High-voltage LED package structure and display screen

Abstract

This application relates to the field of chip packaging, and in particular to a high-voltage LED packaging structure and display screen. The high-voltage LED packaging structure includes a pad assembly, a chip assembly, and a packaging layer. The chip assembly includes multiple LED chips, which form a series branch. The bottom of the multiple LED chips is connected to the pad assembly. The packaging layer wraps around the pad assembly and the multiple LED chips, filling the gaps between them, and exposing the light-emitting surface of the LED chips and the lead surface of the pad assembly. This application reduces costs by directly connecting the bottom of the series-connected LED chips to the pad assembly, using the pad assembly to replace the high-cost ceramic substrate. The pad assembly has a large current-carrying area, improving the LED chip mounting yield and heat dissipation. Furthermore, the packaging layer supports and fixes the LED chips and the pad assembly, providing physical protection and insulation.

Description

Technical Field

[0001] This application relates to the field of chip packaging, and in particular to a high-voltage LED packaging structure and display screen. Background Technology

[0002] LED packaging refers to the encapsulation of the light-emitting chip, with the aim of providing sufficient protection for the chip.

[0003] Currently, high-power LED packaging typically involves mounting the light-emitting chip onto a ceramic substrate, on which circuitry is designed to electrically connect the chip. Existing structures suffer from problems such as large size, excessive thickness, and high production costs. Utility Model Content

[0004] The purpose of this application is to provide a high-voltage LED packaging structure and display screen to solve the problems of large size, thickness and high production cost of existing high-power LED packaging structures.

[0005] This application provides a high-voltage LED packaging structure, including a pad assembly, a chip assembly, and a packaging layer; The chip assembly includes multiple LED chips, and the multiple LED chips form a series branch; the bottom of the multiple LED chips is connected to the pad assembly; The encapsulation layer encapsulates the pad assembly and the plurality of LED chips, and fills the gap between the pad assembly and the plurality of LED chips, and the encapsulation layer exposes the light-emitting surface of the top of the LED chip and the pin surface of the pad assembly.

[0006] In the above technical solution, the pad assembly further includes a first polarity pad and a second polarity pad, wherein the first polarity pad and the second polarity pad are spaced apart. The first polarity terminal of the series branch is connected to the first polarity pad, and the second polarity terminal of the series branch is connected to the second polarity pad. From a view facing the light-emitting surface of the chip assembly, the area ratio of the pad assembly to the area of ​​the encapsulation layer is 60%~98%.

[0007] In the above technical solution, the pad assembly further includes connecting pads; In the series branch, a connecting pad is provided between two adjacent LED chips; The connecting pads are spaced apart from the first polarity pads and the second polarity pads; and when there are multiple connecting pads, adjacent connecting pads are spaced apart.

[0008] In the above technical solution, the multiple LED chips further form multiple series branches, and the multiple series branches are arranged in parallel between the first polarity pad and the second polarity pad.

[0009] In the above technical solution, further, the plurality of series branches are arranged at intervals along the first direction; In the series branch, a plurality of LED chips are spaced apart along the second direction; The first direction is perpendicular to the second direction.

[0010] In the above technical solution, the connecting pads, the first polarity pads, and the second polarity pads are arranged to form a rectangular outer contour.

[0011] In the above technical solution, the LED chip further includes a light-emitting part, a connecting part, and a reflective cup; The connection portion includes a first electrode and a second electrode with opposite polarities. The first electrode and the second electrode are connected to the light-emitting portion, and the first electrode and the second electrode are connected to the pad assembly. The reflective bowl is arranged around the circumference of the light-emitting part to reflect the light emitted from the side of the light-emitting part towards the top.

[0012] In the above technical solution, the encapsulation layer is further described as a high-reflectivity white adhesive layer.

[0013] In the above technical solution, a fluorescent layer is further included; the top surface of the encapsulation layer is flush with the light-emitting surface of the chip assembly, and the fluorescent layer covers the top surface of the encapsulation layer and the light-emitting surface of the chip assembly.

[0014] This application also provides a display screen, including the high-voltage LED packaging structure described above.

[0015] Compared with the prior art, the beneficial effects of this application are as follows: The high-voltage LED packaging structure provided in this application connects multiple LED chips connected in series directly to a pad assembly at their bottom, thereby reducing costs by replacing the high-cost ceramic substrate with the pad assembly. The pad assembly has a large current-carrying area, which improves the LED chip mounting yield. Even with a large overall heat generation from multiple LED chips, the pad assembly provides good heat dissipation. Furthermore, the packaging layer supports and fixes the LED chips and the pad assembly, providing physical protection and insulation.

[0016] This application also provides a display screen, including the high-voltage LED packaging structure described above. Based on the above analysis, it is clear that the display screen also possesses the aforementioned beneficial effects, which will not be elaborated upon further here. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 This is a first structural schematic diagram of the high-voltage LED packaging structure provided in this application; Figure 2 This is a second structural schematic diagram of the high-voltage LED packaging structure provided in this application; Figure 3 This is a third structural diagram of the high-voltage LED packaging structure provided in this application; Figure 4 This is a fourth structural diagram of the high-voltage LED packaging structure provided in this application; Figure 5 This is a fifth structural schematic diagram of the high-voltage LED packaging structure provided in this application; Figure 6 The sixth structural diagram of the high-voltage LED packaging structure provided in this application; Figure 7 The seventh structural diagram is shown for the high-voltage LED packaging structure provided in this application.

[0019] In the figure: 101-Pad assembly; 102-Encapsulation layer; 103-LED chip; 104-First polarity pad; 105-Second polarity pad; 106-Connecting pad; 107-Light-emitting part; 108-Connecting part; 109-Reflective cup; 110-First electrode; 111-Second electrode; 112-Fluorescent layer. Detailed Implementation

[0020] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0021] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] In the description of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0023] Example 1 See Figures 1 to 7 As shown, the high-voltage LED packaging structure provided in this application includes a pad assembly 101, a chip assembly, and a packaging layer 102.

[0024] The chip assembly includes multiple LED chips 103. To reduce the overall thickness of the device, this application eliminates the ceramic substrate structure and directly connects the bottoms of the multiple LED chips 103 to the pad assembly 101. The pad assembly 101 replaces the high-cost ceramic substrate, thereby reducing costs. When the high-voltage LED package structure is placed horizontally, the horizontal projection area of ​​the pad assembly 101 accounts for 60% to 98% of the horizontal projection area of ​​the entire LED package structure. The outer contour of the pad assembly is similar to the outer contour of the package structure to support the chip assembly. Furthermore, the pad assembly 101 has a large current-carrying area, which can improve the surface mount yield of the LED chips 103. Even if the overall heat generation of the multiple LED chips 103 is large, the heat dissipation effect of the pad assembly 101 is also good.

[0025] Specifically, multiple LED chips 103 form a series branch, which can significantly increase the operating voltage of the entire LED package structure. The multiple LED chips 103 can be composed of chips emitting the same color or chips emitting different colors. However, in the series high-voltage structure, it is preferable that the multiple LED chips emit the same color. Compared to a single-chip solution, the series structure applies a higher voltage under the same current, making it suitable for applications requiring high-voltage drive. Integrating multiple LED chips 103 into a single package effectively reduces the number and complexity of external connection lines, resulting in a more compact package structure suitable for miniaturized and lightweight product requirements.

[0026] Furthermore, the encapsulation layer 102 encapsulates the pad assembly 101 and multiple LED chips 103, filling the gaps between the pad assembly 101 and the multiple LED chips 103. The encapsulation layer 102 exposes the light-emitting surface of the top of the LED chips 103 and the lead surface of the pad assembly 101, ensuring that the encapsulation layer 102 does not affect the light emission of the chip assembly or the electrical connection between the pad assembly 101 and external components. On one hand, the encapsulation layer 102 provides physical and insulating protection for the pad assembly 101 and the multiple LED chips 103, preventing damage to the chips and pad assembly 101 from external environments (such as moisture, dust, mechanical stress, etc.), thus extending the lifespan of the LEDs. On the other hand, the encapsulation layer 102 fills all gaps, supporting and fixing the pad assembly 101 and the multiple LED chips 103, enhancing the mechanical stability of the entire encapsulation structure, reducing the risk of internal connection failure due to vibration or impact, and improving the reliability and durability of the product.

[0027] In an optional embodiment, the pad assembly 101 specifically includes a first polarity pad 104 and a second polarity pad 105, which are respectively connected to the positive and negative terminals of the power supply. The first polarity pad 104 and the second polarity pad 105 are spaced apart to ensure electrical isolation between them and avoid the risk of short circuits. The first polarity terminal of the series branch is connected to the first polarity pad 104, and the second polarity terminal of the series branch is connected to the second polarity pad 105, thereby energizing the multiple LED chips 103 in the series branch.

[0028] In an optional embodiment, the pad assembly 101 includes connecting pads 106. Connecting pads 106 are positioned between adjacent LED chips 103 in a series branch. Multiple LED chips 103 can be sequentially electrically connected via the connecting pads 106. The connecting pads 106 have a large current-carrying area and can support multiple LED chips 103 in the series branch, improving the surface mount yield of the LED chips 103. The connecting pads 106 also increase the heat dissipation area, resulting in better heat dissipation.

[0029] It should be noted that the number of connection pads 106 needs to be set according to the number of LED chips 103. The number of connection pads 106 set on a series branch is one less than the number of LED chips 103 set on that series branch. For example Figures 5 to 7 As shown, when two LED chips 103 are provided on a series branch, one connection pad 106 is provided on the series branch; when three LED chips 103 are provided on a series branch, two connection pads 106 are provided on the series branch; when four LED chips 103 are provided on a series branch, three connection pads 106 are provided on the series branch.

[0030] Furthermore, the connecting pads 106 are spaced apart from the first polarity pads 104 and the second polarity pads 105; and when there are multiple connecting pads 106, adjacent connecting pads 106 are spaced apart, which can ensure electrical isolation between multiple pads and avoid the risk of the LED chip 103 being short-circuited.

[0031] In an optional embodiment, multiple LED chips 103 form multiple series branches, and the multiple series branches are connected in parallel between the first polarity pad 104 and the second polarity pad 105.

[0032] In this embodiment, Figures 5 to 7 The structures shown all feature two series branches, but three, four, or more parallel series branches can also be configured according to actual needs. Connecting series branches in parallel distributes the total current across all branches, ensuring even current distribution and preventing localized overheating caused by uneven current distribution. This improves the stability and reliability of the entire LED package structure. Even if a single-color chip in one series branch fails, the other series branches can still operate normally, enhancing the system's fault tolerance and reliability and reducing the risk of system failure due to a single point of failure.

[0033] In an optional embodiment, multiple series branches are spaced apart along a first direction; on the series branches, multiple LED chips 103 are spaced apart along a second direction; the first direction is perpendicular to the second direction.

[0034] In this embodiment, for Figures 5 to 7 The structure shown has a left-right orientation as the first direction and a top-bottom orientation as the second direction. The multiple LED chips 103 shown in the figure are arranged in a rectangular array to make the overall high-voltage LED package structure rectangular. This allows for a more efficient and regular arrangement within a limited space, reducing manufacturing costs and improving product quality consistency. Furthermore, the regular arrangement makes the distribution of light-emitting points in the high-voltage LED package structure more reasonable, ensuring more uniform and clear image output.

[0035] In the optional solutions of this embodiment, such as Figures 5 to 7 As shown, the connecting pad 106, the first polarity pad 104, and the second polarity pad 105 are arranged to form a rectangular outer contour. Correspondingly, the overall high-voltage LED package structure after encapsulation is rectangular. The first polarity pad 104 and the second polarity pad 105 located at both ends are relatively long, so that multiple parallel branches can be connected to the first polarity pad 104 and the second polarity pad 105. The width direction of the connecting pad 106 is the same as the length direction of the first polarity pad 104 and the second polarity pad 105, and the length direction of the connecting pad 106 is the same as the length direction of the parallel branches. The two LED chips 103 connected to the same connecting pad 106 are located at both ends of the length direction of the connecting pad 106, so that there is a gap between the two LED chips 103 to avoid short circuits, and the connection area between the LED chip 103 and the connecting pad 106 is larger, so that the connection between the two is more reliable.

[0036] Example 2 The high-voltage LED packaging structure in this second embodiment is an improvement on the above embodiments. The technical content disclosed in the above embodiments will not be described again, and the content disclosed in the above embodiments also belongs to the content disclosed in this second embodiment.

[0037] In the optional schemes of this embodiment, see [link to relevant documentation]. Figure 3 and Figure 4 As shown, the LED chip 103 includes a light-emitting part 107 and a connecting part 108; the connecting part 108 includes a first electrode 110 and a second electrode 111 with opposite polarities. The first electrode 110 and the second electrode 111 are specifically copper electrodes. The first electrode 110 and the second electrode 111 are connected to the light-emitting part 107 and to the pad assembly 101. In order to improve the conductivity at the connection, the first electrode 110 and the second electrode 111 are provided with a Ti layer, a Ni layer or other metal layer.

[0038] like Figure 4 As shown, the LED chip 103 also includes a reflective cup 109, which is specifically made of transparent silicone and is disposed around the circumference of the light-emitting part 107. Light emitted from the side of the light-emitting part 107 is reflected by the reflective cup 109 and can be emitted from the top of the LED chip 103, thereby improving the brightness of the entire package structure.

[0039] In this optional embodiment, the encapsulation layer 102 is a high-reflectivity white adhesive layer. The light emitted from the side of the light-emitting part 107 of the multiple LED chips 103 is reflected by the encapsulation layer 102 and can be emitted from the top direction, thereby improving the overall brightness of the high-voltage LED encapsulation structure.

[0040] In the optional solutions of this embodiment, such as Figures 1 to 4As shown, the high-voltage LED packaging structure also includes a phosphor layer 112; the top surface of the packaging layer 102 is flush with the light-emitting surface of the chip component, and the phosphor layer 112 covers the top surface of the packaging layer 102 and the light-emitting surface of the chip component.

[0041] In this embodiment, the phosphor layer 112 covers the chip assembly and the surrounding encapsulation layer 102, allowing all light emitted from the chip assembly to pass through the phosphor layer 112 without leakage. The phosphor layer 112 is formed by doping transparent adhesive with phosphor and particles such as SiO2 and TiO2. Light emitted from the monochromatic chip undergoes wavelength conversion after passing through the phosphor layer 112, emitting a different color of light. Specifically, the monochromatic chip is a blue light chip, and the phosphor layer 112 can convert the blue light emitted by the monochromatic chip into white light.

[0042] Example 3 This application provides a display screen in embodiment three, which includes the high-voltage LED packaging structure of any of the above embodiments. Therefore, it has all the beneficial technical effects of the high-voltage LED packaging structure of any of the above embodiments, which will not be repeated here.

[0043] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application. In addition, those skilled in the art can understand that although some embodiments herein include certain features included in other embodiments but not other features, combinations of features from different embodiments are meant to be within the scope of this application and form different embodiments.

Claims

1. A high-voltage LED packaging structure, characterized in that, Includes pad assemblies, chip assemblies, and packaging layers; The chip assembly includes multiple LED chips, and the multiple LED chips form a series branch; the bottom of the multiple LED chips is connected to the pad assembly; The encapsulation layer encapsulates the pad assembly and the plurality of LED chips, and fills the gap between the pad assembly and the plurality of LED chips, and the encapsulation layer exposes the light-emitting surface of the top of the LED chip and the lead surface of the pad assembly; The pad assembly includes a first polarity pad and a second polarity pad, which are spaced apart. The first polarity terminal of the series branch is connected to the first polarity pad, and the second polarity terminal of the series branch is connected to the second polarity pad. From a view facing the light-emitting surface of the chip assembly, the area ratio of the pad assembly to the area of ​​the encapsulation layer is 60%~98%. The pad assembly includes connecting pads; In the series branch, a connecting pad is provided between two adjacent LED chips; The connecting pads are spaced apart from the first polarity pads and the second polarity pads; and when there are multiple connecting pads, adjacent connecting pads are spaced apart.

2. The high-voltage LED packaging structure according to claim 1, characterized in that, Multiple LED chips form multiple series branches, and the multiple series branches are connected in parallel between the first polarity pad and the second polarity pad.

3. The high-voltage LED packaging structure according to claim 2, characterized in that, The multiple series branches are spaced apart along the first direction; In the series branch, a plurality of LED chips are spaced apart along the second direction; The first direction is perpendicular to the second direction.

4. The high-voltage LED packaging structure according to claim 1, characterized in that, The connecting pads, the first polarity pad, and the second polarity pad are arranged to form a rectangular outer contour.

5. The high-voltage LED packaging structure according to claim 1, characterized in that, The LED chip includes a light-emitting part, a connecting part, and a reflective cup; The connection portion includes a first electrode and a second electrode with opposite polarities. The first electrode and the second electrode are connected to the light-emitting portion, and the first electrode and the second electrode are connected to the pad assembly. The reflective bowl is arranged around the circumference of the light-emitting part to reflect the light emitted from the side of the light-emitting part towards the top.

6. The high-voltage LED packaging structure according to claim 1, characterized in that, The encapsulation layer is a high-reflectivity white adhesive layer.

7. The high-voltage LED packaging structure according to claim 1, characterized in that, It also includes a fluorescent layer; the top surface of the encapsulation layer is flush with the light-emitting surface of the chip assembly, and the fluorescent layer covers the top surface of the encapsulation layer and the light-emitting surface of the chip assembly.

8. A display screen, characterized in that, Includes the high-voltage LED packaging structure as described in any one of claims 1 to 7.

Images