An LED chip fixing device
By using an LED chip fixing device with clamping blocks and reset components in the Mini LED display production process, the problem of chip position changes in the material tray is solved, improving the accuracy and success rate of material picking and reducing chip loss.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGXI MTC VISUAL DISPLAY CO LTD
- Filing Date
- 2025-07-10
- Publication Date
- 2026-07-24
AI Technical Summary
During the production of Mini LED displays, the position of chips in the tray can easily change or rotate due to equipment factors, affecting the accuracy and success rate of chip picking and leading to chip loss.
An LED chip fixing device was designed. By setting a clamping block and a resetting component on the material tray, the relative position between the chip and the material tray is ensured. The movement of the clamping block and the resetting force of the resetting component are used to stabilize the position of the chip in the material tray.
It improves the accuracy and success rate of material handling in production equipment, reduces chip loss, and ensures the stability of chips in the tray.
Smart Images

Figure CN224556168U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of LED display manufacturing technology, and in particular to an LED chip fixing device. Background Technology
[0002] In the production process of Mini LED displays, the tray serves as a carrier and protector of LED chips, while also providing precise chip positioning for the production equipment. However, during actual production and transfer, the real-time position of the chips within the tray can easily change or rotate due to production equipment or other factors, affecting the accuracy and success rate of chip retrieval by the production equipment and resulting in chip loss. Utility Model Content
[0003] To address the shortcomings of existing technologies, this invention provides an LED chip fixing device that ensures the relative position of the chip and the tray, improves the accuracy and success rate of material handling in production equipment, and reduces chip loss.
[0004] To solve the above-mentioned technical problems, this utility model provides an LED chip fixing device, comprising:
[0005] The tray has slots for placing chips.
[0006] A fixed base is provided at the notch of the material tray; a pressing block is provided at one end of the fixed base facing the placement groove, and a pressing surface is formed on one side of the pressing block facing the placement groove. The pressing block is adapted to move relative to the fixed base so that the pressing surface extends into the placement groove or moves away from the placement groove.
[0007] As an improvement to the above solution, a sliding groove is formed at one end of the fixed base facing the placement groove, the clamping block is slidably disposed in the sliding groove, and a first reset member is arranged between the side of the clamping block away from the placement groove and the inner wall of the sliding groove.
[0008] Alternatively, the fixing seat has a rotating hole, the clamping block has a rotating shaft, the rotating shaft is rotatably connected to the rotating hole, and the rotating shaft is sleeved with a second reset member;
[0009] The first reset member and the second reset member are used to push the clamping block to move into the placement slot.
[0010] As an improvement to the above solution, the first reset element is one or more of an elastic element or a magnetic element; the second reset element is an elastic element.
[0011] As an improvement to the above solution, the fixing seat includes a base and a cover plate. The base is detachably connected to the bottom wall of the notch, and the base and the cover plate are detachably connected. The sliding groove is formed between the base and the cover plate.
[0012] As an improvement to the above solution, the pressing surface is arranged to be inclined downward toward the placement groove.
[0013] As an improvement to the above solution, the pressing surface is provided with a cushioning pad.
[0014] As an improvement to the above solution, the fixing seat forms a limiting part, the limiting part is located on the movement path of the fixing seat, and the limiting part is close to the placement groove.
[0015] As an improvement to the above solution, the tray is formed with gripping grooves.
[0016] As an improvement to the above solution, a magnetic conductor is provided at the bottom of the tray, and the shape of the magnetic conductor is consistent with the bottom shape of the tray.
[0017] Implementing this utility model has the following beneficial effects:
[0018] According to the LED chip fixing device of this embodiment, before placing the chip in the placement slot of the material tray, the clamping block can be moved relative to the fixing base to move the clamping surface of the clamping block away from the placement slot; then the chip is placed in the placement slot, and the clamping block is moved relative to the fixing base so that the clamping surface of the clamping block extends into the placement slot, so as to use the clamping surface to press the chip in the placement slot, thereby preventing the chip from changing or rotating in the material tray, ensuring the relative position between the chip and the material tray, improving the material picking accuracy and success rate of the production equipment, and reducing chip loss. Attached Figure Description
[0019] Figure 1 This is a three-dimensional structural diagram of an LED chip fixing device according to an embodiment of the present invention;
[0020] Figure 2 This is a three-dimensional structural diagram of the fixing seat in one embodiment of the present invention;
[0021] Figure 3 This is an exploded structural diagram of the fixing seat in one embodiment of the present invention. Detailed Implementation
[0022] To make the objectives, technical solutions, and advantages of this utility model clearer, the following will describe this utility model in further detail with reference to the accompanying drawings. It is hereby declared that the terms "up," "down," "left," "right," "front," "back," "inner," and "outer," etc., appearing or about to appear in this document, are based solely on the accompanying drawings and are not intended to specifically limit this utility model.
[0023] The LED chip fixing device of this invention can ensure the relative position between the chip and the material tray 1, improve the material picking accuracy and success rate of the production equipment, and reduce chip loss.
[0024] In one specific embodiment of this utility model, such as Figures 1 to 3 As shown, the LED chip fixing device includes a tray 1 and a fixing base 2. The tray 1 has a placement groove 11 for placing chips to ensure that the LED display production equipment can accurately position the chips through the tray 1. The tray 1 has a notch 12, and the fixing base 2 is disposed in the notch 12. A clamping block 21 is provided at one end of the fixing base 2 facing the placement groove 11. The clamping block 21 has a clamping surface 211 on the side facing the placement groove 11. The clamping block 21 is adapted to move relative to the fixing base 2 so that the clamping surface 211 extends into the placement groove 11 or moves away from the placement groove 11.
[0025] According to the LED chip fixing device of this embodiment, before placing the chip in the placement slot 11 of the material tray 1, the clamping block 21 can be moved relative to the fixing base 2 to move the clamping surface 211 of the clamping block 21 away from the placement slot 11; then the chip is placed in the placement slot 11, and the clamping block 21 is moved relative to the fixing base 2 so that the clamping surface 211 of the clamping block 21 extends into the placement slot 11, so as to use the clamping surface 211 to press the chip in the placement slot 11, avoid the chip's position in the material tray 1 from changing or rotating, ensure the relative position between the chip and the material tray 1, improve the material picking accuracy and success rate of the production equipment, and reduce chip loss.
[0026] To facilitate the clamping surface 211 of the clamping block 21 extending into or away from the placement groove 11, the clamping block 21 and the fixing base 2 can be connected in the following ways:
[0027] The first connection method, such as Figure 2 and Figure 3 As shown, a groove 22 is formed at the end of the fixing base 2 facing the placement groove 11. The clamping block 21 is slidably disposed in the groove 22. A first reset member 23 is arranged between the side of the clamping block 21 away from the placement groove 11 and the inner wall of the groove 22. The first reset member 23 is used to push the clamping block 21 to move towards the placement groove 11. When it is necessary to insert a chip, the clamping block 21 can be slid away from the placement groove 11, so that the clamping surface 211 of the clamping block 21 moves away from the placement groove 11, and the first reset member 23 is compressed and stored. After the chip is inserted, the clamping block 21 is released, so that the clamping block 21 is pushed towards the placement groove 11 under the reset force of the first reset member 23, so that the clamping surface 211 of the clamping block 21 extends into the placement groove 11, so that the reset force of the first reset member 23 can be used to ensure the clamping effect of the clamping surface 211 on the chip.
[0028] In the second connection method, the fixing base 2 has a rotating hole, and the clamping block 21 has a rotating shaft. The rotating shaft is rotatably connected to the rotating hole, and a second reset member (not shown in the figure) is sleeved on the rotating shaft. The second reset member is used to push the clamping block 21 to move towards the placement slot 11. When it is necessary to place the chip, the clamping block 21 can be rotated away from the placement slot 11, so that the clamping surface 211 of the clamping block 21 rotates away from the placement slot 11, and the second reset member stores energy. After the chip is placed, the clamping block 21 rotates towards the placement slot 11 under the reset force of the second reset member, so that the clamping surface 211 of the clamping block 21 rotates into the placement slot 11, so that the reset force of the second reset member can ensure the clamping effect of the clamping surface 211 on the chip.
[0029] Specifically, such as Figure 3 As shown, the first reset element 23 is one or more of an elastic element or a magnetic element. Preferably, the first reset element 23 is a compression spring. One end of the first reset element 23 is connected to the clamping block 21, and the other end is connected to the inner wall of the slide groove 22, so that the rebound force of the compression spring ensures the clamping effect of the clamping surface 211 on the chip. Of course, the first reset element 23 can also be a disc spring or a gas spring, or other elastic elements, which can be selected according to actual needs.
[0030] Alternatively, the first reset component 23 can also be a permanent magnet assembly, with one permanent magnet bonded to the clamping block 21 and the other permanent magnet bonded to the inner wall of the slide groove 22. The magnetic poles of the two permanent magnets are arranged in a magnetically repulsive manner to ensure the clamping effect of the clamping surface 211 on the chip using the repulsive force between the two permanent magnets. Preferably, when the first reset component 23 is a permanent magnet assembly, the length of the slide groove 22 must ensure that the permanent magnets fixed to it completely cover the slide groove 22.
[0031] The second reset element is an elastic element, preferably a torsion spring, which is sleeved on the rotating shaft to ensure the pressing effect of the pressing surface 211 on the chip by utilizing the rebound force of the torsion spring.
[0032] In this embodiment, the clamping block 21 and the fixed base 2 preferably adopt the first connection method, and the first reset member 23 is preferably a compression spring.
[0033] Among them, such as Figure 2 and Figure 3 As shown, the fixed seat 2 includes a base 24 and a cover plate 25. The base 24 is detachably connected to the bottom wall of the notch 12. The base 24 and the cover plate 25 are detachably connected. A sliding groove 22 is formed between the base 24 and the cover plate 25 to improve the ease of installation of the fixed seat 2 on the material tray 1. At the same time, it is convenient to use the cover plate 25 and the base 24 to limit the clamping block 21 and ensure the sliding stability of the clamping block 21 in the sliding groove 22.
[0034] Specifically, such as Figure 3As shown, a connecting hole is formed on the cover plate 25, and a corresponding threaded hole is formed on the base 24. When installing the base 24 and the cover plate 25, bolts or studs can be inserted into the connecting hole and the threaded hole in sequence and threadedly connected to the bottom wall of the notch 12 to realize the connection between the base 24 and the cover plate 25, and the fixing seat 2 is installed on the material tray 1.
[0035] In this embodiment, as Figure 2 and Figure 3 As shown, the pressing surface 211 is arranged to be inclined downward toward the placement groove 11. When pressing the chip, the inclined pressing surface 211 will apply horizontal and vertical components to the chip. The horizontal component can push the chip to press against the internal reference surface of the placement groove 11 to ensure the chip position is accurate. At the same time, the vertical separation can suppress the warping or vibration of the chip during the pressing process, thereby further preventing the chip from falling out of the placement groove 11.
[0036] Furthermore, a buffer pad (not shown in the figure) is arranged on the pressing surface 211 to provide cushioning protection for the chip and the pressing surface 211 when the pressing surface 211 presses the chip, preventing damage to the brittle chip. The buffer pad is, for example, a rubber pad or a silicone pad, and is attached to the pressing surface 211 by adhesive. The thickness of the buffer pad is 0.5mm-2mm to ensure both cushioning effect and that the pressing force of the pressing surface 211 can be applied to the chip.
[0037] In other embodiments, to further improve the stability of the movement between the fixed base 2 and the clamping block 21, such as... Figure 3 As shown, the mounting base 2 has a limiting part 26, which is located on the movement path of the mounting base 2 and close to the placement groove 11. The limiting part 26 limits the clamping block 21 when it extends into the placement groove 11, ensuring that the clamping block 21 can apply stable pressure to the chip without overloading it, further protecting the chip from damage during clamping. The limiting part 26 can be a fixing baffle formed on the side of the mounting base 2. When the clamping block 21 is slidably arranged in the groove 22 of the mounting base 2, the end of the groove 22 is located within the fixing baffle.
[0038] In this embodiment, as Figure 1 As shown, the tray 1 is formed with a gripping groove 13 so that the chip can be placed or removed by using the gripping groove 13, ensuring the convenience of chip placement or removal.
[0039] In another embodiment of this utility model, a magnetic guide (not shown in the figure) is provided at the bottom of the material tray 1. The shape of the magnetic guide is consistent with the bottom shape of the material tray 1, so that the magnetic guide can cooperate with the magnetic components in the production equipment to ensure the positioning accuracy of the material tray 1 in the production equipment and avoid changes in the position of the material tray 1, thereby improving the success rate of the picking equipment in picking up the chips in the material tray 1. The magnetic guide is preferably made of stainless steel or other magnetically conductive metal sheet, so as to utilize the high permeability of the magnetic guide to improve the stability of the cooperation between the material tray 1 and the magnetic components and avoid changes in the position of the material tray 1.
[0040] The above description is the preferred embodiment of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this invention, and these improvements and modifications are also considered to be within the protection scope of this utility model.
Claims
1. An LED chip fixing device, characterized in that, include: The tray has slots for placing chips. A fixed base is provided at the notch of the material tray; a pressing block is provided at one end of the fixed base facing the placement groove, and a pressing surface is formed on one side of the pressing block facing the placement groove. The pressing block is adapted to move relative to the fixed base so that the pressing surface extends into the placement groove or moves away from the placement groove.
2. The LED chip fixing device according to claim 1, characterized in that, The fixed base has a sliding groove at one end facing the placement groove, the clamping block is slidably disposed in the sliding groove, and a first reset member is arranged between the side of the clamping block away from the placement groove and the inner wall of the sliding groove. Alternatively, the fixing seat has a rotating hole, the clamping block has a rotating shaft, the rotating shaft is rotatably connected to the rotating hole, and the rotating shaft is sleeved with a second reset member; The first reset member and the second reset member are used to push the clamping block to move into the placement slot.
3. The LED chip fixing device according to claim 2, characterized in that, The first reset element is one or more of an elastic element or a magnetic element; the second reset element is an elastic element.
4. The LED chip fixing device according to claim 2, characterized in that, The fixing seat includes a base and a cover plate. The base is detachably connected to the bottom wall of the notch. The base and the cover plate are detachably connected. The sliding groove is formed between the base and the cover plate.
5. The LED chip fixing device according to claim 1, characterized in that, The pressing surface is arranged at a downward angle toward the placement groove.
6. The LED chip fixing device according to claim 5, characterized in that, The pressing surface is provided with a cushioning pad.
7. The LED chip fixing device according to claim 1, characterized in that, The fixed seat forms a limiting part, which is located on the movement path of the fixed seat and is close to the placement groove.
8. The LED chip fixing device according to claim 1, characterized in that, The tray has gripping grooves.
9. The LED chip fixing device according to claim 1, characterized in that, A magnetic conductor is provided at the bottom of the tray, and the shape of the magnetic conductor is consistent with the bottom shape of the tray.