Chipset modular heat sink

Abstract

The utility model provides a kind of chip set modularization heat sink, belong to chip set heat dissipation technical field, to solve the problem that cannot satisfy the severe demand of high heat chip set for heat dissipation;Including frame;The frame top is fixedly provided with heat dissipation component, and the frame top is also fixedly provided with auxiliary structure;The heat dissipation component includes: connecting pipe and heat absorption pipe;Connecting pipe is fixedly set in the inside of frame top side;Heat absorption pipe is set to the top of frame inside, and heat absorption pipe is set to serpentine;Through heat absorption pipe setting is serpentine and with connecting pipe, fixed pipe, liquid-collecting pipe A, liquid-collecting pipe B and radiator pipe constitute circulating heat dissipation circuit, and cooperate circulating pump to accelerate coolant circulation, simultaneously through fan to accelerate heat dissipation speed, to be able to quickly absorb the heat generated by chip set and high efficiency emission;Simultaneously utilize fin to further improve heat dissipation efficiency, can effectively satisfy the heat dissipation demand of high heat chip set.

Description

Technical Field

[0001] This utility model belongs to the field of chipset heat dissipation technology, and more specifically, it relates to a modular heat dissipation device for chipsets. Background Technology

[0002] In the field of electronic devices, chipsets are core components, and their performance stability and reliability play a crucial role in the normal operation of the entire system. During operation, the heat generated by the chipset increases dramatically. If the heat cannot be dissipated in a timely and effective manner, the temperature of the chipset will continue to rise. When the temperature exceeds its tolerance limit, it will cause a series of serious problems.

[0003] Existing heat dissipation devices mostly employ a combination of heat sinks and cooling fans to achieve heat dissipation. As chipset performance continues to improve, its heat generation also increases significantly. However, the existing heat dissipation structure has relatively low efficiency and cannot quickly and effectively dissipate the heat generated by the chipset, failing to meet the stringent heat dissipation requirements of high-heat-generating chipsets. Furthermore, in existing heat dissipation devices, the cooling fan is highly integrated with the overall structure, lacking a modular design concept. This makes the process of maintaining, replacing, or upgrading the cooling fan extremely inconvenient. Utility Model Content

[0004] To address the aforementioned technical problems, this utility model provides a modular heat dissipation device for chipsets, thereby resolving the issues raised in the background art regarding the inability to meet the stringent heat dissipation requirements of high-heat-generating chipsets and the lack of a modular design concept.

[0005] This utility model discloses a modular heat dissipation device for chipsets, which is achieved through the following specific technical means:

[0006] A modular heat dissipation device for chipsets includes a frame; a heat dissipation component is fixedly disposed on the top of the frame, and an auxiliary structure is also fixedly disposed on the top of the frame; a positioning seat is fixedly disposed on the top of the frame, and the positioning seat is configured as an inverted U-shape; the positioning seats are symmetrically arranged, and a connection hole is opened inside one side of the positioning seat; mounting brackets are fixedly disposed on both sides of the bottom of the frame, and mounting holes are opened through the mounting brackets inside; a dustproof mesh A is fixedly disposed on the inner side of the frame; four sets of mounting seats are symmetrically arranged at the bottom of the inner side of the frame, and threaded holes are opened inside the mounting seats.

[0007] The heat dissipation assembly includes: a connecting pipe and a heat absorption pipe; the connecting pipe is fixedly installed inside the top side of the frame, and two sets of connecting pipes are symmetrically arranged; the heat absorption pipe is installed at the top inside the frame, and the heat absorption pipe is serpentine, with both ends of the heat absorption pipe fixedly connected to the two sets of connecting pipes respectively.

[0008] Furthermore, a sealing ring is fixedly installed on the top of the frame, and a heat-conducting plate is movably installed between the bottoms of the two sets of mounting bases, with the two sets of heat-conducting plates arranged symmetrically; connecting holes are opened inside both sides of the heat-conducting plate, and hexagonal socket bolts are movably installed inside the connecting holes, and the hexagonal socket bolts are threaded into the threaded holes; a heat sink is fixedly installed between the tops of the two sets of heat-conducting plates, and the heat sink is arranged in a straight line, with the heat sink located inside the frame.

[0009] Furthermore, the heat sink has ventilation holes inside, and the ventilation holes completely penetrate the heat sink; a limiting groove is provided on the top of the heat sink, and a heat absorption tube is movably arranged inside the limiting groove.

[0010] Furthermore, the heat dissipation assembly also includes: a fixed box, a dust filter B, a fan, and a fixing pipe; the fixed box is fixedly installed on the top of the frame; the dust filter B is fixedly installed on one side of the fixed box; the fan is fixedly installed on the other side of the fixed box, and a filter screen is provided inside the fan; the fixing pipe is fixedly installed inside both sides of the fixed box, and the fixing pipe is fixedly connected to the connecting pipe, and two sets of fixing pipes are arranged symmetrically.

[0011] Furthermore, the heat dissipation assembly also includes: a circulation pump, a liquid collection pipe A, a liquid collection pipe B, and a heat dissipation pipe; the circulation pump is fixedly installed on the top of the inner side of the fixed box, and the liquid inlet of the circulation pump is fixedly connected to a set of fixed pipes; the liquid collection pipe A is fixedly installed on the outside of the liquid outlet of the circulation pump; the liquid collection pipe B is fixedly installed on the outside of another set of fixed pipes; the heat dissipation pipe is fixedly installed between the liquid collection pipe A and the liquid collection pipe B, and the heat dissipation pipes are arranged in a straight line and are serpentine.

[0012] Furthermore, the auxiliary structure includes: a cooling fan and a sealing groove; the cooling fan is movably disposed on the top of the frame, and two sets of cooling fans are provided; the sealing groove is opened at the bottom of the cooling fan, and a sealing ring is movably disposed inside the sealing groove.

[0013] Furthermore, the auxiliary structure also includes: an auxiliary seat, a self-locking block, and a positioning plate; the auxiliary seat is fixedly disposed on both sides of the cooling fan and movably disposed inside the positioning seat; the self-locking block is slidably disposed inside one side of the auxiliary seat, and the bottom side of the end of the self-locking block is configured as a beveled structure; a spring is disposed between the self-locking block and the auxiliary seat, and the end of the self-locking block is slidably disposed inside the connecting hole; the positioning plate is fixedly disposed on the top of the self-locking block and slidably disposed inside the auxiliary seat.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] 1. In this utility model, the heat absorption tube is set in a serpentine shape and forms a circulating heat dissipation circuit with the connecting tube, fixing tube, liquid collection tube A, liquid collection tube B and heat dissipation tube. It is combined with a circulating pump to accelerate the circulation of coolant, and a fan to accelerate the heat dissipation speed. This allows for the rapid absorption and efficient dissipation of heat generated by the chipset. At the same time, the heat sink is arranged in a straight line and has ventilation holes inside, which increases the contact area with air. The cooling fan forces airflow, further improving the heat dissipation efficiency and effectively meeting the heat dissipation needs of high heat generation chipsets.

[0016] 2. In this utility model, a positioning seat and a connecting hole are provided at the top of the frame, so that the cooling fan can be easily installed on the frame through the auxiliary seat and the self-locking block to achieve modular assembly; this design makes the disassembly and maintenance of the cooling fan easy and quick, without complicated operation, reducing maintenance costs and time, and improving the maintainability of the device.

[0017] 3. In this utility model, the mounting base provided at the bottom inner side of the frame allows the heat-conducting plate to be connected to the threaded hole in the mounting base via an internal hex bolt, enabling quick and easy installation; this also allows for modular assembly of the heat sink; and facilitates subsequent maintenance and replacement of the heat sink. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0019] Figure 2 This is a schematic diagram of the lower surface structure of the frame of this utility model.

[0020] Figure 3 This is a cross-sectional structural diagram of the fixing box of this utility model.

[0021] Figure 4 This is a schematic diagram of the structure of the heat sink of this utility model.

[0022] Figure 5 This is a schematic diagram of the auxiliary structure of this utility model.

[0023] Figure 6 This is a schematic diagram of the upper surface structure of the frame of this utility model.

[0024] Figure 7 This is a schematic diagram of the lower surface structure of the cooling fan of this utility model.

[0025] In the diagram, the correspondence between component names and drawing numbers is as follows:

[0026] 1. Frame; 101. Mounting bracket; 102. Dustproof mesh A; 103. Positioning seat; 104. Connecting hole; 105. Mounting seat; 106. Threaded hole; 107. Heat-conducting plate; 108. Connecting hole; 109. Socket head bolt; 1010. Heat sink; 1011. Ventilation hole; 1012. Limiting groove; 1013. Sealing ring;

[0027] 2. Heat dissipation components; 201. Mounting box; 202. Dust filter B; 203. Fan; 204. Mounting pipe; 205. Circulation pump; 206. Liquid collection pipe A; 207. Liquid collection pipe B; 208. Heat dissipation pipe; 209. Connecting pipe; 2010. Heat absorption pipe;

[0028] 3. Auxiliary structure; 301. Cooling fan; 302. Sealing groove; 303. Auxiliary seat; 304. Self-locking block; 305. Positioning plate. Detailed Implementation

[0029] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples.

[0030] Example 1: As shown in the attached document Figure 1 To be continued Figure 7 As shown:

[0031] This utility model provides a modular heat dissipation device for chipsets, including a frame 1; a heat dissipation component 2 is fixedly disposed on the top of the frame 1, and an auxiliary structure 3 is also fixedly disposed on the top of the frame 1; a positioning seat 103 is fixedly disposed on the top of the frame 1, and the positioning seat 103 is configured as an inverted U-shape; the positioning seats 103 are symmetrically arranged, and a connection hole 104 is opened inside one side of the positioning seat 103; mounting brackets 101 are fixedly disposed on both sides of the bottom of the frame 1, and mounting holes are opened through the mounting brackets 101; a dustproof mesh A102 is fixedly disposed on the inner side of the frame 1; a mounting base 105 is fixedly disposed on the bottom inner side of the frame 1, and four sets of mounting bases 105 are symmetrically arranged, and threaded holes 106 are opened inside the mounting bases 105.

[0032] In this embodiment, the heat dissipation assembly 2 includes: a connecting pipe 209 and a heat absorption pipe 2010; the connecting pipe 209 is fixedly installed inside the top side of the frame 1, and two sets of connecting pipes 209 are symmetrically arranged; the heat absorption pipe 2010 is installed at the top inner side of the frame 1, and the heat absorption pipe 2010 is serpentine, and both ends of the heat absorption pipe 2010 are fixedly connected to the two sets of connecting pipes 209 respectively; the heat dissipation assembly 2 also includes: a fixed box 201, a dustproof net B202, a fan 203, a fixed pipe 204, a circulating pump 205, a liquid collecting pipe A206, a liquid collecting pipe B207, and a heat dissipation pipe 208; the fixed box 201 is fixedly installed at the top of the frame 1; the dustproof net B202 is fixedly installed on one side of the fixed box 201; the fan 203 is fixedly installed on the other side of the fixed box 201, and a filter screen is provided inside the fan 203; the fixed pipe 204 is fixedly installed inside both sides of the fixed box 201, and the fixed pipe 204 is connected to the connecting pipe 209 The system is fixedly connected, and two sets of fixed pipes 204 are symmetrically arranged. The circulating pump 205 is fixedly installed on the top of the inner side of the fixed box 201, and the liquid inlet of the circulating pump 205 is fixedly connected to one set of fixed pipes 204. The liquid collecting pipe A206 is fixedly installed on the outside of the liquid outlet of the circulating pump 205. The liquid collecting pipe B207 is fixedly installed on the outside of the other set of fixed pipes 204. The heat dissipation pipe 208 is fixedly installed between the liquid collecting pipe A206 and the liquid collecting pipe B207, and the heat dissipation pipe 208 is arranged in a straight line and is serpentine. Its specific function is: the heat absorption pipe 2010 is set in a serpentine shape and forms a circulating heat dissipation circuit with the connecting pipe 209, fixed pipe 204, liquid collecting pipe A206, liquid collecting pipe B207 and heat dissipation pipe 208, and cooperates with the circulating pump 205 to accelerate the circulation of coolant. At the same time, the fan 203 accelerates the heat dissipation speed, thereby quickly absorbing the heat generated by the chipset and dissipating it efficiently.

[0033] Example 2: As shown in the attached document Figure 2 With appendix Figure 4As shown: Based on Embodiment 1, a sealing ring 1013 is fixedly installed on the top of the frame 1, and a heat-conducting plate 107 is movably installed between the bottoms of the two sets of mounting bases 105, with two sets of heat-conducting plates 107 arranged symmetrically; connecting holes 108 are opened inside both sides of the heat-conducting plate 107, and hexagonal socket bolts 109 are movably installed inside the connecting holes 108, and the hexagonal socket bolts 109 are threaded into the threaded holes 106; a heat sink 1010 is fixedly installed between the tops of the two sets of heat-conducting plates 107, and the heat sink 1010 is arranged in a straight line, and... The heat sink 1010 is located inside the frame 1; the heat sink 1010 has ventilation holes 1011 inside, and the ventilation holes 1011 completely penetrate the heat sink 1010; the top of the heat sink 1010 has a limiting groove 1012, and a heat absorption tube 2010 is movably installed inside the limiting groove 1012; its specific function is: through the mounting base 105 provided at the bottom of the inner side of the frame 1, the heat conduction plate 107 can be connected to the threaded hole 106 in the mounting base 105 through the internal hex bolt 109, and quickly fixed and installed; thus, the heat sink 1010 can be modularly assembled.

[0034] Example 3: As shown in the attached document Figure 5 To be continued Figure 7 As shown: Based on Embodiment 1 and Embodiment 2, the auxiliary structure 3 includes: a cooling fan 301, a sealing groove 302, an auxiliary seat 303, a self-locking block 304, and a positioning plate 305; the cooling fan 301 is movably disposed on the top of the frame 1, and two sets of cooling fans 301 are provided; the sealing groove 302 is opened at the bottom of the cooling fan 301, and a sealing ring 1013 is movably disposed inside the sealing groove 302; the auxiliary seat 303 is fixedly disposed on both sides of the cooling fan 301, and the auxiliary seat 303 is movably disposed inside the positioning seat 103; the self-locking block 304 is slidably disposed on the auxiliary seat. The self-locking block 304 has a beveled bottom side on one side of the internal part of the self-locking block 304 and the auxiliary seat 303. A spring is provided between the self-locking block 304 and the auxiliary seat 303, and the end of the self-locking block 304 is slidably disposed inside the connecting hole 104. The positioning plate 305 is fixedly disposed on the top of the self-locking block 304 and is slidably disposed inside the auxiliary seat 303. Its specific function is: the positioning seat 103 and the connecting hole 104 are provided on the top of the frame 1, so that the cooling fan 301 can be easily installed on the frame 1 through the auxiliary seat 303 and the self-locking block 304 to achieve modular assembly.

[0035] The specific usage and function of this embodiment are as follows:

[0036] In this invention, during use, two sets of heat-conducting plates 107 are placed between four sets of mounting seats 105 on the bottom inner side of the frame 1 to ensure accurate positioning of the heat-conducting plates 107. Using an Allen wrench, Allen bolts 109 are passed through the connecting holes 108 on both sides of the heat-conducting plate 107 and screwed into the threaded holes 106 inside the mounting seat 105 to firmly fix the heat-conducting plate 107 onto the mounting seat 105, thus fixing the heat sink 1010 to the inner side of the frame 1. Then, the cooling fan 301 is placed on top of the frame 1, allowing the sealing ring 1013 to slide into the sealing groove 302, and the auxiliary seat 303 to slide inside the positioning seat 103. When the auxiliary seat 303 slides inside the positioning seat 103, the positioning seat 103 presses against the self-locking block 304, causing the self-locking block 304 to slide into the auxiliary seat 303 using its beveled end. When the auxiliary seat 303 safely slides into the positioning seat 103, the spring element drives the self-locking block 304 to slide into the auxiliary seat 303. Locking block 304 slides into connecting hole 104 to fix cooling fan 301; positioning plate 305 can be used to pull self-locking block 304 out of connecting hole 104; then frame 1 is firmly fixed to the equipment through mounting holes on mounting brackets 101 on both sides of the bottom of frame 1; then circulation pump 205 is started; circulation pump 205 drives coolant to circulate in heat absorption pipe 2010, connecting pipe 209, fixing pipe 204, liquid collection pipe A206, liquid collection pipe B207 and heat dissipation pipe 208. Heat absorption pipe 2010 absorbs heat generated by chipset, and heat dissipation pipe 208 dissipates the absorbed heat quickly through fan 203; at the same time, cooling fan 301 starts to run, accelerating the air flow rate on surface of heat sink 1010, dissipating the heat absorbed by heat sink 1010 to the surrounding environment; thus, dual heat dissipation of chipset can be achieved, which can effectively meet the heat dissipation requirements of high heat generation chipset.

Claims

1. A modular heat dissipation device for chipsets, characterized in that, include: A frame (1); a heat dissipation component (2) is fixedly installed on the top of the frame (1), and an auxiliary structure (3) is also fixedly installed on the top of the frame (1); a positioning seat (103) is fixedly installed on the top of the frame (1), and the positioning seat (103) is set in an inverted U shape; the positioning seats (103) are arranged symmetrically, and a connecting hole (104) is opened inside one side of the positioning seat (103); a mounting bracket (101) is fixedly installed on both sides of the bottom of the frame (1), and a mounting hole is opened through the mounting bracket (101), and a dustproof net A (102) is fixedly installed on the inner side of the frame (1); a mounting seat (105) is fixedly installed on the bottom inner side of the frame (1), and four sets of mounting seats (105) are arranged symmetrically, and a threaded hole (106) is opened inside the mounting seat (105). The heat dissipation component (2) includes: a connecting pipe (209) and a heat absorption pipe (2010); the connecting pipe (209) is fixedly installed inside the top side of the frame (1), and two sets of the connecting pipe (209) are symmetrically arranged; the heat absorption pipe (2010) is installed at the top inside the frame (1), and the heat absorption pipe (2010) is serpentine, and the two ends of the heat absorption pipe (2010) are fixedly connected to the two sets of connecting pipes (209) respectively.

2. The modular heat dissipation device for chipsets according to claim 1, characterized in that: A sealing ring (1013) is fixedly installed on the top of the frame (1), and a heat-conducting plate (107) is movably installed between the bottoms of the two sets of mounting bases (105), and the heat-conducting plate (107) is symmetrically arranged in two sets; a connecting hole (108) is opened inside both sides of the heat-conducting plate (107), and an internal hexagon bolt (109) is movably installed inside the connecting hole (108), and the internal hexagon bolt (109) is installed inside the threaded hole (106) by threaded connection; a heat sink (1010) is fixedly installed between the tops of the two sets of heat-conducting plates (107), and the heat sink (1010) is arranged in a straight line, and the heat sink (1010) is located inside the frame (1).

3. The modular heat dissipation device for chipsets according to claim 2, characterized in that: The heat sink (1010) has a ventilation hole (1011) inside, and the ventilation hole (1011) completely penetrates the heat sink (1010); a limiting groove (1012) is opened on the top of the heat sink (1010), and a heat absorption tube (2010) is movably arranged inside the limiting groove (1012).

4. The modular heat dissipation device for chipsets according to claim 1, characterized in that: The heat dissipation assembly (2) further includes: a fixed box (201), a dustproof net B (202), a fan (203), and a fixed pipe (204); the fixed box (201) is fixedly installed on the top of the frame (1); the dustproof net B (202) is fixedly installed on one side of the fixed box (201); the fan (203) is fixedly installed on the other side of the fixed box (201), and a filter screen is provided inside the fan (203); the fixed pipe (204) is fixedly installed inside both sides of the fixed box (201), and the fixed pipe (204) is fixedly connected to the connecting pipe (209), and two sets of fixed pipes (204) are symmetrically arranged.

5. A modular heat dissipation device for chipsets according to claim 4, characterized in that: The heat dissipation assembly (2) further includes: a circulation pump (205), a liquid collection pipe A (206), a liquid collection pipe B (207), and a heat dissipation pipe (208); the circulation pump (205) is fixedly installed on the top of the inner side of the fixed box (201), and the liquid inlet of the circulation pump (205) is fixedly connected to a set of fixed pipes (204); the liquid collection pipe A (206) is fixedly installed on the outside of the liquid outlet of the circulation pump (205); the liquid collection pipe B (207) is fixedly installed on the outside of another set of fixed pipes (204); the heat dissipation pipe (208) is fixedly installed between the liquid collection pipe A (206) and the liquid collection pipe B (207), and the heat dissipation pipe (208) is arranged in a straight line and is serpentine.

6. A modular heat dissipation device for chipsets according to claim 2, characterized in that: The auxiliary structure (3) includes: a cooling fan (301) and a sealing groove (302); the cooling fan (301) is movably disposed on the top of the frame (1), and two sets of cooling fans (301) are provided; the sealing groove (302) is opened at the bottom of the cooling fan (301), and a sealing ring (1013) is movably disposed inside the sealing groove (302).

7. A modular heat dissipation device for chipsets according to claim 6, characterized in that: The auxiliary structure (3) further includes: an auxiliary seat (303), a self-locking block (304), and a positioning plate (305); the auxiliary seat (303) is fixedly disposed on both sides of the cooling fan (301), and the auxiliary seat (303) is movably disposed inside the positioning seat (103); the self-locking block (304) is slidably disposed inside one side of the auxiliary seat (303), and the bottom side of the end of the self-locking block (304) is configured as a beveled structure; a spring is disposed between the self-locking block (304) and the auxiliary seat (303), and the end of the self-locking block (304) is slidably disposed inside the connecting hole (104); the positioning plate (305) is fixedly disposed on the top of the self-locking block (304), and the positioning plate (305) is slidably disposed inside the auxiliary seat (303).

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