In some embodiments, the number of fans 5 is the same as the number of mounting positions, and the fans 5 are correspondingly arranged with respect to the mounting positions. The controller is also used to determine the temperature difference between each mounting position based on the temperature parameters corresponding to each mounting position, and to control the operating power of each fan 5 based on the temperature difference.

[0082] For example, such as Figure 9As shown, temperature sensors A, B, and C are respectively installed at temperature acquisition points A, B, and C. These three temperature sensors are all connected to the controller and transmit their respective acquired temperature signals to the controller. The controller is also connected to three fans 5 (fan A represents the first fan, fan B represents the second fan, and fan C represents the third fan). Each fan 5 is positioned adjacent to its corresponding mounting position. By allowing the fan 5 to directly act on the heat dissipation area of ​​its corresponding mounting position, heat dissipation efficiency can be effectively improved.

[0083] By setting temperature sensors in the area of ​​the heat exchange plate 2 corresponding to each installation position, the temperature parameters of each installation position are monitored in real time, and the controller calculates the temperature difference (also known as temperature difference) between the installation positions of the heat exchange plate 2, and the fan speed of the fan 5 can be adjusted according to the temperature difference.

[0084] The method of calculating the temperature difference between mounting positions and adjusting the fan speed of fan 5 based on the temperature difference is not unique. In some embodiments, the temperature difference (ΔT) between any two mounting positions is calculated. When the controller detects a large temperature difference between a certain mounting position and other mounting positions (e.g., ΔT > 5°C), the power of fan 5 corresponding to the mounting position with the higher temperature is increased to accelerate heat dissipation, while the power of fan 5 corresponding to the mounting position with the lower temperature is reduced to reduce energy consumption. For example, if the temperature of mounting position A is significantly higher than that of mounting positions B and C, the controller will increase the power of fan 5 corresponding to mounting position A to quickly lower its temperature; if the temperatures of mounting positions A and B are higher than those of mounting position C, the power of fan 5 corresponding to mounting positions A and B will be adjusted simultaneously, and the power of fan 5 corresponding to mounting position C will be appropriately reduced. This achieves precise control of local heat dissipation, quickly eliminates the temperature difference between mounting positions, improves the temperature uniformity of the heat exchanger 2, and avoids high global load operation by adjusting the power of fan 5 as needed, thus reducing energy consumption.

[0085] In other embodiments, the controller stores the initial temperature of each mounting position. After receiving the temperature signal from the temperature sensor, it calculates the temperature difference (ΔT) between the current temperature and the initial temperature of each mounting position. When the controller detects a large temperature difference at a certain mounting position (e.g., ΔT > 5°C), it increases the power of the fan 5 corresponding to the high-temperature mounting position to accelerate heat dissipation. Simultaneously, it controls the fan 5 corresponding to the low-temperature mounting position (e.g., the mounting position with ΔT < 5°C) to reduce power to decrease energy consumption. This allows for precise temperature control of each mounting position, improving the cooling efficiency of the heat spreader 2.

[0086] Furthermore, when adjusting the fan speed of fan 5 based on the temperature difference, the controller can also adjust the fan speed of fan 5 in stages according to the magnitude of the temperature difference. For example, when the temperature difference ΔT > 8℃, the fan 5 at the corresponding installation position is adjusted to operate at the first fan speed; when the temperature difference 8℃ ≥ ΔT > 5℃, the fan 5 at the corresponding installation position is adjusted to operate at the second fan speed; when the temperature difference ΔT ≤ 5℃, the fan 5 at the corresponding installation position is adjusted to operate at the third fan speed; the first fan speed is greater than the second fan speed, which is greater than the third fan speed. Thus, by matching different temperature differences with different fan speeds, insufficient heat dissipation or excessive energy consumption caused by a single fan speed can be avoided.

[0087] In an optional embodiment, please refer to Figures 6-7 The device to be cooled, 4, is a power device. The heat transfer assembly 3 includes a heat pipe array located below the power device for rapid heat conduction. A vapor chamber 2 is located below the heat pipe array for uniform heat dissipation. The radiator 1 includes heat dissipation fins 12 for dissipating heat into the environment. A controller controls the operation of the fan 5 to force air cooling and enhance heat dissipation.

[0088] The heat pipe array is inserted into the vapor chamber 2, directly contacting the phase change material inside the vapor chamber 2 for heat exchange. Compared to surface contact, this results in faster heat conduction. The vapor chamber 2 is embedded into the heat sink 1, ensuring a tighter contact surface. The fan speed of the fan 5 is adjustable, allowing for control of airflow according to different environmental conditions, thus ensuring reliable heat dissipation.

[0089] This application also provides a converter, including power devices and a heat dissipation device. The heat dissipation device can be set with reference to the above embodiments, and will not be described again here.

[0090] As a device to be cooled, the power device's heat-generating part comes into contact with the contact side of the heat transfer component, which can provide heat dissipation efficiency.

[0091] To better understand the above embodiments, the following detailed explanation is provided in conjunction with an optional embodiment. In one embodiment, please refer to... Figures 1-9 The heat dissipation device includes a radiator 1, a vapor chamber 2, and a heat transfer assembly 3. The heat transfer assembly 3 includes a base 31 and multiple heat pipes 32. The base 31 has a first side and a second side. The evaporation section of each heat pipe 32 is located on the first side of the base 31, and the side containing the condensation section of each heat pipe 32 serves as the heat-conducting side of the heat transfer assembly 3. The second side of the base 31 serves as the contact side of the heat transfer assembly 3 and is in contact with the power device. The heat pipes 32 are regularly perpendicular to the plane of the base 31, forming a heat pipe array.

[0092] The vapor chamber 2 has multiple mounting positions, and each mounting position has multiple mounting holes 23 forming a mounting hole array. The number of mounting holes 23 in each mounting position is consistent with the number of heat pipes 32 in the heat transfer assembly 3. In a heat transfer assembly 3, the condensing section of each heat pipe 32 is arranged one-to-one in each mounting hole 23. The vapor chamber 2 is filled with a phase change material, and when the condensing section of the heat pipe 32 is arranged in the mounting hole 23, the condensing section of the heat pipe 32 is in contact with the phase change material.

[0093] The heat sink 1 includes a substrate 13 and a plurality of heat dissipation fins 12, each heat dissipation fin 12 being arranged parallel to the second side of the substrate 13. A mounting groove 11 is provided on the first side of the substrate of the heat sink 1, and a heat spreader 2 is embedded in the mounting groove 11, and the space between the heat spreader 2 and the surface of the mounting groove 11 is filled with thermally conductive silicone grease to reduce thermal resistance.

[0094] The heat dissipation device also includes a fan 5, a temperature detection component, and a controller (not shown). The controller is electrically connected to the fan 5 and the temperature detection component, and is used to control the fan rotation. The number of fans 5 is the same as the number of mounting positions, and the fans 5 are correspondingly arranged to the mounting positions. The controller is also used to determine the temperature difference between each mounting position based on the temperature parameters corresponding to each mounting position, and to control the operating power of each fan 5 according to the temperature difference.

[0095] In a specific application scenario, there are 3 power devices, and the number of heat transfer components 3 is equal to the number of power devices, with one contact side of each heat transfer component 3 corresponding to one power device. Correspondingly, there are also 3 temperature acquisition points in the heat spreader 2, with points A, B, and C corresponding to the positions of the 3 power devices. Temperature sensors A, B, and C are respectively installed at points A, B, and C. These three temperature sensors are all connected to the controller and transmit their respective acquired temperature signals to the controller.

[0096] The controller is also connected to three fans 5 (fan A in the diagram represents the first fan, fan B represents the second fan, and fan C represents the third fan), with each fan 5 positioned adjacent to its corresponding mounting position.

[0097] Please refer to Figure 10 When the converter starts running, the power devices begin to operate. Subsequently, each temperature sensor collects the temperature at its corresponding mounting location inside the heat exchanger 2 and transmits its collected temperature signal to the controller. Taking temperature acquisition point A as an example, let the temperature transmitted by temperature sensor A at point A be T. 点A The initial temperature T0 is the temperature obtained by temperature sensor A before or at the start-up time of the converter. When the temperature difference at point A exceeds the high-temperature threshold (e.g., 8°C), i.e., T... 点AWhen T0 ≥ 8℃, the system enters full-load mode. At this time, the controller outputs a control signal to fan A (the first fan 5 corresponds to the installation position of temperature acquisition point A, and thus corresponds to the power device installed at that position), controlling fan A to run at full load to maximize the heat dissipation airflow.

[0098] When the temperature difference at point A is detected to be lower than the high temperature threshold, T 点A When T0 < 8℃, it is determined to enter non-full load mode, and the current temperature difference at point A is further determined. When the temperature difference at point A is higher than the heat dissipation threshold (e.g., 5℃), i.e., T... 点A When T0≥5℃, the controller outputs a control signal to fan A, controlling fan A to run at a certain percentage of its rated power (e.g., 85% of the rated power) until the temperature distribution plate 2 returns to a uniform temperature state.

[0099] When the temperature difference at point A is lower than the heat dissipation threshold, for example, T 点A When T0 < 5℃, the temperature distribution plate 2 is determined to be in a uniform temperature state. At this time, the controller outputs a control signal to fan A, controlling fan A to operate at a smaller percentage of its rated power (e.g., 70% of its rated power). It can be understood that the logic at temperature acquisition points B and C is similar to that at point A; that is, based on the temperature difference between their respective acquired temperature signals and the initial temperature, the controller determines whether to enter full-load mode or non-full-load mode and adjusts the operating power of the corresponding fan accordingly. This will not be elaborated further here.

[0100] The aforementioned converter features a highly efficient heat dissipation device. Even when the converter power reaches 100kW or higher, and the power devices generate enormous amounts of heat, it can effectively dissipate heat, preventing power device failure and improving the converter's reliability. This, in turn, facilitates the development of converters towards higher power density, higher functional density, and higher space utilization.

[0101] In the description of this specification, references to terms such as "some embodiments," "other embodiments," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0102] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0103] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these modifications and improvements all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A heat dissipating device, characterized by, include: heat sink; A heat transfer assembly having a contact side and a heat-conducting side, the contact side being used to contact the device to be cooled; A heat spreader plate has a conductive side and a mounting side. The mounting side is provided with mounting positions, the number of which is the same as the number of heat transfer components. The heat-conducting side of one heat transfer component is located at one of the mounting positions. The conductive side of the heat spreader plate is located on the radiator. The heat exchange plate is used to conduct heat from each of the mounting positions, and the heat sink is used to dissipate the heat conducted by the heat exchange plate.

2. The heat dissipation device according to claim 1, characterized in that, The heat transfer assembly includes a base and a plurality of heat pipes. The base has a first side and a second side opposite to each other. The evaporation section of each heat pipe is disposed on the first side of the base, and the condensation section of each heat pipe serves as the heat-conducting side of the heat transfer assembly. The second side of the base serves as the contact side of the heat transfer assembly.

3. The heat dissipation device according to claim 2, characterized in that, Each mounting position is provided with multiple mounting holes, and in each heat transfer assembly, the condensation section of each heat pipe is provided one-to-one with each mounting hole.

4. The heat dissipation device according to claim 3, characterized in that, The temperature distribution plate is also provided with multiple sealing components, and each sealing component is provided in a one-to-one manner in each of the mounting holes.

5. The heat dissipation device according to claim 3, characterized in that, The heat exchange plate includes a plate body and capillary structures. The plate body has a first side and a second side facing each other. The plate body encloses a cavity to form a receiving cavity. The capillary structures are wavy and arranged in parallel at intervals within the receiving cavity. The first side of the plate body is provided with the mounting position, and the second side of the plate body serves as the conductive side of the heat exchange plate.

6. The heat dissipation device according to claim 1, characterized in that, The heat sink includes a substrate and a plurality of heat dissipation fins; a first side of the substrate is used to mount the heat spreader, and each of the heat dissipation fins is arranged parallel to the second side of the substrate.

7. The heat dissipation device according to claim 6, characterized in that, The heat sink has a mounting groove on the first side of its substrate, and the heat spreader is embedded in the mounting groove.

8. The heat dissipation device according to any one of claims 1-7, characterized in that, It also includes a controller and a fan connected to the heat sink, the fan being disposed on the heat sink, and the controller being used to control the rotation of the fan.

9. The heat dissipation device according to claim 8, characterized in that, It also includes a temperature detection component connected to the controller, the temperature detection component being used to detect the temperature of each of the mounting positions and output the temperature parameters corresponding to each of the mounting positions to the controller; The controller is also used to control the operating power of the fan according to the temperature parameters corresponding to each of the mounting positions.

10. The heat dissipation device according to claim 9, characterized in that, The number of fans is the same as the number of mounting positions, and the fans are set in correspondence with the mounting positions; the controller is also used to determine the temperature difference of each mounting position according to the temperature parameters corresponding to each mounting position, and control the operating power of each fan according to the temperature difference.

11. A converter, characterized in that, It includes power devices and heat dissipation devices as described in any one of claims 1-10.

Images