A mobile phone air-cooled radiator

Abstract

The utility model provides a kind of mobile phone air-cooled radiator, including shell, shell and refrigeration head are enclosed into an installation space, heat conduction plate, outer thread heat dissipation column and heat dissipation fan are all located in installation space;Outer thread heat dissipation column is located in the side of heat conduction plate away from refrigeration head, heat dissipation fan is installed in the side of outer thread heat dissipation column away from heat conduction plate;Heat conduction plate, annular piece and cold plate are enclosed into a heat insulation space, semiconductor refrigeration piece is installed in heat insulation space, semiconductor refrigeration piece has cold face and hot face, cold face is contacted with cold plate, hot face is contacted with heat conduction plate.The utility model effectively expands the contact area of radiator and air by setting outer thread heat dissipation column, further improves the heat dissipation efficiency, solves the problem of low heat dissipation efficiency of traditional air-cooled radiator, greatly improves overall heat dissipation effect.Refrigeration head is treated by vacuumizing inside, reduces the convection of hot face and cold face of semiconductor refrigeration piece, improves the refrigeration effect of refrigeration head, greatly enhances cooling efficiency.

Description

Technical Field

[0001] This utility model relates to the field of mobile phone heat sink technology, and in particular to a mobile phone air-cooled heat sink. Background Technology

[0002] In mobile live streaming scenarios, the continuous operation of the camera, the real-time encoding and transmission of the image, and the frequent interaction of network data will cause multiple processor cores to operate at full capacity. When running games on mobile devices, the demands of high-quality rendering and complex scene calculations will cause the chip to be under high load for a long time, resulting in the device heating up rapidly.

[0003] To prevent mobile phones from experiencing malfunctions such as screen stuttering, live streaming interruptions, game frame drops, or even automatic shutdowns due to overheating, engineers have developed mobile phone heat sinks. Mobile phone heat sinks can be divided into air-cooled heat sinks and liquid-cooled heat sinks.

[0004] In recent years, as apps have been continuously upgraded and their memory usage has increased, the heat generated by mobile phones during app operation has also gradually increased. However, the heat dissipation efficiency of current air-cooled radiators is low, which often results in slow cooling speed or incomplete heat dissipation, making it difficult to meet the heat dissipation needs of mobile devices. Utility Model Content

[0005] The technical problem to be solved by this utility model is to provide a mobile phone air-cooled heat sink, which uses an aluminum shell and increases the heat dissipation area through external threaded posts to enhance the heat dissipation effect; it also optimizes the cooling head by using vacuum insulation technology, which greatly improves the cooling efficiency.

[0006] This utility model is implemented as follows:

[0007] This utility model provides a mobile phone air-cooled heat sink, including a shell, a cooling head for contacting the mobile phone, a heat conduction plate, an externally threaded heat sink column, and a cooling fan;

[0008] The outer casing and the cooling head form an installation space, and the heat-conducting plate, the externally threaded heat dissipation column, and the cooling fan are all located within the installation space; the externally threaded heat dissipation column is located on the side of the heat-conducting plate away from the cooling head, and the cooling fan is located on the side of the externally threaded heat dissipation column away from the heat-conducting plate;

[0009] A ring-shaped component is provided on the side of the heat-conducting plate near the cooling head. The cooling head includes a semiconductor cooling chip and a cold-conducting plate. The heat-conducting plate, the ring-shaped component, and the cold-conducting plate enclose a heat-insulating space. The semiconductor cooling chip is installed in the heat-insulating space. The semiconductor cooling chip has a cold side and a hot side. The cold side is in contact with the cold-conducting plate, and the space between the cold side and the cold-conducting plate is filled with thermally conductive silicone grease. The hot side is in contact with the heat-conducting plate, and the space between the hot side and the heat-conducting plate is filled with thermally conductive silicone grease.

[0010] Furthermore, the cooling plate has suction holes for vacuuming, and after vacuuming inside the heat insulation space, a vacuum cavity is formed inside the heat insulation space, giving it vacuum insulation capability. The suction holes are also used to inject insulating varnish into the cavity, so that the entire interior and the PN junction of the semiconductor wafer are covered with a layer of insulating varnish, which insulates and protects the semiconductor cooling chip to make it more impact resistant. Then, aerogel is injected, which is used to prevent air molecule convection. The suction holes are connected to screws for sealing the suction holes.

[0011] Furthermore, a magnetic ring groove is provided on the outer side of the cold-conducting plate, a magnetic ring is installed in the magnetic ring groove, and magnetic powder thermal conductive silicone is provided on the outer side of the cold-conducting plate.

[0012] Furthermore, the heat-conducting plate has several recessed holes, and the external thread heat dissipation column corresponds to each of the recessed holes. One end of each external thread heat dissipation column is fixedly installed in the recessed hole.

[0013] Furthermore, the externally threaded heat sink has a central hole at the end facing the cooling fan.

[0014] Furthermore, the heat-conducting plate, the cold-conducting plate, and the externally threaded heat dissipation column are all made of aluminum.

[0015] Furthermore, it also includes a control motherboard installed inside the casing. The heat-conducting plate has two through holes, through which the connecting wires of the semiconductor cooling chip extend to the outside of the heat insulation space, and the through holes are sealed with glue.

[0016] The advantages of this utility model are:

[0017] 1. The externally threaded heat dissipation column effectively expands the contact area between the heat sink and the air, further improving the heat dissipation efficiency, solving the problem of low heat dissipation efficiency of traditional air-cooled heat sinks, and greatly improving the overall heat dissipation effect.

[0018] 2. The cooling head employs a vacuum process to create a vacuum cavity inside, reducing convection between the hot and cold sides of the thermoelectric cooler. This minimizes heat transfer caused by air convection, significantly improving the cooling effect and greatly enhancing cooling efficiency. Vacuum insulation can also be used for cooling heads in water-cooled radiators and other thermoelectric cooling applications. Furthermore, when a radiator is dropped, the cooling chip is easily disintegrated upon impact. Insulating varnish is injected into the cavity, coating the PN junction surface of the thermoelectric cooler with a layer of insulating varnish, making it more impact-resistant and less prone to disintegration while also providing insulation. Insulating varnish injection into thermoelectric coolers can be applied not only to thermoelectric coolers in air-cooled radiators but also to thermoelectric coolers in liquid-cooled or water-cooled radiators, and in other thermoelectric cooling applications. Aerogel is injected into the cooling head housing before vacuuming. The aerogel prevents the convection of small amounts of air molecules in a vacuum environment, further enhancing the long-lasting vacuum insulation effect. Attached Figure Description

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0020] Figure 1 This is a schematic diagram of a mobile phone air-cooled heat sink structure according to the present invention. Figure 1 .

[0021] Figure 2 This is a schematic diagram of the structure of a mobile phone air-cooled heat sink after concealing magnetic powder thermal conductive silicone.

[0022] Figure 3 for Figure 1 Explosion diagram of the structure shown Figure 1 .

[0023] Figure 4 for Figure 1 Explosion diagram of the structure shown Figure 2 .

[0024] Figure 5 This is a schematic diagram of the external thread heat dissipation column structure in this utility model.

[0025] Figure 6 This is a schematic diagram of the heat-conducting plate structure in this utility model.

[0026] Figure 7 This is a schematic diagram of the connection structure between the cold-conducting plate, the semiconductor cooling chip, the annular component, and the heat-conducting plate in this utility model.

[0027] Explanation of the labels in the diagram:

[0028] 1. Outer shell; 2. Cooling head; 21. Semiconductor cooling chip; 22. Cooling plate; 221. Suction hole; 222. Magnetic ring groove; 3. Heat-conducting plate; 31. Recessed hole; 32. Wiring hole; 4. External thread heat sink; 41. Center hole; 5. Cooling fan; 6. Ring-shaped component; 7. Screw; 8. Magnetic ring; 9. Control board; 10. Magnetic powder thermal conductive silicone. Detailed Implementation

[0029] Please see Figures 1 to 7 This utility model provides a mobile phone air-cooled heat sink, including a shell 1, a cooling head 2 for contacting the mobile phone, a heat conduction plate 3, an externally threaded heat dissipation column 4, and a heat dissipation fan 5;

[0030] The outer shell 1 and the cooling head 2 enclose an installation space, and the heat-conducting plate 3, the external thread heat dissipation column 4 and the cooling fan 5 are all located within the installation space; the external thread heat dissipation column 4 is located on the side of the heat-conducting plate 3 away from the cooling head 2, and the cooling fan 5 is located on the side of the external thread heat dissipation column 4 away from the heat-conducting plate 3.

[0031] An annular component 6 is disposed on the side of the heat-conducting plate 3 near the cooling head 2. The cooling head 2 includes a semiconductor cooling chip 21 and a cold-conducting plate 22. The heat-conducting plate 3, the annular component 6, and the cold-conducting plate 22 enclose a heat-insulating space. The semiconductor cooling chip 21 is installed within the heat-insulating space. The semiconductor cooling chip 21 has a cold side and a hot side. The cold side is in contact with the cold-conducting plate 22, and the space between the cold side and the cold-conducting plate 22 is filled with thermally conductive silicone grease. The hot side is in contact with the heat-conducting plate 3, and the space between the hot side and the heat-conducting plate is filled with thermally conductive silicone grease. When the semiconductor cooling chip 21 is working, one end is the cold side and the other end is the hot side. The cold side is in contact with the cold-conducting plate 22, and the heat generated by the operation of the mobile phone is transferred to the cold-conducting plate 22. The hot side is in contact with the heat-conducting plate 3 to conduct heat to the heat-conducting plate 3. The heat on the heat-conducting plate 3 is finally conducted to the externally threaded heat dissipation column 4. After the cooling fan 5 is started, the outside air is blown towards the externally threaded heat dissipation column 4. Because the outer wall of the externally threaded heat sink 4 has external threads, the contact area between the heat sink and the air is effectively expanded, which further improves the heat dissipation efficiency and effectively reduces the hot surface temperature of the semiconductor cooling chip 21, enabling the semiconductor cooling chip 21 to work more efficiently. This solves the problem of low heat dissipation efficiency of traditional air-cooled heat sinks and greatly improves the heat dissipation effect.

[0032] Specifically, the cooling plate 22 has a suction hole 221 for vacuuming. After vacuuming inside the heat insulation space, a vacuum cavity is formed inside the heat insulation space, giving it vacuum insulation capability. The suction hole 221 is also used to inject insulating varnish (insulating glue) into the vacuum cavity, so that the entire interior and the PN junction of the semiconductor cooling chip are covered with a layer of insulating varnish, which can insulate and protect the semiconductor cooling chip to be more impact resistant. Then, aerogel is injected. The aerogel is used to prevent the convection of a small number of air molecules. The suction hole 221 is connected to a screw 7 to seal the suction hole 221.

[0033] When a heat sink is dropped, the cooling chip is easily damaged by the impact and can easily break apart. Injecting insulating varnish into the cavity, covering the entire interior and the PN junction surface of the cooling chip with a layer of insulating varnish, makes it more impact-resistant, less prone to breakage, and also provides insulation. Injecting insulating varnish into cooling chips can be used not only in air-cooled heat sinks but also in liquid-cooled or water-cooled heat sinks for chip protection, and can also be used independently in other cooling applications.

[0034] After the aerogel is injected, the suction hole 221 is sealed. The aerogel fills the gap between the heat insulation space (enclosed by the heat-conducting plate 3, the annular component 6, and the cold-conducting plate 22) and the semiconductor cooling chip 21. The heat insulation space of the cooling head 2 is vacuum-treated to achieve vacuum insulation, which minimizes heat transfer caused by air convection, significantly improves the heat insulation effect of the heat insulation space of the cooling head 2, and ensures that the cooling energy generated by the semiconductor cooling chip 21 is concentrated on the heat-generating parts of the electronic device, greatly enhancing the cooling efficiency. Insulating varnish is injected into the housing of the cooling head 2, so that the interior and the PN junction of the semiconductor cooling chip are coated with a layer of insulating varnish, which has an insulating effect and makes the semiconductor cooling chip more impact-resistant. The aerogel injected before vacuuming is used to prevent the convection of the remaining small amount of air molecules, which can further enhance the heat insulation effect.

[0035] Specifically, a magnetic ring groove 222 is provided on the outer side of the cooling plate 22, and a magnetic ring 8 is installed in the magnetic ring groove 222. Magnetic powder thermally conductive silicone 10 is provided on the outer side of the cooling plate 22. The magnetic ring 8 can be attracted with the hidden magnetic sheet on the inside of the mobile phone, so that the mobile phone is magnetically attracted to the cooling head 2.

[0036] Specifically, the heat-conducting plate 3 has a plurality of recessed holes 31, and the external thread heat dissipation column 4 corresponds one-to-one with the recessed holes 31. One end of each external thread heat dissipation column 4 is fixedly installed in the recessed hole 31.

[0037] Specifically, the externally threaded heat sink 4 has a central hole 41 at the end facing the cooling fan 5. The central hole 41 further increases the heat dissipation area of ​​the externally threaded heat sink 4.

[0038] Specifically, the heat-conducting plate 3, the cold-conducting plate 22, and the externally threaded heat dissipation column 4 are all made of aluminum.

[0039] Specifically, it also includes a control motherboard 9 installed inside the outer casing 1. The heat-conducting plate 3 has two through holes 32, through which the connecting wires of the thermoelectric cooler 21 extend to the outside of the heat-insulating space, and the through holes are sealed with glue. In this embodiment, the control motherboard 9 is connected to the thermoelectric cooler 21 and the cooling fan 5. The thermoelectric cooler 21 is also connected to an interface for connecting to an external power source.

[0040] While specific embodiments of the present invention have been described above, those skilled in the art should understand that the specific embodiments described are merely illustrative and not intended to limit the scope of the present invention. Equivalent modifications and variations made by those skilled in the art in accordance with the spirit of the present invention should be covered within the scope of protection of the claims of the present invention.

Claims

1. A mobile phone air-cooled heat sink, characterized by: Includes the outer casing, a cooling head for contacting the phone, a heat-conducting plate, externally threaded heat sinks, and a cooling fan; The outer casing and the cooling head form an installation space, and the heat-conducting plate, the externally threaded heat dissipation column, and the cooling fan are all located within the installation space; the externally threaded heat dissipation column is located on the side of the heat-conducting plate away from the cooling head, and the cooling fan is installed on the side of the externally threaded heat dissipation column away from the heat-conducting plate; A ring-shaped component is provided on the side of the heat-conducting plate near the cooling head. The cooling head includes a semiconductor cooling chip and a cold-conducting plate. The heat-conducting plate, the ring-shaped component, and the cold-conducting plate enclose a heat-insulating space. The semiconductor cooling chip is installed in the heat-insulating space. The semiconductor cooling chip has a cold side and a hot side. The cold side is in contact with the cold-conducting plate, and the space between the cold side and the cold-conducting plate is filled with thermally conductive silicone grease. The hot side is in contact with the heat-conducting plate, and the space between the hot side and the heat-conducting plate is filled with thermally conductive silicone grease.

2. The mobile phone air-cooled heat sink as described in claim 1, characterized in that: The cooling plate has suction holes for vacuuming. After vacuuming inside the insulation space, a vacuum cavity is formed inside the insulation space, giving it vacuum insulation capability. The suction holes are also used to inject insulating varnish into the cavity, so that the entire interior and the PN junction of the semiconductor cooling chip are covered with a layer of insulating varnish, which insulates and protects the semiconductor cooling chip to make it more impact resistant. Then, aerogel is injected to prevent air molecule convection. The suction holes are connected to screws for sealing the suction holes.

3. The mobile phone air-cooled heat sink as described in claim 1, characterized in that: A magnetic ring groove is provided on the outer side of the cooling plate, a magnetic ring is installed in the magnetic ring groove, and magnetic powder thermal conductive silicone is provided on the outer side of the cooling plate.

4. A mobile phone air-cooled heat sink as described in claim 1, characterized in that: The heat-conducting plate has a number of recessed holes, and the external thread heat dissipation column corresponds to each of the recessed holes. One end of each external thread heat dissipation column is fixedly installed in the recessed hole.

5. A mobile phone air-cooled heat sink as described in claim 1, characterized in that: The externally threaded heat sink has a central hole at the end facing the cooling fan.

6. A mobile phone air-cooled heat sink as described in claim 1, characterized in that: The heat-conducting plate, cold-conducting plate, and externally threaded heat dissipation column are all made of aluminum.

7. A mobile phone air-cooled heat sink as described in claim 1, characterized in that: It also includes a control board installed inside the housing. The heat-conducting plate has two through holes. The connecting wires of the semiconductor cooling chip extend to the outside of the heat insulation space through the through holes, and the through holes are sealed with glue.

Images