A target thickness laser measuring instrument

By using laser scanning and marking technology with a laser thickness measuring instrument, the problem of determining the deformation of ITO target material after sintering has been solved, achieving efficient thickness measurement and deformation area marking, improving processing accuracy and reducing scrap rate.

CN224471008UActive Publication Date: 2026-07-07HEBEI WEIXIN TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HEBEI WEIXIN TECH CO LTD
Filing Date
2025-08-04
Publication Date
2026-07-07

AI Technical Summary

Technical Problem

The deformation of ITO targets during sintering makes it difficult to determine the range of warpage during grinding, which can easily cause cracking. Existing technologies are time-consuming, labor-intensive, and inefficient.

Method used

A laser thickness measuring instrument for target material is used, which employs a laser rangefinder and a marking device to measure the thickness of the target material and mark the deformation area through laser scanning, providing accurate thickness data and deformation location markings.

Benefits of technology

It improves the accuracy and efficiency of target material processing, reduces the scrap rate, and saves labor costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

This utility model discloses a laser target thickness measuring instrument, including a main unit. An industrial control computer is located on one side of the main unit, and a target positioning and adjustment bracket and a target blank are located on the top side of the main unit. A gantry-type movable bracket is longitudinally movable on the top of the main unit, and a measuring device is driven by the gantry-type movable bracket. The measuring device includes a laser displacement rangefinder, a laser rangefinder transmitter, a laser rangefinder receiver, and a laser beam emitting device. The advantages of this utility model compared to existing technologies are: this device can measure the overall target thickness using laser. By setting a range through software, areas exceeding the set value are marked with laser marking, which clearly identifies the location of target distortion and deformation, saving manpower, improving work efficiency, and reducing scrap rate.
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Description

Technical Field

[0001] This utility model relates to the technical field of target material thickness measurement equipment, specifically to a laser measuring instrument for target material thickness. Background Technology

[0002] ITO sputtering targets require sintering at 1600℃ during manufacturing. The high-density sputtering targets undergo significant shrinkage during sintering, resulting in deformation of the sintered ITO blank. After sintering, the ITO sputtering target surface requires pre-machining. The first step is surface grinding on a surface grinder. While experienced grinder operators can use the grinder to level the surface and identify the highest point of the target due to surface deformation, this process is time-consuming, labor-intensive, and makes it difficult to determine the extent of warpage. Furthermore, grinding can easily cause the target to crack, resulting in defective products. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a laser measuring instrument for target material thickness, addressing the shortcomings mentioned in the background art.

[0004] To solve the above-mentioned technical problems, the technical solution provided by this utility model is as follows: a laser measuring instrument for target material thickness, including a main unit of the device, an industrial control computer main unit on one side of the main unit of the device, and a target material positioning and adjustment bracket and a target material blank on the top side of the main unit of the device;

[0005] The device host is equipped with a gantry-type movable support that moves longitudinally on its top. The gantry-type movable support drives a measuring device, which includes a laser displacement ranging sensor, a laser ranging transmitter, a laser ranging receiver, and a laser beam emitting device.

[0006] Furthermore, the end of the target positioning and adjustment bracket is provided with a target positioning fixture.

[0007] The industrial control computer host includes an industrial control computer display screen, industrial control computer operation buttons, keyboard and mouse.

[0008] The gantry-type movable support is equipped with a transmission screw that is threadedly connected to the measuring equipment. One end of the gantry-type movable support is equipped with a transmission motor that drives the transmission screw to rotate. The main unit of the equipment is equipped with a limiting groove for the longitudinal movement of the gantry-type movable support.

[0009] The advantages of this invention compared to existing technologies are as follows: This device can measure the overall thickness of the target material using laser. By setting the range through software, areas exceeding the set value can be marked with laser marking. This allows for clear identification of the twisted and deformed locations of the target material, saving manpower, improving work efficiency, and reducing the scrap rate. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the three-dimensional structure of a laser target thickness measuring instrument.

[0011] Figure 2 This is a front view schematic diagram of a laser target thickness measuring instrument.

[0012] Figure 3 This is a top view schematic diagram of a laser target thickness measuring instrument.

[0013] Figure 4 This is a schematic diagram of the laser marking area structure of a laser thickness measuring instrument for target materials.

[0014] As shown in the figure: 1. Target positioning and adjustment bracket; 2. Target blank; 3. Target positioning fixture; 4. Keyboard; 5. Mouse; 6. Main unit of equipment; 7. Gantry-type movable bracket; 8. Drive screw; 9. Laser displacement ranging sensor; 10. Laser ranging transmitter; 11. Laser ranging receiver; 12. Drive motor; 13. Laser beam emitting device; 14. Industrial control computer display screen; 15. Industrial control computer operation buttons; 16. Industrial control computer main unit; 17. Limiting groove. Detailed Implementation

[0015] The present invention will now be described in further detail with reference to the accompanying drawings.

[0016] Combined with appendix Figure 1-3 A laser measuring instrument for target thickness includes a main unit 6, an industrial control computer 16 on one side of the main unit 6, a target positioning adjustment bracket 1 and a target blank 2 on the top side of the main unit 6, and a target positioning fixture 3 at the end of the target positioning adjustment bracket 1.

[0017] The device host 6 has a gantry-type movable support 7 on its top for longitudinal driving movement. The device host 6 also has a structure for driving the gantry-type movable support 7 to move longitudinally, such as a lead screw drive, as shown in the figure. The top surface of the device host 6 has limiting opening slots on both sides to cooperate with the longitudinal movement of the gantry-type movable support 7. This is a common existing drive structure, so it will not be described in detail. The gantry-type movable support 7 drives a measuring device. The gantry-type movable support 7 has a transmission lead screw 8 that is threadedly connected to the measuring device. One end of the gantry-type movable support 7 has a transmission motor 12 that drives the transmission lead screw 8 to rotate. The device host 6 has a limiting slot 17 for the longitudinal movement of the gantry-type movable support 7.

[0018] The measuring equipment includes a laser displacement ranging sensor 9, a laser ranging transmitter 10, a laser ranging receiver 11, and a laser beam emitting device 13. The industrial control computer host 16 includes an industrial control computer display screen 14, industrial control computer operation buttons 15, a keyboard 4, and a mouse 5.

[0019] In practice, after placing the target blank 2 on the target positioning fixture 3 of the target positioning adjustment bracket 1, the built-in software of the equipment host 6 and the industrial control computer host 16 can be turned on to start laser scanning of the target.

[0020] The laser displacement ranging sensor 9, laser ranging transmitter 10, laser ranging receiver 11, and laser beam emitting device 13 are mounted on a gantry-type movable support. They can move forward, backward, left, and right to scan the target material through the transmission screw 8 and the transmission motor 12. With the target material placement plane as the reference plane, the laser ranging transmitter 10 emits laser light, and the laser ranging receiver 11 receives the laser signal. The scanned target material thickness data is transmitted to the host device 6 for data analysis.

[0021] After scanning the target material thickness, the target material thickness distribution is obtained. A maximum value is set, and data exceeding the maximum value is extracted. The extracted data positions are marked by laser using a laser beam emitting device 13. After marking, the outline of the area exceeding the thickness (i.e., the position of the target material distortion) can be obtained. The marked target material can then be repeatedly flipped and processed on a grinding machine to complete the entire target material pretreatment process.

[0022] The software for target thickness scanning and laser beam emission (laser marking of the area) uses common automated circuit control, so it will not be described in detail. Figure 4 The shaded area is the region where laser marking is applied after the thickness is measured by laser and exceeds the set range value.

[0023] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the inventive spirit of the present invention, such designs should fall within the protection scope of the present invention.

Claims

1. A laser measuring instrument for target thickness, comprising a main unit (6), characterized in that: The main equipment (6) is provided with an industrial control computer (16) on one side, and a target positioning adjustment bracket (1) and a target blank (2) are provided on the top side of the main equipment (6); The device host (6) is provided with a gantry-type movable support (7) on the top of the longitudinal drive movement. The gantry-type movable support (7) is provided with a measuring device, which includes a laser displacement ranging sensor (9), a laser ranging transmitter (10), a laser ranging receiver (11), and a laser beam emitting device (13).

2. The laser measuring instrument for target thickness according to claim 1, characterized in that: The target positioning adjustment bracket (1) is provided with a target positioning fixture (3) at its end.

3. The laser measuring instrument for target thickness according to claim 1, characterized in that: The industrial control computer host (16) includes an industrial control computer display screen (14), industrial control computer operation buttons (15), keyboard (4) and mouse (5).

4. The laser measuring instrument for target thickness according to claim 1, characterized in that: The gantry-type movable support (7) is provided with a transmission screw (8) that is threadedly connected to the measuring equipment, and one end of the gantry-type movable support (7) is provided with a transmission motor (12) that drives the transmission screw (8) to rotate.