Server chassis and servers

Abstract

This application discloses a server chassis and a server, relating to the field of computer technology. The server chassis includes a first end and a second end disposed opposite to each other, a fan area, an I / O component area, a computing area, a power configuration area, and a backplane assembly. The fan area is configured to accommodate fan modules and is located at the second end. The I / O component area and the computing area are located at the first end and are stacked together. The I / O component area is configured to accommodate I / O components. The computing area is configured to accommodate computing components. The backplane assembly is located between the first end and the second end and has a cutout portion located within the orthographic projection range of the fan area onto the backplane assembly. The power configuration area is configured to supply power to the fan area, the I / O component area, and the computing area. This design solves the technical problem of low heat dissipation efficiency of server fan modules in related technologies, achieving the technical effect of improving heat dissipation efficiency.

Description

Technical Field

[0001] This application relates to the field of computer technology, and more particularly to a server chassis and a server. Background Technology

[0002] In recent years, with the rise of computationally intensive fields such as artificial intelligence, high-performance data analysis, and financial analysis, heterogeneous computing has increasingly attracted the attention of academia and industry. To achieve powerful performance and data processing capabilities, complete systems often need to include computing components and graphics processing units (GPUs). GPUs can be used to quickly train large-scale data, while the central processing unit (CPU) can handle data preprocessing and control tasks, achieving more efficient data flow. However, in increasingly high-density server systems, with the increasing power consumption of computing segments and GPUs, heat dissipation has become a critical issue. In existing server systems, the cooling system is usually uniformly designed, making it impossible to finely control the heat dissipation of specific areas such as GPUs. This not only reduces heat dissipation efficiency but may also lead to overheating or damage to components due to improper thermal management. Furthermore, current server systems generally use motherboard power supply, which may cause performance degradation or even system crashes under high-load computing, especially in high-density server systems where traditional power supply methods often struggle to achieve stable circuit switching and stable power supply. Utility Model Content

[0003] This application provides a server chassis and a server to at least solve the problem of low heat dissipation efficiency of server fan modules in related technologies.

[0004] This application provides a server chassis, including a first end and a second end disposed opposite to each other, a fan area, an I / O component area, a computing area, a power configuration area, and a backplane assembly. The fan area is configured to accommodate fan modules and is located at the second end. The I / O component area and the computing area are located at the first end and are stacked together. The I / O component area is configured to accommodate I / O components. The computing area is configured to accommodate computing components. The backplane assembly is located between the first end and the second end, and the fan modules are electrically connected to the backplane assembly. The backplane assembly has a cutout portion located within the orthographic projection range of the fan area on the backplane assembly. The power configuration area is configured to supply power to the fan area, the I / O component area, and the computing area.

[0005] Furthermore, the server chassis also includes a fan module located within the fan area, with at least a portion of the power configuration area stacked with the fan area. The fan module includes at least one sub-module, with a cutout portion located within the orthographic projection range of the at least one sub-module onto the mid-backplane assembly.

[0006] Furthermore, the server chassis has a first sidewall and a second sidewall disposed opposite to each other, a backplane assembly extending from the second sidewall to the first sidewall, and a gap between the backplane assembly and the first sidewall.

[0007] Furthermore, there are at least a plurality of sub-modules, and the projection of the sub-modules near the first sidewall in the fan module onto the plane where the back panel assembly is located is outside the range of the back panel assembly. The plurality of sub-modules are stacked sequentially in a direction away from the power configuration area.

[0008] Furthermore, at least one sub-module includes a first sub-module located on the side of the fan module near the power configuration area, and the cutout includes a first cutout located within the orthographic projection range of the first sub-module onto the back panel assembly.

[0009] Furthermore, at least one sub-module also includes a second sub-module, the first sub-module and the second sub-module are stacked, the second sub-module is located on the side of the first sub-module away from the power configuration area, the direction from the first sub-module to the second sub-module is the second direction, the cutout portion also includes a second cutout portion, the first cutout portion and the second cutout portion are arranged along the second direction.

[0010] Furthermore, the second hollowed-out portion is located within the orthographic projection range of the second sub-module onto the middle backplate assembly.

[0011] Furthermore, at least one sub-module also includes a third sub-module, which is located on the side of the second sub-module away from the first sub-module. The direction in which the second end extends toward the first end is a third direction, and at least a portion of the projection of the third sub-module along the third direction onto the plane where the back panel assembly is located is within the range of the back panel assembly.

[0012] Furthermore, the server chassis also includes a housing, with the fan area located inside the housing. The backplane assembly includes a backplane and a backplane bracket. The backplane has an adapter for electrical connection. The backplane bracket is connected to the housing and has a stacking portion and a supporting portion. The stacking portion is stacked with the backplane. The orthographic projection of the backplane on the backplane bracket coincides with the stacking portion. The stacking portion has a first through hole, and the backplane has a second through hole. The direction in which the second end extends towards the first end is a third direction. At least a portion of the first through hole and at least a portion of the second through hole coincide along the projection of the third direction. The overlapping portion of the projection of the first through hole and the second through hole along the third direction serves as a first cutout portion. The supporting portion has a second cutout portion. The first through hole and the second cutout portion are arranged along a second direction.

[0013] Furthermore, the adapter includes a second connector and a third connector. The second connector is used for electrical connection with the fan module, and the third connector is used for electrical connection with the computing unit. The second connector is located on the side of the middle backplate closer to the fan module, and the third connector is located on the side of the middle backplate away from the fan module.

[0014] Furthermore, the server chassis also includes a power supply module located within the power configuration area. The adapter also includes a first connector for electrical connection with at least a portion of the power supply module. The first connector is located within the orthographic projection area of ​​the power configuration area onto the back panel. The power supply module supplies power to the fan module and computing area via the back panel.

[0015] Furthermore, there are multiple third connectors, and the middle backplate assembly also includes a reinforcing plate located between the middle backplate and the backplate support. At least a portion of the reinforcing plate's projection along a third direction coincides with the projection of the adapter portion along a third direction. The reinforcing plate is capable of supporting the third connector when it is plugged in.

[0016] Furthermore, the back panel assembly also includes a wind deflector for blocking wind, which is located between the fan area and the power configuration area. The back panel bracket has a mounting portion and a mounting protrusion protruding toward the fan area on the side near the fan area. The wind deflector is located between the mounting portion and the mounting protrusion, and both ends of the wind deflector are connected to the mounting portion and the mounting protrusion, respectively.

[0017] Furthermore, the server chassis also includes a fan module located within a fan area. The fan module includes multiple sub-modules, each sub-module including multiple fans. The multiple fans are arranged along a first direction. At least a portion of the power configuration area is stacked with the fan area. The multiple sub-modules are stacked sequentially along a direction away from the power configuration area. The first direction and the stacking direction of the multiple sub-modules are at an angle.

[0018] Furthermore, the server chassis also includes a fan adapter board and at least one fan board. The fan adapter board is located within the fan area and has a first connector and multiple second connectors. The first connector is plugged into the backplane assembly, and the multiple second connectors are arranged along the stacking direction of the multiple sub-modules. The fan board is located within the fan area, and the number of second connectors is the same as that of the fan board and they are plugged into it one-to-one.

[0019] Furthermore, the fan board has multiple third connectors, which are connected to the fans of the sub-modules. The number of third connectors and fans are the same and they are connected in a one-to-one correspondence.

[0020] This application also provides a server, including the server chassis and components described above. The components include I / O components and / or computing units. The I / O components are located in an I / O component area, and the computing units are located in a computing area. The backplane assembly is electrically connected to at least a portion of the components.

[0021] This application, by incorporating a backplane assembly and a fan zone within the server chassis, and featuring a perforated section on the backplane assembly, achieves several advantages. First, the perforated section provides a precise and convenient ventilation channel for the fan modules within the fan zone, allowing them to directly target specific locations within the computing area for ventilation and heat dissipation. This enables more refined heat dissipation control, thereby improving heat dissipation efficiency and reducing server failure rates due to overheating. Second, the backplane assembly's location between the fan zone and the computing area facilitates power supply to the fan modules and / or computing components within the fan zone. This separates the power supply to the fan modules and / or computing components from the motherboard design, eliminating the need for cable connections. This improves the reliability of power supply to the fan modules and / or computing components, reduces costs, enhances server reliability and maintainability, and prevents the impact of fan module and / or computing component failures on the motherboard and other components. The backplane assembly in this embodiment integrates power supply and ventilation functions, which helps improve the server's heat dissipation efficiency and power supply stability, and also improves maintainability. This, in turn, helps improve the stability of server performance and service life. Therefore, it can solve the technical problem of low heat dissipation efficiency of server fan modules in related technologies, and achieve the technical effect of improving heat dissipation efficiency. Attached Figure Description

[0022] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the server chassis provided in an embodiment of this application;

[0024] Figure 2 This is a schematic diagram of the structure of the box provided in an embodiment of this application;

[0025] Figure 3 This is a schematic diagram of the structure of the backplane assembly provided in the embodiments of this application;

[0026] Figure 4 Rear view of the backplane assembly provided in an embodiment of this application;

[0027] Figure 5 Provided for the embodiments of this application Figure 1 Another structural diagram from a different angle;

[0028] Figure 6 This is a schematic diagram of the structure of the adapter plate bracket provided in the embodiments of this application;

[0029] Figure 7 This is a schematic diagram of the structure of the sub-module and fan plate provided in the embodiments of this application;

[0030] Figure 8 Provided for the embodiments of this application Figure 1 Assembly drawing;

[0031] Figure 9 Rear view of the housing and back panel assembly provided in an embodiment of this application;

[0032] Figure 10 This is a schematic diagram of the internal structure of the server provided in an embodiment of this application.

[0033] The above figures include the following reference numerals:

[0034] 10. Housing; 11. Fan plate bracket; 12. Adapter plate bracket; 121. I-beam; 122. Fixing hole; 123. Stop post; 124. Stop bend; 13. Power supply housing cavity; 14. Locking element; 15. Handle; 16. Positioning post; 17. Flanged structure; 20. Fan module; 21. Fan; 30. Back panel assembly; 31. Back panel; 311. First cutout; 312. First connector; 313. Second connector; 314. Third connector; 315. Fourth connector; 316. Adapter; 32 321. Backplate bracket; 322. Stacking part; 323. Second hollow part; 324. Support part; 325. Positioning groove; 326. Mounting part; 327. Mounting protrusion; 328. Reinforcing plate; 329. Hollow part; 40. Power module; 41. First power supply module; 42. Second power supply module; 43. Power board; 50. Fan adapter board; 51. First connector; 52. Second connector; 60. Fan board; 61. Third connector; 62. Fourth connector; 70. Windshield; 80. Graphics processor assembly; 90. Computing component. Detailed Implementation

[0035] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0036] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0037] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0038] The embodiments of this application provide a server chassis and a server. The server chassis is described in detail below, taking into account its structure and working principle.

[0039] like Figures 1 to 10A server chassis is shown, including a first end and a second end disposed opposite to each other; a fan area configured to accommodate a fan module 20, the fan area being located at the second end; an I / O component area and a computing area, the I / O component area and the computing area being located at the first end and stacked thereon; the I / O component area being configured to accommodate I / O components; the computing area being configured to accommodate computing components; a backplane assembly 30, the backplane assembly 30 being located between the first end and the second end, the backplane assembly 30 having a cutout portion 34 located within the orthographic projection range of the fan area on the backplane assembly 30; and a power supply configuration area configured to supply power to the fan area, the I / O component area, and the computing area.

[0040] In this embodiment, by setting a backplane assembly 30 and a fan area inside the server chassis, and providing a cutout 34 on the backplane assembly 30, on the one hand, the cutout 34 can provide a precise and convenient ventilation channel for the fan modules 20 in the fan area, allowing the fan modules 20 to directly ventilate and dissipate heat at specific locations within the computing area, thereby achieving more refined heat dissipation control, which is beneficial to improving heat dissipation efficiency and reducing the server failure rate caused by overheating. On the other hand, the backplane assembly 30 is located between the fan area and the computing area, allowing the backplane assembly 30 to conveniently supply power to the fan modules 20 in the fan area and / or the computing components in the computing area, thereby separating the power supply of the fan modules 20 and / or the computing components from the motherboard design without having to connect them through cables. This not only improves the reliability of the power supply to the fan modules 20 and / or the computing components, but also helps to reduce costs, improve the reliability and maintainability of the server, and avoid the impact on the motherboard and other components when the fan modules 20 and / or the computing components fail. The backplane assembly 30 in this embodiment integrates power supply and ventilation functions, which helps improve the heat dissipation efficiency and power supply stability of the server, and also helps improve maintainability, thereby improving the stability of server performance and service life.

[0041] It should be noted that the server chassis in this embodiment also includes a chassis 10, with a fan area located inside the chassis 10 and a fan module 20 located within the fan area. After the backplane assembly 30 is assembled with the chassis, the fan module 20 can enter the chassis 10 from the side away from the first end and electrically connect with other components installed inside the chassis 10, such as the fan plate 60. The backplane assembly 30 is located on the side of the chassis 10 closer to the first end. The computing components mentioned in this embodiment include a graphics processing unit 80 and a computing unit 90. The graphics processing unit 80 and the computing unit 90 are electrically connected to the backplane assembly 30, which serves to provide power and transmit signals. The graphics processing unit 80 refers to a graphics processing unit including a graphics processor; the computing unit 90 refers to a computing unit including a multi-core processor, etc. I / O refers to input / output; for example, I / O components may include hard drives, network cards, etc.

[0042] The server chassis in this embodiment also includes a fan module 20, which is located in the fan area. The fan module 20 includes at least one sub-module, and the cutout portion 34 is located within the orthographic projection range of the at least one sub-module in the middle backplane assembly 30. This allows the server chassis to support the middle backplane assembly 30 in terms of physical support, data transmission, power distribution, and other functions, while also ensuring good ventilation and heat dissipation.

[0043] The server chassis in this embodiment has a first sidewall and a second sidewall that are arranged opposite to each other. The middle backplate assembly 30 extends from the second sidewall to the first sidewall, and there is a gap between the middle backplate assembly 30 and the first sidewall. This allows the sub-module located in the gap between the middle backplate assembly 30 and the first sidewall to have sufficient ventilation space, thereby ensuring the smooth flow of heat dissipation channels and providing good heat dissipation for the computing area.

[0044] It should be noted that, in this embodiment, the first direction refers to the arrangement direction of each fan 21 within the sub-module, that is... Figure 9 The direction from left to right in the diagram refers to the direction from the first sub-module towards the second sub-module. Figure 9 The direction from bottom to top in the text refers to the direction from the first end to the second end, which is... Figure 10 The direction from left to right in this embodiment. Any two of the first direction, second direction, and third direction are set at an angle.

[0045] In this embodiment, there are multiple sub-modules. The projection of the sub-module near the first sidewall of the fan module 20 onto the plane of the backplate assembly 30 is outside the range of the backplate assembly. This ensures that at least one sub-module among the multiple sub-modules is completely unobstructed on the side closest to the computing area, thus forming a completely unobstructed heat dissipation channel between the at least one sub-module and the computing area. This improves the heat dissipation efficiency of the sub-module for the computing components without affecting the electrical connection between the backplate assembly 30 and the fan area, power configuration area, etc. It should be noted that in this embodiment, at least a portion of the power configuration area is stacked with the fan area, and the multiple sub-modules are stacked sequentially in a direction away from the power configuration area.

[0046] In this embodiment, the cutout portion 34 includes multiple sub-cutout portions, each located within the orthographic projection range of one of the multiple sub-modules on the back panel assembly 30. In this embodiment, each sub-module includes a fan frame and multiple fans 21 arranged along a first direction within the fan frame. The sub-cutout portion 34 includes multiple ventilation holes arranged along the first direction, ensuring consistency between the ventilation hole arrangement direction and the arrangement direction of the multiple fans 21 within the same sub-module. This optimizes the airflow path and ensures the effectiveness of airflow for heat dissipation, achieving optimal heat dissipation. Specifically, one sub-module in this embodiment includes five fans 21 arranged along the first direction, and one sub-cutout portion 34 has three ventilation holes along the first direction, thereby precisely controlling the airflow path. The position of the sub-cutout portion 34 can be adjusted according to the position of the computing component. Optionally, the ventilation holes can be configured in various shapes such as directional, circular, or irregular. Of course, the number of fans 21 in the sub-module and the number of ventilation holes in the sub-cutout 34 can be adjusted according to actual needs.

[0047] like Figure 1 As shown, in this embodiment, the hollowed-out portion 34 includes a first hollowed-out portion 311 and a second hollowed-out portion 3211. Both the first hollowed-out portion 311 and the second hollowed-out portion 3211 are among multiple sub-hollowed-out portions. The first hollowed-out portion 311 and the second hollowed-out portion 3211 are arranged along a second direction, with the first and second directions at an angle. This allows the first hollowed-out portion 311 and the second hollowed-out portion 3211 to be located within the orthographic projection range of different sub-modules on the back panel assembly 30, thereby improving the optimization of the airflow path. Of course, the number of sub-hollowed-out portions can be adjusted according to actual needs. For example, the hollowed-out portion 34 may also include a third hollowed-out portion, which is also among multiple sub-hollowed-out portions.

[0048] The fan module 20 in this embodiment includes a first sub-module and a second sub-module, which are stacked together. The first cutout portion 311 is located within the orthographic projection range of the first sub-module on the middle backplate assembly 30, and the second cutout portion 3211 is located within the orthographic projection range of the second sub-module on the middle backplate assembly 30. This forms well-ventilated heat dissipation channels between the first sub-module and the computing area, as well as between the second sub-module and the computing area, thereby ensuring effective heat dissipation of the computing area by the first and second sub-modules.

[0049] In this embodiment, at least a portion of the power configuration area is stacked with the fan area. The first sub-module is located on the side of the fan module 20 closer to the power configuration area, that is, at least a portion of the power configuration area and the fan area are arranged along the second direction, such as... Figure 10 As shown, the first sub-module is located at the bottom of the fan area and is closer to the power configuration area than the other sub-modules of the fan module 20.

[0050] The fan module 20 in this embodiment further includes a third sub-module and a fourth sub-module. The first sub-module, the second sub-module, the third sub-module, and the fourth sub-module are all one of a plurality of sub-modules. The plurality of sub-modules are arranged along a second direction, and the third sub-module is located on the side of the second sub-module away from the first sub-module. The fourth sub-module is located on the side of the third sub-module away from the second sub-module. That is, from bottom to top, they are the first sub-module, the second sub-module, the third sub-module, and the fourth sub-module. At least a portion of the third sub-module is projected along a third direction onto the plane where the back panel assembly 30 is located within the range of the back panel assembly 30. Specifically, in this embodiment, the back panel assembly 30 has a first edge that is close to the third sub-module and away from the first sub-module. The side of the third sub-module away from the first sub-module is farther away from the first sub-module than the first edge. When the second direction is the height direction, the top height of the third sub-module is greater than the height of the middle backplate assembly 30. In this way, on the one hand, the middle backplate assembly 30 can limit the components in the fan area, ensuring the accuracy of the installation position of the sub-modules in the fan area and preventing the components in the fan area from being installed incorrectly and exceeding the fan area, thus preventing interference with other components. On the other hand, the middle backplate assembly 30 occupies a certain space and can provide effective physical support for the server chassis. At the same time, the power distribution, data transmission and other functions of the middle backplate assembly 30 can also be effectively performed without being affected.

[0051] In this embodiment, the fourth sub-module is located on the side of the third sub-module away from the second sub-module. The projection of the fourth sub-module along a third direction onto the plane where the backplane assembly 30 is located is outside the range of the backplane assembly 30. In this embodiment, the three upper sub-modules are used for ventilation and heat dissipation of the graphics processor assembly 80 inside the chassis, and the lower first sub-module is used for ventilation and heat dissipation of the computing component 90 inside the chassis. This achieves independent heat dissipation for the graphics processor assembly 80 and the computing component 90, enhances the server's thermal management capabilities, and ensures heat dissipation efficiency. In this way, the top of the backplate assembly 30 is higher than the first and second sub-modules, but lower than the top of the third sub-module. This allows the backplate assembly 30 to partially block the third sub-module while completely not blocking the fourth sub-module. This creates a partially unobstructed heat dissipation channel between the computing area and the fan area, directly dissipating heat for the graphics processor assembly 80. Furthermore, since the backplate assembly 30 is located on the side of the first and second sub-modules closest to the first end, a first cutout 311 and a second cutout 3211 are provided on the backplate assembly 30 to ensure heat dissipation efficiency. The two sub-cutouts 34 are arranged along the second direction. The first cutout 311 is located within the orthographic projection range of the first sub-module within the backplate assembly 30, thus providing ventilation for the first sub-module. The second cutout 3211 is located within the orthographic projection range of the second sub-module within the backplate assembly 30, thus providing ventilation for the second sub-module. This ensures both the integrity of the backplate assembly 30's own function and the heat dissipation efficiency of each sub-module. The shape and number of ventilation holes in the first cutout portion 311 and the second cutout portion 3211 can be set to be the same or different, and can be adjusted according to actual needs. Based on the differences in heat dissipation requirements and installation positions of the graphics processor component 80 and the computing component 90, in this embodiment, the number of ventilation holes in the first cutout portion 311 and the second cutout portion 3211 are set to be the same, but the shapes are set to be different, thereby achieving a better heat dissipation effect. Optionally, the first cutout portion 311 may include three irregularly shaped ventilation holes with relatively large openings, and the second cutout portion 3211 may include three rectangular ventilation holes arranged laterally.

[0052] Optionally, the number of sub-modules in this embodiment is not limited to four. The fan module 20 may also have a fifth sub-module, a sixth sub-module, etc., depending on actual needs. The fifth and sixth sub-modules may be located between the third and fourth sub-modules, between the second and third sub-modules, or between the first and second sub-modules. When the fifth and sixth sub-modules are located between the second and third sub-modules, or between the first and second sub-modules, a corresponding perforated portion is provided on the back panel assembly 30 to ensure a smooth ventilation channel between the sub-modules and the computing area.

[0053] like Figure 9The diagram shows the structure of the housing 10 viewed from the second end towards the first end. It can be seen that when the fan module 20 is installed inside the housing 10, the first cutout 311 is located within the orthographic projection range of the first sub-module onto the middle back panel assembly 30, and the second cutout 3211 is located within the orthographic projection range of the second sub-module onto the middle back panel assembly 30. Preferably, portions of the two ventilation holes are located within the orthographic projection range of different fans 21 onto the middle back panel assembly 30 to ensure effective ventilation and prevent localized blockages.

[0054] The backplate assembly 30 in this embodiment includes a backplate 31 and a backplate bracket 32. Both the backplate 31 and the backplate bracket 32 ​​are upright plate-like structures, jointly mounted on the side of the fan area near the first end. The backplate 31 has an adapter 316 for electrical connection with the fan module 20 and / or computing components, thereby enabling the backplate 31 to supply power to the fan module 20 and / or components inside the chassis. Simultaneously, the adapter 316 can also be electrically connected to the power supply module 40, ensuring power supply. The backplate 31 and the backplate bracket 32 ​​can be fixed together using screws.

[0055] In this embodiment, the backplate bracket 32 ​​is connected to the housing 10, and the height of the backplate bracket 32 ​​is greater than the height of the middle backplate 31. The backplate bracket 32 ​​has a stacking part 321 and a support part 322. The stacking part 321 is stacked with the middle backplate 31, and the support part 322 is arranged with the stacking part 321 along the arrangement direction of the fan module 20. The support part 322 is located above the stacking part 321 and is offset from the middle backplate 31. That is, the orthographic projection of the middle backplate 31 on the backplate bracket 32 ​​coincides with the stacking part 321. The stacked portion 321 has a first through hole, and the middle back plate 31 has a second through hole. At least a portion of the first through hole and at least a portion of the second through hole overlap in the projection along a third direction. The overlapping portion of the projections of the first and second through holes along the third direction serves as a first hollow portion 311. In other words, the overlapping portion of the first and second through holes along the third direction serves as the first hollow portion 311, ensuring airflow through the middle back plate assembly 30 and acting on the computing component 90. The support portion 322 has a second hollow portion 3211, thereby cooperating with the second sub-module for heat dissipation. The first through hole and the second hollow portion 3211 are arranged along a second direction, specifically as follows: Figure 4 As shown, the first through hole is located below the second hollowed-out portion 3211. In this way, the first hollowed-out portion 311 and the second hollowed-out portion 3211 cooperate with their respective sub-modules for heat dissipation, work independently, avoid mutual interference of airflow, and thus achieve more precise thermal management.

[0056] In this embodiment, the backplate bracket 32 ​​is connected to the side walls of the enclosure 10 on both sides in the lateral direction. The backplate bracket 32 ​​is provided with a mounting part for connecting to the side walls of the enclosure 10. The mounting part extends towards the interior of the enclosure 10. The mounting part includes a positioning groove 323 and a mounting hole. The side wall of the enclosure 10 is provided with a positioning post 16 and a screw hole. The positioning post 16 cooperates with the positioning groove 323. The mounting hole and the screw hole can be fixed by screws, thereby realizing the connection between the backplate assembly 30 and the enclosure 10, and thus enabling the server chassis to integrate ventilation and power supply functions.

[0057] Considering that the middle back panel assembly 30 integrates power supply and ventilation functions, it does not need to completely cover the second opening of the enclosure 10, such as Figure 8 As shown, in this embodiment, at least some sub-modules are misaligned with the middle backplate assembly 30, that is, the third sub-module and the fourth sub-module are misaligned with the middle backplate assembly 30, so that the air supply of the two sub-modules at the top is not blocked by the middle backplate assembly 30, thereby ensuring a free air supply path and thus ensuring heat dissipation efficiency.

[0058] In this embodiment, the server chassis also includes a power supply module 40. The chassis 10 has five accommodating cavities distributed along its height. The four upper accommodating cavities are used to house the fan module 20, and the lowermost accommodating cavity is the power supply accommodating cavity 13. At least a portion of the power supply module 40 is located within the power supply accommodating cavity 13. The middle backplate assembly 30 is located on the side of the three lower accommodating cavities near the first end, and avoids the uppermost accommodating cavity. This modular design facilitates maintenance and disassembly, improves operational efficiency, and enhances server reliability.

[0059] The power module 40 in this embodiment includes a first power supply module 41, a second power supply module 42, and a power board 43 (PDB board). The first power supply module 41 is a 12V power supply, the second power supply module 42 is a 54V power supply, and the power board includes a 12V power distribution board and a 54V power distribution board. The 12V power supply is connected to the backplane 31 via the first connector 312, thereby supplying power to devices such as the motherboard that require 12V power, and thus powering the central processing unit (CPU), dual in-line memory modules (DIMMs), logic devices, etc. The 54V power supply is connected to the board-to-board connector on the 54V power distribution board, and is connected to the backplane 31 via the bus bar on the 54V power distribution board, supplying power to the backplane 31, thereby powering devices that require 54V voltage, such as the fan 21, the graphics processor assembly 80, and the computing assembly 90. In this way, the voltage of the power module 40 can be transmitted to the fan adapter board 50 via the second connector 313, and then transmitted to each sub-module via the fan adapter board 50 to power the fan 21. Alternatively, it can be transmitted to the 12V power distribution board and the switching board (SW board) via the signal connector in the middle backplane 31 and the corresponding board-to-board connector. The 12V power distribution board can transmit the voltage to the motherboard via the connector on the board and the cable.

[0060] The power module 40 in this embodiment supports a maximum of six 54V dual-input power supplies and two 12V standard power supplies. It supports N+1 redundancy of the power module under all configurations and supports different numbers of 54V power supplies according to different graphics processor components 80. The entire power module adopts 5+1 redundant power supply. The two 12V power supplies are directly inserted into the backplane 31 through the first connector 312.

[0061] In this embodiment, at least a portion of the adapter 316 is located within the orthographic projection range of the power configuration area onto the backplane 31. At least a portion of the adapter 316 is electrically connected to at least a portion of the power module 40. Preferably, at least a portion of the adapter 316 is plugged into at least a portion of the power module 40, thereby improving the stability of the power supply. The power module 40 supplies power to the fan module 20 and the computing unit through the backplane 31, thereby separating the power supply of the fan module 20 from that of the motherboard, so that they do not affect each other. This ensures the stability of the power supply while improving the individual maintainability of each component of the server.

[0062] Specifically, the adapter 316 in this embodiment includes a first connector 312, a second connector 313, and a third connector 314. The first connector 312 is connected to at least a portion of the power supply module 40, and preferably, the first connector 312 is plugged into at least a portion of the power supply module 40. The second connector 313 is used to supply power to the fan module 20. The first connector 312 and the second connector 313 are located on the same side of the back panel 31, and both are located on the side of the back panel 31 closer to the fan module 20, thereby facilitating the plugging of the back panel 31 and the power supply module 40, and also facilitating the electrical connection between the back panel 31 and the fan module 20 to ensure the reliability of power supply. The third connector 314 is located on the side of the back panel 31 away from the fan module 20 and is used for electrical connection with the computing components, specifically connecting to the switching board and general-purpose board inside the chassis, thereby interconnecting the graphics processor component 80 and the computing component 90, improving the integration of the server, and achieving powerful data computing performance. In this way, the server's computing components 90, graphics processor components 80, fan modules 20, and power supply modules 40 are all plugged into the backplane 31, and each node can be plugged in and out independently. This further improves the functional integration of the power supply modules 40 on the backplane 31, and allows the power supply of peripheral networks, storage, fan modules 20, etc., to be completely independent of the motherboard design. The motherboard only retains the power supply for the central processing unit, memory, and logic devices, thereby ensuring that the failure of peripheral components does not affect the normal operation of the motherboard.

[0063] like Figure 4As shown, in this embodiment, the server chassis also includes a wind deflector 70 for blocking airflow. The wind deflector 70 is located between the fan area and the power supply configuration area. The backplate bracket 32 ​​has a mounting portion 324 and a mounting protrusion 325 protruding towards the fan area on the side near the fan area. The mounting portion 324 and the mounting protrusion 325 are arranged along a first direction. The wind deflector 70 is located between the mounting portion 324 and the mounting protrusion 325, and both ends of the wind deflector 70 are connected to the mounting portion 324 and the mounting protrusion 325, respectively. The first connector 312 and the second connector 313 are arranged longitudinally, and the second connector 313 and the first cutout portion 311 are arranged transversely. The wind deflector 70 is provided between the first connector 312 and the first cutout portion 311 and / or between the first connector 312 and the second connector 313, so that the power supply housing 13 and the housing containing the fan module 20 can be isolated to avoid airflow interference, thereby ensuring the safety of the power supply module 40 and the heat dissipation efficiency of the fan module 20. Specifically, a fourth connector 315 is provided on the side of the back panel 31 near the fan module 20. This fourth connector 315 can be configured as a busbar clip for interfacing with the busbars on the 54V power distribution board. It employs a blind-mating design for ease of maintenance and to ensure a stable power supply. A fifth connector is also provided on the side of the back panel 31 near the fan module 20. This fifth connector can be configured as a signal connector for interfacing with switching boards and other components for signal transmission. The fourth connector 315 and the fifth connector can be arranged laterally. The first connector 312 and the fourth connector 315 are arranged horizontally, and the first connector 312 and the second connector 313 are arranged vertically, i.e., in the second direction. The second connector 313 and the first hollow part 311 are arranged horizontally, i.e., in the first direction, and are located above the first connector 312. The windproof part 70 can be set on the back plate bracket 32 ​​and uses windproof foam. When the back plate bracket 32 ​​and the middle back plate 31 are installed together, windproof foam is set around the first connector 312, thereby separating the power supply air duct of the power module 40 and not affecting the fan module 20, thus avoiding the problem of power backflow and reverse voltage caused by being parallel with the fan module 20.

[0064] like Figure 3As shown, in this embodiment, there are multiple third connectors 314, distributed on the upper and lower sides of the first cutout portion 311. The third connector 314 located above the first cutout portion 311 is interconnected with the graphics processor assembly 80, and the third connector 314 located below the first cutout portion 311 is interconnected with the computing component 90, thereby interconnecting the graphics processor assembly 80 and the computing component 90 together. Considering the large number and dense arrangement of the third connectors 314, the middle backplate assembly 30 also includes a reinforcing plate 33. The reinforcing plate 33 is located between the middle backplate 31 and the backplate support 32. At least a portion of the projection of the reinforcing plate 33 along a third direction coincides with the projection of the adapter portion 316 along a third direction, thereby providing support for the third connector 314 when it is plugged into components such as the switching board and the general-purpose substrate, or when it is connected to the graphics processor assembly 80 and the computing component 90, preventing the middle backplate 31 from deforming when the third connector 314 is plugged in or removed, thereby effectively enhancing the reliability of the middle backplate assembly 30. Specifically, the reinforcing plate 33 is configured as an upright plate structure and is located below the first hollow portion 311 to primarily support a row of third connectors 314 located below the first hollow portion 311. The reinforcing plate 33 and the adapter portion 316 where the third connectors 314 are located are partially overlapped, and a clearance hole is provided to allow clearance for the connectors on the side of the backplate 31 away from the fan module 20. Optionally, the reinforcing plate 33 can be integrally formed by die casting.

[0065] In this embodiment, the server chassis also includes a fan adapter plate 50 and at least one fan plate 60. The fan adapter plate 50 is electrically connected to the back panel 31 by plugging in, and the fan adapter plate 50 is electrically connected to the fan plate 60 by plugging in. The fan adapter plate 50 provides power transfer and distribution functions. In this embodiment, the fan adapter plate 50 is vertically positioned and installed on the side wall of the chassis 10, plugging in with the back panel 31. The fan plate 60 is horizontally positioned, with one end of the fan plate 60 near the side wall of the chassis plugging in with the fan adapter plate 50. The fan plate 60 is located at the bottom of the sub-module, facilitating plugging in with the fan 21. In this way, the back panel 31 can power more sub-modules with a simple structure. At the same time, the plug-in method avoids the use of cables, which helps to save space, improve space utilization, facilitate maintenance, and provides simple and convenient installation with strong signal transmission capabilities.

[0066] Preferably, the housing 10 further includes an adapter plate bracket 12 and a fan plate bracket 11. The fan adapter plate 50 is connected to the housing 10 via the adapter plate bracket 12, and the fan plate 60 is connected to the housing 10 via the fan plate bracket 11. Specifically, the fan adapter plate 50 is connected to the adapter plate bracket 12, and the adapter plate bracket 12 is connected to the housing 10. The adapter plate bracket 12 can be configured to be approximately the same size as the fan adapter plate 50, with the fan adapter plate 50 and the adapter plate bracket 12 stacked, and the adapter plate bracket 12 located between the fan adapter plate 50 and the side wall of the housing 10. Figure 2 , Figure 6 As shown, the adapter plate bracket 12 includes a body and a stop bend, forming an L-shaped structure. The adapter plate bracket 12 is provided with I-beams 121, fixing holes 122, and stop posts 123 to facilitate the assembly and positioning of the adapter plate bracket 12 and the fan adapter plate 50. The stop posts 123 are used to limit the installation position of the fan adapter plate 50, while the I-beams 121 and fixing holes 122 are used for fixing the fan adapter plate 50. In this embodiment, four stop posts 123 are provided: one at each end of the adapter plate bracket 12, one at the end of the body away from the stop bend, and another on the stop bend. Two stop posts 123 are provided between the two ends of the body. The stop posts 123 located between the two ends are positioned on the edge of the adapter plate bracket 12 away from the back plate 31, preventing connector insertion failure due to excessive installation depth when the fan adapter plate 50 is installed on the adapter plate bracket 12. The fan adapter plate 50 is provided with a gourd hole for engaging with the I-beam nail 121 and a locking member 14 for engaging with the fixing hole 122. The locking member 14 is installed on the fan adapter plate 50 and can rotate 90 degrees relative to the fan adapter plate 50. Figure 6 As shown, multiple fixing holes 122 are provided, and the fixing holes 122 are configured as convex bridge structures with rectangular cross-sections. This allows the locking member 14 to change its limiting relationship with the fixing hole 122 after rotating 90 degrees, thereby achieving rapid positioning and disassembly between the fan adapter plate 50 and the adapter plate bracket 12, improving maintenance efficiency. The number of hoist holes and the number of locking members 14 can be adjusted according to actual needs, ensuring that the orientation of each hoist hole is consistent. Preferably, at least two locking members 14 are provided to ensure the reliability of locking.

[0067] In this embodiment, the fan plate bracket 11 is configured as a horizontally placed plate structure. The fan plate bracket 11 is located below the fan plate 60 and stacked with the fan plate 60. Since the fan module 20 in this embodiment has multiple sub-modules, multiple fan plates 60 and fan plate brackets 11 are correspondingly provided, and the fan plates 60 are arranged one-to-one with the sub-modules. It should be noted that the one-to-one correspondence between the fan plates 60 and the sub-modules here means that a separate fan plate 60 is provided for each sub-module, so that each sub-module can be connected to the fan adapter plate 50 through the fan plate 60. The position of the fan plate 60 can be set on the side of the sub-module closer to the middle back panel assembly 30 to facilitate the insertion of the fan 21 into the fan area.

[0068] In this embodiment, both the fan adapter board 50 and the fan board 60 are located within the fan area. The fan adapter board 50 has a first connector 51 and multiple second connectors 52. The first connector 51 is plugged into the back panel assembly 30, and the multiple second connectors 52 are arranged along the stacking direction of the multiple sub-modules, i.e., the second direction. The number of second connectors 52 is the same as that of the fan board 60, and they are plugged into one-to-one. Both the fan adapter board 50 and the fan board 60 are connected to the housing 10. The fan board 60 has multiple third connectors 61 and fourth connectors 62. The third connectors 61 are plugged into the fan 21 of the sub-module, and the number of third connectors 61 is the same as that of the fan 21, and they are plugged into one-to-one. The fourth connectors 62 are plugged into the second connectors 52. In this way, the power supply module 40 provides stable power to the multiple sub-modules. Specifically, the first connector 51 is located on the side of the fan adapter plate 50 near the back panel 31. The first connector 51 is plugged into the second connector 313. Multiple second connectors 52 are arranged along the second direction, and each of the multiple second connectors 52 is plugged into the fourth connector 62 of a different fan board 60, thereby enabling the fan adapter plate 50 to supply power to multiple different fan boards 60. Multiple third connectors 61 of the fan board 60 are plugged into different fans 21 within the same sub-module, enabling the fan board 60 to supply power to... Multiple fans 21 within the same sub-module allow the power supply module 40 to supply power to the backplate 31 via the first connector 312, and to the fan adapter board 50 via the connection of the second connector 313 and the first connector 51. Then, power is supplied to the fan board 60 via the connection of the second connector 52 and the fourth connector 62, and finally to each fan 21 via the third connector 61. This enables the power supply module 40 to supply power to multiple sub-modules simultaneously, and each sub-module can be controlled independently, thereby achieving precise control of heat dissipation.

[0069] When assembling the fan adapter plate 50 and the adapter plate bracket 12, the fan adapter plate 50 is first placed vertically downward along the side wall of the housing 10 under the positioning action of the H-shaped pins 121 on the adapter plate bracket 12 and the gourd holes of the fan adapter plate 50. Under the limitation of the stop post 123, the bottom of the fan adapter plate 50 moves towards the stop bend. The stop bend is provided with a stop bend 124 extending towards the body. When the fan adapter plate 50 moves into the stop bend 124, the locking piece 14 rotates 90 degrees to fix the fan adapter plate 50 to the adapter plate bracket 12. Then, the fan plate 60 is pushed laterally towards the side of the adapter plate. The second connector 313 and the first plug 51 are fully inserted. Locking the locking piece 14 on the fan plate 60 can fix the fan plate 60 and the fan adapter plate 50. Repeat the action to install multiple fan plates 60. The plug-in setup of the fan board 60 and the fan adapter board 50 adopts a cable-free design, which helps to save space, improve space utilization, facilitate maintenance, and is simple and convenient to install, while also having strong signal transmission capabilities.

[0070] In this embodiment, flange structures 17 can be provided on both sides of the bottom of the enclosure 10, that is, on the opposite sides of the power supply cavity 13. The flange structures 17 are upright and perpendicular to the middle back plate 31. When the middle back plate assembly 30 is installed on the enclosure 10, it moves towards the fan area along the direction of the flange structure 17. After the second connector 313 is fully inserted into the first connector 51 on the fan adapter plate 50, the middle back plate 31 is fixed to the enclosure 10. Finally, the mounting holes on the mounting parts on both sides of the back plate bracket 32 ​​and the screw holes on the side wall of the enclosure 10 are locked for fixation.

[0071] This embodiment also provides a server, including components and the aforementioned server chassis. The components include I / O components and / or computing components. The I / O components are located in the I / O component area, and the computing components are located in the computing area. The backplane assembly 30 is electrically connected to at least a portion of the components and supplies power to the components, thereby ensuring stable power supply and enabling fine-grained heat dissipation control, which helps to reduce costs and improve reliability and maintainability.

[0072] like Figure 2As shown, the enclosure 10 in this embodiment is also provided with handles 15 on two opposite side walls. The handles 15 are rectangular holes for easy gripping. When installing the server enclosure onto the chassis, hold the handles 15 and insert the enclosure 10 into the chassis from the rear, so that the multiple I-bolts 121 at the bottom of the enclosure 10 are engaged in the grooves of the chassis, and the screws on the side walls and top of the enclosure 10 are locked in place. The operation is convenient and the structure is simple. The sub-modules are sequentially assembled into the housing 10 and plugged into the third connector 61 of the fan plate 60. In this embodiment, the fan module 20 is provided with four sets of sub-modules, each set with five fan 21 positions, and a maximum of twenty fans 21 can be set. The sub-modules are evenly distributed at the rear of the chassis to meet the hot-swappable maintenance requirements. The graphics processor component 80 located on the upper layer of the chassis is assisted in heat dissipation by the three sets of sub-modules above, and the computing component 90 located on the lower layer is assisted in heat dissipation by the first sub-module. The upper and lower sub-modules are separated and independently cooled, which facilitates fine-grained heat dissipation control according to the position of the graphics processor component 80.

[0073] The server chassis provided in this application has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A server chassis, characterized by, include: The first and second ends are set relative to each other; A fan area is configured to accommodate a fan module (20), the fan area being located at the second end; An I / O component area and a computing area are located at the first end and are stacked together; the I / O component area is configured to accommodate I / O components; the computing area is configured to accommodate computing components. A back panel assembly (30) is located between the first end and the second end. The back panel assembly (30) has a cutout portion (34) located within the orthographic projection range of the fan area on the back panel assembly (30). The power configuration area is configured to supply power to the fan area, the I / O component area, and the computing area.

2. The server chassis of claim 1, wherein, The server chassis also includes a fan module (20) located within the fan area. At least a portion of the power configuration area is stacked with the fan area. The fan module (20) includes at least one sub-module. The cutout portion (34) is located within the orthographic projection range of at least one of the sub-modules on the backplane assembly (30).

3. The server chassis of claim 2, wherein, The server chassis has a first sidewall and a second sidewall disposed opposite to each other, the middle backplate assembly (30) extends from the second sidewall to the first sidewall, and there is a gap between the middle backplate assembly (30) and the first sidewall.

4. The server chassis of claim 3, wherein, The number of the at least one sub-module is multiple, and the projection of the sub-module near the first sidewall in the fan module (20) on the plane where the middle backplate assembly (30) is located is outside the range of the middle backplate assembly (30). The multiple sub-modules are stacked sequentially in a direction away from the power configuration area.

5. The server chassis according to claim 2, characterized in that, The at least one sub-module includes a first sub-module located on the side of the fan module (20) near the power configuration area, and the cutout (34) includes a first cutout (311) located within the orthographic projection range of the first sub-module on the middle back panel assembly (30).

6. The server chassis according to claim 5, characterized in that, The at least one sub-module further includes a second sub-module. The first sub-module and the second sub-module are stacked. The second sub-module is located on the side of the first sub-module away from the power configuration area. The direction from the first sub-module to the second sub-module is the second direction. The cutout portion (34) further includes a second cutout portion (3211). The first cutout portion (311) and the second cutout portion (3211) are arranged along the second direction.

7. The server chassis according to claim 6, characterized in that, The second cutout portion (3211) is located within the orthographic projection range of the second sub-module onto the middle back panel assembly (30).

8. The server chassis according to claim 6, characterized in that, The at least one sub-module further includes a third sub-module located on the side of the second sub-module away from the first sub-module, the direction in which the second end extends toward the first end is a third direction, and at least a portion of the projection of the third sub-module along the third direction onto the plane where the middle back panel assembly (30) is located is within the range of the middle back panel assembly (30).

9. The server chassis according to claim 6, characterized in that, The server chassis also includes a housing (10), the fan area is located within the housing (10), and the back panel assembly (30) includes: The back plate (31) has a transition portion (316) for electrical connection mating. A backplate bracket (32) is connected to the housing (10). The backplate bracket (32) has a stacking part (321) and a support part (322). The stacking part (321) is stacked with the middle backplate (31). The orthographic projection of the middle backplate (31) on the backplate bracket (32) coincides with the stacking part (321). The stacking part (321) has a first through hole. The middle backplate (31) has a second through hole. The direction in which the second end extends toward the first end is a third direction. At least a portion of the first through hole and at least a portion of the second through hole coincide along the projection of the third direction. The overlapping portion of the projection of the first through hole and the second through hole along the third direction serves as the first hollow part (311). The support part (322) has a second hollow part (3211). The first through hole and the second hollow part (3211) are arranged along the second direction.

10. The server chassis according to claim 9, characterized in that, The adapter (316) includes a second connector (313) and a third connector (314). The second connector (313) is used for electrical connection with the fan module (20), and the third connector (314) is used for electrical connection with the computing unit. The second connector (313) is located on the side of the middle backplate (31) close to the fan module (20), and the third connector (314) is located on the side of the middle backplate (31) away from the fan module (20).

11. The server chassis according to claim 10, characterized in that, The server chassis also includes a power supply module (40) located within the power configuration area. The adapter (316) also includes a first connector (312) for electrically connecting to at least a portion of the power supply module (40). The first connector (312) is located within the orthographic projection area of ​​the power configuration area onto the back panel (31). The power supply module (40) supplies power to the fan module (20) and the computing area through the back panel (31).

12. The server chassis according to claim 11, characterized in that, There are multiple third connectors (314), and the middle backplate assembly (30) also includes a reinforcing plate (33), which is located between the middle backplate (31) and the backplate support (32). At least a portion of the reinforcing plate (33) is projected along the third direction and coincides with the projection of the adapter (316) along the third direction. The reinforcing plate (33) is able to support the third connector (314) when it is plugged in.

13. The server chassis according to claim 11, characterized in that, The back panel assembly (30) further includes a wind deflector (70) for blocking wind, the wind deflector (70) being located between the fan area and the power configuration area, the back panel bracket (32) having a mounting portion (324) and a mounting protrusion (325) protruding toward the fan area on the side near the fan area, the wind deflector (70) being located between the mounting portion and the mounting protrusion, and the two ends of the wind deflector (70) being connected to the mounting portion (324) and the mounting protrusion (325) respectively.

14. The server chassis according to claim 1, characterized in that, The server chassis also includes a fan module (20) located within the fan area. The fan module (20) includes multiple sub-modules, each sub-module including multiple fans (21). The multiple fans (21) are arranged along a first direction. At least a portion of the power configuration area is stacked with the fan area. The multiple sub-modules are stacked sequentially along a direction away from the power configuration area. The first direction and the stacking direction of the multiple sub-modules are set at an angle.

15. The server chassis according to claim 14, characterized in that, The server chassis also includes a fan adapter board (50), which is located in the fan area. The fan adapter board (50) has a first connector (51) and a plurality of second connectors (52). The first connector (51) is plugged into the backplane assembly (30), and the plurality of second connectors (52) are arranged along the stacking direction of the plurality of sub-modules. At least one fan plate (60) is located within the fan area, and the number of second connectors (52) is the same as that of the fan plates (60) and they are connected in a one-to-one correspondence.

16. The server chassis according to claim 15, characterized in that, The fan plate (60) has a plurality of third connectors (61), which are connected to the fan (21) of the sub-module. The number of third connectors (61) and the number of fans (21) are the same and they are connected in a one-to-one correspondence.

17. A server, characterized in that, include: Server chassis according to any one of claims 1 to 16; The components include I / O components and / or the computing unit, the I / O components being located within the I / O component area, the computing unit being located within the computing area, and the middle backplane assembly (30) being electrically connected to at least a portion of the components.

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