Air energy triple supply room temperature control system

By connecting the room thermostat module to the main control board unit via POWERBUS communication mode, the problem of uneven room temperature control in the air source triple heat pump system is solved, realizing individual adjustment and constant comfort temperature for each room, and simplifying installation and operation.

CN224567516UActive Publication Date: 2026-07-28GUANGDONG ORIENTAL SUNRISE AIR ENERGY +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
GUANGDONG ORIENTAL SUNRISE AIR ENERGY
Filing Date
2025-07-25
Publication Date
2026-07-28

AI Technical Summary

Technical Problem

Existing air-source heat pump systems struggle to achieve individual room temperature control, resulting in uneven comfort levels.

Method used

The room thermostat module, which uses the POWERBUS communication mode, communicates with the main control board unit. Each room uses two wires for power supply and communication. The main control board is linked to the TFT main controller to achieve interconnection between the main control and the sub-control, making it easy for users to operate.

Benefits of technology

It enables individual room temperature adjustment and control, achieving a comfortable and constant temperature effect. Installation and wiring are simple and user-friendly.

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Abstract

The utility model discloses a room temperature control system of air energy triple combination, its characteristic main control board control unit, TFT main line controller, carrier wave communication switching unit, room temperature controller module, temperature sensor module, electric quantity detection module, frequency conversion drive module and room electromagnetic valve. Its advantage is that every room temperature is adjusted separately, and the comfortable constant temperature effect is reached, and the room temperature controller module and host computer adopt POWERBUS communication mode, and every room is powered and communicated with two wires, and the installation wiring connection is simple; every room temperature controller module communicates with the main control board unit through the POWERBUS communication mode, and is connected to the TFT main line controller linkage through the main control board, and the main control and the sub-control interconnection are reached, and the user operation control is convenient and simple.
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Description

Technical Field

[0001] This utility model relates to an air-source heat pump tri-generation room temperature control system. Background Technology

[0002] With the continuous improvement of people's living standards and the constant emergence of new energy products, air source heat pumps, with their energy-saving and efficiency-enhancing features, have become widely used in ordinary households. In particular, the air source triple-heat pump system can provide hot water, heating, and cooling, replacing air conditioning and achieving multiple functions in one unit. However, a triple-heat pump system needs to supply heating and cooling to multiple rooms. Due to the different volumes of each room, it is difficult to achieve balanced and comfortable control, so individual room temperature control is required for each room. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of existing technologies and provide an air-source heat pump tri-generation room temperature control system. In this control system, the room temperature of each room is individually adjusted and controlled to achieve a comfortable and constant temperature effect. The room thermostat module and the main unit use the POWERBUS communication mode. Each room uses two wires for power supply and communication, without distinguishing the wire sequence, making installation, wiring, and connection simple. Each room thermostat module communicates with the main control board unit through the POWERBUS communication method, and is linked to the TFT main controller through the main control board, achieving interconnection and interoperability between the main control and sub-control, making user operation and control convenient and simple.

[0004] To achieve the above objectives, this utility model is implemented as follows: it is mainly an air-source heat pump room temperature control system, which includes a main control board control unit, a TFT main controller, a carrier communication adapter unit, a room thermostat module, a temperature sensor module, a power detection module, a frequency converter drive module, and a room solenoid valve.

[0005] Pins 26, 27, and 28 of the MCU in the main control board control unit are electrically connected to the TFT main controller for operation control functions and display system information, respectively.

[0006] Pins 57, 58, and 59 of the MCU are electrically connected to the carrier communication conversion unit for transmitting and receiving 485 information communication. The carrier communication conversion unit converts the 485 communication into POWERBUS bus communication.

[0007] Pins 63, 64, and 65 of the MCU are electrically connected to the power detection module for detecting and collecting power consumption data.

[0008] Pins 60, 61, and 62 of the MCU are electrically connected to the frequency converter drive module and are used for functional control of the frequency converter compressor drive board.

[0009] The MCU's pins 4, 6, and 21 are electrically connected to relays, which are respectively electrically connected to the solenoid valves of the three rooms to control the switching of the solenoid valves.

[0010] The POWERBUS bus of the carrier communication switching unit is wired to the room thermostat module for transmitting and receiving relevant data, as well as displaying and operating related functions.

[0011] The room thermostat module is electrically connected to the temperature sensor module to receive temperature information;

[0012] Pin 26 of the MCU is electrically connected to one end of the first capacitor C47, the other end of the first capacitor C47 is electrically connected to one end of the inductor L1, and the other end of the inductor L1 is electrically connected to the power supply ground; pins 18 and 17 of the MCU are electrically connected to the power supply +5V and ground GND, and the second capacitor C11 is electrically connected to the power supply +5V and ground GND.

[0013] Pin 9 of the MCU is electrically connected to one end of the first resistor R10, and the other end of the first resistor R10 is electrically connected to the +5V power supply; Pin 10 of the MCU is electrically connected to one end of the second capacitor C12, one end of the second resistor R9, and the positive terminal of the diode D7, the other end of the second capacitor C12 is grounded, the other end of the second resistor R9 is electrically connected to the +5V power supply, and the negative terminal of the diode D7 is electrically connected to the +5V power supply; Pin 27 of the MCU is electrically connected to one end of the third resistor R23 and pin 4 of the second chip, and the other end of the third resistor R23 is electrically connected to the +5V power supply; Pin 28 of the MCU is electrically connected to one end of the fourth resistor R24 ​​and pin 1 of the second chip, and the other end of the fourth resistor R24 ​​is electrically connected to the +5V power supply. Pin 26 of the MCU is electrically connected to one end of the fifth resistor R25 and pins 2 and 3 of the second chip; the other end of the fifth resistor R34 is electrically connected to the power supply ground (GND). Pins 8 and 5 of the second chip are electrically connected to the power supply +5V and ground (GND); pins 6 and 7 of the second chip are electrically connected to the TFT main controller. Pin 57 of the MCU is electrically connected to one end of the sixth resistor R32 and pin 4 of the third chip; the other end of the sixth resistor R32 is electrically connected to the power supply +5V. Pin 58 of the MCU is electrically connected to one end of the seventh resistor R33 and pin 1 of the third chip; the other end of the seventh resistor R33 is electrically connected to the power supply +5V. Pin 59 of the MCU is electrically connected to one end of the eighth resistor R34 and pins 2 and 3 of the third chip. The other end of R34 is electrically connected to the power supply ground (GND); pins 8 and 5 of the third chip are electrically connected to the power supply +5V and ground (GND), and pins 6 and 7 of the third chip are electrically connected to the carrier communication conversion unit; pin 64 of the MCU is electrically connected to one end of the ninth resistor R29 and pin 4 of the fourth chip, and the other end of the ninth resistor R29 is electrically connected to the power supply +5V; pin 65 of the MCU is electrically connected to one end of the tenth resistor R30 and pin 1 of the fourth chip, and the other end of the tenth resistor R30 is electrically connected to the power supply +5V; pin 63 of the MCU is electrically connected to one end of the eleventh resistor R31 and pins 2 and 3 of the fourth chip, and the other end of the eleventh resistor R31 is electrically connected to the power supply ground (GND); pins 8 and 5 of the fourth chip are electrically connected to the power supply +5V. The MCU's pin 60 is electrically connected to ground (GND). Pins 6 and 7 of the fourth chip are electrically connected to the power detection module. Pin 60 of the MCU is electrically connected to one end of the twelfth resistor R26 and pin 4 of the fifth chip. The other end of the twelfth resistor R26 is electrically connected to the +5V power supply. Pin 61 of the MCU is electrically connected to one end of the thirteenth resistor R27 and pin 1 of the fifth chip. The other end of the thirteenth resistor R27 is electrically connected to the +5V power supply. Pin 62 of the MCU is electrically connected to one end of the fourteenth resistor R28 and pins 2 and 3 of the fifth chip. The other end of the fourteenth resistor R28 is electrically connected to ground (GND). Pins 8 and 5 of the fifth chip are electrically connected to the +5V power supply and ground (GND). Pins 6 and 7 of the fifth chip are electrically connected to the frequency converter drive module.

[0014] In this technical solution, the room thermostat module includes a POWERBUS bus communication component, a display component, a button component, and a temperature sensor component.

[0015] In this technical solution, the TFT main controller includes a WIFI communication component, a 4G communication component, an RS485 communication component, and a display button component.

[0016] The advantages of this invention compared to existing technologies are as follows: In this control system, the room temperature of each room can be adjusted and controlled independently to achieve a comfortable and constant temperature effect. The room thermostat module and the main unit adopt the POWERBUS communication mode. Each room uses two wires for power supply and communication, without distinguishing the wire sequence, making installation, wiring and connection simple. Each room thermostat module communicates with the main control board unit through the POWERBUS communication method, and is linked to the TFT main controller through the main control board, achieving interconnection and interoperability between the main control and sub-control, making user operation and control convenient and simple. Attached Figure Description

[0017] Figure 1 This is a block diagram of the control system of this utility model;

[0018] Figure 2 This is the circuit schematic diagram of the main control unit of this utility model;

[0019] Figure 3 This is a circuit diagram showing the main control unit of this utility model connecting the TFT main controller, the carrier communication adapter, the power detection module, and the frequency conversion drive module.

[0020] Figure 4 This is a block diagram of the room thermostat module and the TFT main controller module of this utility model. Detailed Implementation

[0021] The specific embodiments of this utility model will be further described below with reference to the accompanying drawings. It should be noted that these descriptions are for the purpose of aiding understanding of this utility model, but do not constitute a limitation thereof. Furthermore, the technical features involved in the various embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0022] In this description of the utility model, the terms "one end", "the other end", "upper" and "bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the utility model and do not require the utility model to be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the utility model.

[0023] In this utility model, unless otherwise explicitly specified and limited, the terms "set up," "connect," and "install," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, a detachable set, or an integral part; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0024] like Figures 1 to 3 As shown, an air-source heat pump tri-generation room temperature control system is characterized by including a main control board control unit 1, a TFT main controller 2, a carrier communication adapter unit 3, a room thermostat module 4, a temperature sensor module 5, a power detection module 6, a frequency converter drive module 7, and a room solenoid valve 8.

[0025] Pins 26, 27, and 28 of the MCU in the main control board control unit 1 are electrically connected to the TFT main controller 2 for operation control functions and display system information.

[0026] Pins 57, 58, and 59 of the MCU are electrically connected to the carrier communication conversion unit 3 for transmitting and receiving 485 information communication. The carrier communication conversion unit converts the 485 communication into POWERBUS bus communication.

[0027] Pins 63, 64, and 65 of the MCU are electrically connected to the power detection module 6 for detecting and collecting power consumption data.

[0028] Pins 60, 61, and 62 of the MCU are electrically connected to the frequency converter drive module 7 and are used for functional control of the frequency converter compressor drive board.

[0029] The MCU's pins 4, 6, and 21 are electrically connected to relays, which are respectively electrically connected to the three room solenoid valves 8 to control the switching of the solenoid valves;

[0030] The POWERBUS bus of the carrier communication switching unit 3 is wired to the room thermostat module 4 for transmitting and receiving relevant data, as well as displaying and operating related functions.

[0031] The room thermostat module 4 is electrically connected to the temperature sensor module 5 and is used to receive temperature information.

[0032] Pin 26 of the MCU is electrically connected to one end of the first capacitor C47, the other end of the first capacitor C47 is electrically connected to one end of the inductor L1, and the other end of the inductor L1 is electrically connected to the power supply ground; pins 18 and 17 of the MCU are electrically connected to the power supply +5V and ground GND, and the second capacitor C11 is electrically connected to the power supply +5V and ground GND.

[0033] Pin 9 of the MCU is electrically connected to one end of the first resistor R10, and the other end of the first resistor R10 is electrically connected to the +5V power supply; Pin 10 of the MCU is electrically connected to one end of the second capacitor C12, one end of the second resistor R9, and the positive terminal of the diode D7, with the other end of the second capacitor C12 grounded, the other end of the second resistor R9 connected to the +5V power supply, and the negative terminal of the diode D7 connected to the +5V power supply; Pin 27 of the MCU is electrically connected to one end of the third resistor R23 and pin 4 of the second chip, with the other end of the third resistor R23 connected to the +5V power supply; Pin 28 of the MCU is electrically connected to one end of the fourth resistor R24 ​​and pin 1 of the second chip, with the other end of the fourth resistor R24 ​​connected to the +5V power supply; M Pin 26 of the MCU is electrically connected to one end of the fifth resistor R25 and pins 2 and 3 of the second chip; the other end of the fifth resistor R34 is electrically connected to the power supply ground (GND). Pins 8 and 5 of the second chip are electrically connected to the power supply +5V and ground (GND); pins 6 and 7 of the second chip are electrically connected to the TFT main controller 2. Pin 57 of the MCU is electrically connected to one end of the sixth resistor R32 and pin 4 of the third chip; the other end of the sixth resistor R32 is electrically connected to the power supply +5V. Pin 58 of the MCU is electrically connected to one end of the seventh resistor R33 and pin 1 of the third chip; the other end of the seventh resistor R33 is electrically connected to the power supply +5V. Pin 59 of the MCU is electrically connected to one end of the eighth resistor R34 and pins 2 and 3 of the third chip. The other end of pin 34 is electrically connected to the power supply ground (GND); pins 8 and 5 of the third chip are electrically connected to the power supply +5V and ground (GND), and pins 6 and 7 of the third chip are electrically connected to the carrier communication adapter unit 3; pin 64 of the MCU is electrically connected to one end of the ninth resistor R29 and pin 4 of the fourth chip, and the other end of the ninth resistor R29 is electrically connected to the power supply +5V; pin 65 of the MCU is electrically connected to one end of the tenth resistor R30 and pin 1 of the fourth chip, and the other end of the tenth resistor R30 is electrically connected to the power supply +5V; pin 63 of the MCU is electrically connected to one end of the eleventh resistor R31 and pins 2 and 3 of the fourth chip, and the other end of the eleventh resistor R31 is electrically connected to the power supply ground (GND); pins 8 and 5 of the fourth chip are electrically connected to the power supply +5V... The fourth chip's pins 6 and 7 are electrically connected to the power detection module 6, respectively. The MCU's pin 60 is electrically connected to one end of the twelfth resistor R26 and pin 4 of the fifth chip, while the other end of the twelfth resistor R26 is electrically connected to the +5V power supply. The MCU's pin 61 is electrically connected to one end of the thirteenth resistor R27 and pin 1 of the fifth chip, while the other end of the thirteenth resistor R27 is electrically connected to the +5V power supply. The MCU's pin 62 is electrically connected to one end of the fourteenth resistor R28 and pins 2 and 3 of the fifth chip, while the other end of the fourteenth resistor R28 is electrically connected to the power ground (GND). The fifth chip's pins 8 and 5 are electrically connected to the +5V power supply and GND, respectively. The fifth chip's pins 6 and 7 are electrically connected to the frequency converter drive module 7, respectively.

[0034] In this embodiment, the carrier communication switching unit 3 can be connected to the room thermostat module 4 to collect and control the temperature of each room.

[0035] In this embodiment, the room thermostat module 4 includes a POWERBUS bus communication component, a display component, a button component, and a temperature sensor component.

[0036] In this embodiment, the TFT main controller 2 includes a WIFI communication component, a 4G communication component, an RS485 communication component, and a display button component.

[0037] In this embodiment, the main control board control unit 1 includes electrical connections to the power detection module, the frequency converter drive module, and the room solenoid valve control.

[0038] In the control system, the room temperature of each room is individually adjusted and controlled to achieve a comfortable and constant temperature effect. The room thermostat module 4 communicates with the main unit via POWERBUS. Each room uses two wires for power supply and communication, without distinguishing the wire sequence, making installation, wiring, and connection simple. Each room thermostat module communicates with the main control board unit via POWERBUS communication, and is linked to the TFT main controller through the main control board, achieving interconnection between the main control and sub-control, making user operation and control convenient and simple.

[0039] After the room thermostat module 4 collects the temperature data from the temperature sensor module 5, it sends the data back to the carrier communication conversion unit 3 via POWERBUS communication. After being converted to 485 communication, the data is sent back to the main control board unit 1. The main control board unit controls the opening and closing of the room solenoid valve through a relay, thereby achieving the function of controlling the room temperature.

[0040] Meanwhile, the real-time temperature of each room can be viewed through the TFT main controller, and the temperature of each room can be controlled through the main controller, achieving interconnected control and information exchange.

[0041] Meanwhile, OTA remote upgrade functionality can be achieved through the wireless communication WIFI or 4G component of the TFT main controller.

[0042] In this example, the carrier communication switching unit can be connected to the room thermostat module to collect and control the temperature of each room.

[0043] In this example, the room thermostat module includes a POWERBUS bus communication component, a display component, a button component, and a temperature sensor component.

[0044] In this example, the air-source heat pump tri-generation room temperature control system is characterized in that the TFT main controller includes a WIFI communication component, a 4G communication component, an RS485 communication component, and a display button component.

[0045] The embodiments of this utility model have been described in detail above with reference to the accompanying drawings, but this utility model is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions, and variations of these embodiments without departing from the principles and spirit of this utility model still fall within the protection scope of this utility model.

Claims

1. A tri-generation air-source heat pump room temperature control system, characterized in that... It includes a main control board control unit (1), a TFT main line controller (2), a carrier communication adapter unit (3), a room thermostat module (4), a temperature sensor module (5), a power detection module (6), a frequency converter drive module (7), and a room solenoid valve (8). Pins 26, 27 and 28 of the MCU of the main control board control unit (1) are electrically connected to the TFT main controller (2) for operation control functions and display system information. Pins 57, 58 and 59 of the MCU are electrically connected to the carrier communication conversion unit (3) for transmitting and receiving 485 information communication. The carrier communication conversion unit converts the 485 communication into POWERBUS bus communication. Pins 63, 64, and 65 of the MCU are electrically connected to the power detection module (6) for detecting and collecting power consumption data. Pins 60, 61 and 62 of the MCU are electrically connected to the frequency converter drive module (7) for functional control with the frequency converter compressor drive board; The MCU's pins 4, 6, and 21 are electrically connected to relays, which are respectively electrically connected to three room solenoid valves (8) to control the switching of the solenoid valves; The POWERBUS bus of the carrier communication switching unit (3) is wired to the room thermostat module (4) for transmitting and receiving relevant data and displaying and operating related functions; The room thermostat module (4) is electrically connected to the temperature sensor module (5) to receive temperature information; Pin 26 of the MCU is electrically connected to one end of the first capacitor C47, and the other end of the first capacitor C47 is electrically connected to one end of the inductor L1. The other end of the inductor L1 is electrically connected to the power supply ground. Pins 18 and 17 of the MCU are electrically connected to the +5V power supply and GND ground. The second capacitor C11 is electrically connected to the +5V power supply and GND ground. Pin 9 of the MCU is electrically connected to one end of the first resistor R10, and the other end of the first resistor R10 is electrically connected to the +5V power supply. Pin 10 of the MCU is electrically connected to one end of the second capacitor C12, one end of the second resistor R9, and the positive terminal of the diode D7. The other end of the second capacitor C12 is grounded, the other end of the second resistor R9 is electrically connected to the +5V power supply, and the negative terminal of the diode D7 is connected to the +5V power supply. Electrical connections: Pin 27 of the MCU is electrically connected to one end of the third resistor R23 and pin 4 of the second chip; the other end of the third resistor R23 is electrically connected to the +5V power supply; Pin 28 of the MCU is electrically connected to one end of the fourth resistor R24 ​​and pin 1 of the second chip; the other end of the fourth resistor R24 ​​is electrically connected to the +5V power supply; Pin 26 of the MCU is electrically connected to one end of the fifth resistor R25 and pins 2 and 3 of the second chip; the other end of the fifth resistor R34 is electrically connected to the ground GND power supply; Pins 8 and 5 of the second chip are electrically connected to the +5V power supply and ground GND power supply; Pins 6 and 7 of the second chip are electrically connected to the TFT main controller (2); Pin 57 of the MCU is electrically connected to one end of the sixth resistor R32 and pin 4 of the third chip; the sixth resistor R32 is electrically connected to one end of the sixth resistor R32 and pin 4 of the third chip; the sixth resistor R32 is electrically connected to one end of the third chip and pin 4 of the second chip; the second pin 28 of the MCU is electrically connected to one end of the fourth resistor R24 ​​and pin 1 of the second chip; the other end of the fourth resistor R24 ​​is electrically connected to the +5V power supply; the second pin 28 of the MCU is electrically connected to one end of the fourth resistor R24 ​​and pin 1 of the second chip; the second pin 28 of the MCU is electrically connected to one end of the fourth resistor R24 ​​and pin 1 of the second chip; the second pin 28 of the MCU is electrically connected to one end of the fifth resistor R25 and pins 2 and 3 of the second chip; the other end of the fifth resistor R34 is electrically connected to the ground GND power supply; Pins 8 and 5 of the second chip are electrically connected to the +5V power supply and ground GND power supply; the second pin 6 and 7 of the second chip are electrically connected The other end of resistor R32 is electrically connected to the +5V power supply; pin 58 of the MCU is electrically connected to one end of the seventh resistor R33 and pin 1 of the third chip, and the other end of the seventh resistor R33 is electrically connected to the +5V power supply; pin 59 of the MCU is electrically connected to one end of the eighth resistor R34 and pins 2 and 3 of the third chip, and the other end of the eighth resistor R34 is electrically connected to the ground GND; pins 8 and 5 of the third chip are electrically connected to the +5V power supply and ground GND, and pins 6 and 7 of the third chip are electrically connected to the carrier communication adapter unit (3); pin 64 of the MCU is electrically connected to one end of the ninth resistor R29 and pin 4 of the fourth chip, and the other end of the ninth resistor R29 is electrically connected to the +5V power supply; pin 65 of the MCU is electrically connected to one end of the tenth resistor R30. The fourth chip's pin 1 is electrically connected, and the other end of the tenth resistor R30 is electrically connected to the +5V power supply; the MCU's pin 63 is electrically connected to one end of the eleventh resistor R31 and pins 2 and 3 of the fourth chip, and the other end of the eleventh resistor R31 is electrically connected to the power supply ground GND; the fourth chip's pins 8 and 5 are electrically connected to the power supply +5V and ground GND, and the fourth chip's pins 6 and 7 are electrically connected to the power detection module (6); the MCU's pin 60 is electrically connected to one end of the twelfth resistor R26 and pin 4 of the fifth chip, and the other end of the twelfth resistor R26 is electrically connected to the power supply +5V; the MCU's pin 61 is electrically connected to one end of the thirteenth resistor R27 and pin 1 of the fifth chip, and the other end of the thirteenth resistor R27 is electrically connected to the power supply +5V.Pin 62 of the MCU is electrically connected to one end of the fourteenth resistor R28 and pins 2 and 3 of the fifth chip. The other end of the fourteenth resistor R28 is electrically connected to the power ground GND. Pins 8 and 5 of the fifth chip are electrically connected to the power supply +5V and ground GND. Pins 6 and 7 of the fifth chip are electrically connected to the frequency converter drive module (7).

2. The air-source heat pump tri-generation room temperature control system according to claim 1, characterized in that... The room thermostat module (4) includes a POWERBUS bus communication component, a display component, a button component, and a temperature sensor component.

3. The air-source heat pump room temperature control system according to claim 1, characterized in that... The TFT main controller (2) includes a WIFI communication component, a 4G communication component, an RS485 communication component, and a display button component.

4. The air-source heat pump room temperature control system according to claim 1, characterized in that... The main control board control unit (1) includes electrical connections to the power detection module, the frequency converter drive module, and the room solenoid valve control.