An integrated circuit chip storage device

Abstract

The utility model relates to chip storage technical field especially integrated circuit chip storage device, including storage box, the top end hinged connection of storage box has the lid, the inside top end mounting of storage box has the placement board, be provided with positioning support mechanism between placement board with storage box, the surface of placement board even has the placement groove. Advantageous effect lies in: the utility model discloses the placement board of having different diameter placement groove is replaced according to the size of integrated circuit chip size, and integrated circuit chip is stored conveniently, the integrated circuit chip is pressed in the top of antiskid pad by elastic pressure pad, and then keeps integrated circuit chip stable placement in the placement groove, and integrated circuit chip is conveniently transferred safely and stably through storage box, through the support plate, multiple integrated circuit chips are pressed out the placement groove upwards, and thus, integrated circuit chip is conveniently taken out quickly.

Description

Technical Field

[0001] This utility model relates to the field of chip storage technology, and in particular to an integrated circuit chip storage device. Background Technology

[0002] An integrated circuit chip is a miniature electronic device or component. Using specific processes, transistors, resistors, capacitors, inductors, and other components required for a circuit, along with their interconnections, are fabricated on one or several small pieces of semiconductor wafer or dielectric substrate. These are then packaged in a housing, forming a miniature structure with the desired circuit function. All components are structurally integrated, representing a significant step forward in the miniaturization, low power consumption, intelligence, and high reliability of electronic components. Integrated circuit chip storage devices are specifically designed for storing and protecting integrated circuit chips. The main function of a storage device is to provide a safe, stable, and suitable environment to ensure that the chip is not damaged or degraded during storage and transportation. By selecting an appropriate storage device, it is possible to ensure that the integrated circuit chip remains in optimal condition during storage, providing strong support for subsequent use.

[0003] For example, the prior art Chinese patent publication number "CN218022974U" provides a storage device for transporting integrated circuit chips, including a placement box, which includes a lower half box and an upper half box. The lower half box and the upper half box are hinged to one side and can be rotated and opened. A locking component is provided between the upper half box and the lower half box for locking and fixing them. The inner bottom surface of the lower half box is arranged with a plurality of placement stations, each placement station including a placement slot and a receiving slot. The placement slot is used to place the package shell of the integrated circuit chip, and the receiving slot is arranged around the placement slot for accommodating the pins of the integrated circuit chip. The inner top surface of the upper half box is provided with a plurality of clamping blocks, the number of clamping blocks being the same as the number of placement stations. The plurality of clamping blocks are arranged one-to-one with the plurality of placement stations. When the upper half box and the lower half box are assembled, the clamping blocks are located directly above the receiving slots with a gap between them.

[0004] This device has the advantage of preventing damage to the pins of integrated circuit chips during transportation.

[0005] Existing integrated circuit chip storage devices place the integrated circuit chips inside storage boxes for movement and transportation. However, when the integrated circuit chips are placed inside the storage boxes, the size of the placement slots does not match the size of the integrated circuit chips. When storing integrated circuit chips of different sizes, different storage boxes need to be changed, which is troublesome and time-consuming. It is also inconvenient to adjust the depth of the placement slots. Moreover, when the integrated circuit chips are placed in the placement slots inside the storage boxes, they are recessed in the placement slots and need to be dug out one by one, which is also time-consuming and inconvenient for quick removal of integrated circuit chips.

[0006] Therefore, an integrated circuit chip storage device is proposed. Utility Model Content

[0007] The purpose of this invention is to address the shortcomings of existing technologies, such as the need to change storage boxes when storing integrated circuit chips of different sizes, which is troublesome and time-consuming, and the inconvenience of adjusting the depth of the placement slot. Therefore, this invention proposes an integrated circuit chip storage device.

[0008] To achieve the above objectives, this utility model provides the following technical solution: Design an integrated circuit chip storage device, including a storage box, a box cover hinged to the top of the storage box, a placement plate installed inside the top of the storage box, a positioning support mechanism between the placement plate and the storage box, placement grooves evenly opened on the surface of the placement plate, a spring pressing mechanism installed at the top of the placement groove, a lifting frame placed inside the bottom of the storage box, adjustable height placement components evenly installed at the top of the lifting frame, and an elastic lifting mechanism installed in the middle of the top of the lifting frame; The positioning support mechanism includes a support block fixed to the middle of the inner surface of the storage box, a first positioning hole opened on the surface of the support block, a positioning post fixed to the bottom edge of the placement plate and sliding through the first positioning hole, a second positioning hole opened on the surface of the positioning post, a third positioning hole opened in the middle of the side of the storage box, and a positioning bolt that rotates through the second positioning hole and the third positioning hole.

[0009] Furthermore, the storage box has a rectangular structure, the support block is horizontally positioned, the placement plate has a rectangular plate structure and is horizontally overlapped at the top of the support block, the third positioning hole has a threaded hole structure, the positioning bolt is horizontally positioned, and the thread rotates through the third positioning hole.

[0010] Furthermore, the spring-loaded mechanism includes an elastic pad laid on the top of the placement plate, a first spring connected to the bottom of the elastic pad, a pinching groove formed on the top surface of the elastic pad for removing the elastic pad, and a spring-loaded pad connected to the bottom of the first spring for elastically inserting into the placement groove to abut against the chip.

[0011] Furthermore, the elastic pad has a first through hole in the middle, the elastic pad is made of elastic rubber material and is slidably inserted into the inner top of the placement groove, and the placement plate has a second through hole in the middle, which is aligned with the first through hole and used to pull the lifting frame up and down.

[0012] Furthermore, the placement assembly includes a support column uniformly fixed to the top of the lifting frame, an adjustment groove opened inside the support column, an adjustment column threadedly inserted into the adjustment groove, a support plate fixed to the top of the adjustment column, and an anti-slip pad for placing the chip bonded to the top of the support plate.

[0013] Furthermore, the lifting frame is a grid frame structure and is horizontally arranged, the support column is vertically arranged, the adjusting column is a threaded column structure, and the support plate is horizontally slidably inserted into the bottom of the placement groove.

[0014] Furthermore, the elastic lifting mechanism includes a connecting cylinder fixed in the middle of the lifting frame, limiting grooves opened on both sides of the connecting cylinder, a lifting column slidably inserted into the top of the inside of the connecting cylinder, limiting blocks fixed to the bottom of both sides of the lifting column and slidably engaged in the limiting grooves, a second spring connected to the bottom of the inside of the connecting cylinder, and a lifting groove opened on the top of the side of the lifting column.

[0015] Furthermore, the lifting column slides vertically through the first through hole and the second through hole, the height of the limiting groove is less than the depth inside the connecting cylinder, and the lifting groove is located above the elastic pad.

[0016] The integrated circuit chip storage device proposed in this utility model has the following advantages: 1. This utility model uses a support block fixed in the middle of the storage box. The placement plate is positioned and overlapped on the top of the support block by positioning posts and positioning bolts, which facilitates disassembly, installation, replacement and maintenance. In addition, it is convenient to replace the placement plate with a placement slot of different diameter according to the size of the integrated circuit chip, which is convenient for storing integrated circuit chips.

[0017] 2. In this invention, multiple support columns are evenly fixed to the bottom of the storage box via a lifting frame. Support plates and anti-slip pads are installed on the tops of the support columns via adjusting slots and adjusting columns. Multiple first springs and spring-loaded pads are evenly installed on the top of the placement plate via elastic pads. Therefore, based on the thickness of the integrated circuit chip, the integrated circuit chip is placed in the placement slot. The height of the support plate is adjusted via the adjusting columns, and the support plate supports the integrated circuit chip in the placement slot. Simultaneously, the elastic pads cover the placement plate, and the spring-loaded pads are inserted into the placement slots. The first springs push the spring-loaded pads downwards, pressing the integrated circuit chip against the top of the anti-slip pads, thus keeping the integrated circuit chip stably placed in the placement slot. This facilitates the safe and stable transfer of the integrated circuit chip through the storage box.

[0018] 3. This utility model has a connecting cylinder fixed at the top center of the lifting frame, and a lifting column is elastically installed inside the connecting cylinder through a second spring and a limiting block. Therefore, when taking out the integrated circuit chip, the box cover is opened, the elastic pad is removed, the spring pressure pad is pulled out, and the lifting column is pulled upward through the lifting groove, thereby pulling the lifting frame upward, which in turn drives multiple support columns, adjusting columns and support plates to rise. Then, the support plate pushes multiple integrated circuit chips upward out of the placement slot, thus facilitating the quick removal of the integrated circuit chip. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This utility model Figure 1 A schematic diagram of the storage box and placement board; Figure 3 This utility model Figure 1 A schematic diagram of the storage box and support block; Figure 4 This utility model Figure 1 A schematic diagram of the elastic pad and the pressure pad. Figure 5 This utility model Figure 1 A schematic diagram of the placement plate and positioning posts; Figure 6 This utility model Figure 1 A schematic diagram of the lifting frame, placement components, and elastic lifting mechanism; Figure 7 This utility model Figure 6 Enlarged view of point A; Figure 8 This utility model Figure 1 A schematic diagram of the support plate and adjusting column; Figure 9 This utility model Figure 1 A schematic diagram of the lifting column and limiting block.

[0020] In the diagram: 1. Storage box; 2. Positioning bolt; 3. Elastic pad; 4. Lifting column; 5. Grip groove; 6. Box lid; 7. Placement groove; 8. Placement plate; 9. Lifting groove; 10. First positioning hole; 11. Support block; 12. Third positioning hole; 13. First spring; 14. Elastic pad; 15. First through hole; 16. Positioning column; 17. Second positioning hole; 18. Second through hole; 19. Lifting frame; 20. Support column; 21. Adjustment groove; 22. Anti-slip pad; 23. Support plate; 24. Adjustment column; 25. Connecting cylinder; 26. Limiting groove; 27. Second spring; 28. Limiting block. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0022] Example 1 Please see Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 and Figure 9 The figure shows an integrated circuit chip storage device, including a storage box 1. The top of the storage box 1 is hinged to a box cover 6. The top of the storage box 1 is equipped with a placement plate 8. A positioning support mechanism is provided between the placement plate 8 and the storage box 1. Placement grooves 7 are evenly opened on the surface of the placement plate 8. A spring pressing mechanism is installed at the top of the placement grooves 7. A lifting frame 19 is placed at the bottom of the storage box 1. The top of the lifting frame 19 is evenly equipped with height-adjustable placement components. An elastic lifting mechanism is installed in the middle of the top of the lifting frame 19.

[0023] The positioning support mechanism includes a support block 11 fixed to the middle of the inner surface of the storage box 1, a first positioning hole 10 opened on the surface of the support block 11, a positioning post 16 fixed to the bottom edge of the placement plate 8 and sliding through the first positioning hole 10, a second positioning hole 17 opened on the surface of the positioning post 16, a third positioning hole 12 opened in the middle of the side of the storage box 1, and a positioning bolt 2 that rotates through the second positioning hole 17 and the third positioning hole 12.

[0024] The storage box 1 is a rectangular structure, the support block 11 is horizontally set, the placement plate 8 is a rectangular plate structure and is horizontally overlapped on the top of the support block 11, the third positioning hole 12 is a threaded hole structure, the positioning bolt 2 is horizontally set and the thread rotates through the third positioning hole 12.

[0025] The placement plate 8 is positioned and overlapped on the top of the support block 11 by the positioning post 16 and the positioning bolt 2, which facilitates disassembly, installation and replacement maintenance. This also makes it easy to replace the placement plate 8 with a placement slot 7 of different diameters according to the size of the integrated circuit chip, so as to facilitate the storage of integrated circuit chips.

[0026] The spring-loaded mechanism includes an elastic pad 3 laid on the top of the placement plate 8, a first spring 13 connected to the bottom of the elastic pad 3, a pinching groove 5 formed on the top surface of the elastic pad 3 for removing the elastic pad 3, and a spring-loaded pad 14 connected to the bottom of the first spring 13 for elastically inserting into the placement groove 7 to abut against the chip.

[0027] The elastic pad 3 has a first through hole 15 in the middle, the elastic pressure pad 14 is made of elastic rubber material and is slidably inserted into the top of the placement groove 7, and the placement plate 8 has a second through hole 18 in the middle, which is aligned with the first through hole 15 and is used to pull the lifting frame 19 up and down.

[0028] The placement assembly includes a support column 20 evenly fixed to the top of the lifting frame 19, an adjustment groove 21 opened inside the support column 20, an adjustment column 24 threadedly inserted into the adjustment groove 21, a support plate 23 fixed to the top of the adjustment column 24, and an anti-slip pad 22 for placing the chip bonded to the top of the support plate 23.

[0029] The lifting frame 19 is a grid frame structure and is set horizontally. The support column 20 is set vertically. The adjusting column 24 is a threaded column structure. The support plate 23 is horizontally slidably inserted into the bottom of the placement slot 7.

[0030] Based on the thickness of the integrated circuit chip, the integrated circuit chip is placed in the placement slot 7, and the height of the support plate 23 is adjusted by the adjusting column 24. The support plate 23 supports the integrated circuit chip in the placement slot 7. At the same time, the elastic pad 3 covers the placement plate 8, and the spring pressure pad 14 is inserted into the placement slot 7. The spring pressure pad 14 is pushed down by the first spring 13, so that the spring pressure pad 14 presses the integrated circuit chip on the top of the anti-slip pad 22, thereby keeping the integrated circuit chip stably placed in the placement slot 7, which facilitates the safe and stable transfer of the integrated circuit chip through the storage box 1.

[0031] Example 2 Please see Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 and Figure 9 The figure shows an integrated circuit chip storage device, including a storage box 1. The top of the storage box 1 is hinged to a box cover 6. The top of the storage box 1 is equipped with a placement plate 8. A positioning support mechanism is provided between the placement plate 8 and the storage box 1. Placement grooves 7 are evenly opened on the surface of the placement plate 8. A spring pressing mechanism is installed at the top of the placement grooves 7. A lifting frame 19 is placed at the bottom of the storage box 1. The top of the lifting frame 19 is evenly equipped with height-adjustable placement components. An elastic lifting mechanism is installed in the middle of the top of the lifting frame 19.

[0032] The elastic lifting mechanism includes a connecting cylinder 25 fixed in the middle of the lifting frame 19, limiting grooves 26 opened on both sides of the connecting cylinder 25, a lifting column 4 slidably inserted into the top of the inside of the connecting cylinder 25, limiting blocks 28 fixed to the bottom of both sides of the lifting column 4 and slidably engaged in the limiting grooves 26, a second spring 27 connected to the bottom of the inside of the connecting cylinder 25, and a lifting groove 9 opened on the top of the side of the lifting column 4.

[0033] The lifting column 4 slides vertically through the first through hole 15 and the second through hole 18. The height of the limiting groove 26 is less than the depth inside the connecting cylinder 25. The lifting groove 9 is located above the elastic pad 3.

[0034] When removing the integrated circuit chip, open the box cover 6, remove the elastic pad 3 through the pinch groove 5, pull out the spring pressure pad 14, and pull the lifting column 4 upward through the lifting groove 9, thereby pulling the lifting frame 19 upward, which in turn drives multiple support columns 20, adjusting columns 24 and support plates 23 to rise, and then pushes multiple integrated circuit chips upward through the support plate 23 to the placement slot 7, thus facilitating the quick removal of the integrated circuit chip.

[0035] Working method: A support block 11 is fixed in the middle of the inside of the storage box 1. The placement plate 8 is positioned and overlapped on the top of the support block 11 by the positioning post 16 and the positioning bolt 2, which facilitates disassembly, installation and replacement maintenance. This also makes it easy to replace the placement plate 8 with a placement slot 7 of different diameters according to the size of the integrated circuit chip, so as to facilitate the storage of integrated circuit chips.

[0036] Multiple support columns 20 are evenly fixed at the bottom of the storage box 1 by a lifting frame 19, and a support plate 23 and an anti-slip pad 22 are installed on the top of the support column 20 by an adjustment groove 21 and an adjustment column 24. Multiple first springs 13 and spring pressure pads 14 are evenly installed on the top of the placement plate 8 by an elastic pad 3.

[0037] Therefore, based on the thickness of the integrated circuit chip, the integrated circuit chip is placed in the placement slot 7, and the height of the support plate 23 is adjusted by the adjusting column 24. The support plate 23 supports the integrated circuit chip in the placement slot 7. At the same time, the elastic pad 3 covers the placement plate 8, the spring pressure pad 14 is inserted into the placement slot 7, and the spring pressure pad 14 is pushed down by the first spring 13, so that the spring pressure pad 14 presses the integrated circuit chip on the top of the anti-slip pad 22, thereby keeping the integrated circuit chip stably placed in the placement slot 7, which facilitates the safe and stable transfer of the integrated circuit chip through the storage box 1.

[0038] A connecting cylinder 25 is fixed at the top center of the lifting frame 19, and a lifting column 4 is elastically installed inside the connecting cylinder 25 through a second spring 27 and a limiting block 28. Therefore, when taking out the integrated circuit chip, the box cover 6 is opened, the elastic pad 3 is removed through the pinch groove 5, the spring pressure pad 14 is pulled out, and the lifting column 4 is pulled upward through the lifting groove 9, thereby pulling the lifting frame 19 upward, which in turn drives multiple support columns 20, adjusting columns 24 and support plates 23 to rise, and then pushes multiple integrated circuit chips upward out of the placement slot 7 through the support plate 23. In this way, it is easy to quickly take out the integrated circuit chip.

[0039] The above are merely preferred embodiments of this utility model, but the scope of protection of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in this utility model, based on the technical solution and inventive concept of this utility model, should be included within the scope of protection of this utility model.

Claims

1. An integrated circuit chip storage device, comprising a storage box (1), characterized in that: The top of the storage box (1) is hinged to a box cover (6). The top of the storage box (1) is fitted with a placement plate (8). A positioning support mechanism is provided between the placement plate (8) and the storage box (1). The surface of the placement plate (8) is evenly provided with placement grooves (7). A spring pressing mechanism is installed at the top of the placement grooves (7). A lifting frame (19) is placed at the bottom of the storage box (1). An adjustable height placement component is evenly installed at the top of the lifting frame (19). An elastic lifting mechanism is installed in the middle of the top of the lifting frame (19). The positioning support mechanism includes a support block (11) fixed in the middle of the inner surface of the storage box (1), a first positioning hole (10) opened on the surface of the support block (11), a positioning post (16) fixed to the bottom edge of the placement plate (8) and sliding through the first positioning hole (10), a second positioning hole (17) opened on the surface of the positioning post (16), a third positioning hole (12) opened in the middle of the side of the storage box (1), and a positioning bolt (2) that rotates through the second positioning hole (17) and the third positioning hole (12).

2. The integrated circuit chip storage device according to claim 1, characterized in that: The storage box (1) is a rectangular structure, the support block (11) is horizontally set, the placement plate (8) is a rectangular plate structure and is horizontally attached to the top of the support block (11), the third positioning hole (12) is a threaded hole structure, the positioning bolt (2) is horizontally set and the thread rotates through the third positioning hole (12).

3. The integrated circuit chip storage device according to claim 1, characterized in that: The spring-loaded mechanism includes an elastic pad (3) laid on the top of the placement plate (8), a first spring (13) connected to the bottom of the elastic pad (3), a pinching groove (5) opened on the top surface of the elastic pad (3) for removing the elastic pad (3), and a spring-loaded pad (14) connected to the bottom of the first spring (13) for elastically inserting into the placement groove (7) to abut against the chip.

4. The integrated circuit chip storage device according to claim 3, characterized in that: The elastic pad (3) has a first through hole (15) in the middle. The elastic pad (14) is made of elastic rubber material and is slidably inserted into the top of the placement groove (7). The placement plate (8) has a second through hole (18) in the middle. The second through hole (18) is aligned with the first through hole (15) and is used to pull the lifting frame (19) up and down.

5. The integrated circuit chip storage device according to claim 1, characterized in that: The placement assembly includes a support column (20) uniformly fixed to the top of the lifting frame (19), an adjustment groove (21) opened inside the support column (20), an adjustment column (24) threadedly inserted into the adjustment groove (21), a support plate (23) fixed to the top of the adjustment column (24), and an anti-slip pad (22) for placing the chip bonded to the top of the support plate (23).

6. The integrated circuit chip storage device according to claim 5, characterized in that: The lifting frame (19) is a grid frame structure and is set horizontally. The support column (20) is set vertically. The adjusting column (24) is a threaded column structure. The support plate (23) is horizontally slidably inserted into the bottom of the placement groove (7).

7. The integrated circuit chip storage device according to claim 4, characterized in that: The elastic lifting mechanism includes a connecting cylinder (25) fixed in the middle of the lifting frame (19), a limiting groove (26) opened on both sides of the connecting cylinder (25), a lifting column (4) slidably inserted into the top of the inside of the connecting cylinder (25), a limiting block (28) fixed to the bottom of both sides of the lifting column (4) and slidably engaged in the limiting groove (26), a second spring (27) connected to the bottom of the inside of the connecting cylinder (25), and a lifting groove (9) opened on the top of the side of the lifting column (4).

8. The integrated circuit chip storage device according to claim 7, characterized in that: The lifting column (4) slides vertically through the first through hole (15) and the second through hole (18), the height of the limiting groove (26) is less than the depth inside the connecting cylinder (25), and the lifting groove (9) is located above the elastic pad (3).

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