A power board assembly

Abstract

This utility model provides a power board assembly. The power board assembly includes: a substrate with mounting grooves; a plurality of patch tubes spaced apart within the mounting grooves; and a heat dissipation component mounted on the substrate. The heat dissipation component includes a heat sink, a support column, potting compound, and a sealing gasket. The heat sink includes a heat dissipation substrate having a first surface and a second surface. A receiving groove is formed on the circumferential edge of the heat dissipation substrate, recessed from the second surface towards the first surface. The sealing gasket is disposed within the receiving groove, with its inner annular surface and the second surface forming a sealed cavity. When the heat dissipation component is mounted to the substrate, the end of the support column away from the heat dissipation substrate abuts against the bottom surface of the mounting groove. The sealed cavity and the mounting groove form a sealed potting space, and potting compound is filled into the potting space by an automated potting device, at which point the potting compound can encapsulate each patch tube. This power board assembly effectively improves the interfacial adhesion between the potting compound and the patch tubes.

Description

Technical Field

[0001] This utility model relates to the field of energy storage equipment technology, and in particular to a power board assembly assembled in an energy storage device. Background Technology

[0002] The power board includes at least a substrate with copper foil and a surface-mount single transistor (e.g., MOSFET, Metal-Oxide-Semiconductor Field-Effect Transistor, IGBT, Insulated Gate Bipolar Transistor) disposed on the substrate.

[0003] Currently, as the power board density in energy storage devices continues to increase, the heat dissipation problem of surface-mount single-cell chips is becoming increasingly prominent. Therefore, the heat dissipation methods of directly conducting the heat generated by the surface-mount single-cell chip to the outer casing of the energy storage device and the heat dissipation methods of transferring the heat generated by the surface-mount single-cell chip to the copper foil of the substrate through the pins of the surface-mount unit cannot meet the heat dissipation requirements of power boards with high power density. This requires manufacturers to equip the power boards with heat sinks to meet the heat dissipation requirements of power boards with high power density.

[0004] Furthermore, the structure obtained after assembling the heat sink onto the power board is called a power board assembly.

[0005] In traditional power board assemblies, a common method to transfer heat from the surface-mount single-chip and the copper foil of the substrate to the heat sink is to use a thermally conductive medium (e.g., thermal putty, thermal grease).

[0006] However, traditional power board assemblies that use thermal grease for filling still have the following drawbacks: When using thermal grease for filling, the surface of the surface mount tube is not a flat surface but uneven, which makes it difficult for operators to apply the grease to the surface of the surface mount tube. Even if the grease can be applied to the surface of the surface mount tube, uneven application is still likely to occur, which will lead to the heat dissipation failure of the power board. Utility Model Content

[0007] The power board assembly provided by this utility model aims to solve at least some of the defects of existing power board assemblies.

[0008] This utility model provides a power board assembly. The power board assembly includes:

[0009] A substrate, wherein a preset mounting groove is formed on the substrate;

[0010] Multiple patch tubes are spaced apart within the mounting slot;

[0011] A heat dissipation component is mounted on the substrate, and the heat dissipation component includes a heat sink, a support column, potting compound, and an annular sealing gasket.

[0012] The heat sink includes a heat sink base and a plurality of heat sink fins, and the heat sink base has a first surface and a second surface opposite to each other;

[0013] Multiple heat dissipation fins are spaced apart on the heat dissipation substrate, and all of the multiple heat dissipation fins protrude from the first surface;

[0014] The circumferential edge of the heat dissipation substrate is provided with a receiving groove that is recessed from the second surface toward the first surface;

[0015] The sealing gasket is disposed in the receiving groove, and at this time the inner annular surface of the sealing gasket and the second surface enclose a sealing cavity, and the sealing cavity can cover the mounting groove;

[0016] The support column is disposed in the sealed cavity. When the heat dissipation component is assembled to the substrate, the end of the support column away from the heat dissipation substrate abuts against the bottom surface of the mounting groove.

[0017] The sealed cavity and the mounting groove form a closed potting space, and the potting adhesive is filled into the potting space by an automated potting equipment. At this time, the potting adhesive can wrap each of the patch tubes so that each of the patch tubes can contact the heat dissipation substrate through the potting adhesive.

[0018] In some embodiments, when the heat dissipation component is assembled to the substrate, the side of the sealing gasket away from the heat dissipation substrate is compressed until the end of the support post away from the heat dissipation substrate abuts against the bottom surface of the mounting groove, so as to limit the potting compound from overflowing the potting space.

[0019] In some embodiments, a predetermined first distance is provided between the end of the patch tube away from the substrate and the bottom surface of the mounting groove;

[0020] The end of the support column away from the heat dissipation substrate has a preset second distance from the second surface.

[0021] In some embodiments, when the end of the support post away from the heat dissipation substrate abuts against the bottom surface of the mounting groove, the first spacing is smaller than the second spacing, so as to limit the second surface from forming physical contact with the end of the patch tube away from the substrate.

[0022] In some embodiments, the heat dissipation substrate is provided with potting holes and multiple venting holes, and the potting holes and multiple venting holes all penetrate the first surface and the second surface;

[0023] The glue-filling hole is located in the middle of the sealed cavity, and the plurality of vent holes are symmetrically arranged at the corners of the sealed cavity.

[0024] In some embodiments, the two ends of the dispensing hole are respectively connected to the automated dispensing equipment and the dispensing space, so that the potting adhesive in the automated dispensing equipment flows into the dispensing space through the dispensing hole.

[0025] In some embodiments, a plurality of threaded countersunk holes are formed on the second surface, and all of the plurality of threaded countersunk holes are located within the sealing cavity;

[0026] The countersunk hole includes a countersunk hole and a threaded hole, and at least a portion of the support column is housed within the countersunk hole.

[0027] In some embodiments, the substrate is provided with a plurality of mounting holes, and the support column is provided with a through hole;

[0028] When the heat dissipation component is assembled onto the substrate, the mounting hole, the through hole, and the threaded countersunk hole are coaxially arranged.

[0029] In some embodiments, the power board assembly further includes:

[0030] A plurality of fasteners, each fastener corresponding to a threaded countersunk hole, and each fastener including a head and a threaded portion.

[0031] In some embodiments, when the threaded portion passes sequentially through the mounting hole and the through hole until it is inserted into the threaded hole, the heat dissipation substrate is fixedly mounted on the substrate.

[0032] At least one beneficial effect of the power board assembly provided by this utility model embodiment is that: the surface mount tube in this power board assembly is set in a closed potting space, which allows the manufacturer to directly use automated potting equipment to fill the potting compound into the aforementioned potting space. This design can effectively avoid the uneven application of thermal grease, thereby preventing heat dissipation failure of the power board assembly and ensuring the heat dissipation effect of the power board assembly; furthermore, the potting compound can flow freely in the closed potting space, allowing the potting compound to completely wrap the surface mount tube. This design can effectively improve the interface adhesion between the potting compound and the surface mount tube, thereby making the heat dissipation of the power board assembly more uniform, and thus improving the heat dissipation efficiency and reliability of the power board assembly. Attached Figure Description

[0033] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements having the same reference numerals in the drawings are designated as the same elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0034] Figure 1 An exploded view of the power board assembly provided in an embodiment of this utility model;

[0035] Figure 2 An exploded view of the radiator and sealing gasket provided in an embodiment of this utility model;

[0036] Figure 3 An exploded view of the radiator, sealing gasket, and support column provided for an embodiment of this utility model;

[0037] Figure 4 A cross-sectional view of a heat dissipation component without potting compound, provided in an embodiment of the present invention, assembled on a substrate by fasteners;

[0038] Figure 5 This is a schematic diagram of the power board assembly provided in an embodiment of the present utility model;

[0039] Figure 6 A schematic diagram illustrating the interconnection between a power board assembly with electronic components and an automated dispensing device, provided for an embodiment of this utility model.

[0040] Figure 7 An exploded view of an energy storage device including a power board assembly with electronic components, provided for an embodiment of this utility model.

[0041] Figure 8 Temperature simulation diagram of potting compound provided in this embodiment of the utility model;

[0042] Figure 9 Temperature simulation diagram of the radiator provided in this embodiment of the utility model;

[0043] Figure 10 A block diagram of the heat conduction path provided for an embodiment of this utility model.

[0044] Figure label:

[0045] 1000. Energy storage device; 100. Power board assembly; 200. Top cover; 300. Air duct paper; 400. Cooling fan; 500. Battery pack; 600. Bottom shell;

[0046] 1001, Sealed cavity; 1002, Potting space; 1003, Electronic component; 1004, Copper sheet; 1, Substrate; 101, Mounting groove; 102, Mounting hole; 2, Surface mount tube; 3, Heat sink; 31, Heat sink substrate; 32, Heat sink fins; 311, First surface; 312, Second surface; 3101, Receiving groove; 3102, Potting hole; 3103, Vent hole; 3104, Countersunk hole; 3105, Threaded hole; 4, Support post; 401, Through hole; 5, Potting compound; 6, Sealing gasket; 7, Fastener; 701, Head; 702, Threaded part;

[0047] 2000, Automated dispensing equipment; 3000, Air. Detailed Implementation

[0048] The present invention will now be described in detail with reference to specific embodiments. It should be emphasized that the following description is merely exemplary and is not intended to limit the scope and application of the present invention.

[0049] It should be noted that, unless otherwise explicitly specified and limited, the terms “inflow,” “overflow,” “relative,” “compressed,” “inner,” “far away,” “middle,” “corner,” etc., used in this specification to indicate the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. The terms "installation," "fitting," "connection," and "fixing" should be interpreted broadly. For example, "connection" can be a fixed connection or a detachable connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. "Fixing" can be bolt fixing, snap-fit ​​fixing, or glue fixing. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of that feature. "A plurality" or "several" means two or more. In addition, "and / or" includes any and all combinations of one or more of the related listed items. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0050] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0051] In this embodiment, the specific shape, structure and size of the "power board assembly" are not limited. Those skilled in the art can selectively use appropriate heat dissipation components according to actual needs.

[0052] The term "compression" refers to the process of forcing the gasket to undergo elastic deformation through the pre-tightening force of fasteners, thereby filling the microscopic gaps in the connecting surfaces such as the surface where the substrate contacts the gasket and the surface where the receiving groove contacts the gasket, thus forming an effective seal.

[0053] The term "free flow" refers to the process by which potting compound diffuses naturally within a closed potting space, relying solely on its own gravity, surface tension, or capillary action, without the need for external pressure, to fill gaps and eliminate air bubbles, ultimately forming a uniform thermally conductive layer (which can be understood as the adhesive layer formed after the potting compound has cured).

[0054] The term "interface fit" refers to the degree of contact between the potting compound and the surface of the patch tube, and is a key indicator for evaluating the potting effect. Furthermore, the core of interface fit lies in whether the potting compound can fully cover the patch tube (or can be understood as whether the potting compound can fully adhere to the surface of the patch tube) to ensure the heat dissipation performance of the patch tube.

[0055] Figure 1 This is an exploded view of the power board assembly provided in an embodiment of the present invention. Figure 2 An exploded view of the radiator and sealing gasket provided in an embodiment of this utility model. Figure 3 An exploded view of the radiator, sealing gasket, and support column provided in an embodiment of this utility model. Figure 4 This is a cross-sectional view of a heat dissipation component without potting compound, provided in an embodiment of the present invention, assembled on a substrate using fasteners. Figure 5 This is a schematic diagram of the power board assembly provided in an embodiment of the present invention. Figure 6 This is a schematic diagram showing the interconnection between a power board assembly with electronic components and an automated dispensing device, as provided in an embodiment of the present invention.

[0056] Please see Figures 1-6 The power board assembly 100 includes: a substrate 1, multiple surface-mount tubes 2, and heat dissipation components.

[0057] It should be noted that a surface mount transistor (SMT) is a miniaturized electronic component in surface mount technology (SMT). It usually refers to a single tubular or bulk semiconductor device, such as a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) or an IGBT (Insulated Gate Bipolar Transistor).

[0058] It is understandable that traditional power board components typically use thermal paste and thermal grease as thermal filling media. However, after the thermal paste is squeezed into the gap between the traditional heat sink and the traditional substrate, internal stress will be generated, which will cause the traditional substrate to deform and damage electronic components such as surface mount tubes on the traditional substrate.

[0059] Specifically, although using thermal grease can avoid stress, the surface of the surface mount tube is not flat but uneven, making it difficult for operators to apply grease to the surface of the surface mount tube. Even if grease can be applied to the surface of the surface mount tube, uneven application is still likely to occur, which will lead to the heat dissipation failure of traditional power board components.

[0060] In summary, compared with traditional power board components, this power board component 100 uses potting compound 5 as the thermal conductive filler material. This design not only avoids the damage to the single tube of the patch caused by the stress of the thermal paste, but also solves the problem of low interface adhesion caused by uneven application of thermal grease. Moreover, after curing, the potting compound 5 can form a stable thermal conductive layer to improve the heat dissipation efficiency and reliability of this power board component 100.

[0061] The substrate 1 has a preset mounting groove 101, and multiple patch tubes 2 are spaced apart in the mounting groove 101.

[0062] In addition, the surface mount single tube 2 generates heat during operation, and at least a portion of the heat can be transferred to the copper foil of the substrate 1 through the pins of the surface mount single tube 2. Since the heat dissipation capacity of the copper foil is difficult to meet the heat dissipation requirements of the power board when it has high power density (the power board includes at least the substrate 1, the surface mount single tube 2, and electronic devices 1003 disposed around the surface mount single tube 2), the heat dissipation capacity and heat dissipation efficiency of the power board can be improved by assembling heat dissipation components on the power board.

[0063] In this embodiment, the heat dissipation component is mounted on the substrate 1, and the heat dissipation component includes a heat sink 3, a support column 4, a potting compound 5, and an annular sealing gasket 6.

[0064] Preferably, the radiator 3 mentioned above is usually a horizontal radiator (horizontal radiators are usually placed horizontally, which is suitable for scenarios where space is limited or low-height installation is required).

[0065] In addition, the heat sink 3 includes a heat sink base 31 and a plurality of heat sink fins 32, and the heat sink base 31 has a first surface 311 and a second surface 312 opposite to each other.

[0066] Specifically, multiple heat dissipation fins 32 are spaced apart on the heat dissipation substrate 31, and all multiple heat dissipation fins 32 protrude from the first surface 311. The aforementioned heat dissipation fins 32 can conduct the heat accumulated on the heat dissipation substrate 31 to the external environment (or air).

[0067] To further explain, the circumferential edge of the heat dissipation substrate 31 is provided with a receiving groove 3101 that is recessed from the second surface 312 toward the first surface 311. At this time, a step will be formed at the bottom of the heat dissipation substrate 31 (the bottom of the heat dissipation substrate 31 can be understood as the side of the heat dissipation substrate 31 away from the heat dissipation fins 32).

[0068] One side of the sealing gasket 6 is attached to the bottom surface of the receiving groove 3101 with adhesive backing, while the other side of the sealing gasket 6 is higher than the second surface 312. At this time, the inner ring surface of the sealing gasket 6 and the second surface 312 enclose to form a sealing cavity 1001, and the sealing cavity 1001 can completely cover the mounting groove 101.

[0069] In addition, one side of the support column 4 is attached to the bottom surface of the countersunk hole 3104 with adhesive backing, while the other side of the support column 4 protrudes above the second surface 312, and the support column 4 is located in the aforementioned sealing cavity 1001.

[0070] Furthermore, when the heat dissipation component is assembled onto the substrate 1, the end of the support column 4 away from the heat dissipation base 31 abuts against the bottom surface of the mounting groove 101.

[0071] In other words, the support column 4 can not only support the heat dissipation base 31, but also limit the travel of the fastener 7 when locking the heat dissipation base 31, that is, the support column 4 has the functions of limiting and supporting.

[0072] In this embodiment, the sealed cavity 1001 and the mounting groove 101 enclose a sealed potting space 1002, and the potting adhesive 5 is filled into the potting space 1002 by an automated potting equipment 2000 (only some components are shown). At this time, the potting adhesive 5 can wrap each patch tube 2 so that each patch tube 2 can contact the heat dissipation substrate 31 through the potting adhesive 5.

[0073] It should be noted that the potting compound 5 can also fill the gap between the heat dissipation substrate 31 and the substrate 1, so that the copper foil on the substrate 1 can also come into contact with the heat dissipation substrate 31 through the potting compound 5.

[0074] Understandably, the potting compound 5 can form a uniform thermally conductive layer after curing, thereby ensuring that all the heat generated by the patch tube 2 is transferred to the heat dissipation substrate 31.

[0075] In some embodiments, such as Figures 1-4 As shown, when the heat dissipation component is assembled onto the substrate 1, the side of the sealing gasket 6 away from the heat dissipation substrate 31 is compressed until the end of the support column 4 away from the heat dissipation substrate 31 abuts against the bottom surface of the mounting groove 101, so as to limit the potting compound 5 from overflowing the potting space 1002.

[0076] Specifically, when the heat dissipation component is assembled onto the substrate 1, the fastener 7 applies a pre-tightening force to the heat dissipation base 31. At this time, the sealing gasket 6 (including but not limited to the foam gasket) is relatively compressed with the substrate 1, and the amount of compression is controlled by the support column 4. The compressed sealing gasket 6 can ensure that the heat dissipation base 31 and the substrate 1 are sealed around the joint surface, thereby effectively preventing the potting compound 5 from overflowing from the joint surface between the heat dissipation base 31 and the substrate 1. Specifically, the joint surface is the surface of the substrate 1 where the mounting groove 101 is provided.

[0077] In some embodiments, combined with Figures 1-4 It can be seen that there is a preset first distance between the end of the patch tube 2 away from the substrate 1 and the bottom surface of the mounting groove 101.

[0078] It should be noted that there is a preset second distance between the end of the support column 4 away from the heat dissipation base 31 and the second surface 312.

[0079] It is understandable that the first spacing can be understood as the height of the patch tube 2 protruding from the mounting groove 101, while the second spacing can be understood as the height of the support column 4 protruding from the second surface 312.

[0080] In some embodiments, according to Figures 1-4 It is known that when the end of the support column 4 away from the heat dissipation base 31 abuts against the bottom surface of the mounting groove 101, the first gap is smaller than the second gap, so as to limit the second surface 312 from forming physical contact with the end of the patch tube 2 away from the substrate 1, thereby avoiding pressing the patch tube 2 when the heat sink 3 is installed, and thus avoiding damage to the patch tube 2 by the heat sink 3.

[0081] In some embodiments, refer to Figures 1-5 It can be seen that the heat dissipation substrate 31 has a potting hole 3102 and a plurality of vent holes 3103, and the potting hole 3102 and the plurality of vent holes 3103 both penetrate the first surface 311 and the second surface 312.

[0082] In this embodiment, the glue-filling hole 3102 is located in the middle of the sealing cavity 1001, and a plurality of vent holes 3103 are symmetrically located at the corners of the sealing cavity 1001.

[0083] It should be noted that since the potting hole 3102 is located in the middle of the sealing cavity 1001, the potting compound 5 can be poured in from the middle and flow freely to the four corners evenly (or it can be understood as flowing from the middle to the surrounding area), thereby achieving low-stress filling.

[0084] Among them, low-stress filling can not only avoid damage to the patch tube caused by stress extrusion of thermal conductive putty, thus ensuring the service life and safety of the patch tube; but also ensure the even diffusion of potting compound 5, thereby reducing filling defects.

[0085] In addition, multiple vent holes 3103 are symmetrically arranged at the corners of the sealed cavity 1001, which can effectively expel air bubbles in the potting compound 5 and prevent air entrapment, thereby avoiding the formation of voids after the potting compound 5 has cured.

[0086] In some embodiments, please refer to Figures 1-6 The two ends of the dispensing hole 3102 are connected to the automated dispensing equipment 2000 (only some components are shown) and the dispensing space 1002 respectively, so that the potting adhesive 5 in the automated dispensing equipment 2000 (only some components are shown) flows into the dispensing space 1002 through the dispensing hole 3102.

[0087] In other words, the automated dispensing equipment 2000 (only some components are shown) is aligned with the dispensing hole 3102 in the middle to dispense the glue, and the situation of the vent hole 3103 is observed. When the dispensing is seen to be overflowing from the vent hole 3103, the dispensing is stopped.

[0088] In some embodiments, such as Figures 1-4 As shown, multiple threaded countersunk holes are provided on the second surface 312, and all of the multiple threaded countersunk holes are located inside the sealing cavity 1001.

[0089] It should be noted that the countersunk hole includes countersunk hole 3104 and threaded hole 3105, and at least part of the support post 4 is housed in countersunk hole 3104.

[0090] In some embodiments, combined with Figure 1 and Figure 4 It can be seen that the substrate 1 is provided with multiple mounting holes 102, and the support column 4 is provided with through holes 401.

[0091] It is understandable that when the heat dissipation component is assembled onto the substrate 1, the mounting hole 102, the through hole 401 and the threaded countersunk hole are coaxially arranged.

[0092] In some embodiments, according to Figure 1 and Figure 4 It is known that the power board assembly 100 also includes: multiple fasteners 7.

[0093] Each fastener 7 corresponds to a threaded countersunk hole, and each fastener 7 includes a head 701 and a threaded portion 702.

[0094] In addition, the fastener 7 includes, but is not limited to, screws.

[0095] In some embodiments, refer to Figures 1-4 It can be seen that when the threaded part 702 passes through the mounting hole 102 and the through hole 401 in sequence until it is inserted into the threaded hole 3105, the heat dissipation base 31 is fixedly mounted on the substrate 1.

[0096] In this embodiment, when the end of the support column 4 away from the heat dissipation base 31 is in contact with the bottom surface of the mounting groove 101, it indicates that the heat dissipation base 31 has been fixed.

[0097] Figure 7 An exploded view of an energy storage device including a power board assembly with electronic components, provided for an embodiment of this utility model.

[0098] like Figure 7 As shown, to clearly illustrate the heat dissipation effect of the power board assembly 100, the operator can assemble the power board assembly 100 in the energy storage device 1000 for thermal simulation. The energy storage device 1000 includes, but is not limited to, the power board assembly 100, the top cover 200, the air duct paper 300, the cooling fan 400, the battery pack 500, and the bottom shell 600. The power board assembly 100 uses the cooling fan 400 to achieve air cooling. In addition, the ambient temperature is set to 40℃ (℃ is degrees Celsius), the single loss of the patch tube 2 is set to 1W (W is watt), and the thermal conductivity of the potting compound 5 is set to 2W / m·K (W / m·K is watts / meter·Kelvin). Furthermore, the definition of thermal conductivity (or thermal conductivity coefficient) is: under stable heat transfer conditions, the amount of heat transferred through an area of ​​1 square meter in 1 second by a material with a thickness of 1 meter and a temperature difference of 1 Kelvin between its two surfaces.

[0099] Figure 8 Temperature simulation diagram of potting compound provided in this embodiment of the utility model.

[0100] according to Figure 4 and Figure 8It can be seen that the temperature of the potting compound at the same position near the patch tube 2 fluctuates around 64.2℃, with the highest being 64.57℃ and the lowest being 64.02℃, and the maximum temperature difference being 0.55℃. This indicates that the power board assembly 100 uses potting compound 5 to fill the gap between the heat dissipation substrate 31 and the substrate 1, which not only forms a uniform thermally conductive layer after curing, but also ensures that all heat is transferred to the heat dissipation substrate 31.

[0101] It should be noted that the potting compound located in the same position as patch tube 2 can be understood as: potting compound located in the same area as patch tube 2, or potting compound that directly covers the surface of patch tube 2.

[0102] Figure 9 Temperature simulation diagram of the radiator provided in this embodiment of the utility model.

[0103] like Figure 1 and Figure 9 As shown, due to the uniformity of temperature transfer of the potting compound 5, the temperature transfer of the heat dissipation fins 32 is also relatively uniform.

[0104] Specifically, the temperature of the heat dissipation fins 32 is around 63.3℃, ​​with a maximum of 63.43℃ and a minimum of 63℃, and a maximum temperature difference of 0.43℃. This not only effectively prevents excessive heat accumulation in a certain part of the heat dissipation fins 32, which would cause some heat dissipation fins to overheat while others remain at a low temperature, but also avoids wasting a portion of the heat dissipation area of ​​the heat dissipation fins 32, thereby improving the heat dissipation efficiency of the heat dissipation fins 32.

[0105] Figure 10 A block diagram of the heat conduction path provided in the embodiment of the utility model.

[0106] Reference Figure 10 It can be seen that a portion of the heat generated by the surface mount tube 2 is transferred to the copper foil 1004 of the substrate 1 through the pins of the surface mount tube 2, while the other portion of the heat generated by the surface mount tube 2 is directly transferred to the potting compound 5; a portion of the heat accumulated on the copper foil 1004 is directly conducted to the external environment (or air 3000) through the substrate 1, while the other portion of the heat accumulated on the copper foil 1004 is transferred to the potting compound 5; the heat accumulated on the potting compound 5 is completely conducted to the external environment (or air 3000) through the heat sink 3.

[0107] In summary, the surface-mount tube in this power board assembly is positioned within a sealed potting space, allowing manufacturers to directly fill the space with potting compound using automated potting equipment. This design effectively avoids uneven application of thermal grease, preventing heat dissipation failure and ensuring the power board assembly's cooling performance. Furthermore, the potting compound can flow freely within the sealed space, completely encapsulating the surface-mount tube. This design effectively improves the interface adhesion between the potting compound and the surface-mount tube, resulting in more uniform heat dissipation and thus enhancing the power board assembly's cooling efficiency and reliability. Therefore, the power board assembly provided by this embodiment is novel compared to traditional power board assemblies.

[0108] The above description, in conjunction with specific / preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. Those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and all of these fall within the protection scope of the present invention.

Claims

1. A power board assembly, characterized in that, include: A substrate, wherein a preset mounting groove is formed on the substrate; Multiple patch tubes are spaced apart within the mounting slot; A heat dissipation component is mounted on the substrate, and the heat dissipation component includes a heat sink, a support column, potting compound, and an annular sealing gasket. The heat sink includes a heat sink base and a plurality of heat sink fins, and the heat sink base has a first surface and a second surface opposite to each other; Multiple heat dissipation fins are spaced apart on the heat dissipation substrate, and all of the multiple heat dissipation fins protrude from the first surface; The circumferential edge of the heat dissipation substrate is provided with a receiving groove that is recessed from the second surface toward the first surface; The sealing gasket is disposed in the receiving groove, and at this time the inner annular surface of the sealing gasket and the second surface enclose a sealing cavity, and the sealing cavity can cover the mounting groove; The support column is disposed in the sealed cavity. When the heat dissipation component is assembled to the substrate, the end of the support column away from the heat dissipation substrate abuts against the bottom surface of the mounting groove. The sealed cavity and the mounting groove form a closed potting space, and the potting adhesive is filled into the potting space by an automated potting equipment. At this time, the potting adhesive can wrap each of the patch tubes so that each of the patch tubes can contact the heat dissipation substrate through the potting adhesive.

2. The power board assembly according to claim 1, characterized in that, When the heat dissipation component is assembled onto the substrate, the side of the sealing gasket away from the heat dissipation substrate is compressed until the end of the support post away from the heat dissipation substrate abuts against the bottom surface of the mounting groove, thereby preventing the potting compound from overflowing the potting space.

3. The power board assembly according to claim 1, characterized in that, The end of the patch tube furthest from the substrate has a predetermined first distance from the bottom surface of the mounting groove; The end of the support column away from the heat dissipation substrate has a preset second distance from the second surface.

4. The power board assembly according to claim 3, characterized in that, When the end of the support column away from the heat dissipation substrate abuts against the bottom surface of the mounting groove, the first gap is smaller than the second gap, so as to limit the second surface from forming physical contact with the end of the patch tube away from the substrate.

5. The power board assembly according to claim 1, characterized in that, The heat dissipation substrate has potting holes and multiple vent holes, and the potting holes and multiple vent holes all penetrate the first surface and the second surface; The glue-filling hole is located in the middle of the sealed cavity, and the plurality of vent holes are symmetrically arranged at the corners of the sealed cavity.

6. The power board assembly according to claim 5, characterized in that, The two ends of the dispensing hole are respectively connected to the automated dispensing equipment and the dispensing space, so that the potting adhesive in the automated dispensing equipment flows into the dispensing space through the dispensing hole.

7. The power board assembly according to claim 1, characterized in that, The second surface has a plurality of threaded countersunk holes, and all of the plurality of threaded countersunk holes are located within the sealing cavity; The countersunk hole includes a countersunk hole and a threaded hole, and at least a portion of the support column is housed within the countersunk hole.

8. The power board assembly according to claim 7, characterized in that, The substrate is provided with a plurality of mounting holes, and the support column is provided with a through hole. When the heat dissipation component is assembled onto the substrate, the mounting hole, the through hole, and the threaded countersunk hole are coaxially arranged.

9. The power board assembly according to claim 8, characterized in that, Also includes: A plurality of fasteners, each fastener corresponding to a threaded countersunk hole, and each fastener including a head and a threaded portion.

10. The power board assembly according to claim 9, characterized in that... When the threaded portion passes through the mounting hole and the through hole in sequence until it is inserted into the threaded hole, the heat dissipation substrate is fixedly mounted on the substrate.

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