Light emitting diode packaging structure, display module and display screen
By setting insulating tape and cup structure on the substrate, the adhesion and brightness problems of light-emitting diode displays were solved, achieving higher bonding strength and brightness, and improving product quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HANGZHOU MULTI COLOR OPTOELECTRONICS
- Filing Date
- 2025-07-17
- Publication Date
- 2026-07-17
AI Technical Summary
The performance of existing LED displays needs improvement in areas such as the adhesion between the LED and the bracket, the bonding force between the bracket and the encapsulating adhesive layer, and brightness, which affects product quality and market competitiveness.
An insulating tape with a roughened surface is placed on the substrate to improve the adhesion between the light-emitting diode and the pad. The cups surrounding part of the pads and the insulating tape enhance the brightness and bonding strength of the package structure.
It improves the adhesion between the LED and the bracket, and the bonding force between the bracket and the encapsulating adhesive layer, thereby enhancing the brightness and stability of the LED encapsulation structure, preventing short circuits, and extending service life.
Smart Images
Figure CN224521516U_ABST
Abstract
Claims
1. A light-emitting diode (LED) packaging structure, characterized in that, include: Base; Several pads are located on the top surface of the substrate; At least one light-emitting diode is located on the corresponding pad and electrically connected to the corresponding pad; An insulating tape is located on the substrate between adjacent pads, and the insulating tape has a roughened surface.
2. The light emitting diode package structure of claim 1, wherein the first and second electrodes are formed on the first and second surfaces of the substrate, respectively. The roughened surface is mesh-like, granular, or conical.
3. The light emitting diode package structure of claim 1, wherein the phosphor layer is formed on the light emitting diode chip. The substrate and the insulating tape are an integral structure.
4. The light emitting diode package structure of claim 1, wherein the phosphor layer is formed on the light emitting diode chip. The light-emitting diode packaging structure also includes: A bowl-shaped cup is disposed around the top surface of the substrate, and the bowl-shaped cup surrounds a portion of the pad, the insulating tape, and the light-emitting diode.
5. The light emitting diode package structure of claim 4, wherein the phosphor layer is formed on the light emitting diode chip. The base, the insulating strip, and the bowl are an integral structure.
6. The light emitting diode package structure of claim 4, wherein the phosphor layer is formed on the light emitting diode chip. The base and the insulating strip are an integral structure, and the integral structure is arranged in layers with the bowl and cup.
7. The light-emitting diode packaging structure as described in claim 1, characterized in that, The pad extends from the top surface of the substrate through the side surface of the substrate to the bottom surface of the substrate, or the pad extends from the top surface of the substrate through the interior of the substrate to the bottom surface of the substrate.
8. The light-emitting diode packaging structure as described in claim 1, characterized in that, The light-emitting diode packaging structure also includes: Die-attach adhesive is used to fix the at least one light-emitting diode to the corresponding pad.
9. The light-emitting diode packaging structure as described in claim 1, characterized in that, The light-emitting diode packaging structure also includes: An encapsulating adhesive layer covers the at least one light-emitting diode, the insulating tape, and a portion of the solder pads.
10. The light emitting diode package structure of claim 1, wherein the phosphor layer is formed on the light emitting diode chip. The at least one light-emitting diode includes at least one of red light-emitting diodes, green light-emitting diodes, and blue light-emitting diodes.
11. The light emitting diode package structure of claim 8, wherein the phosphor layer is formed on the light emitting diode chip. The roughened surface of the insulating tape prevents the die bond adhesive from diffusing from between the LED and the pad to the periphery of the LED.
12. The light emitting diode package structure of claim 8, wherein the phosphor layer is formed on the light emitting diode chip. The light-emitting diode packaging structure also includes: The bonding wire connects the light-emitting diode to the corresponding pad.
13. The light-emitting diode packaging structure as described in claim 12, characterized in that, The plurality of pads includes a first pad, a second pad, a third pad, and a fourth pad. The light-emitting diodes include a red light-emitting diode, a green light-emitting diode, and a blue light-emitting diode. The bottom surface of the red light-emitting diode has a first electrode, and the top surface of the red light-emitting diode has a second electrode. The top surfaces of the green light-emitting diode and the blue light-emitting diode have a first electrode and a second electrode, respectively. The first electrodes of the red light-emitting diode, the green light-emitting diode, and the blue light-emitting diode are electrically connected to the first pad. The second electrodes of the red light-emitting diode, the green light-emitting diode, and the blue light-emitting diode are electrically connected to the second pad, the third pad, and the fourth pad, respectively. The first pad, the second pad, the third pad, and the fourth pad are isolated by the insulating tape.
14. The light emitting diode package structure of claim 13, wherein the phosphor layer is disposed on the light emitting diode chip. The first electrode of the red light-emitting diode is electrically connected to the first pad via the die-attach adhesive, which is a conductive adhesive. The second electrode of the red light-emitting diode is electrically connected to the second pad via the bonding wire. The green light-emitting diode is fixed to the first pad via the die-attach adhesive, which is an insulating adhesive. The first electrode of the green light-emitting diode is electrically connected to the first pad via the bonding wire, and the second electrode of the green light-emitting diode is electrically connected to the third pad via the bonding wire. The blue light-emitting diode is fixed to the first pad via the die-attach adhesive, which is an insulating adhesive. The first electrode of the blue light-emitting diode is electrically connected to the first pad via the bonding wire, and the second electrode of the blue light-emitting diode is electrically connected to the fourth pad via the bonding wire.
15. The light-emitting diode packaging structure as described in claim 13, characterized in that, The at least one light-emitting diode includes a red light-emitting diode, a green light-emitting diode, or a blue light-emitting diode. A first electrode and a second electrode are formed on the top surface of the red light-emitting diode, the green light-emitting diode, or the blue light-emitting diode. The die bond adhesive is an insulating adhesive. The first electrode is electrically connected to the second pad through the bonding wire, and the second electrode is electrically connected to the fourth pad through the bonding wire.
16. The light emitting diode package structure of claim 1, wherein the phosphor layer is formed on the top surface of the substrate. The number of light-emitting diode (LED) package structures is multiple, and the multiple LED package structures share a common substrate. The multiple LED package structures are connected to each other through a connecting part.
17. A light emitting diode display module, characterized by It includes a substrate and a plurality of light-emitting diode (LED) package structures as described in any one of claims 1 to 16, wherein the plurality of LED package structures are arranged in an array on the substrate.
18. A light emitting diode display screen, characterized by It includes multiple light-emitting diode display modules as described in claim 17, arranged in an array.