Laser hair removal module and laser hair removal device thereof

Abstract

The utility model relates to a laser depilation module and laser depilation appearance thereof, wherein the laser depilation module, including laser package spare, light guide, laser heat sink, refrigeration plant, refrigeration heat dissipation subassembly, is equipped with semiconductor laser chip in laser package spare, and semiconductor laser chip is fixed on the substrate, and the laser shell is fixed on the substrate, the middle installation of laser shell has the light guide, the back of substrate installs the laser heat sink, the flat side of light guide installs the refrigeration plant, and the heat dissipation surface of refrigeration plant installs refrigeration heat dissipation subassembly. The front portion of the bottom cover of laser depilation appearance is installed the laser depilation module, and the working part of light guide is embedded in the front cover, and the light exit surface of light guide is exposed outward, forms the working end, and the heat dissipation fan is installed closely to the laser depilation module, and the air outlet of heat dissipation fan is towards laser heat sink and refrigeration heat dissipation subassembly. The utility model designs the laser depilation module, simplifies the structure, improves the heat dissipation efficiency, has the ice compress function, and is convenient to install.

Description

Technical Field

[0001] This utility model relates to a laser hair removal device, belonging to the field of laser hair removal equipment. Background Technology

[0002] Laser hair removal works on the principle of selective photothermolysis. By adjusting the laser wavelength, energy, and pulse width, the laser can penetrate the skin's surface to reach the hair follicle at the root of the hair. Melanin selectively absorbs the light energy, and the resulting thermal effect causes the hair follicle to die, thus preventing hair regrowth. This process does not damage surrounding tissue and causes only mild pain. Two important conditions must be met for laser hair removal to be effective: first, the laser must be fully absorbed by the hair follicle tissue; second, the laser must effectively penetrate the skin to reach the location of the hair follicle. Semiconductor lasers have a wavelength of 808nm, which is in the near-infrared region of the spectrum. In this wavelength range, melanin absorption is good, and the absorption of laser light by hemoglobin or water is minimized. Furthermore, its penetration is stronger than that of ruby ​​and alexandrite lasers, allowing it to penetrate deep into the dermis and subcutaneous fat tissue, acting on hair follicles at different locations and depths, effectively removing hair from any part of the body at any depth.

[0003] Based on the characteristics of hair growth, laser hair removal is only effective on hair follicles in the growth phase, when the melanin content in the follicle is highest and it is easily destroyed by laser irradiation. However, hair follicles on the human body are often in different growth phases. Therefore, in order to achieve effective and long-lasting hair removal in a localized area, multiple laser hair removal treatments are required for that area.

[0004] To facilitate laser hair removal for beauty enthusiasts, handheld home laser hair removal devices have been developed, integrating the laser into a handheld device for convenient daily home use, increasing convenience. However, due to the size limitations of handheld devices, existing laser hair removal devices generally only have a small laser window, resulting in a smaller effective area for the laser beam and consequently lower hair removal efficiency. This necessitates prolonged handheld use to complete laser hair removal on an entire area, placing a strain on the operator's arm strength and endurance. Furthermore, laser hair removal itself converts light energy into heat energy; prolonged use causes heat to accumulate at the window area, leading to excessively high temperatures on the skin's contact surface, causing discomfort. The high temperatures generated during operation can also cause skin irritation or even burns, negatively impacting the user experience. On the other hand, pursuing higher efficiency by making the device too large and heavy results in inconvenience for operators, especially women, and can easily cause hand fatigue.

[0005] Therefore, improvements are needed in the design of hair removal devices to increase the hair removal window area and improve hair removal efficiency, thereby solving the above problems. Utility Model Content

[0006] The purpose of this invention is to provide a laser hair removal module and its laser hair removal device, which combines the laser, light guide, TEC, and heat sink into a single module, making installation convenient, simplifying the structure, and improving heat dissipation efficiency. The resulting laser hair removal device can obtain a larger laser irradiation window, improving hair removal efficiency, while keeping the window area cool at all times for cold compresses, thus enhancing the user experience.

[0007] To achieve the above-mentioned objectives of the utility model, the first aspect of the utility model provides a laser hair removal module, including a laser package, a light guide, a laser heat sink, a cooling device, and a cooling and heat dissipation component.

[0008] The laser package contains a semiconductor laser chip, and power supply wires are provided on both sides of the semiconductor laser chip. The semiconductor laser chip is fixed on a substrate, and a laser housing is fixed on the substrate. A light guide is installed in the middle of the laser housing.

[0009] A laser heat sink is mounted on the back of the substrate;

[0010] The light guide has an incident surface and an exit surface that are parallel to each other, and at least one flat side surface; a cooling device is installed on the flat side surface of the light guide, and a cooling and heat dissipation component is installed on the heat dissipation surface of the cooling device.

[0011] As a further improvement of this utility model, the semiconductor laser chip is a laser module composed of several mini-bar lasers arranged in parallel; the several mini-bar lasers, arranged in parallel, emit a laser spot in an approximately rectangular area;

[0012] A glass cover is embedded in the middle of the laser housing;

[0013] The mini-bar laser is located beneath the glass cover; a light guide is installed outside the glass cover.

[0014] The optical guide is rectangular.

[0015] Furthermore, a light guide docking window is provided in the middle of the laser housing, and the size of the light guide docking window is consistent with the cross-sectional size of the light guide;

[0016] The incident surface of the light guide is embedded in the light guide docking window of the laser housing.

[0017] As a further improvement of this utility model, the light guide is a sapphire glass light guide;

[0018] A cooling device is installed on the bottom surface of the optical guide;

[0019] The cooling device is a semiconductor cooler, and the cooling surface of the semiconductor cooler is in close contact with the bottom surface of the light guide;

[0020] The bottom surface of the semiconductor cooler is a heat dissipation surface, and the heat dissipation surface of the semiconductor cooler is provided with a cooling heat sink assembly.

[0021] Furthermore, the cooling radiator assembly is a heat pipe radiator, including a heat-absorbing copper block, a heat-conducting copper pipe, and a heat dissipation fin assembly;

[0022] The heat-absorbing copper block is pressed against the heat dissipation surface of the semiconductor cooler;

[0023] The heat-absorbing copper block is embedded with a heat-conducting copper tube;

[0024] One end of the heat-conducting copper tube is in contact with the heat-absorbing copper block to absorb heat;

[0025] The other end of the heat-conducting copper pipe is equipped with a heat dissipation fin assembly for heat dissipation.

[0026] The heat dissipation fin group has several parallel fins, and heat dissipation channels are formed between adjacent fins.

[0027] Furthermore, the laser heat sink includes a heat-absorbing copper plate and several heat dissipation fins;

[0028] The heat-absorbing copper plate is attached to the back of the substrate;

[0029] The heat-absorbing copper plate is provided with a plurality of heat-dissipating fins, and heat dissipation channels are formed between adjacent heat-dissipating fins.

[0030] Furthermore, the laser heat sink is located above the heat dissipation fin assembly;

[0031] The heat dissipation channel of the heat sink fin assembly is connected to the heat dissipation channel of the laser heat sink.

[0032] Specifically, the top of the heat sink fins of the laser is folded into a top plate;

[0033] The top plates of all the heat dissipation fins are connected together to form a closed top surface.

[0034] As a further improvement of this utility model, a module shell is provided, which encloses the light guide and is fixed to the laser shell.

[0035] The working part at the front end of the light guide is exposed outside the module shell, and the light-emitting surface of the light guide is located at the end face of the working part.

[0036] In a second aspect, this utility model provides a laser hair removal device, which is provided with a bottom cover, a top cover, and a front cover; the bottom cover, the top cover, and the front cover are joined together to form an installation chamber.

[0037] The front of the bottom cover is equipped with the laser hair removal module as described above. The working part of the light guide is embedded in the front cover, and the light-emitting surface of the light guide is exposed to the outside to form the working end.

[0038] A cooling fan is installed in the middle of the bottom cover, close to the laser hair removal module; the air outlet of the cooling fan faces the laser heat sink and cooling components.

[0039] A circuit board is installed at the rear of the bottom cover, and the circuit board is connected to a switch and a display device via wires;

[0040] The bottom cover has ventilation holes, including an air inlet near the cooling fan and an air outlet near the cooling components.

[0041] This invention relates to a laser hair removal device that uses a semiconductor laser chip. Under continuous current injection, electrons transition from a low-energy ground state to a high-energy excited state, emitting coherent radiation with the same phase, wavelength, and intensity. After passing through a light guide glass, this radiation acts on the relevant areas of the human skin for hair removal. During laser irradiation, the laser chip emits light of a specific wavelength. This light is absorbed by the melanin in the hair follicle and converted into heat energy, thereby destroying the hair follicle structure and achieving the hair removal effect. Due to the thermal effect of this light, a comfortable experience is required to avoid burning the skin. Therefore, this invention employs TEC cooling technology, placing the cold end of the TEC close to the light guide. Considering the material of the light guide, a sapphire coating is used to ensure both light transmission and cooling conductivity, maximizing the user's cooling experience. Attached Figure Description

[0042] Figure 1 This is a schematic diagram of the internal structure of the laser of this utility model;

[0043] Figure 2 This is a schematic diagram of the external structure of the laser of this utility model;

[0044] Figure 3 This is a schematic diagram of the combination of the laser and the optical guide of this utility model;

[0045] Figure 4 for Figure 3 Structural sectional view;

[0046] Figure 5 In order to be in Figure 3 A schematic diagram of the overall structure with a laser heat sink added to the existing structure;

[0047] Figure 6 In order to be in Figure 5 A schematic diagram of a structure with a refrigeration device added to the existing structure;

[0048] Figure 7 In order to be in Figure 6 A schematic diagram of a structure with a refrigeration device and radiator added to the existing structure;

[0049] Figure 8 for Figure 7 Main sectional view and heat dissipation diagram;

[0050] Figure 9 This is a schematic diagram of the overall structure of the laser hair removal module of this utility model. Figure 1 ;

[0051] Figure 10 This is a schematic diagram of the overall structure of the laser hair removal module of this utility model. Figure 2 ;

[0052] Figure 11 Schematic diagram of the overall structure of the laser hair removal module with an air guide cover Figure 1 ;

[0053] Figure 12 Schematic diagram of the overall structure of the laser hair removal module with an air guide cover Figure 2 ;

[0054] Figure 13 for Figure 12 A sectional view showing the airflow structure of the two radiators;

[0055] Figure 14 A schematic diagram of the overall structure for adding a cooling fan to a laser hair removal module;

[0056] Figure 15 This is a schematic diagram of the internal structure of a laser hair removal device;

[0057] Figure 16 This is a schematic diagram of the bottom structure of the laser hair removal device of this utility model;

[0058] Figure 17 This is a schematic diagram of the top structure of the laser hair removal device of this utility model. Detailed Implementation

[0059] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings.

[0060] This invention designs a laser hair removal module that can be assembled and debugged independently to form a module, and then assembled with other components to form a laser hair removal device, thereby improving the convenience of assembling and debugging the laser hair removal device.

[0061] The laser hair removal module of this utility model uses mini-bar lasers 12 to form a laser module. A single mini-bar laser 12 (also known as a "bar laser") can emit a long, elliptical laser spot after being powered on. Therefore, multiple mini-bar lasers 12 are arranged in parallel. In this embodiment, seven mini-bar lasers 12 are arranged in parallel, which can form a laser spot in an approximately rectangular area with an area of ​​up to 10mm × 20mm.

[0062] Several mini-bar lasers 12 are arranged in parallel to form a laser module. The mini-bar lasers 12 within the laser module are connected in series to increase the supply voltage and reduce the supply current. Power supply wires 13 are provided on both sides of the laser module formed by the parallel arrangement of the mini-bar lasers 12 to supply power to the surface and back of the mini-bar lasers 12 respectively, thereby emitting laser light under the action of current. The mini-bar lasers 12 are soldered and fixed to the substrate 11 by solder 14. The substrate 11 is preferably made of aluminum nitride, which has high thermal conductivity and can quickly absorb the heat generated by the mini-bar lasers 12 due to power supply and quickly disperse it to the entire substrate surface, rather than concentrating it in the area where the mini-bar lasers 12 are located.

[0063] The mini-bar laser 12 is a miniature device and is inherently fragile, therefore it requires... Figure 2 As shown, the laser is encapsulated by a housing 15, with a glass cover 17 embedded in the center of the housing 15. The glass cover 17 is large enough to allow all the laser light emitted by the mini-bar laser 12 to pass through. More preferably, a light guide window 16 is provided in the center of the laser housing 15, such as... Figure 3 , Figure 4 As shown, the size of the light guide docking window 16 is consistent with the cross-sectional size of the light guide 2, which facilitates the quick positioning and installation of the light guide 2 onto the laser housing 15 and alignment with the laser module composed of the mini-bar laser 12; the laser beam emitted by the laser module after being powered on passes through the glass cover 17 and then enters the light guide 2.

[0064] On the back side of substrate 11 (the back side of the light-emitting surface of the laser module) as follows Figure 5 , Figure 6 As shown, a laser heat sink 18 is further installed, preferably a copper heat sink with a heat-absorbing copper plate 181 that is attached to the back of the substrate 11 for heat conduction. Several heat dissipation fins 182 are evenly distributed on the heat-absorbing copper plate 181, forming heat dissipation channels 184 between them. Airflow through the heat dissipation channels 184 carries away the heat from the heat dissipation fins 182, thus achieving heat dissipation. Furthermore, the top of the heat dissipation fins 182 is folded into top plates 183, and all the top plates 183 of the heat dissipation fins 182 are connected together, increasing the strength between the heat dissipation fins 182, ensuring the size of the heat dissipation channels 184, and simultaneously sealing the top surface of the laser heat sink 18. This ensures that the heat dissipation channels 184 of the laser heat sink 18 of this invention have only two open sides, allowing air to enter from the rear and exit from the bottom for heat dissipation.

[0065] To accommodate the size of the laser beam emitted by the laser module, the cross-section of the light guide 2 is preferably 10mm × 20mm and about 35mm long; the side closer to the laser module is the incident surface 22, and the side farther away from the laser module is the emitting surface 21.

[0066] Preferably, the light guide 2 is made of sapphire glass, which has good light transmittance and will not significantly attenuate the energy of the laser beam. Simultaneously, sapphire glass has low self-absorption and scattering rates, thus, as the light guide 2, it can optimize the transmission of the laser beam. During the transmission process, it homogenizes the laser beam, so that the originally parallel elongated elliptical laser spots, after refraction and reflection by the light guide 2, result in a more uniform energy distribution across the entire rectangular area when emitted from the rectangular light-emitting surface 21 of the light guide 2, without significant low-energy or high-energy regions. Furthermore, sapphire glass is scratch-resistant and wear-resistant, so its light-emitting surface 21 can be directly exposed for use.

[0067] Furthermore, sapphire glass has high thermal conductivity. Therefore, a cooling device is installed on the bottom surface of the light guide 2 made of sapphire glass, that is, the surface where the wide side of the longitudinal section of the light guide 2 is located. The cooling device in this utility model adopts TEC technology (Thermoelectric Cooler, or semiconductor cooler). The cooling surface of the semiconductor cooler 31 is in close contact with the bottom surface 23 of the light guide 2. After the semiconductor cooler 31 is energized, it generates cold energy on the cooling surface, which can be directly transferred to the sapphire glass light guide 2. The cold energy diffuses in the light guide 2, and eventually the light-emitting surface 21 of the light guide 2 will be in a cool state, generally reaching about 5℃~10℃, which is significantly lower than the ambient temperature of use.

[0068] However, while the semiconductor cooler 31 cools down when powered on, it also generates heat, requiring a heat sink to dissipate heat to ensure normal operation. Therefore, a cooling heat sink assembly is provided on the heat dissipation surface of the semiconductor cooler 31. To achieve efficient heat dissipation of the entire laser hair removal module, the cooling heat sink assembly of this invention adopts heat pipe cooling technology, such as... Figure 7 , Figure 8 As shown, the device includes a heat-absorbing copper block 32, which is pressed against the heat dissipation surface of the semiconductor cooler 31. A heat-conducting copper tube 33 is embedded within the heat-absorbing copper block 32. The heat-conducting copper tube 33 is filled with a volatile saturated liquid. One end of the heat-conducting copper tube 33 is tightly fitted to the heat-absorbing copper block 32 to ensure good heat conduction, and the other end of the heat-conducting copper tube 33 is equipped with a heat dissipation fin assembly 34. The saturated liquid inside the heat-conducting copper tube 33 absorbs heat at the heat-absorbing copper block 32 side, forming a gas. This gas then flows to the heat dissipation fin assembly 34, where the temperature is lower. The gas is liquefied, releasing heat, and then returns to the saturated liquid through the liquid-absorbing core inside the heat-conducting copper tube 33 to the high-temperature area, i.e., the heat-absorbing copper block 32, to continue absorbing heat, thus achieving efficient heat dissipation. To improve thermal conductivity, two heat-conducting copper tubes 33 are preferably provided, depending on the available space.

[0069] The heat dissipation fin assembly 34 contains several parallel fins 342, which form heat dissipation channels 344. Airflow through the heat dissipation channels 344 carries away the heat from the fins 342, achieving the purpose of heat dissipation. Preferably, the upper part of the fins 342 is folded to form side edges 345 that are pressed together, improving the connection strength of the entire heat dissipation fin assembly 34. The fins 342 are fitted onto the heat-conducting copper pipe 33, and the perforations of the fins 342 are folded to increase the contact area with the heat-conducting copper pipe 33, thereby enabling efficient heat dissipation.

[0070] The laser hair removal module of this invention utilizes heat pipe cooling technology to dissipate heat generated by the semiconductor cooler 31. This heat is then transferred via a heat-conducting copper pipe 33, and the heat sink 34 is installed adjacent to the laser heat sink 18. The heat sink 34 is located below the laser heat sink 18, and its heat dissipation channels 344 and 184 are interconnected. Figure 8 As shown, the small dashed arrows indicate the heat conduction path. A cooling fan is then installed behind the laser heat sink 18 to blow cooling air into the heat dissipation channel 184 of the heat dissipation fins 182, as indicated by the large arrows in the figure. The cooling air carries away the heat from the heat dissipation fins 182 through the heat dissipation channel 184. Then, the cooling air changes direction and flows downward, flowing into the heat dissipation channel 344 of the heat dissipation fin group 34, carrying away the heat from the fins 342. Finally, it leaves the laser hair removal module of this invention. Thus, with only a copper pipe and a cooling fan, efficient active air cooling can be achieved for both heat sinks, thereby efficiently dissipating heat from the laser module and the semiconductor cooler 31, ensuring stable operation of both after power-on.

[0071] Furthermore, such as Figure 9 , Figure 10 As shown, the laser heat sink 18 can be fixed to the substrate 11 and the laser housing 15 by screws, and the heat-absorbing copper block 32 can be fixed to the laser housing 15 by screws. In order to improve the connection reliability between the heat-conducting copper pipe 33 and the heat-absorbing copper block 32, a support plate 36 is provided to support the heat-conducting copper pipe 33 from the bottom and then fix it to the heat-conducting copper pipe 33 by screws.

[0072] To secure the light guide 2, a module housing 4 is further provided, including an upper housing 41 and a lower housing 42, which clamp the light guide 2 between the upper and lower parts; furthermore, the module housing 4 is provided with positioning ribs, which correspond to the positioning grooves 25 provided on the side of the light guide 2 (e.g., Figure 3 (As shown) are combined. The copper tube screws of the module housing 4 are fixed to the laser housing 15 and the heat-absorbing copper block 32, so that the components are reliably connected together.

[0073] The working part 26 of the optical guide 2 exposes the module shell 4.

[0074] The module housing 4 is provided with a mounting part 44, which facilitates the overall installation of the laser hair removal module.

[0075] Furthermore, to facilitate the installation of cooling fans and the sealing of cooling air ducts, such as Figure 11 , Figure 12 As shown, an air guide shroud 46 is provided outside the laser heat sink 18. The air guide shroud 46 is sealed on three sides, and an air inlet 47 is provided at the rear for connecting with the cooling fan. This allows the air generated by the cooling fan to be concentrated and blown into the air guide shroud 46 and flow through the laser heat sink 18.

[0076] Figure 13 The heat dissipation channel 344 of the heat dissipation fin assembly 34 is connected to the heat dissipation channel 184 of the laser heat sink 18.

[0077] Figure 14 The illustration further demonstrates the connection and installation of the cooling fan 5 with the laser hair removal module. In this invention, the cooling fan 5 is preferably a high-speed centrifugal cooling fan, which includes a centrifugal fan 51 and a volute 52. An air intake channel 53 is provided in the middle of one spiral surface of the volute 52, and a rectangular air outlet channel is provided on the side of the volute 52, connecting to the air inlet 47 of the air guide shroud 46. Several mounting ears 55 are provided on the outer side of the cooling fan 5 for easy installation and fixation.

[0078] Based on the aforementioned laser hair removal module and cooling fan 5, this utility model further designs a laser hair removal device, such as... Figure 15 As shown, the various components are installed inside the bottom cover 62. The laser hair removal module of this utility model is installed at the front of the bottom cover 62. The working part 26 of the light guide 2 is embedded in the front cover 63, so that the light-emitting surface 21 of the light guide 2 is exposed to form the working end. If necessary, sensors can also be set near the light-emitting surface 21 of the front cover 63 to detect the skin condition and adjust the light intensity of the laser. A cooling fan 5 is installed in the middle of the bottom cover 62, close to the laser hair removal module. A circuit board 65 is installed at the rear of the bottom cover 62. The circuit board 65 is also connected to a switch 652 and an indicator light 653 via wires. A tail cover 64 is provided at the bottom of the bottom cover 62. The tail cover 64 has several heat dissipation holes 641 to ventilate and dissipate heat in the area of ​​the circuit board 65. The tail cover 64 also has an interface hole 642 for the interface on the circuit board 65 to pass through, which facilitates external power supply or data communication connection.

[0079] Further as Figure 16As shown, the bottom cover 62 has several ventilation holes, namely an air inlet 621 near the cooling fan 5 and an air outlet 622 near the heat dissipation fin assembly 34. This allows external cold air to enter the air intake channel 53 area of ​​the cooling fan 5 through the air inlet 621, and then be blown into the air guide cover 46 by the centrifugal fan 51. The air flows through the laser heat sink 18 and the heat dissipation fin assembly 34, and leaves the laser hair removal device through the air outlet 622 with heat.

[0080] After assembly and testing are completed, the top cover 61 is then placed on top, thus forming the laser hair removal device of this utility model. Figure 17 As shown.

[0081] To improve the integrity of the top cover 61, the part corresponding to the indicator light 653 is designed to be semi-transparent, forming a light-transmitting area 615. It can only transmit light when the indicator light 653 is powered on, so as to indicate the working status.

[0082] This invention relates to a laser hair removal device that utilizes a semiconductor laser chip. Under continuous current injection, electrons transition from a low-energy ground state to a high-energy excited state, emitting coherent radiation with the same phase, wavelength, and intensity. This radiation passes through a light guide glass and is applied to the relevant areas of the human skin for hair removal. During laser irradiation, the laser chip emits light of a specific wavelength. This light is absorbed by the melanin in the hair follicle and converted into heat energy, thereby destroying the hair follicle structure and achieving the hair removal effect. Due to the thermal effect of this light, a comfortable experience is required to avoid burning the skin. Therefore, this invention employs TEC cooling technology, placing the cold end of the TEC close to the light guide. The light guide is made of sapphire with a coating, ensuring both light transmission and cooling conductivity to maximize the user's cooling experience. This invention relates to a laser hair removal device equipped with a skin sensing detection window. The device uses sensors to detect the user's skin condition and select individuals suitable for laser hair removal. It also features a proximity sensor that triggers the light only when the device is close to the skin, thus preventing accidental injury.

[0083] The preferred embodiments of this utility model have been described in detail above, but this utility model is not limited to the embodiments described. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of this utility model, and these equivalent modifications or substitutions are all included within the scope defined by the claims of this application.

Claims

1. A laser hair removal module, characterized in that, This includes laser packaging components, optical guides, laser heat sinks, cooling devices, and cooling and heat dissipation components. The laser package contains a semiconductor laser chip, and power supply wires are provided on both sides of the semiconductor laser chip. The semiconductor laser chip is fixed on a substrate, and a laser housing is fixed on the substrate. A light guide is installed in the middle of the laser housing. A laser heat sink is mounted on the back of the substrate; The light guide has an incident surface and an exit surface that are parallel to each other, and at least one flat side surface; a cooling device is installed on the flat side surface of the light guide, and a cooling and heat dissipation component is installed on the heat dissipation surface of the cooling device.

2. The laser hair removal module as described in claim 1, characterized in that, The semiconductor laser chip is a laser module composed of several mini-bar lasers arranged in parallel; the several mini-bar lasers, arranged in parallel, emit a laser spot with an approximately rectangular area; A glass cover is embedded in the middle of the laser housing; The mini-bar laser is located beneath the glass cover; a light guide is installed outside the glass cover. The optical guide is rectangular.

3. The laser hair removal module as described in claim 2, characterized in that, The laser housing has a light guide docking window in the middle, and the size of the light guide docking window is the same as the cross-sectional size of the light guide; The incident surface of the light guide is embedded in the light guide docking window of the laser housing.

4. The laser hair removal module as described in claim 1, characterized in that, The optical guide is a sapphire glass optical guide; A cooling device is installed on the bottom surface of the optical guide; The cooling device is a semiconductor cooler, and the cooling surface of the semiconductor cooler is in close contact with the bottom surface of the light guide; The bottom surface of the semiconductor cooler is a heat dissipation surface, and the heat dissipation surface of the semiconductor cooler is provided with a cooling heat sink assembly.

5. The laser hair removal module as described in claim 4, characterized in that, The cooling radiator assembly is a heat pipe radiator, including a heat-absorbing copper block, a heat-conducting copper pipe, and a heat dissipation fin assembly; The heat-absorbing copper block is pressed against the heat dissipation surface of the semiconductor cooler; The heat-absorbing copper block is embedded with a heat-conducting copper tube; One end of the heat-conducting copper tube is in contact with the heat-absorbing copper block to absorb heat; The other end of the heat-conducting copper pipe is equipped with a heat dissipation fin assembly for heat dissipation. The heat dissipation fin group has several parallel fins, and heat dissipation channels are formed between adjacent fins.

6. The laser hair removal module as described in claim 5, characterized in that, The laser heat sink includes a heat-absorbing copper plate and several heat dissipation fins. The heat-absorbing copper plate is attached to the back of the substrate; The heat-absorbing copper plate is provided with a plurality of heat-dissipating fins, and heat dissipation channels are formed between adjacent heat-dissipating fins.

7. The laser hair removal module as described in claim 6, characterized in that, The laser heat sink is located above the heat dissipation fin assembly; The heat dissipation channel of the heat sink fin assembly is connected to the heat dissipation channel of the laser heat sink.

8. The laser hair removal module as described in claim 7, characterized in that, The top of the heat sink fins of the laser is folded into a top plate; The top plates of all the heat dissipation fins are connected together to form a closed top surface.

9. The laser hair removal module as described in claim 1, characterized in that, It is equipped with a module housing, which encloses the light guide and is fixed to the laser housing; The working part at the front end of the light guide is exposed outside the module shell, and the light-emitting surface of the light guide is located at the end face of the working part.

10. A laser hair removal device, characterized in that, It is equipped with a bottom cover, a top cover, and a front cover; the bottom cover, top cover, and front cover are joined together to form an installation chamber. The front part of the bottom cover is equipped with a laser hair removal module as described in any one of claims 1-9, and the working part of the light guide is embedded in the front cover, with the light-emitting surface of the light guide exposed to the outside to form a working end; A cooling fan is installed in the middle of the bottom cover, close to the laser hair removal module; the air outlet of the cooling fan faces the laser heat sink and cooling components. A circuit board is installed at the rear of the bottom cover, and the circuit board is connected to a switch and a display device via wires; The bottom cover has ventilation holes, including an air inlet near the cooling fan and an air outlet near the cooling components.

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