material taking mechanism

By setting the material handling module and the linkage module on different mounting surfaces of the mounting base in the chip testing equipment, and driving the mounting base to move through the drive module, the problems of large space occupation and high cost of the material handling mechanism are solved, achieving a more compact structure and cost savings.

CN224393976UActive Publication Date: 2026-06-23CARDMATIX

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
CARDMATIX
Filing Date
2025-06-30
Publication Date
2026-06-23

AI Technical Summary

Technical Problem

The material handling mechanism of existing chip testing equipment occupies a large space and has high production costs, resulting in a large size of the mechanism.

Method used

The material handling module and the linkage module are respectively set on different mounting surfaces of the mounting base, and the mounting base is moved by the drive module, so as to simultaneously drive the material handling module and the linkage module to move, reducing the use of the driver and making the structure compact.

Benefits of technology

The space occupied by the material handling mechanism has been reduced, production costs have been lowered, and a more compact structural design has been achieved.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a material taking mechanism, comprising a mounting seat, a material taking module, a linkage module and a driving module. The mounting seat has a first mounting surface and a second mounting surface; the material taking module comprises a first lifting driver and a material taking head, and the first lifting driver is drivingly connected to the material taking head; the linkage module comprises a second lifting driver and a pressing plate, the second lifting driver is fixed to the second mounting surface, and the second lifting driver is drivingly connected to the pressing plate; and the driving module is drivingly connected to the mounting seat. The material taking module and the linkage module are arranged on the mounting seat, the driving module is drivingly connected to the mounting seat, the driving module drives the mounting seat to move so as to simultaneously drive the material taking module and the linkage module to move, the use of the driver can be reduced, the occupied space of the material taking mechanism can be reduced, and the production cost is saved. The material taking module and the linkage module are arranged on the intersecting first mounting surface and second mounting surface respectively, the occupied space of the material taking mechanism can be further reduced, and the structure is more compact.
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Description

Technical Field

[0001] This application relates to the field of chip testing technology, and in particular to a testing device. Background Technology

[0002] After the chip is programmed, it needs to be tested to check if the programming was successful. In related technologies, a robotic arm picks up the chip and places it in the testing slot of a testing fixture. The terminals of the detector are located at the bottom of the testing slot, and the chip contacts the terminals of the detector. The detector is electrically connected to the chip to test it. The testing fixture is usually equipped with a gripper to close the testing slot. When it is necessary to pick up or put down the chip relative to the testing slot, a linkage module is required to cooperate with the gripper to open the testing slot. After the gripper opens the testing slot, the picking module picks up or puts down the chip relative to the testing slot. The picking module and the linkage module are usually driven by two drive modules, which results in the mechanism occupying more space, having a larger size, and higher production costs. Utility Model Content

[0003] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes a material handling mechanism that can reduce space occupation and lower production costs.

[0004] The material handling mechanism according to an embodiment of this application includes: a mounting base, a material handling module, a linkage module, and a drive module.

[0005] The mounting base has a first mounting surface and a second mounting surface;

[0006] The material handling module includes a first lifting driver and a material handling head. The first lifting driver is connected to the material handling head and is used to drive the material handling head to rise and fall. The material handling head is used to pick up chips.

[0007] The linkage module includes a second lifting driver and a pressure plate. The second lifting driver is fixed to the second mounting surface and drives the pressure plate to lift the pressure plate. The pressure plate is used to cooperate in pushing the grippers on the detection fixture to open and close the detection slots on the detection fixture.

[0008] A drive module, which drives the mounting base, is used to drive the material handling module and the linkage module to move closer to or further away from the detection fixture carrying the chip.

[0009] The material handling mechanism according to the embodiments of this application has at least the following advantages: both the material handling module and the linkage module are disposed on the mounting base, and the drive module drives and connects to the mounting base. The drive module moves the mounting base to simultaneously move the material handling module and the linkage module, which reduces the use of the driver, thereby reducing the space occupied by the material handling mechanism and saving production costs. Furthermore, by disposing of the material handling module and the linkage module on the intersecting first and second mounting surfaces respectively, the space occupied by the material handling mechanism can be further reduced, making the structure more compact.

[0010] According to some embodiments of this application, the first lifting driver includes a belt drive assembly and a first motor. The mounting base forms a third mounting surface on the side opposite to the first mounting surface. The first motor is disposed on the third mounting surface. The driving end of the first motor passes through the mounting base and is drivenly connected to the belt drive assembly. The belt drive assembly is drivenly connected to the material picking head. The belt drive assembly is located between the material picking module and the first mounting surface.

[0011] According to some embodiments of this application, the belt drive assembly includes a first drive wheel, a second drive wheel, and a drive belt. The first drive wheel and the second drive wheel are rotatably connected to the first mounting surface. The first motor drives the first drive wheel. The drive belt is wound around the first drive wheel and the second drive wheel. The material pick-up head is connected to the drive belt. The first drive wheel and the second drive wheel are distributed along the height direction. The axis of the first drive wheel and the axis of the second drive wheel are both perpendicular to the first mounting surface.

[0012] According to some embodiments of this application, the material handling module further includes a first guide component, the first guide component includes a first slide rail and a first slide block, the first slide rail is fixed to the first mounting surface, the first slide rail is located beside the belt drive component, the first slide rail extends in the height direction, the first slide block is slidably connected to the first slide rail, and the material handling head is fixed to the first slide block.

[0013] According to some embodiments of this application, the material handling module further includes a first shielding plate and at least two first position sensors. The first position sensors are disposed on the third mounting surface, and a plurality of the first position sensors are distributed along the height direction. The first position sensors are electrically connected to the first lifting driver. The mounting base has a through slot that penetrates the first mounting surface and the second mounting surface. The first shielding plate can move along the height direction through the through slot. One end of the first shielding plate is fixedly connected to the first slide block, and the other end of the first shielding plate can pass through the detection area of ​​the first position sensor.

[0014] According to some embodiments of this application, the second lifting driver includes a second motor and a connecting block. The second motor is fixed to the second mounting surface, the driving end of the second motor is connected to the upper end of the connecting block, the connecting block is located between the material picking head and the second mounting surface, and the pressure plate is fixed to the lower end of the connecting block.

[0015] According to some embodiments of this application, the linkage module further includes a second guide component, the second guide component including a second slide rail and a second slide block, the second slide rail being fixed to the second mounting surface, the second slide rail and the second slide block being located between the connecting block and the second mounting surface, the second slide rail extending along the height direction, the second slide block being slidably connected to the second slide rail, and the connecting block being fixed to the second slide block.

[0016] According to some embodiments of this application, the linkage module further includes a second shielding plate and at least two second position sensors. The second position sensors are disposed on the second mounting surface and located beside the connecting block. Multiple second position sensors are distributed along the height direction. The second position sensors are signal-connected to the second lifting driver. One end of the second shielding plate is fixedly connected to the connecting block, and the other end of the second shielding plate can pass through the detection area of ​​the second position sensor.

[0017] According to some embodiments of this application, the pressure plate has a clearance hole in the middle, and the material taking head corresponds to the clearance hole along the height direction and can pass through the clearance hole.

[0018] According to some embodiments of this application, the material handling module further includes a pump body, which is fixed to the mounting base, and the suction end of the pump body is connected to the material handling head.

[0019] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0020] The present application will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0021] Figure 1 A schematic diagram of the testing equipment used in the material handling mechanism of an embodiment of this application;

[0022] Figure 2 for Figure 1 Schematic diagram of the material handling mechanism;

[0023] Figure 3 for Figure 2 A schematic diagram of the structure of the material handling mechanism from another direction;

[0024] Figure 4 for Figure 1 A schematic diagram of the structure of the testing mechanism.

[0025] Figure label:

[0026] Material handling mechanism 1000;

[0027] Drive module 100;

[0028] Material handling module 200, first lifting driver 210, belt drive assembly 211, first drive wheel 2111, second drive wheel 2112, drive belt 2113, first motor 212, material handling head 220, pump body 230, first guide assembly 240, first slide rail 241, first slide block 242, first shield 250, first position sensor 260;

[0029] Linkage module 300, second lifting driver 310, second motor 311, connecting block 312, pressure plate 320, clearance hole 321, second guide assembly 330, second slide rail 331, second slide block 332, second shielding plate 340, second position sensor 350;

[0030] Mounting base 400, first mounting surface 410, second mounting surface 420, third mounting surface 430; through groove 440;

[0031] Testing agency 2000;

[0032] Inspection fixture 500, inspection tank 510;

[0033] Gripper 600. Detailed Implementation

[0034] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0035] In the description of this application, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0036] In the description of this application, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0037] In the description of this application, unless otherwise expressly defined, terms such as "setup," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this application in conjunction with the specific content of the technical solution.

[0038] In the description of this application, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0039] Reference Figure 2 and Figure 3 The material handling mechanism 1000 according to an embodiment of this application includes: a mounting base 400, a material handling module 200, a linkage module 300, and a drive module 100.

[0040] Mounting base 400 has a first mounting surface 410 and a second mounting surface 420.

[0041] The material handling module 200 includes a first lifting driver 210 and a material handling head 220. The first lifting driver 210 drives the material handling head 220 to lift and lower. The material handling head 220 is used to adsorb chips.

[0042] The linkage module 300 includes a second lifting driver 310 and a pressure plate 320. The second lifting driver 310 is fixed to the second mounting surface 420. The second lifting driver 310 drives the pressure plate 320 to lift and lower. The pressure plate 320 is used to cooperate in pushing the gripper 600 on the detection fixture 500 to open and close the detection slot 510 on the detection fixture 500.

[0043] The drive module 100 drives the mounting base 400 to drive the material handling module 200 and the linkage module 300 to approach or move away from the detection fixture 500 carrying the chip.

[0044] It should be noted that, referring to Figure 1 The material handling mechanism of this application is applied to a testing device, with reference to... Figure 4 The testing equipment also includes a testing mechanism 2000 and a picking mechanism 1000 for picking up and placing chips on the testing mechanism. The testing mechanism 2000 includes a testing fixture 500, a gripper 600, and a detector (not shown in the figure). The testing fixture 500 has a testing slot 510 for placing chips. The terminals of the detector are disposed in the testing slot 510 for electrical connection with the chips in the testing slot 510. The detector can detect the chips in the testing slot 510. The gripper 600 is oscillatingly disposed on the testing fixture 500 to open and close the testing slot.

[0045] Understandably, the drive module 100 can drive the picking module 200 and the linkage module 300 to move, so that the picking module 200 and the linkage module 300 move above the detection fixture 500. Initially, the gripper 600 is positioned to shield the detection slot 510, and the projection of the gripper 600 onto the horizontal plane overlaps with that of the detection slot 510. The gripper 600 would obstruct the picking module 200 from placing the chip into the detection slot 510. Therefore, the linkage module 300 can first push the gripper 600 to swing it, causing the gripper 600 to deviate from the projection of the detection slot 510 onto the horizontal plane. This opens and exposes the detection slot 510, and the gripper 600 no longer obstructs the picking module 200 from placing the chip into the detection slot 510, allowing the picking module 200 to place the chip into the detection slot 510 or remove the chip that has completed detection from the detection slot 510.

[0046] Specifically, after the picking module 200 is moved above the testing fixture 500, the first lifting driver 210 drives the picking head 220 to descend, bringing it closer to the testing slot 510 of the testing fixture 500. The picking head 220 places the chip it has attracted into the testing slot 510. Subsequently, the first lifting driver 210 drives the picking head 220 to rise away from the testing fixture 500. Correspondingly, after the chip testing is completed, the first lifting driver 210 drives the picking head 220 to descend, bringing it closer to the testing slot 510 of the testing fixture 500. The picking head 220 attracts the tested chip in the testing slot 510, and subsequently, the first lifting driver 210 drives the picking head 220 to rise away from the testing fixture 500.

[0047] Understandably, after the pick-up module 200 moves to above the inspection fixture 500, the second lifting driver 310 drives the pressure plate 320 to descend. The pressure plate 320 approaches the gripper 600 on the inspection fixture 500, and the pressure plate 320 pushes the gripper 600 to swing, opening the inspection slot 510. After the pick-up head 220 places the chip into the inspection slot 510, the second lifting driver 310 drives the pressure plate 320 to rise away from the inspection fixture 500, and the gripper 600 swings back to the position covering the inspection slot 510. Correspondingly, after the chip inspection is completed, the second lifting driver 310 drives the pressure plate 320 to descend. The pressure plate 320 approaches the gripper 600 on the inspection fixture 500, and the pressure plate 320 pushes the gripper 600 to swing, opening the inspection slot 510. The pick-up head 220 picks up the inspected chip in the inspection slot 510, and then the second lifting driver 310 drives the pressure plate 320 to rise away from the inspection fixture 500.

[0048] Understandably, both the material handling module 200 and the linkage module 300 are mounted on the mounting base 400. The drive module 100 drives and connects to the mounting base 400. By moving the mounting base 400, the drive module 100 simultaneously moves the material handling module 200 and the linkage module 300, reducing the need for a driver and thus reducing the space occupied by the material handling mechanism 1000, thereby saving production costs. Furthermore, by placing the material handling module 200 and the linkage module 300 on the intersecting first mounting surface 410 and second mounting surface 420 respectively, the space occupied by the material handling mechanism 1000 can be further reduced, making the structure more compact.

[0049] Specifically, the mounting base 400 has an L-shaped cross-section, with the first mounting surface 410 and the second mounting surface 420 perpendicular to each other and being two adjacent vertical surfaces of the L-shaped mounting base 400.

[0050] Specifically, in this embodiment, the drive module 100 includes a translation screw assembly, which drives the mounting base 400 to translate in a straight line, thereby allowing the material handling module 200 and the linkage module 300 to move above the loading station, above the inspection fixture 500, and above the unloading station. In other embodiments, the drive module 100 may also include a lifting screw assembly, which is disposed at the drive end of the translation screw assembly, and the mounting base 400 is disposed at the drive end of the lifting screw assembly. The lifting screw assembly can drive the material handling module 200 and the linkage module 300 to move up and down respectively.

[0051] Reference Figure 2 and Figure 3According to some embodiments of this application, the first lifting driver 210 includes a belt drive assembly 211 and a first motor 212. The mounting base 400 forms a third mounting surface 430 on the side opposite to the first mounting surface 410. The first motor 212 is disposed on the third mounting surface 430. The driving end of the first motor 212 passes through the mounting base 400 and is drivenly connected to the belt drive assembly 211. The belt drive assembly 211 is drivenly connected to the material pick-up head 220. The belt drive assembly 211 is located between the material pick-up module 200 and the first mounting surface 410.

[0052] Understandably, the first motor 212 drives the material handling head 220 to rise and fall via the belt drive assembly 211. The first motor 212 is positioned on the third mounting surface 430, reducing the space occupied on the first mounting surface 410. The third mounting surface 430 and the first mounting surface 410 are located on opposite sides of the mounting base 400. The drive end of the first motor 212 passes through the mounting base 400 and connects to the belt drive assembly 211 on the first mounting surface 410, facilitating connection. Furthermore, the belt drive assembly 211 has a small width and is located between the material handling module 200 and the first mounting surface 410, making good use of the space between them and resulting in a compact structure.

[0053] Reference Figure 2 According to some embodiments of this application, the belt drive assembly 211 includes a first drive wheel 2111, a second drive wheel 2112, and a drive belt 2113. The first drive wheel 2111 and the second drive wheel 2112 are rotatably connected to the first mounting surface 410. A first motor 212 drives the first drive wheel 2111. The drive belt 2113 is wound around the first drive wheel 2111 and the second drive wheel 2112. The material pick-up head 220 is connected to the drive belt 2113. The first drive wheel 2111 and the second drive wheel 2112 are distributed along the height direction. The axis of the first drive wheel 2111 and the axis of the second drive wheel 2112 are both perpendicular to the first mounting surface 410.

[0054] Understandably, the first motor 212 drives the first transmission wheel 2111 to rotate. The first transmission wheel 2111, in conjunction with the second transmission wheel 2112, drives the transmission belt 2113 to rotate. Since the first transmission wheel 2111 and the second transmission wheel 2112 are distributed along the height direction, and the transmission belt 2113 is partially arranged in the vertical direction, the material picker head 220 is connected to the vertical part of the transmission belt 2113. Thus, the first motor 212 drives the first transmission wheel 2111 to rotate forward or backward, thereby driving the transmission belt 2113 to rotate forward or backward. The vertical part of the transmission belt 2113 drives the material picker head 220 to rise and fall. The radial dimensions of the first transmission wheel 2111 and the second transmission wheel 2112 are relatively small. The axis of the first transmission wheel 2111 and the axis of the second transmission wheel 2112 are both perpendicular to the first mounting surface 410, which allows the gap between the material picker module 200 and the first mounting surface 410 to be set smaller, making the structure more compact.

[0055] Reference Figure 2 According to some embodiments of this application, the material handling module 200 further includes a first guide component 240, which includes a first slide rail 241 and a first slide block 242. The first slide rail 241 is fixed to the first mounting surface 410 and is located beside the belt drive component 211. The first slide rail 241 extends along the height direction, and the first slide block 242 is slidably connected to the first slide rail 241. The material handling head 220 is fixed to the first slide block 242.

[0056] Understandably, during the process of the first lifting driver 210 driving the material-taking head 220 to rise and fall, the first slide block 242 moves along the first slide rail 241, and the sliding engagement between the first slide rail 241 and the first slide block 242 guides the rising and falling process of the material-taking head 220. Since both the first slide rail 241 and the belt drive assembly 211 extend along the height direction, placing the first slide rail 241 beside the belt drive assembly 211 utilizes the horizontal space of the first mounting surface 410, making the structure more compact.

[0057] Specifically, the drive belt 2113 of the belt drive assembly 211 is connected to the first slide 242, and the first slide 242 is driven to rise and fall, thereby driving the material pick-up head 220 to rise and fall.

[0058] Reference Figure 2 and Figure 3According to some embodiments of this application, the material handling module 200 further includes a first shielding plate 250 and at least two first position sensors 260. The first position sensors 260 are disposed on the third mounting surface 430. The multiple first position sensors 260 are distributed along the height direction. The first position sensors 260 are electrically connected to the first lifting driver 210. The mounting base 400 has a through groove 440 that penetrates the first mounting surface 410 and the second mounting surface 420. The first shielding plate 250 is movable along the height direction and passes through the through groove 440. One end of the first shielding plate 250 is fixedly connected to the first slide 242, and the other end of the first shielding plate 250 can pass through the detection area of ​​the first position sensor 260.

[0059] It is understandable that when the first slide 242 drives the material handling head 220 to rise and fall, the first baffle 250 rises and falls with the first slide 242. When the first slide 242 slides to a certain horizontal height, the first baffle 250 can pass through the detection area of ​​the first position sensor 260. The first position sensor 260 can transmit the signal to the first lifting driver 210 to control the first lifting driver 210 to stop driving. For example, there are two first position sensors 260. When the first slide 242 rises, it drives the pick-up head 220 away from the detection fixture 500. The first shield 250 will reach the detection area of ​​the first position sensor 260 located at the higher position, that is, the pick-up head 220 has completed picking up or putting down the material. The first lifting driver 210 stops driving so that the pick-up head 220 is kept at the current height. When the first slide 242 falls, it drives the pick-up head 220 closer to the detection fixture 500. The first shield 250 will reach the detection area of ​​the first position sensor 260 located at the lower position, that is, the pick-up head 220 has reached the height where the chip can be placed in the detection slot 510 or can be attracted to the chip in the detection slot 510. The first lifting driver 210 stops driving so that the pick-up head 220 can pick up and put down the chip.

[0060] It is also understandable that the first position sensor 260 is located on the third mounting surface 430, which can reduce the space occupied on the first mounting surface 410. The third mounting surface 430 and the first mounting surface 410 are located on opposite sides of the mounting base 400, and the first shielding plate 250 can cooperate with the first position sensor 260 on the third mounting surface 430 by passing through the through slot 440 on the mounting base 400.

[0061] Reference Figure 2 According to some embodiments of this application, the second lifting driver 310 includes a second motor 311 and a connecting block 312. The second motor 311 is fixed to the second mounting surface 420. The driving end of the second motor 311 is connected to the upper end of the connecting block 312. The connecting block 312 is located between the material picking head 220 and the second mounting surface 420. The pressure plate 320 is fixed to the lower end of the connecting block 312.

[0062] Understandably, the second motor 311 drives the connecting block 312 to rise and fall, thereby raising and lowering the pressure plate 320. The second motor 311 is connected to the upper end of the connecting block 312, and the pressure plate 320 is located at the lower end of the connecting block 312, so that the second motor 311, the connecting block 312, and the pressure plate 320 are distributed along the height direction to utilize the height space on the second mounting surface 420. The connecting block 312 is only used to connect the pressure plate 320 and the second motor 311, and the connecting block 312 is located between the material picking head 220 and the second mounting surface 420. The thickness of the connecting block 312 can be set to be smaller, so that the gap between the material picking head 220 and the second mounting surface 420 can be set to be smaller, making the structure more compact.

[0063] Reference Figure 2 According to some embodiments of this application, the linkage module 300 further includes a second guide component 330, which includes a second slide rail 331 and a second slide block 332. The second slide rail 331 is fixed to the second mounting surface 420. The second slide rail 331 and the second slide block 332 are located between the connecting block 312 and the second mounting surface 420. The second slide rail 331 extends along the height direction. The second slide block 332 is slidably connected to the second slide rail 331. The connecting block 312 is fixed to the second slide block 332.

[0064] Understandably, during the process of the second motor 311 driving the pressure plate 320 to rise and fall via the connecting block 312, the second slide block 332 moves along the second slide rail 331. The sliding cooperation between the second slide rail 331 and the second slide block 332 guides the rising and falling process of the pressure plate 320. Both the second slide rail 331 and the connecting block 312 extend along the height direction, and the second slide rail 331 and the second slide block 332 are positioned between the connecting block 312 and the second mounting surface 420, so that the projections of the connecting block 312, the second slide rail 331, and the second slide block 332 on the second mounting surface 420 overlap, thereby reducing the space occupied in the width direction of the second mounting surface 420.

[0065] Reference Figure 2 According to some embodiments of this application, the linkage module 300 further includes a second shielding plate 340 and at least two second position sensors 350. The second position sensors 350 are disposed on the second mounting surface 420 and located beside the connecting block 312. The multiple second position sensors 350 are distributed along the height direction. The second position sensors 350 are signal connected to the second lifting driver 310. One end of the second shielding plate 340 is fixedly connected to the connecting block 312, and the other end of the second shielding plate 340 can pass through the detection area of ​​the second position sensor 350.

[0066] Understandably, when the connecting block 312 drives the pressure plate 320 to rise and fall, the second baffle 340 rises and falls along with the connecting block 312. When the connecting block 312 slides to a certain horizontal height, the second baffle 340 can pass through the detection area of ​​the second position sensor 350. The second position sensor 350 can transmit this signal to the second lifting driver 310 to control the second lifting driver 310 to stop driving. For example, there are two second position sensors 350. When the connecting block 312 descends, it drives the pressure plate 320 closer to the detection fixture 500. The second baffle 340 will reach the detection area of ​​the second position sensor 350 located at the lower position. That is, the pressure plate 320 has pushed the gripper 600 to a position away from the detection slot 510. The second lifting driver 310 stops driving, keeping the pressure plate 320 at the current height and the gripper 600 at the current position, so that the subsequent pick-up head 220 can pick up and put in the chip. The connecting block 312 rises, causing the pressure plate 320 to move away from the detection fixture 500. The second shielding plate 340 will reach the detection area of ​​the second position sensor 350 located at a high position. That is, the picking head 220 completes the picking of the detected chip and the pressure plate 320 returns to the initial height. The second lifting driver 310 stops driving so that the next chip can be detected.

[0067] Reference Figure 2 According to some embodiments of this application, a clearance hole 321 is provided in the middle of the pressure plate 320, and the material taking head 220 corresponds to the clearance hole 321 along the height direction and can pass through the clearance hole 321.

[0068] Understandably, in the initial state, the pressure plate 320 is located below the pick-up head 220. After the pressure plate 320 pushes the gripper 600, the pick-up head 220 can move down through the clearance hole 321 in the middle of the pressure plate 320 to pick up and put down the chip relative to the detection slot 510.

[0069] Reference Figure 2 According to some embodiments of this application, the material handling module 200 also includes a pump body 230, which is fixed to the mounting base 400, and the suction end of the pump body 230 is connected to the material handling head 220.

[0070] It is understandable that the pump body 230 is connected to the pick-up head 220. When the pump body 230 is working, it can create a vacuum in the pick-up head 220, allowing the pick-up head 220 to pick up the chip. Fixing the pump body 230 to the mounting base 400 reduces the length of the air pipe connecting the pump body 230 and the pick-up head 220. Furthermore, the pump body 230 and the pick-up head 220 move simultaneously with the mounting base 400, thus preventing excessive bending of the air pipe during the movement of the mounting base 400.

[0071] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application. Furthermore, unless otherwise specified, the embodiments and features described in the embodiments of this application can be combined with each other.

Claims

1. A material handling mechanism, characterized in that, include: The mounting base has a first mounting surface and a second mounting surface; The material handling module includes a first lifting driver and a material handling head. The first lifting driver is connected to the material handling head and is used to drive the material handling head to rise and fall. The material handling head is used to pick up chips. The linkage module includes a second lifting driver and a pressure plate. The second lifting driver is fixed to the second mounting surface and drives the pressure plate to lift the pressure plate. The pressure plate is used to cooperate in pushing the grippers on the detection fixture to open and close the detection slots on the detection fixture. A drive module, which drives the mounting base, is used to drive the material handling module and the linkage module to move closer to or further away from the detection fixture carrying the chip.

2. The material handling mechanism according to claim 1, characterized in that, The first lifting driver includes a belt drive assembly and a first motor. The mounting base forms a third mounting surface on the side opposite to the first mounting surface. The first motor is disposed on the third mounting surface. The drive end of the first motor passes through the mounting base and is drivenly connected to the belt drive assembly. The belt drive assembly is drivenly connected to the material picking head. The belt drive assembly is located between the material picking module and the first mounting surface.

3. The material handling mechanism according to claim 2, characterized in that, The belt drive assembly includes a first drive wheel, a second drive wheel, and a drive belt. The first drive wheel and the second drive wheel are rotatably connected to the first mounting surface. The first motor drives the first drive wheel. The drive belt is wound around the first drive wheel and the second drive wheel. The material pick-up head is connected to the drive belt. The first drive wheel and the second drive wheel are distributed along the height direction. The axis of the first drive wheel and the axis of the second drive wheel are both perpendicular to the first mounting surface.

4. The material handling mechanism according to claim 3, characterized in that, The material handling module further includes a first guide component, which includes a first slide rail and a first slide block. The first slide rail is fixed to the first mounting surface and is located beside the belt drive component. The first slide rail extends along the height direction, and the first slide block is slidably connected to the first slide rail. The material handling head is fixed to the first slide block.

5. The material handling mechanism according to claim 4, characterized in that, The material handling module further includes a first shielding plate and at least two first position sensors. The first position sensors are disposed on the third mounting surface, and multiple first position sensors are distributed along the height direction. The first position sensors are electrically connected to the first lifting driver. The mounting base has a through slot that penetrates the first mounting surface and the second mounting surface. The first shielding plate can move along the height direction through the through slot. One end of the first shielding plate is fixedly connected to the first slide, and the other end of the first shielding plate can pass through the detection area of ​​the first position sensor.

6. The material handling mechanism according to claim 1, characterized in that, The second lifting driver includes a second motor and a connecting block. The second motor is fixed to the second mounting surface. The driving end of the second motor is connected to the upper end of the connecting block. The connecting block is located between the material picking head and the second mounting surface. The pressure plate is fixed to the lower end of the connecting block.

7. The material handling mechanism according to claim 6, characterized in that, The linkage module further includes a second guide component, which includes a second slide rail and a second slide block. The second slide rail is fixed to the second mounting surface. The second slide rail and the second slide block are located between the connecting block and the second mounting surface. The second slide rail extends along the height direction. The second slide block is slidably connected to the second slide rail. The connecting block is fixed to the second slide block.

8. The material handling mechanism according to claim 6, characterized in that, The linkage module also includes a second shielding plate and at least two second position sensors. The second position sensors are disposed on the second mounting surface and located beside the connecting block. Multiple second position sensors are distributed along the height direction. The second position sensors are signal-connected to the second lifting driver. One end of the second shielding plate is fixedly connected to the connecting block, and the other end of the second shielding plate can pass through the detection area of ​​the second position sensor.

9. The material handling mechanism according to claim 1, characterized in that, The pressure plate has a clearance hole in the middle, and the material taking head corresponds to the clearance hole along the height direction and can pass through the clearance hole.

10. The material handling mechanism according to claim 1, characterized in that, The material handling module also includes a pump body, which is fixed to the mounting base, and the suction end of the pump body is connected to the material handling head.