LED panel processing device

Abstract

The present disclosure provides an LED panel processing device, which can accurately remove black paint in the area above LED lamp beads in the LED panel by using a laser, solve the problem of brightness reduction caused by the blocking of LED lamp beads by black paint, and make the black color of the LED panel consistent, thereby ensuring the brightness and contrast of the LED panel.

Description

Technical Field

[0001] This disclosure relates to the field of LED processing technology, and more specifically, to an LED panel processing apparatus. Background Technology

[0002] A light-emitting diode (LED) is a semiconductor device that converts electrical energy into light energy. An LED panel is a planar structure that integrates multiple LED devices together to achieve lighting or display functions.

[0003] Because LED backplanes vary in color, black paint is typically sprayed onto the LED panel surface to increase color consistency. However, the black paint significantly reduces the brightness and contrast of the LED panel. Utility Model Content

[0004] This disclosure provides at least one LED panel processing apparatus to solve the problem of insufficient brightness and contrast.

[0005] In a first aspect, embodiments of this disclosure provide an LED panel processing apparatus, including a laser emitter, optical components, a limiting platform, and a control module;

[0006] The limiting platform is used to fix the LED panel to be processed; the light-emitting surface of the LED panel is coated with black paint;

[0007] The laser emitted by the laser emitter is processed by the optical components and then directed onto the light-emitting surface of the LED panel to remove the black paint from the LED bead area of ​​the light-emitting surface.

[0008] The control module is used to control the contact position between the laser and the light-emitting surface by controlling the pose of the optical components and the limiting platform.

[0009] In one optional embodiment, the angle between the laser and the light-emitting surface is adjustable; the angle between the laser and the light-emitting surface is greater than 0 degrees and less than or equal to 90 degrees.

[0010] In one optional embodiment, the optical component is provided with a first adjustment component; and / or, the limiting platform is provided with a second adjustment component;

[0011] The first adjustment component is used to adjust the deflection angle of the laser emission direction of the laser emitter relative to the vertical plane;

[0012] The second adjustment component is used to adjust the tilt angle of the LED panel and / or the limiting platform relative to the horizontal plane.

[0013] In one optional implementation, the second adjustment component includes at least one of the following:

[0014] At least two independently height-adjustable support mechanisms; at least two independently height-adjustable clamping mechanisms.

[0015] In one alternative embodiment, the optical components include a beam expander and a scanning galvanometer.

[0016] In one alternative embodiment, the scanning galvanometer includes a field lens element.

[0017] In one optional embodiment, the laser emitted by the laser emitter has a wavelength less than or equal to 1064 nm.

[0018] In one optional embodiment, the pulse width of the laser emitted by the laser emitter is less than or equal to 200 ns.

[0019] In one optional embodiment, the device further includes a chip removal assembly for cleaning up the debris generated during the laser removal of black paint; the chip removal assembly includes an air suction assembly and / or an air blowing assembly.

[0020] In one optional embodiment, the limiting platform is parallel to the horizontal plane; when the chip removal component includes an air suction component and an air blowing component, the air suction component and the air blowing component are respectively disposed on the left and right sides of the limiting platform; the air blowing component is located above the limiting platform.

[0021] In one optional embodiment, the limiting platform has an angle with the horizontal plane; the first end of the limiting platform is positioned lower in the vertical direction than the second end; when the chip removal assembly includes a suction assembly and a blowing assembly, the suction assembly is disposed at the first end and the blowing assembly is disposed at the second end.

[0022] In one optional embodiment, the limiting platform is parallel to the blowing direction of the blowing assembly and the suction direction of the suction assembly, respectively.

[0023] In one optional embodiment, the device further includes a camera assembly; the camera assembly is used to acquire image information of the LED panel; the control module is specifically used to control the pose of the optical assembly and the limiting platform based on the image information acquired by the camera assembly.

[0024] It should be understood that the above general description and the following detailed description are merely exemplary and explanatory, and are not intended to limit the technical solutions of this disclosure.

[0025] The LED panel processing apparatus provided in this embodiment can use laser to precisely remove the black paint from the LED bead area of ​​the LED panel, solving the problem of reduced brightness caused by the black paint blocking the LED beads, and making the black color of the LED panel uniform, thus ensuring the brightness and contrast of the LED panel.

[0026] Furthermore, when using a laser to remove black paint, this disclosure allows the laser to be positioned at a certain angle to the LED panel, avoiding potential damage to the LED beads from laser penetration and reducing the risk of damage to the LED beads by the laser.

[0027] To make the above-mentioned objects, features and advantages of this disclosure more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0028] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. These drawings are incorporated in and constitute a part of this specification. They illustrate embodiments conforming to this disclosure and, together with the specification, serve to explain the technical solutions of this disclosure. It should be understood that the following drawings only show some embodiments of this disclosure and should not be considered as limiting the scope. Those skilled in the art can obtain other related drawings based on these drawings without creative effort.

[0029] Figure 1 A schematic diagram of an LED panel processing apparatus provided in some embodiments of this disclosure is shown;

[0030] Figure 2 A layered schematic diagram of an LED panel provided in some embodiments of this disclosure is shown;

[0031] Figure 3 An overall schematic diagram of an LED panel provided in some embodiments of this disclosure is shown;

[0032] Figure 4 A schematic diagram of one of the limiting platforms provided in some embodiments of this disclosure is shown;

[0033] Figure 5 A second schematic diagram of a limiting platform provided in some embodiments of this disclosure is shown;

[0034] Figure 6 A flowchart illustrating an LED panel processing method provided in some embodiments of this disclosure is shown;

[0035] Figure 7 A schematic diagram of a computer device provided in some embodiments of the present disclosure is shown. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. The components of the embodiments of this disclosure described and shown herein can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this disclosure is not intended to limit the scope of the claimed disclosure, but merely represents selected embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without inventive effort are within the scope of protection of this disclosure.

[0037] Research has found that due to variations in LED backplane color, a common practice is to spray black paint over the LED panel surface to increase color consistency. However, this black paint significantly reduces the brightness and contrast of the LED panel. Current technology presents a dilemma: it must maintain a certain level of light transmittance to ensure sufficient brightness from the LED chips, while simultaneously achieving a sufficiently dark LED panel. Generally, a thicker layer of black paint results in better LED panel consistency, but this also leads to a sharp decrease in LED brightness and an increase in energy consumption. Currently, there is no solution to this problem within the industry.

[0038] Based on the above research, this disclosure provides an LED panel processing apparatus that can use laser to precisely remove the black paint from the LED bead area of ​​the LED panel, solving the problem of reduced brightness caused by the black paint blocking the LED beads, and making the black color of the LED panel uniform, thus ensuring the brightness and contrast of the LED panel.

[0039] The shortcomings of the above solutions are the result of the inventor's practical experience and careful research. Therefore, the discovery process of the above problems and the solutions proposed in this disclosure below should be considered as the inventor's contribution to this disclosure.

[0040] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0041] To facilitate understanding of this embodiment, a detailed description of an LED panel processing apparatus disclosed in this disclosure will be provided first. See also... Figure 1The diagram shown is a schematic of an LED panel processing apparatus provided in an embodiment of this disclosure. The LED panel processing apparatus includes a laser emitter 10, an optical component 20, a limiting platform 30, and a control module 40.

[0042] The limiting platform 30 is used to fix the LED panel to be processed; the light-emitting surface of the LED panel is coated with black paint.

[0043] See Figure 2 and Figure 3 The figures shown are a layered schematic diagram and an overall schematic diagram of the LED panel to be processed. Figure 2 and Figure 3 In an LED panel, the structure can be divided into multiple layers. The bottom layer of the LED panel may include a substrate on which LED beads can be disposed. The middle layer of the LED panel may be a transparent resin layer, which is formed of transparent resin and allows the light emitted by the LED beads to pass through the transparent resin layer.

[0044] Typically, in order for the light emitted by LED beads to penetrate the black paint, the black paint is usually thin. However, if the black paint is too thin, it is not enough to completely solve the problem of inconsistent colors on the LED panel. At the same time, if the black paint is too thick, it will reduce the brightness of the LED beads and the contrast will be poor.

[0045] Therefore, this embodiment utilizes a laser to remove the black paint from the LED bead area, allowing the light emitted by the LED beads to pass directly through the transparent resin layer without being blocked by the black paint, thus ensuring the brightness of the LED beads. Simultaneously, since the black paint does not obstruct the LED beads, its thickness can be increased, thereby improving the uniformity and contrast of the LED panel.

[0046] The laser emitted by the laser emitter 10 can be processed by the optical component 20 and then directed onto the light-emitting surface of the LED panel to remove the black paint from the LED bead area of ​​the light-emitting surface.

[0047] In one possible implementation, the laser emitter 10 can emit at least one of nanosecond, picosecond, and femtosecond lasers, with a wavelength less than or equal to 1064 nm, such as 1064 nm, 532 nm, 355 nm, 266 nm, 248 nm, 193 nm, etc. The pulse width of the laser emitter 10 can be less than 200 ns, such as 100 ns.

[0048] The optical component 20 may include a beam expander 21 and a scanning galvanometer 22. In one possible embodiment, the optical component 20 may also include a reflector for changing the direction of the optical path.

[0049] The beam expander 21 can be used to expand the diameter of the laser beam, transforming a smaller diameter laser beam into a larger parallel beam. It can also prevent the laser spot from diverging too quickly during transmission, improving long-distance collimation. Furthermore, when used in conjunction with a focusing lens, it can form a smaller focused spot at the target location, improving processing accuracy.

[0050] The scanning galvanometer 22 can control the deflection and scanning of the laser beam on a two-dimensional plane (i.e., the light-emitting surface of the LED panel) at high speed and with high precision. It can usually be composed of two rotatable mirrors, which control the X-axis and Y-axis directions respectively.

[0051] In one possible implementation, the scanning galvanometer 22 may contain a field lens element that can accurately focus the laser beam deflected by the scanning galvanometer onto the processing plane and maintain consistent focusing quality and distortion control throughout the scanning area.

[0052] The control module 40 is used to control the contact position between the laser and the light-emitting surface by controlling the pose of the optical component 20 and the limiting platform 30.

[0053] For example, the control module 40 can control the scanning galvanometer 22 in the optical component 20 to move the laser across the light-emitting surface of the LED panel, thereby removing black paint from different locations. Alternatively, the control module 40 can keep the scanning galvanometer 22 stationary while controlling the limiting platform 30 to move, thus changing the contact position between the laser and the LED panel. Alternatively, the position of both the scanning galvanometer 22 and the limiting platform 30 can be controlled simultaneously to jointly control the contact position between the laser and the LED panel, enabling the laser to precisely remove black paint from the LED bead area without affecting black paint in other areas.

[0054] In one possible implementation, the LED panel processing apparatus may further include a camera component 50. The camera component 50 can be used to acquire image information of the LED panel, thereby determining the LED bead area within the LED panel. For example, the area in the light-emitting surface that transmits light can be determined as the LED bead area by illuminating the LED beads.

[0055] Furthermore, the camera component 50 can monitor the light-emitting surface of the LED panel in real time and provide real-time feedback to the control module 40 on the black paint removal process. The control module 40 can control the position and orientation of the optical component 20 and the limiting platform 30 in real time based on the monitoring image, adjusting the contact position between the laser and the LED panel. The control module 40 can also control whether the laser emitter 10 emits laser based on the image information collected by the camera component 50, preventing the laser from removing the black paint in areas other than LED beads.

[0056] For example, the control module 40 can determine the starting position of the initial row in the middle of the LED panel and control the pose of the optical component 20 and the limiting platform 30 so that the laser is focused on the starting position of the initial row in the middle of the LED panel, and the black paint in the LED bead area is removed starting from the starting position of the initial row.

[0057] In one possible implementation, when removing the black paint, a laser can be emitted from the starting position of the initial row onto the LED panel, and the black paint can be scanned and removed row by row from top to bottom by controlling the pose of the limiting platform.

[0058] In one possible implementation, the angle between the laser and the emitting surface is adjustable; the angle between the laser and the emitting surface is greater than 0 degrees and less than or equal to 90 degrees.

[0059] To prevent damage to the LED chips from the laser, there can be a certain angle between the laser and the light-emitting surface. This angle can be greater than 0 degrees and less than or equal to 90 degrees. The angle between the laser and the light-emitting surface can be determined according to actual needs.

[0060] In one possible implementation, after the angle between the laser and the emitting surface is adjusted to a suitable angle, the angle can remain constant during the processing. The angle between the laser and the emitting surface can be related to the thickness of the transparent resin layer. For example, the thinner the transparent resin layer, the smaller the angle between the laser and the emitting surface can be; the thicker the transparent resin layer, the larger the angle between the laser and the emitting surface can be.

[0061] The angle between the laser and the emitting surface can also be related to the required processing accuracy. Generally, the smaller the angle between the laser and the emitting surface, the larger the laser spot on the emitting surface, the wider the scanning line, and the lower the processing accuracy; conversely, the larger the angle, the smaller the laser spot, the finer the scanning line, and the higher the processing accuracy.

[0062] In one possible implementation, the optical component 20 is provided with a first adjustment component; and / or, the limiting platform 30 is provided with a second adjustment component;

[0063] The first adjustment component is used to adjust the deflection angle of the laser emission direction of the laser emitter 10 relative to the vertical plane;

[0064] The second adjustment component is used to adjust the tilt angle of the LED panel and / or the limiting platform 30 relative to the horizontal plane.

[0065] For example, the first adjustment component can be an adjustable-angle reflector module (or beam deflector). The second adjustment component can be a part or device integrated into the limiting platform. For instance, the second adjustment component can be a component for controlling the tilt of the platform, such as at least two independently adjustable-height support mechanisms; or at least two independently adjustable-height clamping mechanisms. Alternatively, the second adjustment component can also be an integrated / independent rotary table / tilting table, a platform with lifting support (such as three-point leveling), a parallel mechanism, etc.

[0066] In one possible implementation, the second adjustment component can directly adjust the tilt angle of the LED panel; or, it can indirectly adjust the tilt angle of the LED panel by adjusting the tilt of the limiting platform.

[0067] In one possible implementation, the limiting platform itself has the function of adjusting the tilt angle; for example, the limiting platform itself is a rotary table or a tilting table.

[0068] In one possible implementation, the vertical position of the laser focus can be controlled by the scanning galvanometer 22 in the optical assembly 20, and the limiting platform 30 can be used to adjust the contact position of the laser on the LED panel.

[0069] In one possible implementation, since waste is generated during the laser removal of black paint, the LED panel processing device can also be equipped with a chip removal component, which can clean up the waste generated during the laser removal of black paint.

[0070] For example, the chip removal assembly may include an air blowing assembly and / or an air suction assembly.

[0071] The limiting platform can be parallel to the horizontal plane. In this case, when the chip removal component includes a suction component and a blowing component, the suction component and the blowing component are respectively set on the left and right sides of the limiting platform 30; the blowing component can be located above the limiting platform 30.

[0072] like Figure 4 The diagram shown is one of the schematic diagrams of the limiting platform provided in this embodiment. The blowing component can be located at the upper right of the limiting platform, and the suction component can be located at the left side of the limiting platform.

[0073] In one possible implementation, there may be an angle between the limiting platform and the horizontal plane so that the laser forms a certain angle between the LED panels; the first end of the limiting platform is positioned lower in the vertical direction than the second end; when the chip removal assembly includes a suction assembly and a blowing assembly, the suction assembly is disposed at the first end and the blowing assembly is disposed at the second end.

[0074] In one possible implementation, the limiting platform is parallel to the blowing direction of the blowing component and the suction direction of the suction component, respectively, which facilitates the cleaning of waste.

[0075] like Figure 5 The diagram shown is a second schematic of the limiting platform provided in this embodiment. The blowing component can be located at the second end of the limiting platform, and the suction component can be located at the first end of the limiting platform. The limiting platform is parallel to the blowing direction of the blowing component and the suction direction of the suction component, respectively.

[0076] In one possible implementation, the limiting platform 30 may be provided with a tilting clamping mechanism, which can fix the LED panel and adjust the tilt angle of the LED panel relative to the horizontal plane.

[0077] In one possible implementation, after the black paint is removed, the removal effect can be detected. For example, the LED beads of the LED panel can be powered on, and the control module 40 can determine the black paint removal effect in the LED bead area based on the image information collected by the camera module. If the removal effect does not meet the standard, the black paint can be removed again.

[0078] This disclosure also provides an LED panel processing method. The method is generally executed by a computer device with certain computing capabilities, such as the control module in the aforementioned LED panel processing apparatus. In some possible implementations, the method can be implemented by a processor calling computer-readable instructions stored in memory.

[0079] See Figure 6 The diagram shows a flowchart of an LED panel processing method provided in this embodiment of the present disclosure. The method includes steps S601 to S603, wherein:

[0080] S601. Determine the LED bead area in the light-emitting surface of the LED panel, and determine the starting position of the initial row in the LED bead area.

[0081] S602. Control the pose of the optical component and the limiting platform so that the laser emitter is focused to the starting position of the initial row.

[0082] S603. Starting from the beginning position of the initial row, remove the black paint from the LED bead area.

[0083] In one possible implementation, removing the black paint from the LED bead area starting from the beginning position of the initial row includes:

[0084] A laser is emitted from the starting position of the initial row onto the LED panel, and the black paint is scanned and removed row by row from top to bottom by controlling the pose of the limiting platform.

[0085] In one possible implementation, the method further includes:

[0086] During the removal of black paint, the waste generated during the laser removal of black paint is cleaned by blowing and / or sucking air obliquely towards the laser irradiation area through the chip removal component.

[0087] In one possible implementation, determining the LED bead area in the light-emitting surface of the LED panel includes:

[0088] Acquire image information of the LED panel captured by the camera component;

[0089] Based on the image information collected by the camera group, the LED bead area in the light-emitting surface of the LED panel is determined;

[0090] Controlling the pose of the optical component and the limiting platform includes:

[0091] Based on the image information, the pose of the optical component and the limiting platform is controlled.

[0092] Those skilled in the art will understand that, in the above-described method of the specific implementation, the order in which each step is written does not imply a strict execution order and does not constitute any limitation on the implementation process. The specific execution order of each step should be determined by its function and possible internal logic.

[0093] This disclosure also provides a computer device, such as... Figure 7 The diagram shown is a schematic representation of a computer device structure provided in an embodiment of this disclosure, including:

[0094] A processor 71 and a memory 72; the memory 72 stores machine-readable instructions executable by the processor 71, and the processor 71 executes the machine-readable instructions stored in the memory 72. When the machine-readable instructions are executed by the processor 71, the processor 71 performs the following steps:

[0095] Determine the LED bead area in the light-emitting surface of the LED panel, and determine the starting position of the initial row in the LED bead area;

[0096] Control the pose of the optical components and the limiting platform so that the laser emitter is focused to the starting position of the initial row;

[0097] The black paint in the LED bead area is removed starting from the beginning position of the initial row.

[0098] The aforementioned memory 72 includes a main memory 721 and an external memory 722; the main memory 721, also known as internal memory, is used to temporarily store the computational data in the processor 71, as well as the data exchanged with external memory 722 such as a hard disk. The processor 71 exchanges data with the external memory 722 through the main memory 721.

[0099] In one possible implementation, processor 71 is also used to perform:

[0100] A laser is emitted from the starting position of the initial row onto the LED panel, and the black paint is scanned and removed row by row from top to bottom by controlling the pose of the limiting platform.

[0101] In one possible implementation, processor 71 is also used to perform:

[0102] During the removal of black paint, the waste generated during the laser removal of black paint is cleaned by blowing and / or sucking air obliquely towards the laser irradiation area through the chip removal component.

[0103] In one possible implementation, processor 71 is also used to perform:

[0104] Acquire image information of the LED panel captured by the camera component;

[0105] Based on the image information collected by the camera group, the LED bead area in the light-emitting surface of the LED panel is determined;

[0106] Based on the image information, the pose of the optical component and the limiting platform is controlled.

[0107] This disclosure also provides a computer-readable storage medium storing a computer program, which, when executed by a processor, performs the steps of the LED panel processing method described in the above-described method embodiments. The storage medium can be a volatile or non-volatile computer-readable storage medium.

[0108] This disclosure also provides a computer program product carrying program code. The program code includes instructions that can be used to execute the steps of the LED panel processing method described in the above method embodiments. For details, please refer to the above method embodiments, which will not be repeated here.

[0109] The aforementioned computer program product can be implemented through hardware, software, or a combination thereof. In one optional embodiment, the computer program product is specifically embodied in a computer storage medium; in another optional embodiment, the computer program product is specifically embodied in a software product, such as a software development kit (SDK), etc.

[0110] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems and devices described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here. In the several embodiments provided in this disclosure, it should be understood that the disclosed systems, devices, and methods can be implemented in other ways. The device embodiments described above are merely illustrative. For example, the division of units is only a logical functional division; in actual implementation, there may be other division methods. Furthermore, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Another point is that the displayed or discussed mutual coupling or direct coupling or communication connection may be through some communication interfaces; the indirect coupling or communication connection of devices or units may be electrical, mechanical, or other forms.

[0111] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0112] In addition, the functional units in the various embodiments of this disclosure can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0113] If the aforementioned functions are implemented as software functional units and sold or used as independent products, they can be stored in a processor-executable, non-volatile, computer-readable storage medium. Based on this understanding, the technical solution of this disclosure, in essence, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this disclosure. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0114] Finally, it should be noted that the above-described embodiments are merely specific implementations of this disclosure, used to illustrate the technical solutions of this disclosure, and not to limit it. The protection scope of this disclosure is not limited thereto. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or easily conceive of changes to the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features, within the scope of the technology disclosed in this disclosure. Such modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure, and should all be covered within the protection scope of this disclosure. Therefore, the protection scope of this disclosure should be determined by the protection scope of the claims.

Claims

1. An LED panel processing apparatus, characterized in that, Includes laser emitter, optical components, limiting platform, and control module; The limiting platform is used to fix the LED panel to be processed; the light-emitting surface of the LED panel is coated with black paint; The laser emitted by the laser emitter is processed by the optical components and then directed onto the light-emitting surface of the LED panel to remove the black paint from the LED bead area of ​​the light-emitting surface. The control module is used to control the contact position between the laser and the light-emitting surface by controlling the pose of the optical components and the limiting platform.

2. The apparatus according to claim 1, characterized in that, The angle between the laser and the light-emitting surface is adjustable; the angle between the laser and the light-emitting surface is greater than 0 degrees and less than or equal to 90 degrees.

3. The apparatus according to claim 2, characterized in that, The optical component is provided with a first adjustment component; and / or, the limiting platform is provided with a second adjustment component; The first adjustment component is used to adjust the deflection angle of the laser emission direction of the laser emitter relative to the vertical plane; The second adjustment component is used to adjust the tilt angle of the LED panel and / or the limiting platform relative to the horizontal plane.

4. The apparatus according to claim 3, characterized in that, The second adjustment component includes at least one of the following: At least two independently height-adjustable support mechanisms; at least two independently height-adjustable clamping mechanisms.

5. The apparatus according to claim 1, characterized in that, The optical components include a beam expander and a scanning galvanometer.

6. The apparatus according to claim 5, characterized in that, The scanning galvanometer includes a field lens element.

7. The apparatus according to claim 1, characterized in that, The laser emitted by the laser emitter has a wavelength of less than or equal to 1064 nm.

8. The apparatus according to claim 1, characterized in that, The laser emitted by the laser emitter has a pulse width of less than or equal to 200 ns.

9. The apparatus according to any one of claims 1 to 8, characterized in that, The device further includes a chip removal component; the chip removal component is used to clean up the waste generated during the laser removal of black paint; the chip removal component includes an air suction component and / or an air blowing component.

10. The apparatus according to claim 9, characterized in that, The limiting platform is parallel to the horizontal plane; when the chip removal component includes an air suction component and an air blowing component, the air suction component and the air blowing component are respectively disposed on the left and right sides of the limiting platform; the air blowing component is located above the limiting platform.

11. The apparatus according to claim 9, characterized in that, There is an angle between the limiting platform and the horizontal plane; the first end of the limiting platform is positioned lower in the vertical direction than the second end; when the chip removal assembly includes an air suction assembly and an air blowing assembly, the air suction assembly is disposed at the first end and the air blowing assembly is disposed at the second end.

12. The apparatus according to claim 11, characterized in that, The limiting platform is parallel to the blowing direction of the blowing component and the suction direction of the suction component, respectively.

13. The apparatus according to claim 1, characterized in that, The device also includes a camera assembly; the camera assembly is used to acquire image information of the LED panel; the control module is specifically used to control the position and orientation of the optical assembly and the limiting platform based on the image information acquired by the camera assembly.

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