LED packaging structure and display screen
By using pad components instead of ceramic substrates in the LED packaging structure and combining them with a light mixing layer and an anti-color bleeding layer, the problems of large size, thick thickness, and high cost are solved, achieving miniaturization, low cost, and high efficiency in light emission, while improving mechanical stability and reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUAIAN AUCKSUN OPTOELECTRONICS TECHNOLOGY CO LTD
- Filing Date
- 2025-06-11
- Publication Date
- 2026-06-02
AI Technical Summary
Existing LED packaging structures suffer from problems such as large size, thick thickness, and high production costs.
The high-cost ceramic substrate is replaced by a pad assembly, which directly connects multiple light-emitting chips to the pad assembly. The encapsulation layer wraps and fills the gaps. Shared and exclusive pads are set to reduce costs and improve heat dissipation. At the same time, a light mixing layer and an anti-color mixing layer are added to improve light efficiency and color purity.
This has enabled the miniaturization and weight reduction of LED packaging structures, reduced production costs, improved light emission uniformity and consistency, enhanced mechanical stability and reliability, and extended service life.
Smart Images
Figure CN224319830U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of chip packaging, and in particular to an LED packaging structure and display screen. Background Technology
[0002] LED packaging refers to the encapsulation of RGB light-emitting chips, with the aim of providing sufficient protection for the RGB light-emitting chips.
[0003] Currently, LED packaging typically involves mounting individual color LED chips onto a ceramic substrate, and then adding lenses to the surface of each chip for encapsulation. Existing structures suffer from problems such as large size, excessive thickness, and high production costs. Utility Model Content
[0004] The purpose of this application is to provide an LED packaging structure and display screen to solve the problems of large size, thickness and high production cost of existing LED packaging structures.
[0005] This application provides an LED packaging structure, including a pad assembly, a chip assembly, and a packaging layer;
[0006] The chip assembly includes a plurality of spaced light-emitting chips, and the pad assembly is connected to the electrodes of the plurality of light-emitting chips; the encapsulation layer encapsulates the pad assembly and the plurality of light-emitting chips, and fills the gap between the pad assembly and the plurality of light-emitting chips, and the encapsulation layer exposes the light-emitting surfaces of the plurality of light-emitting chips and the pin surfaces of the pad assembly;
[0007] The pad assembly includes a common pad that simultaneously connects the first electrodes of multiple light-emitting chips, and multiple dedicated pads that respectively connect the second electrodes of each of the light-emitting chips.
[0008] From a view of the light-emitting surface of the chip assembly, the ratio of the area of the pad assembly to the area of the encapsulation layer is 70% to 95%.
[0009] In the above technical solution, further, the plurality of light-emitting chips include a first chip, a second chip, and a third chip of different colors, wherein the first chip emits red light, the second chip emits green light, and the third chip emits blue light.
[0010] In the above technical solution, the shared pad and the multiple dedicated pads are further arranged at intervals;
[0011] From a view facing the light-emitting surface of the chip assembly, the outer contour of the pad assembly, which consists of the common pad and multiple individual pads, is adapted to the outer contour of the encapsulation layer.
[0012] In the above technical solution, a light mixing layer is further included; on the side where the light emitting surface is located, the light mixing layer covers the light emitting surfaces of the plurality of light-emitting chips and the surface of the encapsulation layer.
[0013] Furthermore, the above technical solution also includes an anti-color bleeding layer;
[0014] The anti-color-crossing layer is located between the encapsulation layer and the light-mixing layer; the anti-color-crossing layer surrounds the circumference of the light-emitting chip, and is flush with and exposes the light-emitting surface of the light-emitting chip.
[0015] In the above technical solution, the plurality of light-emitting chips further includes a fourth chip;
[0016] The light-emitting surface of the fourth chip is covered with a fluorescent layer to convert the light emitted by the fourth chip into white light; the encapsulation layer wraps the fluorescent layer and exposes the fluorescent surface on top of the fluorescent layer.
[0017] The above technical solution further includes a transparent layer;
[0018] The light-emitting surfaces of the first chip, the second chip, and the third chip are covered with a transparent layer; the encapsulation layer wraps around the transparent layer, and the encapsulation layer exposes the light-transmitting surface at the top of the transparent layer.
[0019] In the above technical solution, the first chip, the second chip, the third chip and the fourth chip are arranged in a rectangular array.
[0020] In the above technical solution, the conductive area of the common pad is greater than the conductive area of any one of the individual pads; the common pad and the multiple individual pads are arranged to form a rectangular outer contour;
[0021] The gap width between any two adjacent light-emitting chips is between 50µm and 2000µm.
[0022] This application also provides a display screen, including the LED packaging structure described above.
[0023] Compared with the prior art, the beneficial effects of this application are as follows:
[0024] The LED packaging structure provided in this application directly connects red, green, and blue light-emitting chips to a pad assembly, thereby reducing costs by replacing the high-cost ceramic substrate with the pad assembly. The large conductive area of the pad assembly improves the chip mounting yield, and even with a large overall heat generation from multiple chips, heat dissipation is also effective. Furthermore, the packaging layer supports and fixes the light-emitting chips to the pad assembly, providing physical protection and insulation.
[0025] This application also provides a display screen, including the LED packaging structure described above. Based on the above analysis, it is clear that the display screen also possesses the aforementioned beneficial effects, which will not be elaborated upon further here. Attached Figure Description
[0026] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0027] Figure 1 A first structural schematic diagram of the LED packaging structure provided in this application;
[0028] Figure 2 This is a second structural schematic diagram of the LED packaging structure provided in this application;
[0029] Figure 3 This is a third structural diagram of the LED packaging structure provided in this application;
[0030] Figure 4 This is a fourth structural diagram of the LED packaging structure provided in this application;
[0031] Figure 5 This is a fifth structural diagram of the LED packaging structure provided in this application;
[0032] Figure 6 This is a sixth structural diagram of the LED packaging structure provided in this application;
[0033] Figure 7 The seventh structural diagram of the LED packaging structure provided in this application.
[0034] In the diagram: 101-Pad assembly; 102-Encapsulation layer; 103-Light-emitting chip; 104-First chip; 105-Second chip; 106-Third chip; 107-Light-emitting part; 108-Connection part; 109-Reflective cup; 110-First electrode; 111-Second electrode; 112-Shared pad; 113-Dedicated pad; 114-Light mixing layer; 115-Anti-color mixing layer; 116-Fourth chip; 117-Fluorescent layer; 118-Transparent layer. Detailed Implementation
[0035] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0036] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0037] In the description of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0038] Example 1
[0039] See Figures 1 to 2 As shown, the LED packaging structure provided in this application includes a pad assembly 101, a chip assembly, and a packaging layer 102.
[0040] The chip assembly includes multiple light-emitting chips 103. To reduce the overall thickness of the device, this application eliminates the ceramic substrate structure and directly connects the multiple light-emitting chips 103 to the pad assembly 101. The pad assembly 101 replaces the high-cost ceramic substrate, thereby reducing costs. When the LED package structure is placed horizontally, the horizontal projection area of the pad assembly 101 accounts for 60% to 98% of the horizontal projection area of the entire LED package structure. The outer contour of the pad assembly is similar to the outer contour of the package structure, which can provide better support for the chip assembly. Furthermore, the large current-conducting area of the pad assembly 101 can improve the chip mounting yield of the light-emitting chips 103. Even if the overall heat generation of the multiple light-emitting chips 103 is relatively large, the heat dissipation effect is also good.
[0041] The pad assembly includes a shared pad 112 and multiple individual pads 113. Each chip includes a first electrode 110 of a first polarity and a second electrode 111 of the opposite polarity. The first electrodes of the multiple chips are electrically connected to the upper surface of the shared pad 112, and the upper surfaces of the multiple individual pads 113 are electrically connected to the second electrode of each chip. The gap width between any two adjacent light-emitting chips is between 50µm and 2000µm. Preferably, the gap width between any two adjacent light-emitting chips is between 51µm and 800µm, such as 55µm, 60µm, 100µm, 150µm, 200µm, 300µm, 400µm, 500µm, 600µm, and 700µm. Smaller spacing reduces the distance between pads, making interconnection easier during die bonding. However, excessively large chip spacing can lead to uneven color mixing.
[0042] Multiple light-emitting chips 103 can be light-emitting chips of different colors, such as a first chip 104, a second chip 105, and a third chip 106. The first chip 104 emits red light, the second chip 105 emits green light, and the third chip 106 emits blue light. Red, green, and blue are the three primary colors in optics. By adjusting the light emission intensity of each chip, multiple colors can be mixed to generate, thereby achieving full-color display functionality. Integrating the three light-emitting chips 103 that generate red, green, and blue light into the same package structure can reduce optical path deviations between different color light sources, improving the uniformity and consistency of light emission. Furthermore, the integrated design can also reduce optical path deviations between different color light sources, improving the uniformity and consistency of light emission. Compared to traditional discrete light source designs, this integrated chip component can significantly reduce the overall size, meeting the requirements of miniaturization and lightweight design.
[0043] The encapsulation layer 102 encapsulates the pad assembly 101 and multiple light-emitting chips 103, filling the gaps between them. The encapsulation layer 102 exposes the lower surface of the pad assembly 101, which is the pin surface connected to an external power source. This ensures that the encapsulation layer 102 does not affect the light emission of the chip assembly or the electrical connection between the pad assembly 101 and external components. On one hand, the encapsulation layer 102 provides physical and insulating protection for the pad assembly 101 and the multiple light-emitting chips 103, preventing damage from external environmental factors (such as moisture, dust, and mechanical stress) and extending the lifespan of the LEDs. On the other hand, by filling all gaps, the encapsulation layer 102 supports and fixes the pad assembly 101 and the multiple light-emitting chips 103, enhancing the mechanical stability of the entire encapsulation structure, reducing the risk of internal connection failure due to vibration or impact, and improving the reliability and durability of the product.
[0044] Preferably, the encapsulation layer 102 can cover or expose the light-emitting surfaces of multiple light-emitting chips, depending on the material of the encapsulation layer and the desired light pattern of the final LED package. For example, the encapsulation layer 102 can be transparent silicone or silicone doped with reflective materials. When the encapsulation layer 102 is a high-reflectivity white adhesive layer, the encapsulation layer needs to fully expose the light-emitting surfaces of multiple light-emitting chips. In this case, the light emitted from the sides of the multiple light-emitting chips 103 is reflected by the encapsulation layer 102 and can be emitted from the top, improving the overall brightness of the LED package structure.
[0045] like Figure 7 As shown, the light-emitting chip 103 includes a light-emitting part 107 and a connecting part 108; the connecting part 108 includes a first electrode 110 and a second electrode 111 with opposite polarities. The first electrode 110 and the second electrode 111 are specifically copper electrodes. The first electrode 110 and the second electrode 111 are connected to the light-emitting part 107 and to the pad assembly 101. In order to improve the conductivity at the connection, the first electrode 110 and the second electrode 111 are provided with a Ti layer, a Ni layer or other metal layer.
[0046] In a possible embodiment, the light-emitting chip 103 further includes a reflective cup 109, which is specifically made of transparent silicone and is disposed around the circumference of the light-emitting part 107. Light emitted from the side of the light-emitting part 107 is reflected by the reflective cup 109 and can be emitted from the top of the light-emitting chip 103, thereby improving the brightness of the light-emitting chip 103.
[0047] In the optional solutions of this embodiment, such as Figure 1 and Figure 5 As shown, the pad assembly 101 includes a common pad 112 and multiple individual pads 113, which are spaced apart. The first electrodes 110 of the multiple light-emitting chips 103 have the same polarity and are all connected to the common pad 112. The second electrodes 111 of the multiple light-emitting chips 103 have the same polarity and are respectively connected to the corresponding individual pads 113. Optionally, the current-conducting area of the common pad 112 is larger than the current-conducting area of any individual pad 113. The common pad 112 and the multiple individual pads 113 are arranged to form a rectangular outer contour.
[0048] In this embodiment, specifically, the shared pad 112 is the positive electrode, and the multiple individual pads 113 are the negative electrodes; or the shared pad 112 is the negative electrode, and the multiple individual pads 113 are the positive electrodes. The first electrodes 110 of the multiple light-emitting chips 103 are connected to the same shared pad 112. The shared pad 112 carries the largest current, so its current-conducting area is set to be the largest. The individual pads 113 are respectively connected to their corresponding light-emitting chips 103, so their current-conducting areas are relatively small. The shared pad 112 and the multiple individual pads 113 are arranged to form a rectangular outer contour, making the structure of the pad assembly 101 regular.
[0049] The shared pad 112 reduces the number of pads required, thereby reducing circuit complexity. Each light-emitting chip 103's second electrode 111 is connected to an independent dedicated pad 113, allowing for individual control of the brightness and operating status of each chip, enabling finer dimming and color control. Furthermore, the shared pad 112 design reduces the space occupied by the pad assembly 101, contributing to increased integration of the entire device and resulting in a smaller LED package structure suitable for space-constrained applications.
[0050] Specifically, both the shared pad 112 and the dedicated pad 113 include a two-layer structure: a primary expanded pad and a secondary expanded pad. The primary expanded pad is generally made of copper and is directly connected to the light-emitting chip 103. The primary expanded pad has a relatively large area to provide better heat dissipation. The secondary expanded pad is generally made of tin and is connected to the side of the primary expanded pad away from the light-emitting chip 103. The secondary expanded pad is located within the coverage area of the primary expanded pad and has a relatively small area to increase the distance between the secondary expanded pads. During subsequent surface mount technology (SMT) processes, solder paste needs to be applied to both the shared pad 112 and the dedicated pad 113. The greater distance between the secondary expanded pads allows for a wider solder paste application, preventing short circuits between the pads.
[0051] In the optional solutions of this embodiment, such as Figures 1 to 4 As shown, the three types of light-emitting chips 103—first chip 104, second chip 105, and third chip 106—are spaced apart along a preset direction, which is the width direction of the first chip 104, second chip 105, and third chip 106, i.e., the vertical direction of the structure shown. The arrangement of the three light-emitting chips 103 is consistent with the length direction of the LED package structure to make the light source distribution more uniform and reasonable.
[0052] Furthermore, such as Figure 1As shown, in order to connect with multiple light-emitting chips 103 and achieve a reasonable arrangement of multiple pads, the common pad 112 of the pad assembly 101 is rectangular. The common pad 112 is located at the lower left corner and extends upward so that the first electrodes 110 of the three light-emitting chips 103 can all be connected to the common pad 112. The current-conducting areas of the three independent pads are basically the same, and the three independent pads are arranged sequentially from top to bottom. The two upper independent pads are L-shaped so that the upper independent pads can utilize the space above and to the right of the common pad 112, and the second electrode 111 at the right end of the upper first chip 104 can be connected to the independent pad. The middle independent pad can utilize the space to the right of the common pad 112 and the space to the right of the upper independent pad, so that the second electrode 111 at the right end of the middle second chip 105 can be connected to the independent pad. The lower independent pad is located lower, and the second electrode 111 at the right end of the lower third chip 106 can be connected to the independent pad. Furthermore, the independent pad is set to a rectangle so that its current-carrying area is basically the same as that of the other two independent pads.
[0053] In the optional solutions of this embodiment, such as Figure 3 As shown, the LED packaging structure also includes a light mixing layer 114. The light mixing layer 114 is a transparent adhesive doped with particles such as SiO2, TiO2, Ag powder, and Al powder, and its thickness is between 5 μm and 100 μm. On the side where the light-emitting surface is located, the light mixing layer 114 covers the light-emitting surfaces of multiple light-emitting chips 103 and the surface of the packaging layer 102. The light mixing layer 114 can mix red, green, and blue light together, and by adjusting the brightness ratio of each color, various colors of light can be produced. Through reasonable light mixing design, the luminous efficacy and color rendering index of the LED can be improved, making it more suitable for various application scenarios, such as lighting and displays.
[0054] In the optional solutions of this embodiment, such as Figure 4 As shown, the LED packaging structure also includes an anti-color-crossing layer 115; the anti-color-crossing layer 115 is located between the top of the packaging layer 102 and the light mixing layer 114; the anti-color-crossing layer 115 surrounds the circumference of the light-emitting chip 103, and is flush with the light-emitting surface of the light-emitting chip 103 and completely exposes the light-emitting surface of each light-emitting chip 103. In the horizontal projection direction, the area of the anti-color-crossing layer 115 is less than or equal to the area of the packaging layer 102.
[0055] In this embodiment, the anti-crosstalk layer 115 is a dark film layer, specifically a black adhesive layer formed by doping carbon powder with silicone, and its thickness is between 1µm and 100µm. The anti-crosstalk layer 115 is mainly used to prevent different colors of light from interfering with each other between the light-emitting chips 103. The anti-crosstalk layer 115 can isolate light-emitting chips 103 of different colors, ensuring that each color of light remains independent before reaching the mixing layer 114, thereby avoiding the problem of uneven color mixing, helping to improve the color purity of the overall light output, and making the final mixed light color more accurate and consistent.
[0056] Example 2
[0057] The LED packaging structure in this second embodiment is an improvement on the above embodiments. The technical content disclosed in the above embodiments will not be described again, and the content disclosed in the above embodiments also belongs to the content disclosed in this second embodiment.
[0058] See Figures 5 to 7 As shown, in an optional embodiment, the plurality of light-emitting chips 103 further includes a fourth chip 116; the light-emitting surface of the fourth chip 116 is covered with a phosphor layer 117 to convert the light emitted by the fourth chip 116 into white light; the encapsulation layer 102 wraps the phosphor layer 117, and the encapsulation layer 102 exposes the phosphor surface on top of the phosphor layer 117.
[0059] In this embodiment, in addition to the light-emitting chips 103 with red, green, and blue colors, a white light-emitting chip 103 is added, thus forming an RGBW four-color pixel. This structure can produce a more realistic and softer white light and can display colors more accurately. Specifically, the fourth chip 116 is generally a blue light chip, and the fluorescent layer 117 can convert the blue light emitted by the fourth chip 116 into white light. The fluorescent layer 117 is formed by doping transparent adhesive with phosphor and particles such as SiO2 and TiO2. The light emitted by the fourth chip 116 undergoes wavelength conversion after passing through the fluorescent layer 117, thus emitting white light.
[0060] In the optional solutions of this embodiment, such as Figure 5 As shown, the LED packaging structure also includes a transparent layer 118; the light-emitting surfaces of the first chip 104, the second chip 105 and the third chip 106 are covered by the transparent layer 118; the encapsulation layer 102 wraps the transparent layer 118, and the encapsulation layer 102 exposes the light-transmitting surface at the top of the transparent layer 118.
[0061] In this embodiment, the transparent layer 118 is specifically a transparent adhesive doped with particles such as SiO2 and TiO2 powder, and its thickness is between 5 μm and 100 μm. The transparent layer 118 can effectively improve the light extraction efficiency, allowing more light to be transmitted from the light-emitting chip 103 to the outside, thereby improving the overall luminous efficiency. Furthermore, the transparent layer 118 covers the light-emitting surface of the light-emitting chip 103, providing a layer of physical protection to prevent dust, moisture, and other external factors from directly contacting the chip, reducing the risk of mechanical damage, extending the chip's lifespan, and improving the reliability of the LED.
[0062] In this embodiment, the first chip 104, the second chip 105, the third chip 106, and the fourth chip 116 are arranged in a rectangular array so that the overall LED packaging structure is rectangular. This allows for a more efficient and regular arrangement within a limited space, reducing manufacturing costs and improving product quality consistency. Furthermore, the regular arrangement makes the distribution of light-emitting points in the LED packaging structure more reasonable, ensuring more uniform and clear image output.
[0063] like Figure 6 As shown, in order to connect with multiple light-emitting chips 103 and to achieve a reasonable arrangement of multiple pads, the common pad 112 of the pad assembly 101 is rectangular and located in the middle. Two independent pads 113 are provided on the left side of the common pad 112 and two independent pads 113 are provided on the right side of the common pad 112. The current conduction area of the four independent pads is basically the same.
[0064] Example 3
[0065] This application provides a display screen in embodiment three, which includes the LED packaging structure of any of the above embodiments. Therefore, it has all the beneficial technical effects of the LED packaging structure of any of the above embodiments, which will not be repeated here.
[0066] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application. In addition, those skilled in the art can understand that although some embodiments herein include certain features included in other embodiments but not other features, combinations of features from different embodiments are meant to be within the scope of this application and form different embodiments.
Claims
1. An LED package structure, characterized in that, Includes pad assemblies, chip assemblies, and packaging layers; The chip assembly includes a plurality of spaced light-emitting chips, and the pad assembly is connected to the electrodes of the plurality of light-emitting chips; the encapsulation layer encapsulates the pad assembly and the plurality of light-emitting chips, and fills the gap between the pad assembly and the plurality of light-emitting chips, and the encapsulation layer exposes the light-emitting surfaces of the plurality of light-emitting chips and the pin surfaces of the pad assembly; The pad assembly includes a common pad that simultaneously connects the first electrodes of multiple light-emitting chips, and multiple dedicated pads that respectively connect the second electrodes of each of the light-emitting chips. From a view of the light-emitting surface of the chip assembly, the ratio of the area of the pad assembly to the area of the encapsulation layer is 70% to 95%.
2. The LED package structure of claim 1, wherein, The plurality of light-emitting chips include a first chip, a second chip, and a third chip of different colors, wherein the first chip emits red light, the second chip emits green light, and the third chip emits blue light.
3. The LED package structure of claim 1, wherein, The shared pads and the multiple dedicated pads are spaced apart; From a view facing the light-emitting surface of the chip assembly, the outer contour of the pad assembly, which consists of the common pad and multiple individual pads, is adapted to the outer contour of the encapsulation layer.
4. The LED package structure of claim 3, wherein, It also includes a light mixing layer; on the side where the light emitting surface is located, the light mixing layer covers the emitting surfaces of the plurality of light-emitting chips and the surface of the encapsulation layer.
5. The LED package structure of claim 4, wherein, It also includes an anti-color bleeding layer; The anti-color-crossing layer is located between the encapsulation layer and the light-mixing layer; the anti-color-crossing layer surrounds the circumference of the light-emitting chip, and is flush with and exposes the light-emitting surface of the light-emitting chip.
6. The LED package structure of claim 2, wherein, The plurality of light-emitting chips also includes a fourth chip; The light-emitting surface of the fourth chip is covered with a fluorescent layer to convert the light emitted by the fourth chip into white light; the encapsulation layer wraps the fluorescent layer and exposes the fluorescent surface on top of the fluorescent layer.
7. The LED package structure of claim 6, wherein, It also includes a transparent layer; The light-emitting surfaces of the first chip, the second chip, and the third chip are covered with a transparent layer; the encapsulation layer wraps around the transparent layer, and the encapsulation layer exposes the light-transmitting surface at the top of the transparent layer.
8. The LED package structure of claim 6, wherein, The first chip, the second chip, the third chip, and the fourth chip are arranged in a rectangular array.
9. The LED package structure of claim 2, wherein, The conductive area of the shared pad is greater than the conductive area of any of the individual pads; the shared pad and the multiple individual pads are arranged to form a rectangular outer contour; The gap width between any two adjacent light-emitting chips is between 50µm and 2000µm.
10. A display screen, characterized by Includes the LED packaging structure as described in any one of claims 1 to 9.