An integrated valve assembly for semiconductors

Abstract

This utility model discloses an integrated valve assembly for semiconductors, comprising: a valve body having several interface channels, some of which connect to a loadlock chamber and a vacuum pump, some of which connect to an atmospheric chamber, and some of which connect to a transmission chamber; two vacuum pressure switches connected to the interface channels for detecting the air pressure at the connection between the interface channels and the loadlock chamber; six baffle valves connected one-to-one to the interface channels for controlling the opening and closing of the interface channels; and four connectors connected one-to-one to the interface channels, including two atmospheric connectors and two leak detection connectors, with the atmospheric connectors connected to the atmospheric chamber; thereby overcoming the technical problems of poor air pressure balancing, complex structure, and unsightly appearance.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, specifically to an integrated valve assembly for semiconductor applications. Background Technology

[0002] Wafers are the basic material in semiconductor manufacturing. They are usually circular thin films made of high-purity single-crystal silicon. Wafers are processed into various semiconductor devices through a series of complex processes, such as photolithography, etching, and deposition. They are widely used as core components of electronic products.

[0003] In the deposition process, the wafer needs to move from the atmospheric chamber to the vacuum chamber (transfer chamber). However, the environments of the vacuum chamber and the atmospheric chamber are different. Pipes are needed to connect the relevant equipment to ensure that the environments within the chambers are nearly identical. The traditional method involves adding a loadlock chamber and a vacuum pump between the atmospheric chamber and the vacuum chamber. The wafer moves from the atmospheric chamber into the loadlock chamber, and the vacuum pump evacuates the loadlock chamber to make its internal environment similar to that of the vacuum chamber. Then, the transfer valve between the loadlock chamber and the vacuum chamber is opened, and the wafer is sent into the vacuum chamber for processing. After processing, the wafer returns to the loadlock chamber, which is then filled with gas to the same level as the atmospheric chamber before being removed. This method ensures the vacuum and cleanliness of the wafer processing. However, this structure has poor pressure balancing and requires a signal collection device to collect data from the chamber, resulting in a cluttered and unsightly layout with many intersecting pipes. Utility Model Content

[0004] In view of the above-mentioned shortcomings in the related technologies, the purpose is to provide an integrated valve assembly for semiconductors to solve the technical problems of poor pressure balancing effect, complex structure and unsightly appearance in the related technologies.

[0005] The technical solution to achieve the objective is: an integrated valve assembly for semiconductors, comprising:

[0006] The valve body has several interface channels, some of which are connected to the loadlock chamber and the vacuum pump, some of which are connected to the atmospheric chamber, and some of which are connected to the transmission chamber.

[0007] Two vacuum pressure switches are connected to the interface channel to detect the air pressure at the connection between the interface channel and the loadlock chamber.

[0008] Six baffle valves are connected one-to-one to the interface channel to control the opening and closing of the interface channel;

[0009] And four connectors, one-to-one connected to the interface channel, the connectors being two atmospheric connectors and two leak detection connectors, the atmospheric connectors being connected to the atmospheric chamber.

[0010] Furthermore: the valve body has a first interface, a second interface, a third interface, a fourth interface, a fifth interface, a sixth interface, a seventh interface, an eighth interface, a ninth interface, a tenth interface, an eleventh interface, a twelfth interface, a thirteenth interface, a fourteenth interface, a fifteenth interface, and a sixteenth interface;

[0011] The first interface and the second interface are connected to the loadlock chamber;

[0012] The third interface is connected to the ninth and eleventh interfaces, and passes through the valve body to form a first channel;

[0013] The first channel is connected to the first interface;

[0014] The second interface is connected to the first channel via the second channel;

[0015] The sixth interface is connected to the first channel via the third channel, and the atmospheric connector is connected to the sixth interface and the atmospheric connector is connected to the atmospheric chamber.

[0016] The fourth interface is connected to the first interface, and the leak detection connector is connected to the fourth interface;

[0017] The eighth interface is connected to the second interface via the fourth channel, and the atmospheric connector is connected to the eighth interface, which is connected to the atmospheric chamber.

[0018] The fifth interface is connected to the second interface, and the leak detection connector is connected to the fifth interface;

[0019] The fifteenth interface is connected to the vacuum pump, and the fifteenth interface is connected to the first channel and the second interface;

[0020] The tenth interface is used to connect to the transmission chamber.

[0021] Furthermore: the first interface and the second interface are spaced apart on the bottom of the valve body;

[0022] The third interface, the fourth interface, the fifth interface, the sixth interface, the seventh interface, and the eighth interface are spaced apart and disposed on one side wall of the valve body;

[0023] The ninth, tenth, eleventh, twelfth, and thirteenth interfaces are spaced apart on the other side wall of the valve body;

[0024] The fourteenth, fifteenth, and sixteenth interfaces are spaced apart on the top of the valve body.

[0025] Furthermore: one of the vacuum pressure switches is connected to the third interface for detecting the air pressure at the first interface;

[0026] Another vacuum pressure switch, connected to the twelfth interface, is used to detect the air pressure at the second interface via the fourth channel.

[0027] Furthermore: the baffle valve includes: a first baffle valve, connected at the eleventh interface, used to control the connection and disconnection between the first channel and the second channel;

[0028] The second baffle valve is connected to the ninth interface and is used to control the connection and disconnection between the second channel and the second interface;

[0029] The third baffle valve is connected to the sixteenth interface and is used to control the connection and disconnection between the third channel and the first channel;

[0030] The fourth baffle valve is connected to the fourteenth interface and is used to control the connection and disconnection between the fourth channel and the second interface.

[0031] The fifth baffle valve is connected to the thirteenth interface and is used to control the connection and disconnection between the fifteenth interface and the first channel;

[0032] And a sixth baffle valve, connected to the seventh interface, for controlling the connection and disconnection between the fifteenth interface and the second interface.

[0033] Furthermore, it also includes two leak detectors, one of which is connected to the leak detection connector at the fourth interface, and the other of which is connected to the leak detection connector at the fifth interface.

[0034] The above technical solution has the following beneficial effects: an integrated valve assembly for semiconductors, compared with related technologies, is provided with a valve body, a vacuum pressure switch, a baffle valve and a connector;

[0035] The valve body has several interface channels, which facilitates connection to the loadlock chamber, vacuum pump, atmospheric chamber and transmission chamber;

[0036] The vacuum pressure switch is used to detect the air pressure, ensuring that the vacuum value at the loadlock chamber meets the corresponding numerical requirements;

[0037] Baffle valves are used to control the opening and closing of interface channels, which helps to balance air pressure and offers relatively good flexibility in use.

[0038] The connector is used to connect to the atmospheric chamber;

[0039] A loadlock chamber is installed between the atmospheric chamber and the transfer chamber. A valve body is connected between the loadlock chamber and the vacuum pump. The valve body has a vacuum pressure switch, a baffle valve, and a connector. When the wafer needs to enter the transfer chamber from the atmospheric chamber, both the loadlock chamber and the transfer chamber are in a "vacuum state." Because the air pressure in the atmospheric chamber is greater than that in the loadlock chamber, gas is injected into the loadlock chamber, making the air pressure in the loadlock chamber greater than that in the atmospheric chamber. One of the baffle valves activates, balancing the air pressure between the loadlock chamber and the atmospheric chamber. The transfer window opens, and gas in the loadlock chamber overflows, preventing gas from the atmospheric chamber from entering the loadlock chamber. In the k-chamber, the wafer enters the loadlock chamber from the atmospheric chamber. Another baffle valve activates, and the vacuum pump evacuates the loadlock chamber. Another baffle valve activates, and the vacuum pump evacuates both the loadlock chamber and the transfer chamber. The air pressure in the loadlock chamber and the transfer chamber is nearly equal. The transfer window between the loadlock chamber and the transfer chamber opens, and the wafer enters the transfer chamber from the loadlock chamber. Because of the integrated valve group for semiconductors, which acts as a transfer point, it not only ensures the effect of balancing air pressure, but also prevents the pipes from being intertwined and messy when connecting the loadlock chamber, the atmospheric chamber, the transfer chamber, and the vacuum pump. The structure is relatively compact and aesthetically pleasing.

[0040] This overcomes the technical problems of poor air pressure balancing effect, complex structure, and unattractive appearance, achieving a relatively good air pressure balancing effect, a relatively compact structure, and a relatively aesthetically pleasing appearance, thus possessing practicality. Attached Figure Description

[0041] Figure 1 This is one of the schematic diagrams of the overall assembly structure;

[0042] Figure 2 This is the second schematic diagram of the overall assembly structure;

[0043] Figure 3 This is one of the structural schematic diagrams of the valve body;

[0044] Figure 4 This is the second schematic diagram of the valve body structure;

[0045] Figure 5 This is the third schematic diagram of the valve body structure;

[0046] Figure 6 This is a schematic diagram of the atmospheric chamber, loadlock chamber, and transmission chamber.

[0047] Figure 7 A schematic diagram showing the layout of the loadlock chamber, vacuum pump, transfer chamber, baffle valve, fourth interface, fifth interface, sixth interface, and eighth interface;

[0048] In the diagram: 10. Valve body, 11. First port, 12. Second port, 13. Third port, 14. Fourth port, 15. Fifth port, 16. Sixth port, 17. Seventh port, 18. Eighth port, 19. Ninth port, 191. Tenth port, 192. Eleventh port, 193. Twelfth port, 194. Thirteenth port, 195. Fourteenth port, 196. Fifteenth port, 197. Sixteenth port, 20. Vacuum pressure switch, 30. Connector, 40. First baffle valve, 50. Second baffle valve, 60. Third baffle valve, 70. Fourth baffle valve, 80. Fifth baffle valve, 90. Sixth baffle valve, 100. Loadlock chamber, 200. Atmospheric chamber, 300. Transmission chamber, 400. Vacuum pump. Detailed Implementation

[0049] To make the content easier to understand, the following detailed description is provided with reference to specific embodiments and accompanying drawings;

[0050] An integrated valve assembly for semiconductors solves the technical problems of poor pressure balancing effect, complex structure, and unsightly appearance in related technologies. It can be manufactured and used, achieving the positive effects of relatively better pressure balancing effect, relatively compact structure, and relatively aesthetically pleasing appearance. The overall concept is as follows:

[0051] Implementation

[0052] like Figure 1 , Figure 2 , Figure 6 As shown; an integrated valve assembly for semiconductors, comprising:

[0053] The valve body 10 has a plurality of interface channels, some of which are connected to the loadlock chamber 100 and the vacuum pump 400, some of which are connected to the atmospheric chamber 200, and some of which are connected to the transmission chamber 300.

[0054] Two vacuum pressure switches 20 are connected to the interface channel to detect the air pressure at the connection between the interface channel and the loadlock chamber 100.

[0055] Six baffle valves are connected one-to-one to the interface channel to control the opening and closing of the interface channel;

[0056] And four connectors 30, which are connected one-to-one to the interface channel, the connectors being two atmospheric connectors and two leak detection connectors, the atmospheric connectors being connected to the atmospheric chamber 200;

[0057] Specifically, in implementation, a loadlock chamber is set between the atmospheric chamber 200 and the transfer chamber 300. A valve body 10 is connected between the loadlock chamber 100 and the vacuum pump 400. The valve body 10 has a vacuum pressure switch 20, a baffle valve, and a connector 30. When the wafer needs to enter the transfer chamber 300 from the atmospheric chamber 200, both the loadlock chamber 100 and the transfer chamber 300 are in a "vacuum state." Because the air pressure in the atmospheric chamber 200 is greater than that in the loadlock chamber 100, gas is injected into the loadlock chamber 100, making its air pressure greater than that in the atmospheric chamber 200. One of the baffle valves then activates, balancing the air pressure between the loadlock chamber 100 and the atmospheric chamber 200. The transfer window opens, allowing gas in the loadlock chamber 100 to overflow, preventing gas from the atmospheric chamber 200 from entering. The wafer enters the loadlock chamber 100 from the atmospheric chamber 200. Another baffle valve is activated, and the vacuum pump 400 evacuates the loadlock chamber 100. The vacuum pump 400 also evacuates the loadlock chamber 100 and the transfer chamber 300. The air pressure in the loadlock chamber 100 and the transfer chamber 300 is nearly equal. The transfer window between the loadlock chamber 100 and the transfer chamber 300 is opened, and the wafer enters the transfer chamber 300 from the loadlock chamber 100. Because an integrated valve group for semiconductors is provided as a transfer, which is equivalent to an adapter, it can not only ensure the effect of balancing air pressure, but also prevent the pipes from being intertwined and messy when connecting the loadlock chamber 100, the atmospheric chamber 200, the transfer chamber 300 and the vacuum pump 400. The structure is relatively compact and relatively aesthetically pleasing.

[0058] Another implementation method:

[0059] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7As shown; in practice, the valve body 10 has a first interface 11, a second interface 12, a third interface 13, a fourth interface 14, a fifth interface 15, a sixth interface 16, a seventh interface 17, an eighth interface 18, a ninth interface 19, a tenth interface 191, an eleventh interface 192, a twelfth interface 193, a thirteenth interface 194, a fourteenth interface 195, a fifteenth interface 196, and a sixteenth interface 197.

[0060] The first interface 11 and the second interface 12 are connected to the loadlock chamber 100;

[0061] The third interface 13 is connected to the ninth interface 19 and the eleventh interface 192, and passes through the valve body 10 to form a first channel;

[0062] The first channel is connected to the first interface 11;

[0063] The second interface 12 is connected to the first channel via the second channel;

[0064] The sixth interface 16 is connected to the first channel through the third channel, and the atmospheric connector is connected to the sixth interface 16. The atmospheric connector is connected to the atmospheric chamber 200 through a flexible tube.

[0065] The fourth interface 14 is connected to the first interface 11, and the leak detection connector is connected to the fourth interface 14; the eighth interface 18 is connected to the second interface 12 through the fourth channel, and the atmospheric connector is connected to the atmospheric chamber 200 through a flexible hose.

[0066] The fifth interface 15 is connected to the second interface 12, and the leak detection connector is connected to the fifth interface 15;

[0067] The fifteenth interface 196 is connected to the vacuum pump 400, and the fifteenth interface 196 is connected to the first channel and the second interface 12;

[0068] The tenth interface 191 is connected to the transmission chamber 300 via a flexible tube;

[0069] The first interface 11 and the second interface 12 are spaced apart on the bottom of the valve body 10;

[0070] The third interface 13, the fourth interface 14, the fifth interface 15, the sixth interface 16, the seventh interface 17 and the eighth interface 18 are spaced apart on one side wall of the valve body 10;

[0071] The ninth interface 19, the tenth interface 191, the eleventh interface 192, the twelfth interface 193, and the thirteenth interface 194 are spaced apart on the other side wall of the valve body 10;

[0072] The fourteenth interface 195, the fifteenth interface 196 and the sixteenth interface 197 are spaced apart on the top of the valve body 10;

[0073] The valve body 10 is connected to the machine base by bolts, which makes assembly relatively convenient and the structure has relatively good reliability.

[0074] The valve body 10 has several interface channels, which facilitates connection with the loadlock chamber 100, the vacuum pump 400, the atmospheric chamber 200, and the transmission chamber 300;

[0075] One of the vacuum pressure switches 20 is connected to the third interface 13 and is used to detect the air pressure at the first interface 11.

[0076] Another vacuum pressure switch 20 is connected to the twelfth interface 193 for detecting the air pressure at the second interface 12 through the fourth channel;

[0077] The vacuum pressure switch 20 is a commonly used structure in the prior art. It is connected to the valve body 10 and is used to detect the air pressure, ensuring the vacuum value at the loadlock chamber 100 (e.g., the vacuum degree is controlled between 10⁻³ and 10⁻⁴). 6 (between torr), to achieve the corresponding numerical requirements, so that the environment of Loadlock chamber 100 is close to that of atmospheric chamber 200 and transmission chamber 300;

[0078] The baffle valve includes: a first baffle valve 40 connected to the eleventh interface 192 for controlling the connection between the first channel and the second channel; a second baffle valve 50 connected to the ninth interface 19 for controlling the connection between the second channel and the second interface 12; a third baffle valve 60 connected to the sixteenth interface 197 for controlling the connection between the third channel and the first channel; a fourth baffle valve 70 connected to the fourteenth interface 195 for controlling the connection between the fourth channel and the second interface 12; a fifth baffle valve 80 connected to the thirteenth interface 194 for controlling the connection between the fifteenth interface 196 and the first channel; and a sixth baffle valve 90 connected to the seventh interface 17 for controlling the connection between the fifteenth interface 196 and the second interface 12.

[0079] The baffle valve is a common structure in the prior art. It is connected to the valve body 10 by bolts and is used to control the opening and closing of the interface channel. It has relatively good flexibility in use.

[0080] The connector 30 is roughly T-shaped and is connected to the valve body 10 by bolts. It is used to connect the atmospheric chamber 200 through the VCR connector and hose, and is also used to connect the leak detector. It is relatively easy to assemble.

[0081] Connector 30 consists of two atmospheric connections and two leak detection connections;

[0082] One of the leak detectors is connected to the leak detection connector at the fourth interface 14, and the other leak detector is connected to the leak detection connector at the fifth interface 15;

[0083] Leak detectors are a common structure in existing technology, used for leak detection, ensuring the sealing of chambers and baffle valves, and have relatively good structural reliability;

[0084] Regarding the structure of loadlock chamber 100, atmospheric chamber 200, transfer chamber 300, and vacuum pump 400:

[0085] See Figure 6 , Figure 7 The loadlock chamber 100, atmospheric chamber 200, transfer chamber 300, and vacuum pump 400 are common structures in the prior art and are not the inventive point of this utility model. They are only used to better describe the structure of the integrated valve group for semiconductors and to facilitate understanding of the technical solution of this utility model. The atmospheric chamber 200 is used to store the wafer to be processed. Under normal circumstances, the air pressure of the transfer chamber 300 is lower than that of the atmospheric chamber 200, and the air pressure of the loadlock chamber 100 is between that of the transfer chamber 300 and the atmospheric chamber 200. Those skilled in the art can directly and without doubt know how to set it up after seeing the disclosed content, without needing to put in creative effort or conduct excessive experiments.

[0086] The working principle is as follows:

[0087] like Figure 7 As shown, taking the loadlock chamber 100 on the right as an example:

[0088] When wafer transfer is not required, the second baffle valve 50 and the sixth baffle valve 90 are in the open state, and the vacuum pump 400 evacuates the loadlock chamber 100 and the transfer chamber 300.

[0089] When wafer transfer is required, the second baffle valve 50 and the sixth baffle valve 90 are closed, and the loadlock chamber 100 and the transfer chamber 300 are in a "vacuum state." Since the air pressure in the atmospheric chamber 200 is greater than that in the loadlock chamber 100 (at this time, the transfer window between the loadlock chamber 100 and the atmospheric chamber 200 cannot be opened), gas is injected into the loadlock chamber 100, making its air pressure greater than that in the atmospheric chamber 200. The fourth baffle valve 70 then opens, balancing the air pressure between the loadlock chamber 100 and the atmospheric chamber 200. The transfer window (e.g., a rectangular window, a transfer valve) opens, allowing gas in the loadlock chamber 100 to escape, preventing gas from escaping from the atmospheric chamber 200. Gas enters the loadlock chamber 100, and the wafer enters the loadlock chamber 100 from the atmospheric chamber 200. The fourth baffle valve 70 is closed, the sixth baffle valve 90 is opened, the vacuum pump 400 evacuates the loadlock chamber 100, the second baffle valve 50 is opened, and the vacuum pump 400 evacuates both the loadlock chamber 100 and the transfer chamber 300. The gas pressure in the loadlock chamber 100 and the transfer chamber 300 is nearly the same, and the transfer window between the loadlock chamber 100 and the transfer chamber 300 is opened. The wafer enters the transfer chamber 300 from the loadlock chamber 100. After the wafer is processed, it returns from the transfer chamber 300 to the loadlock chamber 100, and then back to the atmospheric chamber 200, and so on.

[0090] like Figure 7 As shown, taking the loadlock chamber 100 on the left as an example:

[0091] When wafer transfer is not required, the first baffle valve 40 and the fifth baffle valve 80 are in the open state, and the vacuum pump 400 evacuates the loadlock chamber 100 and the transfer chamber 300.

[0092] When wafer transfer is required, the first baffle valve 40 and the fifth baffle valve 80 are closed, and the loadlock chamber 100 and the transfer chamber 300 are in a "vacuum state." Since the air pressure in the atmospheric chamber 200 is greater than that in the loadlock chamber 100 (at this time, the transfer window between the loadlock chamber 100 and the atmospheric chamber 200 cannot be opened), gas is injected into the loadlock chamber 100, making its air pressure greater than that in the atmospheric chamber 200. The third baffle valve 60 then opens, balancing the air pressure between the loadlock chamber 100 and the atmospheric chamber 200. The transfer window (e.g., a rectangular window, a transfer valve) opens, allowing gas in the loadlock chamber 100 to escape, preventing gas from escaping from the atmospheric chamber 200. Gas enters the loadlock chamber 100, and the wafer enters the loadlock chamber 100 from the atmospheric chamber 200. The third baffle valve 60 is closed, and the fifth baffle valve 80 is opened. The vacuum pump 400 evacuates the loadlock chamber 100. The first baffle valve 40 is opened, and the vacuum pump 400 evacuates both the loadlock chamber 100 and the transfer chamber 300. The gas pressure in the loadlock chamber 100 and the transfer chamber 300 is nearly the same. The transfer window between the loadlock chamber 100 and the transfer chamber 300 is opened, and the wafer enters the transfer chamber 300 from the loadlock chamber 100. After the wafer is processed, it returns from the transfer chamber 300 to the loadlock chamber 100, and then back to the atmospheric chamber 200, and so on.

[0093] Two sets of loadlock chambers 100 are symmetrically arranged, forming two wafer channels from atmospheric chamber 200 → loadlock chamber 100 → transmission chamber 300, which improves processing efficiency;

[0094] Furthermore, due to the inclusion of an integrated valve assembly for semiconductors, which acts as a transfer point and essentially a connector, it not only ensures the effect of balancing air pressure, but also prevents the pipes from intersecting or becoming messy when connecting the loadlock chamber 100, the atmospheric chamber 200, the transmission chamber 300, and the vacuum pump 400. The structure is relatively compact and aesthetically pleasing.

[0095] In the description, it should be understood that the terms "up", "down", "left", "right", "front", "back", etc., indicate the orientation or positional relationship based on the positional relationship shown in the accompanying drawings, and are only for the convenience or simplification of the description, rather than indicating a specific orientation that must be present; the operation process described in the embodiments is not an absolute usage step, and corresponding adjustments can be made in actual use;

[0096] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art; the words “first,” “second,” and similar terms used in the specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components, and similarly, the words “a” or “a” and similar terms do not determine a quantity limitation, but rather indicate the presence of at least one, as determined by the content of the embodiments;

[0097] The above description is only a preferred embodiment, but the scope of protection is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the disclosed technology, based on the technical solution and inventive concept, should be included within the scope of protection.

Claims

1. An integrated valve set for a semiconductor, characterized by comprising: include: The valve body has several interface channels, some of which are connected to the loadlock chamber and the vacuum pump, some of which are connected to the atmospheric chamber, and some of which are connected to the transmission chamber. Two vacuum pressure switches are connected to the interface channel to detect the air pressure at the connection between the interface channel and the loadlock chamber. Six baffle valves are connected one-to-one to the interface channel to control the opening and closing of the interface channel; And four connectors, one-to-one connected to the interface channel, the connectors being two atmospheric connectors and two leak detection connectors, the atmospheric connectors being connected to the atmospheric chamber.

2. An integrated valve package for semiconductor use according to claim 1, characterized in that: The valve body has a first interface, a second interface, a third interface, a fourth interface, a fifth interface, a sixth interface, a seventh interface, an eighth interface, a ninth interface, a tenth interface, an eleventh interface, a twelfth interface, a thirteenth interface, a fourteenth interface, a fifteenth interface, and a sixteenth interface; The first interface and the second interface are connected to the loadlock chamber; The third interface is connected to the ninth and eleventh interfaces, and passes through the valve body to form a first channel; The first channel is connected to the first interface; The second interface is connected to the first channel via the second channel; The sixth interface is connected to the first channel via the third channel, and the atmospheric connector is connected to the sixth interface and the atmospheric connector is connected to the atmospheric chamber. The fourth interface is connected to the first interface, and the leak detection connector is connected to the fourth interface; The eighth interface is connected to the second interface via the fourth channel, and the atmospheric connector is connected to the eighth interface, which is connected to the atmospheric chamber. The fifth interface is connected to the second interface, and the leak detection connector is connected to the fifth interface; The fifteenth interface is connected to the vacuum pump, and the fifteenth interface is connected to the first channel and the second interface; The tenth interface is used to connect to the transmission chamber.

3. An integrated valve package for semiconductor use according to claim 2, characterized in that: The first interface and the second interface are spaced apart on the bottom of the valve body; The third interface, the fourth interface, the fifth interface, the sixth interface, the seventh interface, and the eighth interface are spaced apart and disposed on one side wall of the valve body; The ninth, tenth, eleventh, twelfth, and thirteenth interfaces are spaced apart on the other side wall of the valve body; The fourteenth, fifteenth, and sixteenth interfaces are spaced apart on the top of the valve body.

4. An integrated valve package for semiconductor use according to claim 2 or 3, characterized in that: One of the vacuum pressure switches is connected to the third interface for detecting the air pressure at the first interface; Another vacuum pressure switch, connected to the twelfth interface, is used to detect the air pressure at the second interface via the fourth channel.

5. An integrated valve package for semiconductor use according to claim 2 or 3, characterized in that: The baffle valve includes: a first baffle valve, connected to the eleventh interface, used to control the connection and disconnection between the first channel and the second channel; The second baffle valve is connected to the ninth interface and is used to control the connection and disconnection between the second channel and the second interface; The third baffle valve is connected to the sixteenth interface and is used to control the connection and disconnection between the third channel and the first channel; The fourth baffle valve is connected to the fourteenth interface and is used to control the connection and disconnection between the fourth channel and the second interface. The fifth baffle valve is connected to the thirteenth interface and is used to control the connection and disconnection between the fifteenth interface and the first channel; And a sixth baffle valve, connected to the seventh interface, for controlling the connection and disconnection between the fifteenth interface and the second interface.

6. An integrated valve set for a semiconductor as claimed in claim 2 or 3, characterized in that: Also includes: Two leak detectors, one of which is connected to the leak detection connector at the fourth interface, and the other of which is connected to the leak detection connector at the fifth interface.

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