A semiconductor component local temperature control detection device

By using a combination of electric push rod and thermal pad in the local temperature control and detection device for semiconductor components, the problem of tight contact between semiconductor components and temperature control module is solved, thereby improving the uniformity of heat transfer and the accuracy of temperature control, and simplifying the operation process.

CN224518895UActive Publication Date: 2026-07-17LEILING SEMICON EQUIP (JIANGSU) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
LEILING SEMICON EQUIP (JIANGSU) CO LTD
Filing Date
2025-08-11
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

In the field of semiconductor manufacturing and testing, local temperature control and detection devices need to ensure close contact between semiconductor components and temperature control modules to achieve efficient heat conduction. Traditional methods have problems such as high contact thermal resistance, complex structure and slow response speed. In particular, when there are gaps in the contact surface, it will lead to uneven heat transfer and affect the temperature control accuracy. At the same time, frequent adjustment of the push rod stroke increases the complexity of operation.

Method used

The electric actuator employs a combination of lifting blocks and thermal pads to ensure a tight fit between the thermal pads and semiconductor components. The thermal pads reduce contact thermal resistance, and the spring and guide slider structure simplifies operation, eliminating the need to adjust the actuator stroke based on component thickness.

Benefits of technology

It achieves faster and more uniform heat transfer, simplifies the operation process, improves temperature control accuracy and efficiency, reduces contact thermal resistance, and simplifies the equipment structure.

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Abstract

The utility model relates to temperature control detection technical field, specifically is a kind of semiconductor accessory local temperature control detection device, including base, fixedly installed with intelligent control chamber on the base, sound-light alarm is provided on the intelligent control chamber, first recess is provided in base one side, the first recess upper side is provided with the sliding slot, electric push rod is fixedly installed in the sliding slot, lifting block is provided on the electric push rod, temperature controller is provided on the lifting block, heat-conducting gasket is fixedly arranged in temperature controller lower side one side, placing groove is provided in the first recess lower side one side, a plurality of temperature detectors are fixedly installed in the placing groove inner wall, reduce contact thermal resistance, make heat transfer more rapidly, more evenly, simplify operation procedure.
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Claims

1. A local temperature control detection device for semiconductor components, comprising a base (1), characterized in that: An intelligent control room (2) is fixedly installed on the base (1). An audible and visual alarm (3) is installed on the intelligent control room (2). A first groove (4) is provided on one side of the base (1). A sliding groove (5) is provided on one side above the first groove (4). An electric push rod (6) is fixedly installed in the sliding groove (5). A lifting block (7) is provided on the electric push rod (6). A temperature controller (8) is provided on the lifting block (7). A heat-conducting pad (9) is fixedly installed on one side below the temperature controller (8). A placement groove (10) is provided on one side below the first groove (4). Several temperature detectors (11) are fixedly installed on the inner wall of the placement groove (10).

2. The local temperature detection device for semiconductor assembly according to claim 1, wherein: The intelligent control room (2) is connected to the temperature controller (8) and the temperature detector (11) via signal connection, and the thermal pad (9) is made of thermally conductive material.

3. The local temperature detection device for a semiconductor assembly according to claim 2, wherein: The lifting block (7) includes a lifting block base (701), a second groove (702) is provided on the lifting block base (701), a connecting plate (703) is slidably provided in the second groove (702), a spring (704) is fixedly provided on the side of the connecting plate (703) away from the temperature controller (8), and a plurality of guide grooves (705) are provided on both sides of the connecting plate (703), and guide sliders (706) are slidably provided in the guide grooves (705).

4. The local temperature detection device for a semiconductor assembly according to claim 3, wherein: The lifting block base (701) is fixedly connected to the electric push rod (6).

5. The local temperature detection device for a semiconductor assembly according to claim 4, wherein: The connecting plate (703) is fixedly connected to the temperature controller (8).

6. The local temperature detection device for a semiconductor assembly according to claim 5, wherein: The spring (704) and the guide slider (706) are both fixedly installed in the second groove (702).