Power supply heat dissipation structure

Abstract

The utility model discloses a power supply heat dissipation structure belongs to heat dissipation structure technical field, including power supply shell, the inside of power supply shell is provided with power module, and the outside of power supply shell is equipped with hollow cavity ventilation mechanism, and hollow cavity ventilation mechanism includes protective housing, heat dissipation fan subassembly and hollow interlayer, and the outside of power supply shell is equipped with protective housing, and hollow interlayer sets up between power supply shell and protective housing, the utility model discloses the hollow cavity ventilation mechanism of setting, through heat dissipation fan subassembly injects the hollow interlayer between power supply shell and protective housing with cold air, utilizes the low resistance of interlayer and passes through the space, and cooperates heat dissipation fan ventilation, forms the smooth heat dissipation channel, and hot air is discharged fast, and the contact area that hollow interlayer increases simultaneously makes the heat more fully transfer to the air, and the heat dissipation efficiency is greatly promoted, and compared with solid shell, can emit more heat in the same time, and effectively reduce the temperature in the power supply.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation structure technology, specifically a power supply heat dissipation structure. Background Technology

[0002] With the rapid development of electronic devices, power supply equipment, as its core power supply component, is widely used in many fields such as communication base stations, data centers, and industrial automation. During the operation of power supply equipment, internal electronic components, such as power devices and control chips, generate a lot of heat due to the current passing through them. If the heat cannot be dissipated in time, the internal temperature of the power supply will rise sharply, which will not only reduce the working efficiency and stability of electronic components, but may also accelerate component aging, and in severe cases, even cause equipment failure or safety accidents. Therefore, efficient heat dissipation design has become a key factor in ensuring the normal operation of power supply equipment and extending its service life. Common power supply heat dissipation methods mainly include natural heat dissipation, air cooling, and liquid cooling.

[0003] Among them, air cooling is currently the most widely used heat dissipation method. By setting heat dissipation holes on the power supply casing and using a fan to force airflow, heat is carried away. However, although directly opening heat dissipation holes on the power supply casing can accelerate airflow to a certain extent, dust and debris can easily enter the power supply through the heat dissipation holes. In addition, power supplies with solid casings have limited heat dissipation area, and the bottom is placed in contact with the air, which affects ventilation and heat dissipation. These factors make it difficult to quickly and effectively transfer heat to the air, resulting in low heat dissipation efficiency and making it difficult to guarantee the stable performance of the power supply under long-term, high-load operation. Furthermore, the airflow path generated by the fan inside the power supply is unreasonable. The incoming airflow is blocked by the uneven components on the power supply module, which makes it difficult to directly blow heat to various parts of the power supply module, resulting in serious local overheating inside the power supply. Therefore, a power supply heat dissipation structure is needed to solve the problems existing in the current technology. Utility Model Content

[0004] The purpose of this invention is to provide a power supply heat dissipation structure to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a power supply heat dissipation structure, comprising a power supply housing, a power module disposed inside the power supply housing, and a hollow cavity ventilation mechanism fitted outside the power supply housing, the hollow cavity ventilation mechanism comprising a protective housing, a cooling fan assembly, and a hollow interlayer, the protective housing being fitted outside the power supply housing, the hollow interlayer being disposed between the power supply housing and the protective housing, the cooling fan assembly being disposed on one side of the power supply housing, a perforated hole being provided on the upper surface of the power supply housing, and an air outlet being provided at the rear end of the power supply housing.

[0006] Preferably, a supporting rib is fixed between the protective housing and the power supply housing, and a fixing frame is fixed at the tail end of the protective housing.

[0007] Preferably, a dustproof mesh is fixed to the inner wall of the fixed frame, and the dustproof mesh is located at one end of the hollow interlayer.

[0008] Preferably, the cooling fan assembly includes a closed cover and a cooling fan, the closed cover being disposed on one side of the power supply housing, and the cooling fan being fixed to one side surface of the closed cover.

[0009] Preferably, the closed cover plate has an embedded shell on one side surface opposite to the cooling fan, and an air inlet is opened on one end face of the embedded shell.

[0010] Preferably, the mounting shell is embedded in the hollow interlayer, the air inlet is connected to the hollow interlayer, and the blower end of the cooling fan is connected to the air inlet.

[0011] This utility model provides a power supply heat dissipation structure, which has the following advantages compared with the prior art:

[0012] The hollow cavity ventilation mechanism injects cool air into the hollow space between the power supply casing and the protective casing through the cooling fan assembly. Utilizing the low-obstruction flow space of the space, combined with the cooling fan ventilation, a smooth heat dissipation channel is formed, allowing hot air to be quickly expelled. At the same time, the increased contact area of ​​the hollow space allows heat to be transferred to the air more fully, significantly improving heat dissipation efficiency. Compared with a solid casing, it can dissipate more heat in the same amount of time, effectively reducing the internal temperature of the power supply.

[0013] With its hollow interlayer and perforations, cool air enters the hollow interlayer and partially enters the inner cavity through the perforations at the top of the power supply casing. This top-entry method reduces airflow obstruction, enabling direct airflow cooling of all parts of the power module, removing heat from various components, preventing localized overheating, and significantly improving the overall stability and reliability of the power supply. The supporting ribs between the protective casing and the power supply casing enhance structural stability, and the dustproof mesh on the inner wall of the fixing frame is located at the hollow interlayer port. While ensuring airflow, it effectively prevents dust from penetrating deep into the power supply casing, extending the power supply's lifespan and reducing the risk of failure due to dust accumulation. Attached Figure Description

[0014] Figure 1 This is a perspective view of the overall structure of this utility model;

[0015] Figure 2 This is a perspective view of the protective shell structure of this utility model;

[0016] Figure 3 This is a three-dimensional cross-sectional view of the protective shell structure of this utility model;

[0017] Figure 4 This is a three-dimensional view of the hollow hole structure of this utility model.

[0018] In the diagram: 1. Power supply casing; 2. Hollow cavity ventilation mechanism; 3. Protective casing; 4. Cooling fan assembly; 5. Hollow interlayer; 6. Fixing frame; 7. Dustproof mesh; 8. Air outlet; 9. Closed cover plate; 10. Cooling fan; 11. Embedded shell; 12. Air inlet; 13. Supporting ribs; 14. Hollow hole. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figure 1-4 This utility model provides a power supply heat dissipation structure, including a power supply shell 1. The power supply shell 1 is used to house the power supply module and is the main frame of the entire power supply, providing installation space for the power supply module and protecting the power supply module from the influence of the external environment. The power supply module is installed inside the power supply shell 1. A hollow cavity ventilation mechanism 2 is fitted on the outside of the power supply shell 1. The hollow cavity ventilation mechanism 2 includes a protective shell 3, a cooling fan assembly 4, and a hollow interlayer 5. The protective shell 3 is fitted on the outside of the power supply shell 1, the hollow interlayer 5 is disposed between the power supply shell 1 and the protective shell 3, the cooling fan assembly 4 is disposed on one side of the power supply shell 1, the upper end surface of the power supply shell 1 is provided with a hollow hole 14, and the rear end of the power supply shell 1 is provided with an air outlet 8. The hollow cavity ventilation mechanism 2 as a whole provides a heat dissipation channel for the power supply, and the heat is carried away by the air flow, thereby reducing the temperature of the power supply and ensuring the normal operation of the power supply.

[0021] Further as Figure 1 , Figure 2 and Figure 3 As shown, it is worth noting that a supporting rib 13 is fixed between the protective shell 3 and the power supply shell 1. A fixing frame 6 is fixed to the tail end of the protective shell 3. A dustproof mesh 7 is fixed to the inner wall of the fixing frame 6. The dustproof mesh 7 is set at one end of the hollow interlayer 5. The protective shell 3 protects the power supply shell 1 and forms a hollow interlayer 5 with the power supply shell 1, increasing the contact area with air and assisting in heat dissipation.

[0022] Further as Figure 4As shown, it is worth noting that the cooling fan assembly 4 includes a closed cover plate 9 and a cooling fan 10. The closed cover plate 9 is located on one side of the power supply housing 1, and the cooling fan 10 is fixed to one side surface of the closed cover plate 9. The closed cover plate 9 has an embedded shell 11 on one side surface of the cooling fan 10. One end face of the embedded shell 11 has an air inlet 12. The air inlet 12 is the entrance for air to enter the hollow interlayer 5, so that the airflow generated by the cooling fan 10 can accurately enter the hollow interlayer 5, improving the utilization efficiency of the airflow. The embedded shell 11 is embedded in the hollow interlayer 5, and the air inlet 12 is connected to the hollow interlayer 5. The blower end of the cooling fan 10 is connected to the air inlet 12. The hollow interlayer 5 provides air circulation space. When the air flows in it, it absorbs the heat of the power supply housing 1, so that the heat can be more fully transferred to the air, improving the heat dissipation effect.

[0023] This solution has the following working process: When the heat dissipation is in use, the heat dissipation fan 10 on the closed cover plate 9 is activated. The airflow generated by the heat dissipation fan 10 is introduced from the air inlet 12 of the embedded shell 11 into the hollow interlayer 5 between the power supply shell 1 and the protective shell 3. The hollow interlayer 5 provides a minimal obstruction space for airflow. With the ventilation of the heat dissipation fan 10, a smoother heat dissipation channel can be formed. The heat dissipation fan 10 blows cold air into the hollow interlayer. The cold air flows in the interlayer, absorbs the heat of the power supply shell 1 and becomes hot air, and then is discharged through the other end of the hollow interlayer 5, which accelerates the heat dissipation speed. In addition, the hollow interlayer 5 increases the contact area between the protective shell 3 and the air, so that the heat can be transferred to the air more fully. Compared with a solid shell, more heat can be dissipated in the same amount of time, effectively reducing the internal temperature of the power supply.

[0024] When cold air is introduced into the hollow interlayer 5, because the upper part of the power supply housing 1 is provided with a perforation 14, some of the cold air flowing in the hollow interlayer 5 will enter the inner cavity of the power supply housing 1 through the perforation 14. The way the air enters the power supply housing 1 from the top helps to reduce the possibility of airflow obstruction. Direct air cooling treatment of each part of the power module can remove the heat of each part and avoid local overheating, thereby improving the overall stability and reliability of the power supply.

[0025] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Although embodiments of this utility model have been shown and described, this does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model. Regarding the embodiments of this utility model, those skilled in the art will understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of this utility model. The scope of this utility model is defined by the appended claims and their equivalents.

Claims

1. A power supply heat dissipation structure, comprising a power supply shell (1), an inside of the power supply shell (1) is provided with a power supply module, characterized in that: The power supply housing (1) is fitted with a hollow cavity ventilation mechanism (2). The hollow cavity ventilation mechanism (2) includes a protective housing (3), a cooling fan assembly (4), and a hollow interlayer (5). The protective housing (3) is fitted on the outside of the power supply housing (1). The hollow interlayer (5) is disposed between the power supply housing (1) and the protective housing (3). The cooling fan assembly (4) is disposed on one side of the power supply housing (1). The upper surface of the power supply housing (1) is provided with a perforated hole (14). The tail end of the power supply housing (1) is provided with an air outlet (8).

2. The power supply heat dissipation structure of claim 1, wherein: A support rib (13) is fixed between the protective shell (3) and the power supply shell (1), and a fixing frame (6) is fixed at the tail end of the protective shell (3).

3. The power supply heat dissipation structure of claim 2, wherein: The inner wall of the fixed frame (6) is fixed with a dustproof net (7), which is set at one end of the hollow interlayer (5).

4. The power supply heat dissipation structure according to claim 3, characterized in that: The cooling fan assembly (4) includes a closed cover plate (9) and a cooling fan (10). The closed cover plate (9) is disposed on one side of the power supply housing (1), and the cooling fan (10) is fixed to one side surface of the closed cover plate (9).

5. The power supply heat dissipation structure according to claim 4, characterized in that: The closed cover plate (9) has an embedded shell (11) on one side surface opposite to the cooling fan (10), and an air inlet (12) is opened on one end face of the embedded shell (11).

6. The power supply heat dissipation structure of claim 5, wherein: The embedded shell (11) is embedded in the hollow interlayer (5), the air inlet (12) is connected to the hollow interlayer (5), and the blower end of the heat dissipation fan (10) is connected to the air inlet (12).

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