A memory heat dissipation monitoring and detection tool
By using a modular memory heat dissipation monitoring tool, which combines a cooling fan, fins, and a temperature sensor, efficient heat dissipation and accurate temperature monitoring of the memory are achieved. This solves the problems of inaccurate heat dissipation and monitoring delay in existing technologies, improves system stability, and reduces maintenance costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- GOLDEN EMPIRE INT (SHEN ZHEN) CO LTD
- Filing Date
- 2025-06-23
- Publication Date
- 2026-07-03
AI Technical Summary
Existing memory thermal monitoring tools cannot achieve integrated operation of efficient heat dissipation and accurate monitoring. They lack real-time temperature monitoring and dynamic adjustment, resulting in severe overheating under high memory load. Low sensor accuracy leads to temperature data delays, which cannot trigger a timely thermal response and increase maintenance costs.
It adopts a modular structure consisting of a cooling fan, heat dissipation fins, nano-oleophobic coating, temperature sensor and transmission system to achieve dynamic scanning and real-time temperature monitoring. Combined with a wireless transmission module and intelligent adjustment of fan speed, it forms an integrated operation of efficient heat dissipation and precise monitoring.
It achieves efficient heat dissipation and precise temperature monitoring of memory, reduces dust accumulation, prevents loosening and displacement, reduces energy consumption, improves system stability, and reduces maintenance costs.
Smart Images

Figure CN224457374U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of memory heat dissipation monitoring technology, and in particular to a memory heat dissipation monitoring and detection tool. Background Technology
[0002] As electronic devices improve performance, memory power consumption increases, and heat generation becomes more prominent. Excessive temperature can lead to decreased memory stability, shortened lifespan, or even system crashes. Existing cooling solutions mostly rely on passive cooling or fixed-speed fans, lacking real-time temperature monitoring and dynamic adjustment mechanisms, and cannot accurately match the actual heat generation status of the memory.
[0003] However, in actual use, the following shortcomings still exist, such as: existing memory heat dissipation monitoring and detection tools cannot achieve integrated operation of efficient heat dissipation and accurate monitoring. Memory heats up severely under high load, and the lack of accurate monitoring and active heat dissipation control may lead to frequency reduction or performance limitation. Low-precision sensors or low sampling rates cause temperature data delays, which cannot trigger heat dissipation response in time. The lack of visual monitoring makes it difficult for users to locate the root cause of the problem and they need to rely on guesswork to adjust the heat dissipation solution. Long-term high-temperature operation accelerates the aging of capacitors, PCB boards and memory chips, increasing repair or replacement costs.
[0004] Therefore, this utility model proposes a memory heat dissipation monitoring and detection tool to solve the above problems. Utility Model Content
[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a memory heat dissipation monitoring and detection tool.
[0006] To achieve the above objectives, this utility model adopts the following technical solution: a memory heat dissipation monitoring and detection tool, including a housing, and further comprising:
[0007] A heat dissipation assembly, comprising a heat dissipation fan mounted on one side of the bottom of the housing, heat dissipation fins provided on the housing, and a nano-oleophobic coating provided on the heat dissipation fins;
[0008] A heat dissipation monitoring component includes a first support block connected to one side of a housing, a guide rail connected to the first support block, a first drive wheel on the housing, a belt on the first drive wheel, a second drive wheel on the belt, a mounting base on the top of the housing, a roller rotatably connected to the mounting base, the roller being disposed within the guide rail, a connecting block connected to the side of the mounting base away from the roller, the connecting block being connected to the belt, and a temperature sensor mounted on the bottom of the mounting base.
[0009] Furthermore, a dust cover is provided on the housing, and air outlets are provided on both the housing and the dust cover.
[0010] The beneficial effects of adopting the above-mentioned further solution are: the dust cover installed on the housing can effectively block dust from entering the tool and prevent dust accumulation from affecting the performance of the heat dissipation components. When the cooling fan is running, hot air will be discharged through the air outlet on the housing and the dust cover, forming an air circulation channel to ensure that the heat dissipation process is carried out efficiently.
[0011] Furthermore, a fixing plate is connected to both the housing and the cooling fan on the side near the bottom.
[0012] The beneficial effects of adopting the above-mentioned further solution are: the fixing plate is connected to the bottom of the housing and the cooling fan respectively, and the tool can be firmly installed at the memory installation position by bolts, preventing the tool from shifting during use.
[0013] Furthermore, the fixing plate is threaded with bolts.
[0014] The advantages of adopting the above-mentioned further solutions are: the modular structure is easy to maintain and upgrade, while enhancing the overall structural strength and preventing loosening or displacement due to long-term operation.
[0015] Furthermore, a second support block is connected to the side of the housing away from the first support block, and the first transmission wheel is rotatably connected to the second support block.
[0016] The beneficial effect of adopting the above-mentioned further solution is that the second support block is fixed on the shell, providing rotational support for the first transmission wheel, and the first transmission wheel can rotate flexibly on the second support block.
[0017] Furthermore, a drive motor is installed on the side of the housing near the first drive wheel, and the first drive wheel is connected to the output end of the drive motor.
[0018] The beneficial effect of adopting the above-mentioned further solution is that the drive motor is mounted on the housing, and its output end is connected to the first drive wheel. When the drive motor starts, it will drive the first drive wheel to rotate, providing power for the operation of the entire heat dissipation monitoring component.
[0019] Compared with the prior art, the advantages and positive effects of this utility model are as follows:
[0020] In this invention, when the memory generates heat during operation, the bottom cooling fan starts, accelerating airflow and directing the heat to the heat dissipation fins. The nano-oleophobic coating on the heat dissipation fins reduces dust accumulation and ensures long-term heat dissipation efficiency. Simultaneously, the heat dissipation monitoring component starts working, with the drive motor driving the first drive wheel to rotate, which in turn drives the second drive wheel to rotate synchronously via a belt. Since the roller on one side of the mounting base is embedded in the guide rail and the connecting block is fixed to the belt, the movement of the belt will cause the mounting base to reciprocate linearly along the guide rail. At this time, the temperature sensor installed at the bottom of the mounting base will dynamically scan the surface of the memory and collect temperature data at different locations in real time, thereby achieving integrated operation of efficient heat dissipation and precise monitoring. Attached Figure Description
[0021] Figure 1 This is a schematic diagram of the structure of a memory heat dissipation monitoring and detection tool according to the present invention;
[0022] Figure 2 This is a structural breakdown diagram of a memory heat dissipation monitoring and detection tool according to the present invention;
[0023] Figure 3 This is a schematic diagram of the heat dissipation component structure of a memory heat dissipation monitoring and detection tool according to the present invention;
[0024] Figure 4 This is a schematic diagram of the heat dissipation monitoring component structure of a memory heat dissipation monitoring and detection tool according to the present invention;
[0025] Figure 5 This is a structural breakdown diagram of the heat dissipation monitoring component of a memory heat dissipation monitoring and detection tool according to this utility model.
[0026] Figure label:
[0027] 1. Shell;
[0028] 2. Heat dissipation components; 21. Cooling fan; 22. Heat dissipation fins; 23. Air outlet; 24. Nano oleophobic coating; 25. Dust cover; 26. Mounting plate; 27. Bolts;
[0029] 3. Heat dissipation monitoring component; 31. First support block; 32. Guide rail; 33. Second support block; 34. Drive motor; 35. First drive wheel; 36. Belt; 37. Second drive wheel; 38. Mounting base; 39. Roller; 310. Connecting block; 311. Temperature sensor. Detailed Implementation
[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0031] like Figures 1-5 As shown, this embodiment provides a technical solution: a memory heat dissipation monitoring and detection tool, including a housing 1, and further including:
[0032] Heat dissipation component 2 includes a heat dissipation fan 21 installed on one side of the bottom of housing 1, heat dissipation fins 22 are provided on housing 1, and a nano oleophobic coating 24 is provided on heat dissipation fins 22.
[0033] The heat dissipation monitoring component 3 includes a first support block 31 connected to one side of the housing 1, a guide rail 32 connected to the first support block 31, a first transmission wheel 35 disposed on the housing 1, a belt 36 disposed on the first transmission wheel 35, a second transmission wheel 37 disposed on the belt 36, a mounting base 38 disposed on the top of the housing 1, a roller 39 rotatably connected to the mounting base 38, the roller 39 being disposed within the guide rail 32, a connecting block 310 connected to the side of the mounting base 38 away from the roller 39, the connecting block 310 being connected to the belt 36, and a temperature sensor 311 mounted on the bottom of the mounting base 38. When the memory generates heat during operation, the bottom cooling fan 21 is activated to accelerate airflow and direct the heat to the heat dissipation fins 22. The oleophobic coating 24 reduces dust accumulation and ensures long-term heat dissipation efficiency. At the same time, the heat dissipation monitoring component 3 starts to work. The drive motor 34 drives the first drive wheel 35 to rotate, which drives the second drive wheel 37 to rotate synchronously through the belt 36. Since the roller 39 on one side of the mounting base 38 is embedded in the guide rail 32 and the connecting block 310 is fixed on the belt 36, the movement of the belt 36 will drive the mounting base 38 to make linear reciprocating motion along the guide rail 32. At this time, the temperature sensor 311 installed at the bottom of the mounting base 38 will dynamically scan the surface of the memory and collect temperature data at different locations in real time. The data is fed back to the terminal through the wireless transmission module and used to intelligently adjust the speed of the cooling fan 21, thereby realizing the integrated operation of efficient heat dissipation and precise monitoring.
[0034] The above solutions still have the problem of not being able to create an airflow channel to ensure efficient heat dissipation when memory cooling is required. Figures 1-4As shown: A dust cover 25 is provided on the housing 1. Both the housing 1 and the dust cover 25 have air outlets 23. The dust cover 25 is installed on the housing 1 and can effectively block dust from entering the tool and prevent dust accumulation from affecting the performance of the heat dissipation component 2. When the heat dissipation fan 21 is running, hot air will be discharged through the air outlets 23 on the housing 1 and the dust cover 25, forming an air circulation channel to ensure efficient heat dissipation. The housing 1 and the heat dissipation fan 21 are connected to a fixing plate 26 on the side near the bottom. The fixing plate 26 is connected to the bottom of the housing 1 and the heat dissipation fan 21 respectively, and the tool can be firmly installed in the memory installation position by bolts 27 to prevent the tool from shifting during use. The fixing plate 26 is threaded with bolts 27. This modular structure facilitates maintenance and upgrades, while enhancing the strength of the overall structure and preventing loosening or displacement due to long-term operation.
[0035] like Figure 2 as well as Figure 4 As shown, a second support block 33 is connected to the side of the housing 1 away from the first support block 31. The first transmission wheel 35 is rotatably connected to the second support block 33. The second support block 33 is fixed to the housing 1 and provides rotational support for the first transmission wheel 35. The first transmission wheel 35 can rotate flexibly on the second support block 33. A transmission motor 34 is installed on the side of the housing 1 near the first transmission wheel 35. The first transmission wheel 35 is connected to the output end of the transmission motor 34. The transmission motor 34 is installed on the housing 1, and its output end is connected to the first transmission wheel 35. When the transmission motor 34 starts, it will drive the first transmission wheel 35 to rotate, providing power for the operation of the entire heat dissipation monitoring component 3.
[0036] Working principle:
[0037] like Figures 1-5As shown, when the memory generates heat during operation, the heat dissipation component 2 first activates the bottom cooling fan 21 to accelerate airflow and direct the heat generated by the memory to the heat dissipation fins 22. The heat dissipation fins 22 greatly increase the heat dissipation area and improve heat exchange efficiency. The nano-oleophobic coating 24 on the surface of the heat dissipation fins 22 effectively reduces dust accumulation, preventing a decrease in heat dissipation performance due to dust accumulation and ensuring long-term stable heat dissipation efficiency. At the same time, the air outlets 23 on the housing 1 and the dust cover 25 form an airflow channel, through which hot air is discharged, enhancing the heat dissipation effect. The dust cover 25 prevents dust from entering the tool's interior, protecting the performance of the heat dissipation component 2. During the heat dissipation process, the heat dissipation monitoring component 3 is activated simultaneously. The drive motor 34 drives the first drive wheel 35 to rotate, which in turn drives the second drive wheel 37 to rotate synchronously via the belt 36. Since the roller 39 on one side of the mounting base 38 is embedded in the guide rail 32, The connecting block 310 is fixed on the belt 36. The movement of the belt 36 drives the mounting base 38 to move linearly back and forth along the guide rail 32. At this time, the temperature sensor 311 installed at the bottom of the mounting base 38 dynamically scans the surface of the memory and collects temperature data at different locations in real time. On the one hand, the temperature data is fed back to the terminal through the wireless transmission module, allowing the user to remotely monitor the memory temperature status in real time. On the other hand, the speed of the cooling fan 21 is intelligently adjusted according to the collected temperature data. When the temperature is high, the speed of the cooling fan 21 is increased to enhance the heat dissipation capacity. When the temperature drops, the speed is appropriately reduced to save energy. This ensures the heat dissipation effect while reducing energy consumption. The fixing plate 26 and bolts 27 ensure that the tool can be firmly installed at the memory mounting location to prevent displacement. At the same time, it facilitates the maintenance and upgrading of the tool, enhances the overall structural strength, and prevents loosening or displacement caused by long-term operation.
[0038] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.
Claims
1. A memory heat dissipation monitoring and detecting tool comprising a housing (1), characterized in that, Also includes: Heat dissipation assembly (2), the heat dissipation assembly (2) includes a heat dissipation fan (21) installed on one side of the bottom of the housing (1), heat dissipation fins (22) are provided on the housing (1), and a nano oleophobic coating (24) is provided on the heat dissipation fins (22); A heat dissipation monitoring component (3) includes a first support block (31) connected to one side of the housing (1), a guide rail (32) connected to the first support block (31), a first transmission wheel (35) provided on the housing (1), a belt (36) provided on the first transmission wheel (35), a second transmission wheel (37) provided on the belt (36), a mounting base (38) provided on the top of the housing (1), a roller (39) rotatably connected to the mounting base (38), the roller (39) being disposed in the guide rail (32), a connecting block (310) connected to the side of the mounting base (38) away from the roller (39), the connecting block (310) being connected to the belt (36), and a temperature sensor (311) installed at the bottom of the mounting base (38).
2. The memory heat dissipation monitoring and detecting tool of claim 1, wherein: The housing (1) is provided with a dust cover (25), and both the housing (1) and the dust cover (25) are provided with air outlets (23).
3. The memory heat dissipation monitoring and detecting tool of claim 1, wherein: The housing (1) and the cooling fan (21) are both connected to a fixing plate (26) on the side near the bottom.
4. The memory heat dissipation monitoring and detecting tool of claim 3, wherein: Bolts (27) are threaded onto the fixing plate (26).
5. The memory heat dissipation monitoring and detecting tool of claim 1, wherein: A second support block (33) is connected to the side of the housing (1) away from the first support block (31), and the first transmission wheel (35) is rotatably connected to the second support block (33).
6. The memory heat dissipation monitoring and detecting tool of claim 1, wherein: A drive motor (34) is installed on the side of the housing (1) near the first drive wheel (35), and the first drive wheel (35) is connected to the output end of the drive motor (34).