Antistatic UHF ceramic tag antenna based on Koch star ring short-circuit structure
By introducing a Koch star ring short-circuit structure into the UHF ceramic tag antenna, the problems of chip damage and performance degradation in electrostatic sensitive environments are solved, achieving efficient electrostatic discharge and electromagnetic signal transmission, thus expanding the application range of the tag.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHEJIANG JOHAR TECH CO LTD
- Filing Date
- 2025-07-10
- Publication Date
- 2026-07-03
AI Technical Summary
Existing UHF ceramic tag antennas are susceptible to electrostatic discharge in electrostatic sensitive environments, which can lead to chip damage or performance degradation. Existing anti-static designs can affect the antenna's electromagnetic performance or reduce energy transmission efficiency.
A Koch star ring short-circuit structure that penetrates the substrate is set between the radiating metal layer and the grounding metal layer of the ceramic substrate to form a low-impedance discharge path. The anti-static connection point is connected through the Koch star ring short-circuit structure to form an electrical short-circuit structure, thereby improving the anti-static capability.
The electrostatic withstand voltage has been increased to 8kV, protecting the chip from electrostatic damage, maintaining the electromagnetic signal transmission efficiency of the antenna, and expanding the application range of the tag in electrostatic sensitive environments.
Smart Images

Figure CN224458576U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic tag technology, specifically to an antistatic UHF ceramic tag antenna based on a Koch star ring short-circuit structure. Background Technology
[0002] In the field of IoT identification and sensing, UHF ceramic tag antennas are widely used in logistics management, industrial monitoring, and other scenarios due to their advantages such as small size, high stability, and suitability for complex environments. However, in electrostatic-sensitive environments, tag antennas are susceptible to electrostatic discharge, which can lead to chip damage or performance degradation. Therefore, anti-static design has become a key technical challenge.
[0003] Existing anti-static solutions for UHF ceramic tag antennas have significant drawbacks: some ceramic tags use surface coatings to achieve protection, but the coating thickness directly affects the antenna's electromagnetic performance. When the coating thickness exceeds 20μm, it significantly alters the antenna's equivalent dielectric constant and impedance matching characteristics, causing the antenna's resonant frequency to shift by more than 5%, severely impacting the tag's read / write stability and even leading to communication failure. Another technology achieves ESD protection by adding a protection diode to the tag circuit, utilizing the diode's reverse breakdown characteristic to discharge electrostatic charge. However, the diode itself introduces parasitic capacitance, disrupting the impedance matching between the antenna and the chip, resulting in decreased energy transmission efficiency. In practical applications, this reduces the reading distance by more than 30%, significantly limiting the tag's effective operating range. Utility Model Content
[0004] To address the shortcomings of existing technologies, this invention provides an antistatic UHF ceramic tag antenna based on a Koch star ring short-circuit structure.
[0005] This utility model discloses an antistatic UHF ceramic tag antenna based on a Koch star ring short-circuit structure, including a ceramic substrate, a radiating metal layer disposed on the upper surface of the ceramic substrate, and a grounding metal layer disposed on the lower surface of the ceramic substrate;
[0006] At least one antistatic connection point is provided on the radiating metal layer, and each antistatic connection point is provided with a Koch star ring short-circuit structure that penetrates the ceramic substrate. The Koch star ring short-circuit structure connects the radiating metal layer and the ground metal layer to form an electrical short-circuit structure.
[0007] As a further improvement of this utility model, a feeding point is provided on the radiating metal layer;
[0008] All the aforementioned antistatic connection points are distributed within an annular region with a radius of 0.2λ to 0.3λ centered on the feed point, where λ is the antenna operating wavelength.
[0009] As a further improvement of this utility model, the number of antistatic connection points is 1-4; when the number of antistatic connection points is not 1, all the antistatic connection points are distributed at equal angles along the circumference centered on the feed point; the central angle formed by connecting two adjacent antistatic connection points to the feed point is 45°≤θ≤180°.
[0010] As a further improvement of this utility model, the Koch star ring short-circuit structure is a metallized via penetrating the ceramic substrate, and the cross-section of the metallized via is a fractal structure formed by iterative Koch curves from a regular hexagon.
[0011] As a further improvement of this invention, the Koch curve of the fractal structure is iterated at least once.
[0012] As a further improvement of this utility model, in the fractal structure, the height of the groove is 0.25-0.35 times the length of the base side.
[0013] As a further improvement of this utility model, the Koch star ring short-circuit structure is filled with conductive epoxy resin or a metal probe.
[0014] As a further improvement of this utility model, a chip is disposed on one side of the ceramic substrate, and the chip is electrically connected to the radiating metal layer through a feed point.
[0015] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0016] This invention significantly improves the electrostatic discharge (ESD) immunity of UHF ceramic tag antennas by incorporating a Koch star ring short-circuit structure that penetrates the substrate between the radiating metal layer and the grounding metal layer. During an ESD pulse, this structure forms a low-impedance discharge path, allowing most of the ESD current to flow from the radiating metal layer to the grounding layer, preventing damage to the chip. The ESD withstand voltage is increased from 4kV to 8kV (compliant with IEC 61000-4-2 standard), solving the problem of chip damage or performance degradation under ESD-sensitive environments.
[0017] This invention optimizes overall efficiency while balancing antistatic performance with tag miniaturization requirements. The fractal characteristics of the Koch Star Ring increase the surface area of the short-circuit structure, improving electrostatic discharge efficiency. Its compact structure eliminates the need for additional tag size increases, expanding its application range in logistics management, industrial monitoring, and other scenarios.
[0018] The short-circuit structure of the KOH star ring in this utility model adopts an inward fractal design, which has little impact on the effective radiation area of the radiating metal layer, and exhibits high impedance characteristics during normal operation, without interfering with the transmission of electromagnetic signals. Attached Figure Description
[0019] Figure 1 This is a structural axis view of an antistatic UHF ceramic tag antenna based on a Koch star ring short-circuit structure, as disclosed in one embodiment of the present invention.
[0020] Figure 2 This is a top view of the antistatic UHF ceramic tag antenna based on a Koch star ring short-circuit structure disclosed in one embodiment of the present invention;
[0021] Figure 3 This is a top view of the antistatic UHF ceramic tag antenna based on a Koch star ring short-circuit structure disclosed in one embodiment of the present invention;
[0022] Figure 4 This is a schematic diagram of the Koch star ring iterative deformation of an antistatic UHF ceramic tag antenna based on a Koch star ring short-circuit structure, as disclosed in one embodiment of this utility model.
[0023] In the picture:
[0024] 1. Ceramic substrate; 2. Radiation metal layer; 3. Grounding metal layer; 4. Koch star ring short-circuit structure; 5. Chip. Detailed Implementation
[0025] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0026] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0027] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0028] The present invention will now be described in further detail with reference to the accompanying drawings:
[0029] like Figure 1-3 As shown, an antistatic UHF ceramic tag antenna based on a Koch star ring short-circuit structure provided by this utility model includes a ceramic substrate 1. A radiating metal layer 2 is disposed on the upper surface of the ceramic substrate 1, and a grounding metal layer 3 is disposed on the lower surface of the ceramic substrate 1. At least one antistatic connection point is disposed on the radiating metal layer, and a Koch star ring short-circuit structure 4 penetrating the ceramic substrate 1 is disposed at each antistatic connection point. The Koch star ring short-circuit structure 4 connects the radiating metal layer 2 and the grounding metal layer 3 to form an electrical short-circuit structure.
[0030] Specifically:
[0031] like Figure 1-3 As shown, in this utility model, preferably, a feed point is provided on the radiating metal layer 2; all antistatic connection points are distributed in an annular region with a radius of 0.2λ to 0.3λ centered on the feed point, where λ is the antenna operating wavelength.
[0032] In this utility model, preferably, the number of antistatic connection points is 1-4; when the number of antistatic connection points is not 1, all the antistatic connection points are distributed at equal angles along the circumference centered on the feed point; the central angle formed by the connection of two adjacent antistatic connection points and the feed point is 45°≤θ≤180°.
[0033] All antistatic connection points are distributed at equal angles along the circumference centered on the power supply point; the included angle between two adjacent antistatic connection points is 45°≤θ≤180°.
[0034] like Figure 1 , Figure 4As shown, in the above embodiment, preferably, the Koch star-ring short-circuit structure 4 is a metallized via penetrating the ceramic substrate 1, and the cross-section of the metallized via is a fractal structure formed by iterative Koch curves of a regular hexagon. The Koch curve of the fractal structure is iterated at least once. In the fractal structure, the height of the groove is 0.25-0.35 times the length of its base side. In this embodiment, the fractal structure is based on the deformation of a regular hexagon through a Koch curve to form multiple star-shaped grooves, and the height of the groove is 0.25-0.35 times the length of its base side. In this utility model, the Koch star-ring short-circuit structure 4 is a fractal structure formed by three iterations of the Koch curve of a regular hexagon.
[0035] In this invention, preferably, the Koch star ring short-circuit structure 4 is filled with conductive epoxy resin or a metal probe.
[0036] In this invention, preferably, a chip 5 is disposed on one side of the ceramic substrate 1, and the chip 5 is electrically connected to the radiating metal layer 2 through a feed point. Example 1
[0037] Example 1 discloses a single Koch star ring short-circuit structure, which specifically includes a ceramic substrate 1 with dimensions of 30×30×5mm and a relative permittivity εr of 40; the designed operating frequency is 915 MHz (corresponding to an operating wavelength λ=70 mm).
[0038] In Example 1, there is one anti-static connection point, which is located 16.5 mm (approximately 0.23λ) from the center of the feed point. The equivalent diameter of the Koch star ring short-circuit structure 4 is 3 mm.
[0039] Test Results: Electrostatic discharge (ESD) tests were performed on the antenna of this embodiment, and the results are as follows: Anti-static performance: The ESD withstand voltage reached 8.5 kV (compliant with IEC61000-4-2 standard), verifying the low impedance discharge effect of the Koch star-ring short-circuit structure 4 under electrostatic pulses, effectively protecting the chip from electrostatic damage; Radio frequency performance: The read sensitivity was −19dBm, indicating that the antenna has good radiation efficiency in the operating frequency band, and the Koch star-ring short-circuit structure 4 did not significantly affect the antenna's energy transmission and signal reception. Example 2
[0040] Example 2 discloses a dual Koch star-ring short-circuit structure. The structure and operating frequency of the ceramic substrate 1 in this example are the same as in Example 1. The dual Koch star-ring short-circuit structures are symmetrically arranged on both sides of the feed point with a spacing of 16 mm, utilizing symmetrical distribution to enhance the uniformity of electrostatic discharge. The equivalent diameters of the two Koch star-ring short-circuit structures 4 are 0.28 mm and 0.32 mm, respectively, introducing a phase difference through subtle dimensional variations. The designed introduced phase difference Δφ = 180° ± 10° compensates for radiation field distortion using the phase cancellation principle, balancing antistatic and radiation performance. This example achieves electrostatic discharge and radiation field compensation through a "dual-structure + phase cancellation" design.
[0041] In another embodiment of this utility model, the cross-section of the short-circuit structure may also include a circle, a square, or other shapes that can achieve the same effect.
[0042] Advantages of this utility model:
[0043] This invention significantly improves the electrostatic discharge (ESD) immunity of UHF ceramic tag antennas by incorporating a Koch star ring short-circuit structure 4 that penetrates the substrate between the radiating metal layer 2 and the grounding metal layer 3 of the ceramic substrate 1. During an ESD pulse, this structure forms a low-impedance discharge path, allowing most of the ESD current to flow from the radiating metal layer 2 to the grounding layer, thus preventing damage to the chip. The ESD withstand voltage is increased from 4kV to 8kV (compliant with IEC61000-4-2 standard), solving the problem of chip damage or performance degradation under ESD-sensitive environments.
[0044] This invention optimizes overall efficiency while balancing antistatic performance with tag miniaturization requirements. The fractal characteristics of the Koch Star Ring increase the surface area of the short-circuit structure, improving electrostatic discharge efficiency. Its compact structure eliminates the need for additional tag size increases, expanding its application range in logistics management, industrial monitoring, and other scenarios.
[0045] The KOH star ring short-circuit structure 4 of this utility model adopts an inward fractal design, which has little impact on the effective radiation area of the radiating metal layer 2, and exhibits high impedance characteristics during normal operation, without interfering with electromagnetic signal transmission.
[0046] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. An antistatic UHF ceramic tag antenna based on a short-circuited structure of a Koch star, characterized by, The ceramic substrate (1) includes a radiating metal layer (2) disposed on the upper surface of the ceramic substrate (1) and a grounding metal layer (3) disposed on the lower surface of the ceramic substrate (1). At least one antistatic connection point is provided on the radiating metal layer (2), and a Koch star ring short-circuit structure (4) penetrating the ceramic substrate (1) is provided at each antistatic connection point. The Koch star ring short-circuit structure (4) connects the radiating metal layer (2) and the grounding metal layer (3) to form an electrical short-circuit structure.
2. The antistatic UHF ceramic tag antenna according to claim 1, characterized in that, A feed point is provided on the radiating metal layer (2); All the aforementioned antistatic connection points are distributed within an annular region with a radius of 0.2λ to 0.3λ centered on the feed point, where λ is the antenna operating wavelength.
3. The antistatic UHF ceramic tag antenna according to claim 2, characterized in that, The number of antistatic connection points is 1-4; when the number of antistatic connection points is not 1, all the antistatic connection points are distributed at equal angles along the circumference centered on the feed point; the central angle formed by connecting two adjacent antistatic connection points to the feed point is 45°≤θ≤180°.
4. The antistatic UHF ceramic tag antenna according to claim 1, characterized in that, The Koch star ring short-circuit structure (4) is a metallized via that penetrates the ceramic substrate (1). The cross-section of the metallized via is a fractal structure formed by iterative Koch curves from a regular hexagon.
5. The antistatic UHF ceramic tag antenna according to claim 4, characterized in that, The Koch curve of the fractal structure is iterated at least once.
6. The antistatic UHF ceramic tag antenna according to claim 4, wherein In the fractal structure, the height of the groove is 0.25-0.35 times the length of its base side.
7. The antistatic UHF ceramic tag antenna according to claim 1, wherein The Koch star ring short-circuit structure (4) is filled with conductive epoxy resin or metal probes.
8. The antistatic UHF ceramic tag antenna according to claim 1, wherein A chip (5) is disposed on one side of the ceramic substrate (1), and the chip (5) is electrically connected to the radiating metal layer (2) through a power supply point.