A temperature control device for semiconductor equipment

Abstract

This utility model discloses a temperature control device suitable for semiconductor equipment, including a temperature-controlled mixing mechanism and a heating device installed at the bottom of the temperature-controlled mixing mechanism. A circulating mixing mechanism is provided on the outside of the temperature-controlled mixing mechanism, and a circulating pump is located on the outside of the circulating mixing mechanism. The temperature-controlled mixing mechanism includes a meshing gear ring, and a mixing rotating disk is rotatably connected to the bottom of the meshing gear ring. Several meshing gears are meshed on the inner side of the meshing gear ring, wherein the number of meshing gears is three. A rotating motor is provided on the top of the meshing gear ring, wherein a drive gear is fixedly connected to the output end of the rotating motor. The drive gear meshes with the meshing gears, so that the meshing gears drive the mixing rotating disk and three vertical stirring rods to revolve, and at the same time, the vertical stirring rods drive the vertical auger to rotate, thereby realizing the up-and-down stirring of the cleaning liquid, which can not only improve the mixing efficiency of the cleaning liquid, but also achieve uniform heating of the cleaning liquid.

Description

Technical Field

[0001] This utility model relates to the field of temperature control technology, specifically a temperature control device suitable for semiconductor equipment. Background Technology

[0002] Semiconductors are materials whose conductivity at room temperature falls between that of conductors and insulators. Semiconductors have wide applications in radios, televisions, and temperature measurement. For example, diodes are devices made using semiconductors. From both a technological and economic development perspective, semiconductors are extremely important. In semiconductor cleaning processes, there are strict requirements for the temperature of the cleaning solution. Too high or too low a temperature will severely affect the cleaning effect and the semiconductor itself. When the cleaning solution temperature is too high, it may damage the semiconductor within the solution; when the temperature is too low, the cleaning effect may be unsatisfactory. Furthermore, different semiconductors require different cleaning temperatures to achieve the best results.

[0003] Publication No. CN218014530U discloses a temperature control device for semiconductor cleaning equipment. During use, an M-shaped heating rod heats the semiconductor cleaning fluid, bringing it to the optimal operating temperature. This not only improves cleaning efficiency but also enhances the cleanliness of the semiconductor. The M-shaped heating rod offers high heating efficiency. A temperature display allows real-time monitoring of the cleaning fluid temperature, ensuring it remains at its optimal operating temperature. During use, a heat sink dissipates excess heat from the semiconductor cleaning fluid, and several cooling fans further improve the heat dissipation efficiency when the cleaning fluid temperature is too high, accelerating heat dissipation and preventing damage to the semiconductor from overheating. However, this patent still has the following problems in practical use:

[0004] Although the temperature control device of this semiconductor cleaning equipment can heat the semiconductor cleaning fluid through the M-type heating rod to bring the semiconductor cleaning fluid to the optimal operating temperature, it cannot heat the semiconductor cleaning fluid evenly during the heating process. This can easily cause localized overheating of the semiconductor cleaning fluid, thereby affecting the heating effect.

[0005] Therefore, a temperature control device suitable for semiconductor equipment is proposed to solve the problems mentioned above. Utility Model Content

[0006] The purpose of this invention is to provide a temperature control device suitable for semiconductor equipment, so as to solve the problem mentioned in the background art that when heating semiconductor cleaning fluid, the semiconductor cleaning fluid cannot be heated evenly, which easily causes the local temperature of the semiconductor cleaning fluid to be too high, thereby affecting the heating effect of the semiconductor cleaning fluid.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a temperature control device suitable for semiconductor equipment, comprising a temperature control mixing mechanism and a heating device installed at the bottom of the temperature control mixing mechanism;

[0008] A circulating mixing mechanism is provided on the outside of the temperature-controlled mixing mechanism, and a circulating pump is provided on the outside of the circulating mixing mechanism.

[0009] Also includes:

[0010] The temperature-controlled mixing mechanism includes a meshing gear ring, a mixing rotating disk is rotatably connected to the bottom of the meshing gear ring, and several meshing gears are meshed to the inner side of the meshing gear ring.

[0011] The number of meshing gears is three, and a rotating motor is provided on the top of the meshing gear ring;

[0012] The output end of the rotating motor is fixedly connected to a drive gear, which meshes with a meshing gear.

[0013] Preferably, a heating rod is fixedly installed at the bottom of the drive gear, the heating rod is rotatably connected to the mixing rotating disk, a heating rod is fixedly installed at the bottom of the heating rod, several horizontal stirring rods are fixedly installed on the outer side of the heating rod, and a connecting shaft is rotatably connected to the bottom of the heating rod.

[0014] Preferably, a heating device is fixedly installed at the bottom of the connecting shaft, and rotating connecting rings are fixedly installed at the top and bottom of the heating rod near the horizontal stirring rod. A top bracket and a bottom bracket are fixedly installed on the outer side of the two rotating connecting rings, and a cleaning shovel is fixedly installed on the outer side of the bottom bracket.

[0015] Preferably, a vertical temperature measuring device is fixedly installed at the ends of the top support and the bottom support, a vertical stirring rod is rotatably connected to the middle of the top support and the bottom support, the vertical stirring rod is fixedly installed at the bottom of the meshing gear, and a vertical auger is fixedly installed at the middle of the vertical stirring rod.

[0016] Preferably, the circulating mixing mechanism includes a mixing box, the meshing toothed ring is fixedly installed on the inner top of the mixing box, the rotating motor is fixedly installed at the center of the top of the mixing box, and a discharge valve is fixedly installed on the outer bottom of the mixing box.

[0017] Preferably, a feed pipe is fixedly installed on one side of the top of the mixing box, a feed box is fixedly installed on the top of the feed pipe, an insulation cover is fixedly installed on the top of the feed box, a support ring is fixedly installed in the middle of the mixing box, and support legs are fixedly installed around the bottom of the support ring.

[0018] Preferably, a first circulation pipe is symmetrically installed on the outside of the mixing tank, a circulation pump is fixedly installed at the end of each of the two first circulation pipes, and a second circulation pipe is fixedly installed at the bottom of each of the two circulation pumps, and the second circulation pipe is fixedly connected to the bottom of the mixing tank.

[0019] Compared with the prior art, the beneficial effects of this utility model are as follows: This temperature control device suitable for semiconductor equipment realizes the revolution of the mixing disc and three vertical stirring rods driven by the meshing gears, while simultaneously causing the vertical stirring rods to drive the vertical auger to rotate, thereby realizing the up-and-down stirring of the cleaning liquid. This not only improves the mixing efficiency of the cleaning liquid, but also achieves uniform heating of the cleaning liquid. Utilizing the first circulation pipe, circulation pump, and second circulation pipe, the cleaning liquid can be circulated up and down inside the mixing tank, which not only achieves thorough mixing of the cleaning liquid, but also achieves uniform heating of the cleaning liquid. The specific details are as follows:

[0020] 1. By setting up a temperature-controlled mixing mechanism, the rotating motor can drive the drive gear, heating rod, and horizontal stirring rod to rotate, and the heating equipment can heat the heating rod. The horizontal stirring rod can also achieve horizontal stirring of the cleaning liquid. At the same time, by utilizing the meshing connection between the drive gear, the meshing gear, and the meshing gear ring, the meshing gear can drive the mixing disc and the three vertical stirring rods to revolve, while the vertical stirring rods can drive the vertical auger to rotate, thereby achieving up-and-down stirring of the cleaning liquid. This not only improves the mixing efficiency of the cleaning liquid but also achieves uniform heating of the cleaning liquid. The vertical temperature measuring device can not only detect the temperature of the cleaning liquid but also clean the inner wall of the mixing tank to prevent the residue of the cleaning liquid.

[0021] 2. By setting up a circulating mixing mechanism, not only can the mixing tank be kept warm using the heat-insulating cover, but the cleaning liquid can also be circulated up and down inside the mixing tank using the first circulation pipe, circulation pump and second circulation pipe. This not only ensures thorough mixing of the cleaning liquid, but also ensures uniform heating of the cleaning liquid, further improving the temperature control effect of the cleaning liquid. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall three-dimensional structure of this utility model;

[0023] Figure 2 This is a three-dimensional structural diagram of the temperature-controlled mixing mechanism in this utility model;

[0024] Figure 3 This is a three-dimensional structural diagram of the heating rod and horizontal stirring rod in this utility model;

[0025] Figure 4 This is a three-dimensional structural diagram of the vertical temperature measuring device in this utility model;

[0026] Figure 5 This is a three-dimensional structural diagram of the circulating mixing mechanism in this utility model;

[0027] Figure 6 This is a three-dimensional structural diagram of the mixing box in this utility model.

[0028] In the diagram: 1. Temperature-controlled mixing mechanism; 101. Meshing gear ring; 102. Mixing rotating disk; 103. Meshing gear; 104. Rotating motor; 105. Drive gear; 106. Heating rod; 107. Horizontal stirring rod; 108. Connecting shaft; 109. Heating equipment; 110. Rotating connecting ring; 111. Top support; 112. Bottom support; 113. Cleaning shovel; 114. Vertical temperature measuring device; 115. Vertical stirring rod; 116. Vertical auger; 2. Circulating mixing mechanism; 201. Mixing box; 202. Discharge valve; 203. Feed pipe; 204. Feed box; 205. Insulation cover; 206. Support ring; 207. Support leg; 208. First circulation pipe; 209. Circulating pump; 210. Second circulation pipe. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] Please see Figures 1-6This utility model provides a technical solution: a temperature control device suitable for semiconductor equipment, including a temperature-controlled mixing mechanism 1 and a heating device 109 installed at the bottom of the temperature-controlled mixing mechanism 1. A circulating mixing mechanism 2 is provided on the outside of the temperature-controlled mixing mechanism 1, and a circulating pump 209 is located on the outside of the circulating mixing mechanism 2. The temperature-controlled mixing mechanism 1 includes a meshing gear ring 101, a mixing rotating disk 102 is rotatably connected to the bottom of the meshing gear ring 101, and a plurality of meshing gears 103 are meshed on the inner side of the meshing gear ring 101, wherein the number of meshing gears 103 is three. A rotating motor 104 is provided on the top of the meshing gear ring 101, wherein the rotating motor 104 outputs... A drive gear 105 is fixedly connected to the outlet end, and the drive gear 105 meshes with a meshing gear 103. A heating rod 106 is fixedly installed at the bottom of the drive gear 105, and the heating rod 106 is rotatably connected to the mixing rotating disk 102. A heating rod 106 is fixedly installed at the bottom of the heating rod 106, and several horizontal stirring rods 107 are fixedly installed on the outer side of the heating rod 106. A connecting shaft 108 is rotatably connected to the bottom of the heating rod 106, and a heating device 109 is fixedly installed at the bottom of the connecting shaft 108. Rotating connecting rings 110 are fixedly installed at the top and bottom of the heating rod 106 near the horizontal stirring rods 107. The outer sides of the two rotating connecting rings 110 are... A top bracket 111 and a bottom bracket 112 are fixedly installed. A cleaning shovel 113 is fixedly installed on the outer side of the bottom bracket 112. A vertical temperature measuring device 114 is fixedly installed at the ends of the top bracket 111 and the bottom bracket 112. A vertical stirring rod 115 is rotatably connected to the middle of the top bracket 111 and the bottom bracket 112. The vertical stirring rod 115 is fixedly installed at the bottom of the meshing gear 103. A vertical auger 116 is fixedly installed in the middle of the vertical stirring rod 115. A rotating motor 104 drives the drive gear 105, the heating rod 106, and the horizontal stirring rod 107 to rotate. The heating device 109 heats the heating rod 106. The horizontal stirring rod 107 is used to achieve horizontal stirring of the cleaning liquid. At the same time, the meshing connection between the drive gear 105, the meshing gear 103, and the meshing ring 101 is utilized. This not only enables the meshing gear 103 to drive the mixing disk 102 and the three vertical stirring rods 115 to revolve, but also enables the vertical stirring rods 115 to drive the vertical auger 116 to rotate, thereby achieving vertical stirring of the cleaning liquid. This not only improves the mixing efficiency of the cleaning liquid, but also achieves uniform heating of the cleaning liquid. The vertical temperature measuring device 114 can not only detect the temperature of the cleaning liquid, but also clean the inner wall of the mixing tank 201 to avoid the residue of the cleaning liquid.

[0031] The circulating mixing mechanism 2 includes a mixing tank 201, a meshing gear ring 101 fixedly installed on the inner top of the mixing tank 201, a rotating motor 104 fixedly installed at the center of the top of the mixing tank 201, a discharge valve 202 fixedly installed on the outer bottom of the mixing tank 201, a feed pipe 203 fixedly installed on one side of the top of the mixing tank 201, a feed box 204 fixedly installed on the top of the feed pipe 203, a heat insulation cover 205 fixedly installed on the top of the feed box 204, a support ring 206 fixedly installed in the middle of the mixing tank 201, and support legs 207 fixedly installed around the bottom of the support ring 206. A first circulation pipe 208 is symmetrically installed on the outside. A circulation pump 209 is fixedly installed at the end of each of the two first circulation pipes 208. A second circulation pipe 210 is fixedly installed at the bottom of each of the two circulation pumps 209. The second circulation pipe 210 is fixedly connected to the bottom of the mixing tank 201. The mixing tank 201 is insulated by the heat insulation cover 205. At the same time, the first circulation pipe 208, circulation pump 209 and second circulation pipe 210 can realize the up and down circulation of the cleaning liquid inside the mixing tank 201. This not only enables the cleaning liquid to be fully mixed, but also enables the cleaning liquid to be heated evenly, further improving the temperature control effect of the cleaning liquid.

[0032] Working principle: Before using this temperature control device suitable for semiconductor equipment, it is necessary to check the overall condition of the device to ensure it can operate normally. Figure 1 - Figure 6 As shown, firstly, the rotating motor 104 drives the drive gear 105, heating rod 106, and horizontal stirring rod 107 to rotate. The heating device 109 heats the heating rod 106, and the horizontal stirring rod 107 horizontally stirs the cleaning fluid. Simultaneously, utilizing the meshing connection between the drive gear 105, the meshing gear 103, and the meshing ring 101, not only does the meshing gear 103 drive the mixing rotating disk 102 and the three vertical stirring rods 115 to revolve, but the vertical stirring rods 115 also drive the vertical auger 116 to rotate, thus achieving vertical agitation of the cleaning fluid. This system improves the mixing efficiency of the cleaning solution and enables uniform heating. The vertical temperature measuring device 114 can detect the temperature of the cleaning solution and clean the inner wall of the mixing tank 201 to prevent residue. The insulation cover 205 keeps the mixing tank 201 warm. The first circulation pipe 208, circulation pump 209, and second circulation pipe 210 enable the cleaning solution to circulate up and down inside the mixing tank 201. This not only ensures thorough mixing of the cleaning solution but also achieves uniform heating, further improving the temperature control effect of the cleaning solution.

[0033] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A temperature control device suitable for semiconductor equipment, comprising a temperature control mixing mechanism (1) and a heating device (109) installed at the bottom of the temperature control mixing mechanism (1); A circulating mixing mechanism (2) is provided on the outside of the temperature control mixing mechanism (1), and a circulating pump (209) is provided on the outside of the circulating mixing mechanism (2); Its features are, Also includes: The temperature-controlled mixing mechanism (1) includes a meshing gear ring (101), the bottom of which is rotatably connected to a mixing rotating disk (102), and the inner side of the meshing gear ring (101) is meshed with a plurality of meshing gears (103). Among them, there are three meshing gears (103), and a rotating motor (104) is provided on the top of the meshing gear ring (101); The output end of the rotating motor (104) is fixedly connected to a drive gear (105), which meshes with a meshing gear (103).

2. The temperature control device for semiconductor equipment according to claim 1, characterized in that: A heating rod (106) is fixedly installed at the bottom of the drive gear (105). The heating rod (106) is rotatably connected to the mixing rotating disk (102). The heating rod (106) is fixedly installed at the bottom. Several horizontal stirring rods (107) are fixedly installed on the outside of the heating rod (106). A connecting shaft (108) is rotatably connected to the bottom of the heating rod (106).

3. A temperature control device suitable for semiconductor equipment according to claim 2, characterized in that: A heating device (109) is fixedly installed at the bottom of the connecting shaft (108). Rotating connecting rings (110) are fixedly installed at the top and bottom of the heating rod (106) near the horizontal stirring rod (107). A top bracket (111) and a bottom bracket (112) are fixedly installed on the outer side of the two rotating connecting rings (110), respectively. A cleaning shovel (113) is fixedly installed on the outer side of the bottom bracket (112).

4. A temperature control device suitable for semiconductor equipment according to claim 3, characterized in that: A vertical temperature measuring device (114) is fixedly installed at the ends of the top support (111) and the bottom support (112). A vertical stirring rod (115) is rotatably connected to the middle of the top support (111) and the bottom support (112). The vertical stirring rod (115) is fixedly installed at the bottom of the meshing gear (103). A vertical auger (116) is fixedly installed in the middle of the vertical stirring rod (115).

5. A temperature control device suitable for semiconductor equipment according to claim 1, characterized in that: The circulating mixing mechanism (2) includes a mixing box (201), the meshing toothed ring (101) is fixedly installed on the inner side of the top of the mixing box (201), the rotating motor (104) is fixedly installed at the center of the top of the mixing box (201), and a discharge valve (202) is fixedly installed on the outer side of the bottom of the mixing box (201).

6. A temperature control device suitable for semiconductor equipment according to claim 5, characterized in that: A feed pipe (203) is fixedly installed on one side of the top of the mixing box (201), a feed box (204) is fixedly installed on the top of the feed pipe (203), a heat insulation cover (205) is fixedly installed on the top of the feed box (204), a support ring (206) is fixedly installed in the middle of the mixing box (201), and support legs (207) are fixedly installed around the bottom of the support ring (206).

7. A temperature control device suitable for semiconductor equipment according to claim 6, characterized in that: The mixing tank (201) is symmetrically equipped with first circulation pipes (208) on the outside. A circulation pump (209) is fixedly installed at the end of each of the two first circulation pipes (208). A second circulation pipe (210) is fixedly installed at the bottom of each of the two circulation pumps (209). The second circulation pipe (210) is fixedly connected to the bottom of the mixing tank (201).

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