A refrigeration system with high performance thermoelectric economizer in the field of semiconductor

Abstract

The application provides a refrigeration system with high-performance thermoelectric economizer in the field of semiconductors, comprising that the output ends of a compressor are connected with the input ends of a condenser and an evaporator respectively; two sides of a semiconductor refrigeration sheet are respectively provided with a cold surface heat exchanger and a hot surface heat exchanger; the output ends of the condenser are connected with the input ends of the cold surface heat exchanger and the hot surface heat exchanger respectively; the output end of the cold surface heat exchanger is connected with the evaporator through a first electronic expansion valve; a second electronic expansion valve is further arranged between the hot surface heat exchanger and the condenser, and the output end is connected with the input end of the compressor; a third electronic expansion valve is further arranged between the input end of the evaporator and the output end of the compressor. Through connecting the output ends of the compressor with the condenser and the evaporator respectively, conventional refrigeration can be carried out through the first electronic expansion valve, the condensed refrigerant can be warmed through the third electronic expansion valve, the refrigeration precision is effectively improved, and the compressor can be directly cooled through the second electronic expansion valve.

Description

Technical Field

[0001] This application relates to the field of industrial refrigeration technology, and more specifically to a refrigeration system with a high-efficiency thermoelectric economizer in the semiconductor field. Background Technology

[0002] Semiconductor manufacturing is an extremely complex process with very demanding environmental requirements. As chip integration continues to increase and feature sizes shrink, the temperature stability requirements for semiconductor manufacturing processes have reached unprecedented levels. Any minute temperature change can trigger alterations in the physical properties of materials, leading to chip performance deviations, reduced yields, and even damage to production equipment. In the early stages of semiconductor manufacturing, due to the relatively simple chip manufacturing process, the precision requirements for temperature control could be met through basic heat dissipation methods. However, with technological advancements, especially the emergence of high-precision processes such as photolithography, etching, and epitaxial growth, traditional heat dissipation methods are no longer sufficient to meet the ever-increasing heat dissipation demands. Photolithography, as a core component of chip manufacturing, generates a significant amount of heat during operation from key components such as optical lenses and laser sources. If this heat cannot be dissipated promptly and accurately, the minute deformations caused by the thermal expansion and contraction of the lenses will directly lead to deviations in the photolithographic pattern, severely impacting chip manufacturing precision.

[0003] Chiller technology emerged to address this need. It utilizes a circulating, low-temperature coolant to efficiently absorb the heat generated during equipment operation, enabling precise temperature control. Early chiller technology was relatively simple, with limited cooling capacity and temperature control accuracy only around ±2℃, suitable only for some less temperature-critical semiconductor manufacturing processes. However, with the rapid development of the semiconductor industry, the performance requirements for chillers have continuously increased, prompting continuous iteration of this technology. Today, chiller technology has made significant progress in the semiconductor field globally. The development and application of key components such as new refrigeration compressors and high-efficiency heat exchangers have greatly improved the cooling efficiency of chillers and reduced energy consumption. The combination of advanced temperature sensors and intelligent control systems enables modern chillers to maintain temperature control accuracy at ±0.1℃ or even higher, fully meeting the stringent temperature requirements of semiconductor manufacturing processes. Furthermore, to meet the demands of 24 / 7 uninterrupted operation on semiconductor production lines, chillers have achieved a qualitative leap in stability and reliability. Multiple safety protection mechanisms ensure stable operation under various complex conditions, reducing production interruptions caused by equipment failures.

[0004] While chillers are widely used in the semiconductor industry, they still have shortcomings. Some traditional chillers have low cooling efficiency, resulting in high energy consumption and increased operating costs. In addition, some chillers lack temperature control stability under extreme operating conditions, making it difficult to consistently maintain the stringent temperature standards required for semiconductor processes, thus affecting product yield and equipment lifespan. Summary of the Invention

[0005] In view of the above-mentioned defects or deficiencies in the prior art, it is desirable to provide a refrigeration system with a high-efficiency thermoelectric economizer in the semiconductor field.

[0006] This application provides a refrigeration system with a high-efficiency thermoelectric economizer in the semiconductor field, including... The compressor, the output of which is connected to the input of the condenser and the evaporator respectively; A semiconductor refrigeration chip, wherein a cold surface heat exchanger and a hot surface heat exchanger are respectively provided on both sides of the semiconductor refrigeration chip; The output end of the condenser is connected to the input ends of the cold surface heat exchanger and the hot surface heat exchanger, respectively. The output end of the cold surface heat exchanger is connected to the evaporator through a first electronic expansion valve; A second electronic expansion valve is also provided between the hot surface heat exchanger and the condenser, with its output end connected to the input end of the compressor; A third electronic expansion valve is also provided between the input end of the evaporator and the output end of the compressor.

[0007] Furthermore, The condenser is connected to the compressor via a three-way valve and the third electronic expansion valve. An oil separator is also provided between the three-way valve and the compressor to separate oil from the refrigerant; The oil separator is also connected to the input end of the compressor for returning the separated oil.

[0008] Furthermore, It also includes a first temperature sensor; The first temperature sensor is located between the oil separator and the compressor to monitor the temperature of the refrigerant in real time.

[0009] Furthermore, The output end of the condenser is also provided with a liquid storage tank, a first pressure sensor and a drying filter in sequence. The end of the dryer filter furthest from the first pressure sensor is connected to the cold surface heat exchanger and the second electronic expansion valve.

[0010] Furthermore, The output end of the evaporator is connected to the input end of the compressor; A second temperature sensor and a second pressure sensor are respectively provided between the input end of the compressor and the output end of the evaporator.

[0011] Furthermore, The condenser is also connected to a circulating cooling device for heat exchange and cooling with the refrigerant; The input end of the circulating cooling device is equipped with a third temperature sensor and a third pressure sensor, and the output end is equipped with a fourth temperature sensor and a fourth pressure sensor.

[0012] Furthermore, The evaporator is also connected to a temperature control system for controlling the temperature of the external environment; The input end of the temperature control system is connected to the evaporator, and the output end is connected to the water tank. The input end of the water tank is connected to the evaporator and is used to store coolant.

[0013] Furthermore, A fifth temperature sensor, a fifth pressure sensor, and a flow meter are respectively installed between the input end of the temperature control system and the evaporator.

[0014] Furthermore, A water pump, a drain valve, an electric heater, a sixth temperature sensor, and a sixth pressure sensor are respectively installed between the output end of the temperature control system and the water tank. The input end of the water pump is connected to the output end of the water tank to provide circulation power; The electric heater is connected to the output end of the water pump and is used to control the output temperature of the coolant; The drain valve is located between the electric heater and the water pump; The sixth temperature sensor and the sixth pressure sensor are respectively located at the end of the electric heater away from the water pump.

[0015] Furthermore, The water tank is equipped with a level gauge, a filling port, and a level switch. The filling port is located at the top of the water tank and is used to add coolant into the water tank; The level gauge is configured to detect the liquid level height in the water tank; The liquid level switch is linked to the liquid level gauge and the liquid filling port respectively, and is used to control the automatic addition of coolant.

[0016] The advantages and positive effects of this application are: This technical solution connects the compressor's output to the condenser and evaporator respectively. It can perform conventional refrigeration through the first electronic expansion valve, and can also heat the condensed refrigerant through the third electronic expansion valve, thereby effectively improving refrigeration accuracy. It can also directly cool the compressor through the second electronic expansion valve. At the same time, the first and second electronic expansion valves are also connected to the cold-side heat exchanger and the hot-side heat exchanger respectively. The cold-side heat exchanger can further cool the condensed refrigerant, thereby effectively improving the refrigeration capacity, while the hot-side heat exchanger can cool the refrigerant output from the third electronic expansion valve, preventing the refrigerant from entering the compressor in a liquid state and preventing liquid slugging in the compressor. Attached Figure Description

[0017] Figure 1 A schematic diagram of a refrigeration system with a high-efficiency thermoelectric economizer in the semiconductor field, provided as an embodiment of this application.

[0018] The text labels in the diagram represent: 100-Compressor; 110-Oil separator; 120-First temperature sensor; 200-Condenser; 210-First electronic expansion valve; 220-Second electronic expansion valve; 230-Liquid receiver; 240-First pressure sensor; 250-Drier filter; 260-Third temperature sensor; 261-Third pressure sensor; 270-Fourth temperature sensor; 271-Fourth pressure sensor; 300-Evaporator; 310-Third electronic expansion valve. Valve; 320-Second temperature sensor; 330-Second pressure sensor; 340-Water tank; 341-Level gauge; 342-Inlet port; 343-Level switch; 350-Fifth temperature sensor; 351-Fifth pressure sensor; 352-Flow meter; 360-Water pump; 361-Drain valve; 362-Electric heater; 363-Sixth temperature sensor; 364-Sixth pressure sensor; 400-Semiconductor cooling chip; 410-Cold surface heat exchanger; 420-Hot surface heat exchanger. Detailed Implementation

[0019] To enable those skilled in the art to better understand the technical solution of this application, the application will be described in detail below with reference to the accompanying drawings. The description in this section is only exemplary and explanatory, and should not be used to limit the scope of protection of this application.

[0020] Please refer to Figure 1This embodiment provides a refrigeration system with a high-efficiency thermoelectric economizer in the semiconductor field, including a compressor 100, the output end of which is connected to the input ends of a condenser 200 and an evaporator 300 respectively; a semiconductor refrigeration chip 400, with a cold-side heat exchanger 410 and a hot-side heat exchanger 420 respectively on both sides of the semiconductor refrigeration chip 400; the output end of the condenser 200 is connected to the input ends of the cold-side heat exchanger 410 and the hot-side heat exchanger 420 respectively; the output end of the cold-side heat exchanger 410 is connected to the evaporator 300 through a first electronic expansion valve 210; a second electronic expansion valve 220 is also provided between the hot-side heat exchanger 420 and the condenser 200, and its output end is connected to the input end of the compressor 100; a third electronic expansion valve 310 is also provided between the input end of the evaporator 300 and the output end of the compressor 100.

[0021] In this embodiment, the output end of the compressor 100 is connected to the condenser 200 and the evaporator 300 respectively; wherein the circuit formed by the compressor 100, the condenser 200, the first electronic expansion valve 210 and the evaporator 300 is the basic refrigeration circuit; According to external demand, when the cooling capacity demand is low, the high-temperature and high-pressure refrigerant can be directly mixed with the low-temperature liquid refrigerant output from the first electronic expansion valve 210 and input into the evaporator 300 through the third electronic expansion valve 310, thereby effectively improving the cooling accuracy. When the cooling capacity demand is high according to external needs, a low-voltage DC power supply can be input to the semiconductor cooling chip 400, and then the refrigerant can be further cooled through the cold surface heat exchanger 410, thereby effectively improving the cooling capacity. When the compressor 100 temperature is too high, the second electronic expansion valve 220 can also directly deliver the condensed refrigerant to the input end of the compressor 100, thereby rapidly cooling the compressor 100.

[0022] In this embodiment, the refrigerant output by the second electronic expansion valve 220 first passes through the hot surface heat exchanger 420 before entering the compressor 100; the heating by the hot surface heat exchanger 420 can effectively ensure that the refrigerant is in a gaseous state when it enters the compressor 100, thus avoiding liquid slugging in the compressor.

[0023] In a preferred embodiment, the condenser 200 is connected to the compressor 100 via a tee valve to the third electronic expansion valve 310; an oil separator 110 is also provided between the tee valve and the compressor 100 for separating oil from the refrigerant; the oil separator 110 is also connected to the input end of the compressor 100 for returning the separated oil.

[0024] In this embodiment, the oil separator 110 can effectively separate the oil mixed in the refrigerant and return it to the compressor 100. Depending on the compressor 100, the returned oil can enter the compressor 100 through the input end of the compressor 100 or a separate oil return port.

[0025] In a preferred embodiment, a first temperature sensor 120 is also included; the first temperature sensor 120 is located between the oil separator 110 and the compressor 100, and is used to monitor the temperature of the refrigerant in real time.

[0026] In a preferred embodiment, the output end of the condenser 200 is further provided with a liquid storage tank 230, a first pressure sensor 240 and a dryer filter 250 in sequence; the end of the dryer filter 250 away from the first pressure sensor 240 is connected to the cold surface heat exchanger 410 and the second electronic expansion valve 220 respectively.

[0027] In this embodiment, the liquid storage tank 230 is used to store refrigerant to prevent the system pressure from being too high; the dryer filter 250 is used to filter out moisture and impurities in the refrigerant to ensure that the refrigeration system will not experience ice blockage or dirt blockage.

[0028] In a preferred embodiment, the output end of the evaporator 300 is connected to the input end of the compressor 100; a second temperature sensor 320 and a second pressure sensor 330 are respectively provided between the input end of the compressor 100 and the output end of the evaporator 300.

[0029] In a preferred embodiment, the condenser 200 is also connected to a circulating cooling device for heat exchange and cooling with the refrigerant; the input end of the circulating cooling device is provided with a third temperature sensor 260 and a third pressure sensor 261, and the output end is provided with a fourth temperature sensor 270 and a fourth pressure sensor 271.

[0030] In this embodiment, the circulating cooling device can effectively cool the refrigerant through circulating cooling water; at the same time, the cooling water that has absorbed heat and increased in temperature can also be used to provide external heating.

[0031] In a preferred embodiment, the evaporator 300 is also connected to a temperature control system for controlling the temperature of the external environment; the input end of the temperature control system is connected to the evaporator 300, and the output end is connected to the water tank 340; the input end of the water tank 340 is connected to the evaporator 300 for storing coolant.

[0032] In this embodiment, after the coolant exchanges heat with the refrigerant in the evaporator 300, it can be effectively reduced to a specified temperature, and then the external environment is cooled through circulation.

[0033] In a preferred embodiment, a fifth temperature sensor 350, a fifth pressure sensor 351, and a flow meter 352 are respectively provided between the input end of the temperature control system and the evaporator 300.

[0034] In a preferred embodiment, a water pump 360, a drain valve 361, an electric heater 362, a sixth temperature sensor 363, and a sixth pressure sensor 364 are respectively provided between the output end of the temperature control system and the water tank 340; the input end of the water pump 360 is connected to the output end of the water tank 340 to provide circulation power; the electric heater 362 is connected to the output end of the water pump 360 to control the output temperature of the coolant; the drain valve 361 is located between the electric heater 362 and the water pump 360; the sixth temperature sensor 363 and the sixth pressure sensor 364 are respectively located at the end of the electric heater 362 away from the water pump 360.

[0035] In this embodiment, the water pump 360 is directly connected to the water tank 340 for circulating the coolant; the electric heater 362 is located on the side of the water pump 360 away from the water tank 340, and can quickly control the temperature of the cooling water according to the external temperature requirements.

[0036] In a preferred embodiment, the water tank 340 is provided with a level gauge 341, a filling port 342, and a level switch 343; the filling port 342 is located at the top of the water tank 340 and is used to add coolant into the water tank 340; the level gauge 341 is configured to detect the liquid level in the water tank 340; the level switch 343 is linked to the level gauge 341 and the filling port 342 respectively, and is used to control the automatic addition of coolant.

[0037] In this embodiment, the liquid filling port 342 is located at the top of the water tank 340 and is connected to an external liquid filling device; the liquid level switch is linked to the liquid level gauge and the liquid filling port 342 respectively, and can effectively realize automatic liquid filling according to the liquid level change.

[0038] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the methods and core ideas of this application. The above descriptions are only preferred embodiments of this application. It should be noted that due to the limitations of textual expression, while there are objectively infinite specific structures, those skilled in the art can make several improvements, modifications, or changes without departing from the principles of this invention, and can also combine the above technical features in an appropriate manner. These improvements, modifications, changes, or combinations, or the direct application of the inventive concept and technical solution to other situations without modification, should all be considered within the scope of protection of this application.

Claims

1. A refrigeration system with a high-efficiency thermoelectric economizer in the semiconductor field, characterized in that, include A compressor (100) is provided, the output of which is connected to the input of a condenser (200) and an evaporator (300), respectively. A semiconductor refrigeration chip (400) is provided with a cold surface heat exchanger (410) and a hot surface heat exchanger (420) on both sides of the semiconductor refrigeration chip (400). The output end of the condenser (200) is connected to the input ends of the cold surface heat exchanger (410) and the hot surface heat exchanger (420), respectively. The output end of the cold surface heat exchanger (410) is connected to the evaporator (300) through the first electronic expansion valve (210); A second electronic expansion valve (220) is also provided between the hot surface heat exchanger (420) and the condenser (200), and its output end is connected to the input end of the compressor (100); A third electronic expansion valve (310) is also provided between the input end of the evaporator (300) and the output end of the compressor (100).

2. The refrigeration system with a high-efficiency thermoelectric economizer in the semiconductor field according to claim 1, characterized in that, The condenser (200) is connected to the compressor (100) via a tee valve to the third electronic expansion valve (310); An oil separator (110) is also provided between the three-way valve and the compressor (100) for separating oil from the refrigerant; The oil separator (110) is also connected to the input of the compressor (100) for returning the separated oil.

3. The refrigeration system with a high-efficiency thermoelectric economizer in the semiconductor field according to claim 2, characterized in that, It also includes a first temperature sensor (120); The first temperature sensor (120) is located between the oil separator (110) and the compressor (100) to monitor the temperature of the refrigerant in real time.

4. The refrigeration system with a high-efficiency thermoelectric economizer in the semiconductor field according to claim 1, characterized in that, The output end of the condenser (200) is also provided with a liquid storage tank (230), a first pressure sensor (240) and a dryer filter (250) in sequence. The end of the dryer filter (250) away from the first pressure sensor (240) is connected to the cold surface heat exchanger (410) and the second electronic expansion valve (220).

5. The refrigeration system with a high-efficiency thermoelectric economizer in the semiconductor field according to claim 1, characterized in that, The output end of the evaporator (300) is connected to the input end of the compressor (100); A second temperature sensor (320) and a second pressure sensor (330) are respectively provided between the input end of the compressor (100) and the output end of the evaporator (300).

6. The refrigeration system with a high-efficiency thermoelectric economizer in the semiconductor field according to claim 1, characterized in that, The condenser (200) is also connected to a circulating cooling device for heat exchange and cooling with the refrigerant; The input end of the circulating cooling device is equipped with a third temperature sensor (260) and a third pressure sensor (261), and the output end is equipped with a fourth temperature sensor (270) and a fourth pressure sensor (271).

7. The refrigeration system with a high-efficiency thermoelectric economizer in the semiconductor field according to claim 1, characterized in that, The evaporator (300) is also connected to a temperature control system for controlling the temperature of the external environment; The input end of the temperature control system is connected to the evaporator (300), and the output end is connected to the water tank (340); The input end of the water tank (340) is connected to the evaporator (300) for storing coolant.

8. The refrigeration system with a high-efficiency thermoelectric economizer in the semiconductor field according to claim 7, characterized in that, A fifth temperature sensor (350), a fifth pressure sensor (351), and a flow meter (352) are respectively provided between the input end of the temperature control system and the evaporator (300).

9. The refrigeration system with a high-efficiency thermoelectric economizer in the semiconductor field according to claim 7, characterized in that, A water pump (360), a drain valve (361), an electric heater (362), a sixth temperature sensor (363), and a sixth pressure sensor (364) are respectively provided between the output end of the temperature control system and the water tank (340). The input end of the water pump (360) is connected to the output end of the water tank (340) to provide circulation power; The electric heater (362) is connected to the output end of the water pump (360) to control the output temperature of the coolant; The drain valve (361) is located between the electric heater (362) and the water pump (360); The sixth temperature sensor (363) and the sixth pressure sensor (364) are located at the end of the electric heater (362) away from the water pump (360).

10. The refrigeration system with a high-efficiency thermoelectric economizer in the semiconductor field according to claim 7, characterized in that, The water tank (340) is equipped with a level gauge (341), a liquid inlet (342), and a level switch (343). The filling port (342) is located at the top of the water tank (340) and is used to add coolant into the water tank (340); The level gauge (341) is configured to detect the liquid level height in the water tank (340); The liquid level switch (343) is linked to the liquid level gauge (341) and the liquid filling port (342) respectively, and is used to control the automatic addition of coolant.

Images