Electronic device assembly structure and electronic device

Abstract

The application discloses an electronic device assembly structure and an electronic device. The electronic device assembly structure comprises a base provided with a first conductive structure, the first conductive structure extending to the top of the base at least partially, and the part of the first conductive structure extending to the top of the base forms a patch pin. A circuit board is arranged above the base, and the surface of the circuit board facing the base is provided with a patch pad corresponding to the patch pin. The base and the circuit board are conductively connected through the abutting connection of the patch pin and the patch pad. The application effectively solves the assembly failure problem caused by the deviation of the pin direction, the contact end plane contact mode avoids the accumulation of alignment errors, and the assembly reliability and production efficiency are improved. The structure simplifies the complex assembly process of the traditional plug-in connection, and is particularly suitable for the surface mounting process of high-density electronic devices.

Description

Technical Field

[0001] This application relates to the field of semiconductor device technology, and in particular to an electronic device assembly structure and an electronic device. Background Technology

[0002] In existing technology, the base has several first conductive structures at its top and several metal pins on the base. The circuit board has several through holes that correspond to the guide posts of the base. The insulated core wire of the transformer inductor coil connects the pins and the guide posts. When using through-hole reflow soldering technology, it is difficult to ensure that the orientation of the base metal pins is consistent. During mounting, a deviation in the position of a certain metal pin can cause the metal at the top of the base to not be inserted into the through holes of the circuit board, resulting in mounting problems. Utility Model Content

[0003] The purpose of this utility model embodiment is to provide an electronic device assembly structure, electronic device, and manufacturing method, which has the advantages of improving assembly efficiency, enhancing conductivity reliability, and reducing the risk of poor contact.

[0004] To achieve the above objectives, this application adopts the following technical solution:

[0005] On the one hand, an electronic device assembly structure is provided, comprising:

[0006] A base on which a first conductive structure is disposed, the first conductive structure extending at least partially to the top of the base, the portion of the first conductive structure extending to the top of the base forming a surface mount pin;

[0007] A circuit board is disposed above the base, and its surface facing the base is provided with surface mount pads corresponding to the surface mount pins;

[0008] The base and the circuit board are electrically connected through the contact between the surface mount pins and the surface mount pads.

[0009] Optionally, the patch pins protrude from the top of the base and are attached to the top surface of the base.

[0010] Optionally, the patch pins protrude from the top of the base, and the angle between them and the top surface of the base is between 100° and 120°.

[0011] Optionally, the patch pin is formed by bending the first conductive structure, or the patch pin is the end face of the first conductive structure.

[0012] Optionally, the base is further provided with a first positioning element, and the circuit board is further provided with a second positioning element. The first positioning element and the second positioning element cooperate to position the base and the circuit board.

[0013] Optionally, the first positioning element is a positioning post protruding from the top surface of the base, and the second positioning element is a positioning hole that mates with the positioning post.

[0014] Optionally, the positioning post includes a guide portion and a positioning portion, the periphery of the guide portion is formed with a guide radius, and the outer dimensions of the positioning portion are matched with the outer dimensions of the positioning hole.

[0015] Optionally, there are two or more positioning posts, and the number of positioning holes corresponds to the number of positioning posts.

[0016] On the other hand, an electronic device is provided, including a base, a circuit board, and a housing. The base and the circuit board are assembled using the electronic device assembly structure described above. The housing is fastened to the base, forming an installation space between the housing and the base. The circuit board is disposed in the installation space.

[0017] In another aspect, a method for manufacturing an electronic device is provided, for producing the electronic device as described above, providing a base with surface mount pins and a circuit board with surface mount pads, and assembling the base and the circuit board by surface mount technology.

[0018] Optionally, the method for manufacturing the electronic device specifically includes the following steps:

[0019] S1. The first conductive structure of the base is pre-bent into a surface mount pin shape;

[0020] S2. Provide a circuit board with surface mount pads;

[0021] S3. The base is automatically mounted onto the surface mount pads of the circuit board via SMT.

[0022] Optionally, in step S1, the base material is packaged in rolls, and the circuit board is a panelized circuit board.

[0023] Optionally, the steps also include:

[0024] S4. Spot weld the transformer inductor coil onto the circuit board;

[0025] S5. Fix the spot-welded transformer inductor coil with glue.

[0026] Optionally,

[0027] In step S3, epoxy resin is used for dispensing, which forms a vibration-resistant support structure after curing.

[0028] Optionally, the process also includes step S6: separating the panelized circuit boards to form individual semi-finished products.

[0029] Optionally, the board separation process is performed using a V-cut board separation machine or a milling cutter board separation process.

[0030] Optionally, the spot welding in step S4 can be performed using resistance welding or laser welding.

[0031] The beneficial effects of this application are as follows: This application effectively solves the assembly failure problem caused by pin direction deviation, and the planar contact method at the contact end avoids the accumulation of alignment errors, thereby improving assembly reliability and production efficiency. This structure simplifies the complex assembly process of traditional plug-in connections and is particularly suitable for surface mount technology of high-density electronic devices. Attached Figure Description

[0032] The present application will now be described in further detail with reference to the accompanying drawings and embodiments.

[0033] Figure 1 This is a three-dimensional structural schematic diagram of the electronic device described in the embodiments of this application;

[0034] Figure 2 This is a schematic diagram showing the exploded view of the electronic device described in the embodiments of this application;

[0035] Figure 3 This is another perspective exploded view of the electronic device described in the embodiments of this application;

[0036] Figure 4 This is a top view schematic diagram of the electronic device described in the embodiments of this application;

[0037] Figure 5 for Figure 4 Sectional view along line AA;

[0038] Figure 6 for Figure 5 Enlarged view of a section at point I;

[0039] Figure 7 This is a three-dimensional schematic diagram of the first conductive structure in an embodiment of this application;

[0040] Figure 8 This is a flowchart of the manufacturing method of the electronic device described in the embodiments of this application.

[0041] In the picture:

[0042] 1. Electronic component; 100. Base; 110. First conductive structure; 120. Surface mount pin; 130. Positioning post; 131. Positioning part; 132. Guide part; 200. Circuit board; 210. Surface mount pad; 220. Positioning hole; 300. Housing; 400. Transformer inductor coil. Detailed Implementation

[0043] To make the technical problems solved by this application, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of this application are further described in detail below. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0044] In the description of this application, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0045] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0046] like Figure 1-7 As shown, this embodiment provides an electronic device assembly structure, including:

[0047] A base 100 is provided thereon with a first conductive structure 110, the first conductive structure 110 extending at least partially to the top of the base 100, and the portion of the first conductive structure 110 extending to the top of the base 100 forms a surface mount pin 120.

[0048] A circuit board 200 is disposed above the base 100, and its surface facing the base 100 is provided with surface mount pads 210 corresponding to the surface mount pins 120.

[0049] The base 100 and the circuit board 200 are electrically connected by the surface mount pins 120 abutting against the surface mount pads 210.

[0050] The base 100 refers to the support body that carries the electronic device 1, which can be manufactured using injection molding and has internal conductive paths. The first conductive structure 110 refers to the conductive element embedded inside the base 100, which can be a stamped metal part to achieve current conduction. The surface mount pin 120 refers to the contact end formed by the extension of the top of the first conductive structure 110, which can be manufactured using bending forming and is used to establish a surface contact connection. The surface mount pad 210 refers to the conductive area on the surface of the circuit board 200, which can be formed by etching into a copper pad to form a surface contact conductive connection with the surface mount pin 120.

[0051] Compared to existing technologies, the first conductive structure 110 supported by the base 100 extends upward to form a planar contact end, and a planar pad is provided at the corresponding position on the circuit board 200. During assembly, the base 100 and the circuit board 200 are pressed together in a vertical direction, and the end face of the surface mount pin 120 and the surface mount pad 210 are electrically connected through SMT technology, maintaining a stable contact state through pressure. This contact method does not require insertion and alignment operations, and current is directly conducted through the contact surface.

[0052] Through the above technical solution, this application effectively solves the assembly failure problem caused by pin orientation deviation. The planar contact method at the contact end avoids the accumulation of alignment errors, improving assembly reliability and production efficiency. This structure simplifies the complex assembly process of traditional plug-in connections and is particularly suitable for surface mount technology of high-density electronic devices.

[0053] Preferably, in order to ensure effective electrical connection between the surface mount pin 120 and the surface mount pad 210, the surface mount pin 120 in this embodiment of the application protrudes from the top of the base 100 and is attached to the top surface of the base 100.

[0054] The bonding refers to the seamless physical contact between the surface mount pin 120 and the top surface of the base 100. The surface mount pin 120 forms a raised structure on the top of the base 100, with its bottom surface in complete contact with the surface of the base 100. During assembly, the surface mount pin 120 maintains vertical positional stability through its own rigid support, and the bonding with the surface of the base 100 prevents pin root misalignment. When the circuit board 200 is aligned with the base 100, the surface mount pin 120 and the surface mount pad 210 achieve conductive connection through planar contact, without relying on the precision of the pin insertion into the via.

[0055] It should be noted that the above-mentioned arrangement of the patch pin 120 being attached to the top of the base 100 is not intended to limit this application. In another optional embodiment of this application, the patch pin 120 protrudes from the top of the base 100, and the angle between the patch pin 120 and the top surface of the base 100 is between 100° and 120° (not shown).

[0056] The included angle range refers to the geometric angle formed between the inclined portion of the surface mount pin 120 and the top surface of the base 100. Specifically, it can be achieved by adjusting the bending angle of the stamping die. This angle range is set to ensure that the pin and the pad form a stable contact surface.

[0057] Specifically, the tilt angle of the surface mount pin 120 on the top of the base 100 is controlled between 100° and 120°. During the assembly process of the circuit board 200 and the base 100, the tilt angle of the pin allows it to be displaced to a certain extent relative to the top surface of the base 100. This can prevent some surface mount pins 120 from failing to make effective electrical contact with the surface mount pad 210 due to inconsistent heights of the surface mount pins 120.

[0058] For example, when there are 4 surface mount pins 120, if 3 of them are slightly higher than the other surface mount pin 120, the position of the circuit board 200 is determined by the support of the 3 higher surface mount pins 120 when it is assembled with the circuit board 200. This will cause the slightly shorter pin to be unable to make effective contact with the surface mount pad 210, which may result in an inability to achieve an effective electrical connection at that position, thus affecting the use of the device.

[0059] The tilted design of the surface mount pins 120 allows them to deform to a certain extent under the pressure of the circuit board 200. Similar to the case of the four pins, when the three surface mount pins 120 support the circuit board 200, the circuit board 200 can be pressed down further, causing the three surface mount pins 120 to bend downwards. This allows the fourth surface mount pin 120, which has not yet made contact, to also be effectively electrically connected to the surface mount pad 210 on the circuit board 200, thereby significantly reducing connection failures caused by the angular height deviation of the surface mount pins 120 during the mounting process.

[0060] It should be noted that the surface mount pin 120 described in this application can be formed in various ways, for example, the surface mount pin 120 can be formed by bending the first conductive structure 110.

[0061] Alternatively, the surface mount pin 120 may be the end face of the first conductive structure 110, which may directly serve as the surface mount pin 120; or the end face may be processed into an L-shaped structure, with the bottom surface of the L-shaped structure serving as the surface mount pin 120.

[0062] When the bending method is used, the first conductive structure 110 extends from the inside of the base 100 to the top, and then protrudes from the surface of the base 100 by bending, forming a pin structure that contacts the surface mount pad 210. When the end face method is used, the first conductive structure 110 terminates directly on the top surface of the base 100, and its end face directly contacts the surface mount pad 210. Both implementations simplify the pin forming process and avoid the need for separate installation steps required by traditional pins.

[0063] Furthermore, the base 100 is provided with a first positioning element, and the circuit board 200 is provided with a second positioning element. The first positioning element and the second positioning element cooperate to position the base 100 and the circuit board 200.

[0064] The first positioning element refers to the mechanical guide 132 pieces disposed on the top of the base 100, which can be implemented as a protruding structure or a columnar body, and is used to form a physical fit with the corresponding component on the circuit board 200. The second positioning element refers to the matching structure disposed on the surface of the circuit board 200, which can be implemented as a recessed structure or a through hole, and is used to receive the first positioning element and limit its range of movement.

[0065] During the assembly of the base 100 and the circuit board 200, the insertion of the first positioning member into the second positioning member creates a spatial constraint, automatically aligning the contact surfaces of the surface mount pins 120 and the surface mount pads 210. The top of the base 100 and the lower surface of the circuit board 200 are mechanically engaged by the positioning members to achieve axial and radial positioning, thereby ensuring the positional accuracy of the conductive connection parts.

[0066] Specifically, refer to Figure 2 As shown, the first positioning element is a positioning post 130 protruding from the top surface of the base 100, and the second positioning element is a positioning hole 220 that mates with the positioning post 130. The positioning post 130 includes a guide portion 132 and a positioning portion 131. The guide portion 132 has a guide radius on its periphery, and the outer dimensions of the positioning portion 131 match the outer dimensions of the positioning hole 220.

[0067] In this application, the guide part 132 is used to guide the positioning post 130 and the positioning hole 220 during the assembly process of the base 100 and the circuit board 200. The guide rounded corner on the guide part 132 can easily enter the guide hole. Under its guiding action, the entire guide post can smoothly cooperate with the guide hole. The positioning part 131 performs actual positioning. Since the guide part 132 is set with a guide rounded corner, most of its position dimensions will be smaller than the size of the guide hole. Therefore, a gap will be generated between the mating surfaces of the two. By using the positioning part 131 for positioning and the guide part 132 for guiding, the problems of easy assembly and accurate positioning can be solved at the same time.

[0068] It is understood that, in order to achieve positioning, there are two or more positioning posts 130, and the number of positioning holes 220 corresponds to the number of positioning posts 130. The positioning posts 130 and positioning holes 220 are in a shaft-hole fit. When a single positioning post 130 is positioned with a positioning hole 220, it will rotate, so the exact position of the base 100 and the circuit board 200 cannot be determined. By using at least two positioning posts 130 to fit with positioning holes 220, accurate positioning in the plane can be achieved.

[0069] Understandably, in order to facilitate processing and optimize the use and assembly performance of the product, the number of positioning pins 130 and positioning holes 220 should not be too many, usually two to three is sufficient.

[0070] Meanwhile, this application also provides an electronic device 1, which adopts the electronic device assembly structure described above. The electronic device assembly structure refers to an integrated assembly system including a base 100, a circuit board 200, and positioning components. The base 100 forms surface mount pins 120 through a first conductive structure 110. The circuit board 200 achieves conductive connection by abutting the surface mount pins 120 through surface mount pads 210. The base 100 and the circuit board 200 are mechanically aligned through positioning posts 130 and positioning holes 220. This structure can eliminate mounting problems caused by misalignment of the metal pins.

[0071] Furthermore, the electronic device 1 also includes a housing 300, which is fastened to the base 100, forming an installation space between the housing 300 and the base 100, and the circuit board 200 is disposed in the installation space. The housing 300 refers to the external protective structure covering the base 100, and the housing 300 and the base 100 can be fixedly connected by adhesive.

[0072] Meanwhile, this application also provides a method for manufacturing an electronic device, for manufacturing the electronic device 1 as described above, including providing a base 100 with surface mount pins 120 and a circuit board 200 with surface mount pads 210, and assembling the base 100 and the circuit board 200 by surface mount technology.

[0073] Traditional processes require precise insertion of guide pins into vias to complete assembly, while this solution simplifies positional tolerance requirements from three-dimensional space to a two-dimensional plane through planar mounting. Soldering reliability is significantly improved. SMT equipment can achieve placement speeds of thousands of components per minute, improving efficiency by two orders of magnitude compared to manual insertion. This application completely solves the assembly defects caused by misalignment between guide pins and vias in the insertion process. The planar contact mode between the surface mount pins 120 and the pads completely avoids vertical positional tolerance requirements, making automated mass production of miniaturized electronic devices 1 possible. The solder joint uniformity formed by the reflow soldering process is superior to that of traditional wave soldering, effectively reducing the incidence of soldering defects such as cold solder joints and bridging.

[0074] Specifically, the manufacturing method of the electronic device described in this embodiment refers to... Figure 8 As shown, the specific steps include:

[0075] S1. The first conductive structure of the base 100 is pre-bent into the form of a patch pin 120;

[0076] S2. Provide a circuit board 200 with surface mount pads 210;

[0077] S3. The base 100 is automatically mounted onto the surface mount pad 210 of the circuit board 200 via SMT.

[0078] The first conductive structure pre-bending refers to bending the columnar metal structure, which is originally perpendicular to the surface of the base 100, to form the surface mount pin 120. This can be achieved using a stamping die or mechanical bending equipment, and the bending angle can be 90 degrees or other specific angles. The surface mount pad 210 refers to the metal contact area on the surface of the circuit board 200 for soldering surface mount components. This can be formed using a copper foil etching process, and its shape can be rectangular or circular. SMT automatic placement refers to using surface mount equipment to position and solder the base 100 to the circuit board 200. This can be accomplished using a vision positioning system and a reflow oven.

[0079] Furthermore, in step S1, the base 100 is supplied in roll packaging, and the circuit board 200 is a panelized circuit board 200. Roll packaging refers to the base 100 being packaged and transported in a continuous roll form, specifically achieved using anti-static carrier tape combined with a film coating, to maintain the directional arrangement of the base 100. Panelized circuit board 200 refers to a plate-like structure formed by multiple unit circuit boards 200 combined by connecting ribs, specifically achieved using FR-4 substrate with V-cut dividing lines for mass automated production.

[0080] The base 100 enters the production line in a uniform orientation via tape and reel packaging. During the pre-bending process, automated equipment shapes the surface mount pins 120 at a fixed angle. The panelized circuit board 200, through a standardized pad layout, allows multiple unit circuit boards 200 to be simultaneously mounted onto the base 100 during the SMT process. The combination of the continuous feeding method of the tape and reel packaging and the parallel processing mode of the panelized circuit board 200 achieves precise control over the positional matching between the base 100 and the circuit board 200 during assembly.

[0081] This solution solves the problem of misalignment in the forming of the surface mount pins 120 caused by inconsistent material feeding direction in the first conductive structure of the base 100. At the same time, the design of the panel circuit board 200 reduces the number of mounting and positioning steps before the board separation process, achieving the dual effect of improving production efficiency and reducing material loss.

[0082] Furthermore, the method for manufacturing the electronic device described in this application embodiment further includes the following steps:

[0083] S4. Spot weld the transformer inductor coil 400 onto the circuit board 200. Spot welding is a process of fusing metal components by localized heating, which can be achieved using resistance welding or laser welding. The solder joint is located at the junction of the surface mount pin 120 and the transformer inductor coil 400. Spot welding enables precise connection between the pin and the coil, avoiding component misalignment caused by an excessively large heat-affected zone during the welding process.

[0084] S5. Apply adhesive to fix the spot-welded transformer inductor coil 400; adhesive fixing refers to the process of reinforcing the component by applying an adhesive, specifically epoxy resin. After the epoxy resin cures, it forms a vibration-resistant support structure, which can effectively prevent the coil from becoming loose from the pins due to vibration in subsequent processes or during use.

[0085] In step S3, epoxy resin is used for dispensing, which forms a vibration-resistant support structure after curing.

[0086] After surface mounting is completed on the base 100, the junction of the transformer inductor coil 400 is connected to the surface mount pin 120 using a spot welding process. Because the heat is concentrated in the solder joint area during spot welding, overall heat deformation of the base 100 is prevented. Epoxy resin is then applied to the junction, and after curing, it forms a support structure encasing the solder joint. Thus, the connection between the coil and the pin possesses both mechanical strength and shock absorption capability.

[0087] In traditional through-hole reflow soldering processes, the fit gap between the metal pins and the guide holes cannot effectively eliminate the displacement accumulation caused by vibration. However, this solution uses a three-dimensional support network formed by the cured adhesive layer to absorb both lateral shear force and longitudinal tensile force, allowing the base 100 to maintain a stable posture when subjected to vibration and preventing contact failure of the pins due to repeated micro-displacement.

[0088] A further preferred embodiment of the manufacturing method for the electronic device includes step S6: separating the panelized circuit board 200 into individual semi-finished products. The panelized circuit board 200 refers to an array structure composed of multiple unit circuit boards 200, which can be implemented using a standardized panel design, enabling automated mass production during surface mount technology (SMT). The separation process involves separating the assembled panelized circuit board 200 into independent units, which can be achieved using mechanical cutting or milling processes. This step avoids mutual interference caused by the panelized structure during subsequent processing.

[0089] After the base 100 and circuit board 200 are welded and assembled, the panelized circuit board 200, which carries multiple electronic device units, is depaneled. The panel structure is separated along a pre-designed cutting path, allowing each electronic device unit to form an independent semi-finished product. The depaneling process uses a V-cut depaneling machine or a milling cutter.

[0090] V-cut depaneling machine refers to depaneling equipment that pre-cuts V-shaped grooves at the connection points of panelized circuit boards 200. Specifically, it can be achieved by using CNC mechanical drive blades to cut along a preset path. Its function is to achieve precise depaneling by pre-forming a weakened area, avoiding damage to solder joints caused by cutting stress.

[0091] The milling cutter separation process refers to the processing method of cutting the connection of the panelized circuit board 200 using a high-speed rotating milling cutter. Specifically, it can be achieved by using a multi-axis CNC machine tool with a tungsten carbide milling cutter. Its function is to separate the panelized circuit board 200 through physical cutting, maintain the flatness of the cutting edge, and prevent electronic components from being displaced due to mechanical impact.

[0092] Specifically, after the base 100 is mounted and the coil is soldered, the panelized circuit board 200 needs to be separated into independent semi-finished products through a separation process. When the V-cut separation machine is working, the cutter applies pressure along the pre-cut V-groove trajectory between the panels, causing the board to break neatly along the weakening line. The milling separation process, on the other hand, uses a CNC program to control the milling cutter to rotate at high speed along the separation path, achieving micron-level precision in board separation. Both processes avoid stress concentration caused by traditional punching processes by controlling the cutting path and force distribution.

[0093] Compared to existing technologies, traditional depaneling methods are prone to causing cracks at the connection between the surface mount pins 120 and the pads due to cutting stress, or causing coil solder joints to loosen due to impact. After adopting a V-cut depaneling machine or milling cutter depaneling process, the cutting force can be precisely controlled in the separation area of ​​the circuit board 200 substrate, effectively isolating the transmission path of mechanical stress to functional areas.

[0094] Through the above technical solution, this application solves the problem of solder joint breakage or component displacement caused by cutting stress during the panelization process of the 200 panelized circuit board, ensures the integrity of the connection structure between the surface mount pin 120 and the pad, and maintains the stability of the welding part of the transformer inductor coil 400, and finally obtains an independent semi-finished product that meets the dimensional accuracy requirements.

[0095] Furthermore, in step S4, the spot welding is performed using resistance welding or laser welding.

[0096] Resistance welding is a welding method that uses the heat generated by the flow of current through the metal joint to achieve welding. For example, it can be achieved by pressing electrodes against the joint and applying current, using the heat generated by the contact resistance to melt the metal and form a weld.

[0097] Laser welding refers to a method of molten welding by irradiating the metal joint with a high-energy laser beam. For example, a pulsed laser or a continuous laser can be used to emit a focused beam, and local welding can be completed by precisely controlling the energy density.

[0098] Specifically, during spot welding, resistance welding or laser welding energy is applied to the joint between the circuit board 200 and the transformer inductor coil 400, causing the metal material in that area to melt and form a metallurgical bond. Resistance welding applies pressure and current through electrodes, generating concentrated heat at the joint and avoiding thermal impact on surrounding materials; laser welding uses a high-precision beam to heat specific points, adapting to the welding needs of miniaturized devices. The solder joint covers the entire contact surface of the joint, thereby eliminating the risk of incomplete soldering and improving connection strength.

[0099] The choice between resistance welding and laser welding can be flexibly adapted to production conditions, ensuring welding quality while improving process compatibility.

[0100] The electronic device manufacturing method described in this application also includes a testing and packaging step; the testing step mainly verifies whether the converter can work normally according to the design requirements and output a stable target voltage.

[0101] Taking electronic devices as voltage converters as an example, the tests include, but are not limited to, the following:

[0102] I. Basic Performance Testing

[0103] The main purpose is to verify whether the converter can operate normally as required by the design and output a stable target voltage.

[0104] 1. Input voltage test

[0105] Test objective: To confirm whether the converter can operate normally within the range of input voltage fluctuations.

[0106] Test method:

[0107] Simulate the minimum (e.g., rated input -10%), nominal (e.g., 220V), and maximum (e.g., rated input +10%) of the input voltage, and observe whether the output voltage is stable within the error range (e.g., ±1%~±5%).

[0108] For example, when the AC / DC converter has a wide input voltage range of 100-240V, it is necessary to cover low voltage (100V), standard voltage (220V), and high voltage (240V) testing.

[0109] 2. Output voltage / current test

[0110] Test objective: To verify the accuracy of the output voltage and its load-carrying capacity.

[0111] Test method:

[0112] No-load test: Without any load connected, measure whether the output voltage is equal to the nominal value (e.g., 5V, 12V).

[0113] Full load test: Connect the rated maximum load (if the converter is labeled "5V / 2A", then use a 2A load) and measure whether the output voltage drops within the allowable range (e.g., 5V±0.25V).

[0114] Load regulation: Gradually increase the load current (from 0 to full load) and observe the fluctuation range of the output voltage. The smaller the fluctuation, the better.

[0115] 3. Efficiency Test

[0116] Test objective: To measure the converter's ability to convert input power into output power (efficiency = output power / input power × 100%).

[0117] Test method:

[0118] Under full load conditions, the efficiency is calculated by simultaneously measuring the input current × input voltage (input power) and the output current × output voltage (output power).

[0119] For example, switching power supplies typically need to be ≥80% efficient, while linear power supplies may have lower efficiency (due to higher heat generation).

[0120] II. Security Testing

[0121] Ensure that the converter will not cause dangers such as electric shock or fire during use, and comply with safety standards (such as UL, CE, etc.).

[0122] 1. Insulation withstand voltage test

[0123] Test objective: To verify the high voltage resistance of insulating components such as the casing and circuit board.

[0124] Test method:

[0125] Apply a high voltage (such as AC1500V) several times higher than the rated voltage between the input and output, and between the input and the casing, for 1-2 minutes, and observe for any breakdown or leakage.

[0126] 2. Grounding continuity test

[0127] Test objective: To ensure that the metal casing or grounding terminal is properly grounded to prevent the risk of leakage.

[0128] Test method: Use a low resistance tester to measure the resistance between the grounding terminal and the casing. It should typically be ≤0.1Ω.

[0129] 3. Overheat protection test

[0130] Test objective: To verify whether the converter can automatically cut off power in case of overload or abnormality to prevent overheating and fire.

[0131] Test method:

[0132] Intentionally overload the converter (e.g., exceed the rated load by 120%), or use a heating device to simulate a high-temperature environment, and observe whether the overheat protection is triggered (e.g., automatic shutdown, indicator light goes out).

[0133] After restoring normal conditions, check if the system can be restarted.

[0134] III. Reliability and Environmental Adaptability Testing

[0135] Simulate extreme environments in real-world use to verify the stability of the converter.

[0136] 1. Temperature cycling test

[0137] Test objective: To evaluate the impact of high and low temperature environments on performance.

[0138] Test method:

[0139] Place the converter in a constant temperature chamber and cycle between low temperature (e.g., -20℃) and high temperature (e.g., 60℃), maintaining each temperature point for 2 hours. Monitor the output voltage and operating status during the test.

[0140] 2. Vibration / Shock Testing

[0141] Test objective: To simulate physical vibrations and collisions during transportation or use, and to check whether internal components are loose.

[0142] Test method:

[0143] Fix the converter on a vibration table and vibrate it for several hours at the specified frequency (e.g., 10-50Hz) and amplitude, or apply instantaneous impact force with an impact testing machine. After the test, check whether the solder joints and components have fallen off.

[0144] 3. Long-term aging test

[0145] Test objective: To verify the reliability of long-term continuous operation.

[0146] Test method: Run the converter continuously under full load for 24-72 hours, and monitor whether the temperature and output voltage are stable, and whether the components show signs of overheating or aging (such as capacitor bulging).

[0147] IV. Special Function Testing (Optional)

[0148] Add targeted testing based on converter type:

[0149] 1. AC / DC converter (such as power adapter)

[0150] Surge current test: whether the maximum input current at the moment of power-on is within the safe range (to avoid impacting the power grid).

[0151] Ripple test: Use an oscilloscope to measure the AC ripple of the output voltage (the smaller the better, usually ≤100mV).

[0152] 2. DC / DC converter (such as vehicle power supply)

[0153] Reverse connection protection test: Intentionally reverse the positive and negative input terminals to check if it will burn out components or trigger the protection.

[0154] Dynamic response test: Quickly switch the load (e.g., from no load to full load) and observe how quickly the output voltage recovers to a stable state.

[0155] In the description herein, it should be understood that the terms "upper," "lower," "left," "right," and other orientations or positional relationships are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used merely for descriptive distinction and have no special meaning.

[0156] In the description of this specification, references to terms such as "an embodiment," "example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0157] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style of the specification is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0158] The technical principles of this application have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this application and should not be construed as limiting the scope of protection of this application in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of this application without inventive effort, and these embodiments will all fall within the scope of protection of this application.

Claims

1. An electronic device assembly structure, characterized in that, include: A base (100) having a first conductive structure (110) thereon, the first conductive structure (110) extending at least partially to the top of the base (100), the portion of the first conductive structure (110) extending to the top of the base (100) forming a surface mount pin (120). A circuit board (200) is disposed above the base (100), and its surface facing the base (100) is provided with a surface mount pad (210) corresponding to the surface mount pin (120). The base (100) and the circuit board (200) are electrically connected by the surface mount pins (120) and the surface mount pads (210).

2. The electronic device assembly structure according to claim 1, characterized in that, The patch pin (120) protrudes from the top of the base (100) and is attached to the top surface of the base (100).

3. The electronic device assembly structure according to claim 1, characterized in that, The patch pin (120) protrudes from the top of the base (100) and the angle between the patch pin and the top surface of the base (100) is between 100° and 120°.

4. The electronic device assembly structure according to claim 1, characterized in that, The patch pin (120) is formed by bending the first conductive structure (110), or the patch pin (120) is the end face of the first conductive structure (110).

5. The electronic device assembly structure according to any one of claims 1-4, characterized in that, The base (100) is further provided with a first positioning element, and the circuit board (200) is further provided with a second positioning element. The first positioning element and the second positioning element cooperate to position the base (100) and the circuit board (200).

6. The electronic device assembly structure according to claim 5, characterized in that, The first positioning element is a positioning post (130) protruding from the top surface of the base (100), and the second positioning element is a positioning hole (220) that cooperates with the positioning post (130).

7. The electronic device assembly structure according to claim 6, characterized in that, The positioning post (130) includes a guide part (132) and a positioning part (131). The guide part (132) has a guide rounded corner on its periphery, and the outer dimensions of the positioning part (131) match the outer dimensions of the positioning hole (220).

8. The electronic device assembly structure according to claim 6, characterized in that, There are two or more positioning posts (130), and the number of positioning holes (220) corresponds to the number of positioning posts (130).

9. An electronic device (1), characterized in that, The electronic device assembly structure adopted according to any one of claims 1-8.

10. The electronic device (1) according to claim 9, characterized in that, It also includes a housing (300), which is fastened to the base (100) and forms an installation space between the housing (300) and the base (100), and the circuit board (200) is disposed in the installation space.

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