Chip wire bond section avl appearance detection machine

The WireBond segment AVI appearance inspection machine for chips, which integrates a dual-station material preparation component, a material basket buffer component, and a product pick-and-place component, solves the problem of low efficiency in manual inspection, realizes automated and continuous visual inspection, and adapts to the needs of large-scale production.

CN224772921UActive Publication Date: 2026-09-18GUANGDONG ZHONGBANGDA INTELLIGENT TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202521929787.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-09
Publication Date
2026-09-18
Estimated Expiration
2035-09-09

AI Technical Summary

Technical Problem

In existing technologies, the detection of the WireBond segment of a chip relies on manual inspection, which cannot meet the cycle time requirements of large-scale production, resulting in low inspection efficiency.

Method used

Design a chip WireBond segment AVI appearance inspection machine, which adopts a dual-station material preparation component, a material basket buffer component and a product picking and placing component to work together, and integrates with a vision inspection component to realize the automatic transfer of the material basket between the material preparation position and the buffer position, and the automatic flow of products between the buffer position and the inspection position, reducing manual intervention.

Benefits of technology

It enables automated and continuous visual inspection of chip wire bonding products, improving inspection efficiency, reducing manual intervention, and adapting to the needs of large-scale production.

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Abstract

The utility model relates to a kind of chip WireBond section AVI appearance detection machine, comprising: machine table;Material preparation assembly is installed in the opposite ends of machine table top surface;Material preparation assembly includes bunker, first bearing seat, and second bearing seat;Respectively installed in each material preparation assembly inside material basket clamping component;Respectively installed in each material basket clamping component one side material basket buffer component;Visual inspection component is installed in the middle of machine table top surface;And product pick-and-place component is installed in one side of machine table top surface.The above-mentioned chip WireBond section AVI appearance detection machine, simple structure, convenient to use, through the material preparation assembly of double station, the material basket buffer component of double station and product pick-and-place component collaborative work, and with visual inspection component integration, material basket is automatically transferred between material preparation site, buffer site, product is automatically circulated between buffer site and detection site, reduce manual intervention, realized the automation, continuous visual inspection of chip lead bonding product.
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