A cleaning nozzle for a multilayer circuit board

By incorporating a deformable water jacket and support spring into the metal nozzle, the problem of damage when the cleaning nozzle comes into contact with multi-layer circuit boards is solved, thus achieving a safe cleaning process.

CN224443307UActive Publication Date: 2026-07-03SI CHUAN ZHONG FEI CHUANG XIN ZHI NENG KE JI YOU XIAN ZE REN GONG SI

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SI CHUAN ZHONG FEI CHUANG XIN ZHI NENG KE JI YOU XIAN ZE REN GONG SI
Filing Date
2025-04-29
Publication Date
2026-07-03

AI Technical Summary

Technical Problem

During the cleaning process of multi-layer circuit boards, the cleaning nozzle is prone to scratches or collisions when it comes into contact with the circuit board, which can lead to damage.

Method used

A deformable water jacket is installed at one end of the metal nozzle, and its shape is supported by a support spring to avoid rigid contact between the nozzle and the circuit board. The deformable water jacket deforms upon contact to protect the circuit board.

Benefits of technology

This effectively avoids rigid contact between the nozzle and the circuit board, improving cleaning safety and protection.

✦ Generated by Eureka AI based on patent content.

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  • Figure CN224443307U_ABST
    Figure CN224443307U_ABST
Patent Text Reader

Abstract

This utility model discloses a cleaning nozzle for multilayer circuit boards, including a metal nozzle in the shape of a straight tube. A deformable water sleeve, made of soft tubular material, is provided at one end of the metal nozzle. A water outlet ring is connected to the end of the deformable water sleeve away from the metal nozzle. A support spring is fitted around the deformable water sleeve, with one end connected to the end of the metal nozzle and the other end connected to the water outlet ring. This multilayer circuit board cleaning nozzle, by providing a deformable water sleeve at one end of the metal nozzle and supporting its shape with a support spring, remains unaffected during normal use. When the nozzle contacts the multilayer circuit board, the pressure of the nozzle forces the deformable water sleeve to deform, thereby avoiding rigid contact between the nozzle and the multilayer circuit board, protecting the multilayer circuit board, and improving cleaning safety.
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Description

Technical Field

[0001] This utility model relates to the field of multilayer circuit board manufacturing technology, and in particular to a cleaning nozzle for multilayer circuit boards. Background Technology

[0002] Multilayer circuit boards require cleaning during production. To ensure effective cleaning, the cleaning nozzle is typically placed as close as possible to the surface of the circuit board, usually within centimeters. However, due to mechanical errors, positioning errors, and other factors, the distance control error may become too large, causing the cleaning nozzle to come into contact with the circuit board. In such cases, the cleaning nozzle may scrape or collide with the circuit board, damaging it. Utility Model Content

[0003] To address the shortcomings of existing technologies, this utility model provides a cleaning nozzle for multi-layer circuit boards. This cleaning nozzle for multi-layer circuit boards features a deformable water jacket at one end of a metal nozzle, supported by a spring. During normal use, the water jacket remains unaffected. When the nozzle contacts the multi-layer circuit board, the pressure exerted by the nozzle forces the deformable water jacket to deform, thereby avoiding rigid contact between the nozzle and the multi-layer circuit board, protecting the multi-layer circuit board, and improving cleaning safety.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] This utility model provides a cleaning nozzle for multilayer circuit boards, including a metal nozzle, the metal nozzle being in the shape of a straight tube, a deformable water jacket being provided at one end of the metal nozzle, the deformable water jacket being a soft tube sleeve, and a water outlet ring being connected to the end of the deformable water jacket away from the metal nozzle.

[0006] The deformable water jacket is fitted with a support spring. One end of the support spring is connected to the end of the metal nozzle, and the other end of the support spring is connected to the water outlet ring.

[0007] The cleaning nozzle for multi-layer circuit boards features a deformable water jacket at one end of a metal nozzle, supported by a spring. This jacket remains unaffected during normal use. When the nozzle contacts the multi-layer circuit board, the pressure exerted by the nozzle forces the deformable water jacket to deform, thus preventing rigid contact between the nozzle and the multi-layer circuit board, protecting the board, and improving cleaning safety.

[0008] In a further technical solution, both the deformable water jacket and the supporting spring are conical.

[0009] Since the deformable water jacket itself will expand and deform to a certain extent due to water pressure during normal use, resulting in a decrease in water pressure, it is designed to be conical to increase water pressure and compensate for the decrease in water pressure caused by its deformation.

[0010] In a further technical solution, the outer diameter of one end of the deformable water jacket is smaller than the outer diameter of the metal nozzle, and the outer diameter of the other end of the deformable water jacket is smaller than the outer diameter of the water outlet ring.

[0011] Both ends of the deformable water jacket have a radial portion left at their connection points to provide sufficient support for the spring and ensure the support effect.

[0012] In a further technical solution, the water outlet ring is a rubber ring.

[0013] The rubber ring can further prevent hard contact between the nozzle and the multi-layer circuit board, thus further improving safety.

[0014] In a further technical solution, the axial length of the deformable water jacket is 5mm.

[0015] The beneficial effects are:

[0016] 1. The cleaning nozzle for multi-layer circuit boards has a deformable water jacket at one end of the metal nozzle, which is supported by a support spring and is unaffected during normal use. When the nozzle comes into contact with the multi-layer circuit board, the pressure of the nozzle on the multi-layer circuit board forces the deformable water jacket to deform, thereby avoiding rigid contact between the nozzle and the multi-layer circuit board, protecting the multi-layer circuit board and improving cleaning safety. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the cleaning nozzle for a multilayer circuit board according to an embodiment of the present invention.

[0018] 10. Metal nozzle; 20. Water outlet ring; 30. Deformable water jacket; 40. Support spring. Detailed Implementation

[0019] The present invention will be further described below with reference to the accompanying drawings:

[0020] Example:

[0021] A cleaning nozzle for multi-layer circuit boards, such as Figure 1 As shown, it includes a metal nozzle 10, which is in the shape of a straight tube. A deformable water jacket 30 is provided at one end of the metal nozzle 10. The deformable water jacket 30 is a soft tube sleeve. A water outlet ring 20 is connected to the end of the deformable water jacket 30 away from the metal nozzle 10.

[0022] A support spring 40 is fitted on the outside of the deformable water jacket 30. One end of the support spring 40 is connected to the end of the metal nozzle 10, and the other end of the support spring 40 is connected to the water outlet ring 20.

[0023] The cleaning nozzle for multi-layer circuit boards has a deformable water jacket 30 at one end of the metal nozzle 10, and its shape is supported by a support spring 40. It is unaffected during normal use. When the nozzle comes into contact with the multi-layer circuit board, the pressure of the nozzle on the multi-layer circuit board forces the deformable water jacket 30 to deform, thereby avoiding rigid contact between the nozzle and the multi-layer circuit board, protecting the multi-layer circuit board and improving cleaning safety.

[0024] Understandably, the support spring 40 is wrapped around the deformable water jacket 30, firstly to support its axial length, and secondly to limit the deformation of the water jacket 30 from being excessively stretched by water pressure during normal use.

[0025] In another embodiment, both the deformable water jacket 30 and the support spring 40 are conical.

[0026] Since the deformable water jacket 30 itself will expand and deform to a certain extent due to water pressure during normal use, resulting in a decrease in water pressure, it is designed to be conical to increase water pressure and compensate for the decrease in water pressure caused by its deformation.

[0027] In another embodiment, the outer diameter of one end of the deformable water jacket 30 is smaller than the outer diameter of the metal nozzle 10, and the outer diameter of the other end of the deformable water jacket 30 is smaller than the outer diameter of the water outlet ring 20.

[0028] Both ends of the deformable water jacket 30 have a radial portion left at their connection points to provide sufficient support for the support spring 40 and ensure the support effect.

[0029] In another embodiment, the water outlet ring 20 is a rubber ring.

[0030] The rubber ring can further prevent hard contact between the nozzle and the multi-layer circuit board, thus further improving safety.

[0031] In another embodiment, the axial length of the deformable water jacket 30 is 5 mm.

[0032] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A cleaning nozzle for a multilayer wiring board, characterized by comprising: It includes a metal nozzle, which is in the shape of a straight tube. One end of the metal nozzle is provided with a deformable water jacket, which is a soft tube sleeve. The end of the deformable water jacket away from the metal nozzle is connected to a water outlet ring. The deformable water jacket is fitted with a support spring. One end of the support spring is connected to the end of the metal nozzle, and the other end of the support spring is connected to the water outlet ring.

2. The cleaning nozzle for a multilayer wiring board according to claim 1, characterized by Both the deformable water jacket and the supporting spring are conical.

3. The cleaning nozzle for a multilayer wiring board according to claim 1 or 2, characterized by The outer diameter of one end of the deformable water jacket is smaller than the outer diameter of the metal nozzle, and the outer diameter of the other end of the deformable water jacket is smaller than the outer diameter of the water outlet ring.

4. The cleaning nozzle for a multilayer wiring board according to claim 1, characterized by The water outlet ring is a rubber ring.

5. The cleaning nozzle for a multilayer wiring board according to claim 1, characterized by The axial length of the deformable water jacket is 5 mm.