A thermal imaging sight support structure
By designing a thermal imaging sight bracket structure, and utilizing components such as lens mounting slots, shutter mounting slots, rubber gaskets, and buffer pads to absorb and disperse recoil, the problem of lens damage during firing of the thermal imaging sight is solved, thus improving its service life and accuracy.
Patent Information
- Application Number
- CN202522445831.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-18
- Publication Date
- 2026-11-03
- Estimated Expiration
- 2035-11-18
AI Technical Summary
Thermal imaging sights are susceptible to recoil during firing, which can damage the lens and reduce aiming accuracy.
A thermal imaging aiming device bracket structure was designed. The lens and shutter components are fixed by the lens mounting slot and shutter mounting slot on the base bracket. The rubber gasket and shutter buffer pad absorb the impact of recoil. The corner snap and locking hole ensure a stable connection. The UFPA buffer pad and limiting spring provide all-round buffer protection.
It significantly reduces the risk of recoil damage to the internal components of the scope, extends its service life, and improves its working stability and accuracy in environments with severe vibration.
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Figure CN224933356U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of thermal imaging technology, specifically a thermal imaging aiming device support structure. Background Technology
[0002] As described in the published patent CN210119162U, "A Mounting Structure for a Thermal Imaging Scope," a scope is mounted on a firearm to facilitate aiming and improve accuracy. The scope is fixed to the receiver cover or barrel of the firearm via a mounting mechanism. During firing, the firearm experiences significant instantaneous recoil, the reaction force of the bullet after it is fired. Since the scope contains precision optical lenses, recoil can be fatal to both the scope and its optical lenses. The scope base is also more prone to tearing, cracking, or breaking. Due to the recoil, the scope base and the optical lenses within the scope are frequently damaged, requiring frequent scope replacements. This causes considerable inconvenience for firearm users and the vibrations affect the scope's accuracy, thus reducing the precision of aiming and shooting.
[0003] In summary, in some application scenarios (shooting), the thermal imaging sight is subject to significant recoil, which can easily damage the internal components of the sight. Utility Model Content
[0004] To overcome the shortcomings mentioned above, this utility model aims to provide a technical solution that can solve the above problems.
[0005] To achieve the above objectives, this utility model provides the following technical solution: A thermal imaging aiming device support structure includes a base support, a recessed lens mounting groove is formed on the upper end surface of the base support, a shutter mounting groove is formed on the inner bottom surface of the lens mounting groove, a lens component is installed in the lens mounting groove, and a shutter component is installed in the shutter mounting groove. A rubber gasket is installed below the lens component; A shutter buffer pad is installed below the shutter component; The shutter mounting groove has corner locking grooves at its four corners. The shutter buffer pad has corner locking parts formed on its four corners for fixed locking and engagement within the corner locking grooves. The corner locking parts have buffer extensions formed on both sides that fit against the inner wall of the shutter mounting groove. The shutter component has shutter locking holes at its four corners. The shutter buffer pad has shutter mounting holes that align with the shutter locking holes.
[0006] As a further embodiment of this utility model: a positioning bracket is formed on the lower end face of the base bracket, and a chip assembly is fixedly mounted on the lower end face of the positioning bracket; The chip assembly includes a UFPA board bracket fixedly mounted on the lower end face of the positioning bracket, and a UFPA buffer pad is installed between the UFPA board bracket and the positioning bracket. The UFPA buffer pad is arranged around the periphery of the positioning bracket; The UFPA board bracket houses an HK detector module and a UFPA board module, which are respectively inserted into each other from the upper and lower end faces of the UFPA board bracket.
[0007] As a further embodiment of this utility model: a limiting spring is installed between the UFPA buffer pad and the positioning bracket, and the inner ring of the limiting spring is formed with an inwardly extending elastic limiting part, which elastically limits the upper end face of the HK detector module.
[0008] As a further embodiment of this utility model: the periphery of the UFPA board bracket extends with multiple UFPA mounting holes, and the lower end face of the positioning bracket is provided with multiple UFPA locking holes that are respectively aligned and engaged with the UFPA mounting holes.
[0009] As a further embodiment of this utility model: the UFPA board bracket is equipped with a mounting plate, the mounting plate is provided with a through slot, the HK detector module is mounted on the top of the mounting plate, the UFPA board module is mounted on the bottom of the mounting plate, and the PIN pin group of the HK detector module passes downward from the through slot and is aligned and plugged into the PIN pin socket on the UFPA board module. The lower end face of the mounting plate is equipped with multiple UFPA buffer blocks along its periphery, and the UFPA buffer blocks are elastically engaged with the upper end face of the UFPA board module.
[0010] As a further embodiment of this utility model: a UFPA elastic gasket is fixedly installed on the UFPA board module, the UFPA elastic gasket is fixedly installed between the PIN pin holes, and the UFPA elastic gasket elastically abuts against the lower end face of the mounting plate.
[0011] As a further embodiment of this utility model: a tail plate component is fixedly installed below the UFPA plate bracket, and multiple tail plate bolts are sleeved around the four corners of the tail plate component. The tail plate bolts are fixedly installed on the mounting plate, and a buffer sleeve is sleeved on the tail plate bolt. The lower end of the buffer sleeve is elastically abutting against the tail plate component, and the upper end of the buffer sleeve is elastically abutting against the mounting plate.
[0012] As a further embodiment of this utility model: the inner bottom surface of the lens mounting groove is provided with a lens locking hole, and the lower end surface of the lens component is provided with a lens mounting hole that aligns and cooperates with the lens locking hole.
[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: This utility model's aiming sight bracket structure uses a lens mounting slot and a shutter mounting slot on the base bracket to fix the lens and shutter components respectively. The rubber gasket below the lens component and the shutter buffer pad below the shutter component work together to effectively absorb and disperse the recoil impact generated during firing. The corner locking part of the shutter buffer pad is fixedly engaged with the corner locking groove of the shutter mounting slot, and the buffer extensions on both sides fit against the groove wall, enhancing stability and preventing displacement. At the same time, the shutter locking hole is aligned with the shutter mounting hole to ensure a tight connection. Through multiple buffers and firm fixation, the risk of recoil damage to the precision components inside the aiming sight is significantly reduced, extending its service life. Attached Figure Description
[0014] Figure 1 This is an exploded view of the structure of this utility model; Figure 2 This is another exploded view of the structure of this utility model; Figure 3 This is a three-dimensional structural view of the base support in this utility model; Figure 4 This is another three-dimensional view of the base support structure in this utility model; Figure 5 This is a top view of the present invention; Figure 6 yes Figure 5 A cross-sectional view along the AA direction; Figure 7 This is a three-dimensional structural view of the UFPA plate support in this utility model; Figure 8 This is another three-dimensional view of the UFPA plate bracket in this utility model; Figure 9 This is a three-dimensional structural view of the UFPA board module and tail plate component in this utility model; The reference numerals and names in the figure are as follows: Base bracket-100, lens mounting slot-101, shutter mounting slot-102, lens assembly-103, shutter assembly-104, rubber gasket-105, shutter buffer pad-106, corner locking slot-107, corner locking part-108, buffer extension-109, shutter locking hole-110, shutter mounting hole-111, positioning bracket-112, chip assembly-113, UFPA board bracket-114, UFPA buffer Pad-115, HK detector module-116, UFPA board module-117, limiting spring-118, elastic limiting part-119, UFPA mounting hole-120, UFPA locking hole-121, mounting plate-122, interlocking slot-123, UFPA buffer block-124, UFPA elastic gasket-125, tail plate piece-126, tail plate bolt-127, buffer sleeve-128, lens mounting hole-129. Detailed Implementation
[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0016] Please see Figure 1-9 A thermal imaging aiming device support structure includes a base support 100, a recessed lens mounting groove 101 is provided on the upper end surface of the base support 100, a shutter mounting groove 102 is provided on the inner bottom surface of the lens mounting groove 101, a lens component 103 is installed in the lens mounting groove 101, and a shutter component 104 is installed in the shutter mounting groove 102. A rubber gasket 105 is installed below the lens component 103; A shutter buffer pad 106 is installed below the shutter component 104; The shutter mounting groove 102 has corner locking grooves 107 at its four corners. The shutter buffer pad 106 has corner locking parts 108 formed on it, which are fixedly engaged in the corner locking grooves 107. The corner locking parts 108 have buffer extensions 109 formed on both sides of them, which fit against the inner wall of the shutter mounting groove 102. The shutter component 104 has shutter locking holes 110 at its four corners. The shutter buffer pad 106 has shutter mounting holes 111 that are aligned with the shutter locking holes 110. like Figure 1 and 3As shown, the rubber gasket 105 below the lens assembly 103 and the shutter buffer pad 106 below the shutter assembly 104 constitute multiple buffer systems. As elastic media, the rubber gasket 105 and the shutter buffer pad 106 can effectively absorb and disperse the huge, instantaneous recoil impact energy generated during shooting. This buffering effect transforms the violent rigid impact into flexible elastic deformation, reducing the peak stress and acceleration transmitted to precision optical components (such as the lens and shutter), and avoiding lens displacement, breakage, or optical axis offset caused by instantaneous overload. The corner locking part 108 of the shutter buffer pad 106 and the corner locking groove 107 cooperate to achieve a firm three-dimensional lock, preventing the shutter buffer pad 106 from shifting or rotating under repeated impacts. The buffer extensions 109 on both sides of the corner locking part 108 fit tightly against the inner wall of the shutter mounting groove 102, further increasing the contact area and friction, forming a multi-directional wrapping fixation. This design ensures the stability of the position of the shutter buffer pad 106 itself, thereby ensuring its buffering performance is durable and effective, reducing secondary vibrations or abnormal noises caused by loose parts, and improving the reliability of the overall structure. By aligning the shutter locking hole 110 with the shutter mounting hole 111, the shutter component 104 can be stably pressed onto the shutter buffer pad 106 by fasteners (such as screws) and finally firmly installed on the base bracket 100. This utilizes the shock absorption characteristics of the shutter buffer pad 106 and ensures a tight fit between components through rigid connection, avoiding additional impact and wear caused by gaps. The sight bracket structure of this utility model uses the lens mounting groove 101 and shutter mounting groove 102 on the base bracket 100 to fix the lens component 103 and the shutter component 104 respectively. The rubber gasket 105 under the lens component 103 and the shutter buffer pad 106 under the shutter component 104 work together to effectively absorb and disperse the recoil impact generated during shooting. The corner snap-fit part 108 of the shutter buffer pad 106 is fixedly snapped into the corner snap-fit groove 107 of the shutter mounting groove 102. The buffer extension parts 109 on both sides fit against the groove wall, which enhances stability and prevents displacement. At the same time, the shutter locking hole 110 is aligned with the shutter mounting hole 111 to ensure a tight connection. Through multiple buffers and firm fixation, the risk of damage to the precision components inside the sight by recoil is significantly reduced, and the service life is extended.
[0017] In this embodiment of the present invention, a positioning bracket 112 is formed on the lower end face of the base bracket 100, and a chip assembly 113 is fixedly mounted on the lower end face of the positioning bracket 112. The chip assembly 113 includes a UFPA board bracket 114 fixedly mounted on the lower end face of the positioning bracket 112, and a UFPA buffer pad 115 is installed between the UFPA board bracket 114 and the positioning bracket 112. The UFPA buffer pad 115 is arranged around the periphery of the positioning bracket 112; The UFPA board bracket 114 is equipped with an HK detector module 116 and a UFPA board module 117, which are respectively inserted into each other from the upper and lower end faces of the UFPA board bracket 114. like Figure 2 and 4 As shown, a UFPA buffer pad 115 is provided between the UFPA board bracket 114 and the positioning bracket 112, surrounding the periphery of the bracket. The surrounding UFPA buffer pad 115 can absorb and isolate the high-frequency impact energy transmitted to the precision chip assembly 113 by the recoil of the gun and daily vibration in all directions. At the same time, the module matching method of plugging in the upper and lower parts reduces the risk of loosening of traditional welding or cable connection under vibration, providing uniform and stable buffer protection for the entire chip core. This significantly reduces the possibility of damage or performance degradation of the HK detector module 116 and UFPA board module 117 due to mechanical stress, thereby ensuring that the thermal imaging system can still work stably for a long time in harsh impact environments.
[0018] In this embodiment of the present invention, a limiting spring 118 is installed between the UFPA buffer pad 115 and the positioning bracket 112. The inner ring of the limiting spring 118 is formed with an inwardly extending elastic limiting part 119, which elastically limits the upper end face of the HK detector module 116. like Figure 4 and 6 As shown, a limiting spring 118 is added between the UFPA buffer pad 115 and the positioning bracket 112. The elastic limiting part 119 of the inner ring of the limiting spring 118 applies flexible elastic pressure to the upper end face of the HK detector module 116 from above. The elastic limiter allows the HK detector module 116 to have a small elastic floating space on the basis of the UFPA buffer pad 115. When subjected to impacts such as recoil, the elastic limiter 119 can effectively suppress excessive vertical displacement or jumping of the HK detector module 116, preventing it from coming loose from the UFPA board module 117 plug-in interface below. At the same time, it works in conjunction with the surrounding UFPA buffer pad 115 to dissipate impact energy. It provides precise and dynamic axial positioning constraints for the HK detector module 116, improving the connection reliability and operational stability of the chip assembly 113 under continuous and severe vibration environments.
[0019] In this embodiment of the utility model, the periphery of the UFPA board bracket 114 extends with a plurality of UFPA mounting holes 120, and the lower end face of the positioning bracket 112 is provided with a plurality of UFPA locking holes 121 that are respectively aligned and engaged with the UFPA mounting holes 120. Multiple UFPA mounting holes 120 extending from the periphery of the UFPA board bracket 114 are precisely aligned with the corresponding UFPA locking holes 121 on the lower end face of the positioning bracket 112. Fasteners (such as bolts) passing through these alignment holes are used to securely and evenly lock the UFPA board bracket 114, which integrates the HK detector module 116 and the UFPA board module 117, as well as the key UFPA buffer pad 115 and the limiting spring 118, onto the positioning bracket 112. This provides necessary cushioning while ensuring the integrity and rigid connection of the entire chip assembly 113 stacked structure. A reliable structural anchor point was established, which effectively prevented the chip assembly 113 from shifting laterally or becoming loose relative to the base support 100 under severe vibration. This ensured that the buffering performance of the UFPA buffer pad 115 was stable and consistent, and worked in conjunction with the aforementioned elastic limiting mechanism to create a stable working environment that is resistant to impact and prevents displacement.
[0020] In this embodiment of the present invention, a mounting plate 122 is installed inside the UFPA board bracket 114. The mounting plate 122 has a through-hole 123. The HK detector module 116 is installed above the mounting plate 122, and the UFPA board module 117 is installed below the mounting plate 122. The PIN pins of the HK detector module 116 pass downward from the through-hole 123 and are aligned and plugged into the PIN pin holes on the UFPA board module 117. The lower end face of the mounting plate 122 is provided with a plurality of UFPA buffer blocks 124 along the periphery, and the UFPA buffer blocks 124 are elastically abutted against the upper end face of the UFPA board module 117. An mounting plate 122 is set inside the UFPA board bracket 114 as a support structure. An HK detector module 116 is installed above the mounting plate 122 and a UFPA board module 117 is installed below it. The PIN pins of the HK detector module 116 are passed through the through slot 123 on the mounting plate 122 and aligned with the PIN pin holes on the UFPA board module 117 for direct connection. This top-bottom separated layout and vertical interlocking connection naturally form a stable and compact chip stack. The multiple UFPA buffer blocks 124 arranged around the lower end face of the mounting plate 122 provide uniform elastic support and buffering to the UFPA board module 117 from above, working in conjunction with the PIN pin insertion interface. The UFPA buffer blocks 124 effectively absorb and disperse the impact stress acting on the module plane, preventing the PIN pins from bending or being damaged due to force.
[0021] In this embodiment of the present invention, a UFPA elastic gasket 125 is fixedly installed on the UFPA board module 117. The UFPA elastic gasket 125 is fixedly installed between the PIN pin holes and the UFPA elastic gasket 125 is elastically abutting against the lower end face of the mounting plate 122. By fixing UFPA elastic pads 125 on the UFPA board module 117 and positioning the UFPA elastic pads 125 between the PIN pin insertion holes, the UFPA elastic pads 125 form an elastic abutment with the lower end face of the mounting plate 122 above. When the entire module is subjected to impacts such as recoil, the UFPA elastic pads 125, as a local and refined buffer unit, can effectively absorb and disperse the axial stress that attempts to act on the PIN pin insertion area, providing additional elastic support and protection for the fragile PIN pins. In one embodiment, the HK detector module 116 is a variety of detector products (such as HK-DTS100) launched by manufacturers such as Hikvision. Its core is a chip that can convert the received infrared radiation (heat) into electrical signals. The module typically includes a detector chip, a readout circuit, and a packaging structure that realizes vacuum sealing and cooling. In one embodiment, the UFPA board module 117 is a drive and signal processing board directly connected to the detector. Therefore, the UFPA board module 117 can be understood as an electronic circuit module specifically used to drive, bias, read the aforementioned infrared detector, and perform initial signal amplification, conditioning, and digitization and other front-end processing on it. It should be noted that names such as "HK detector module 116" and "UFPA board module 117" are terms defined by the applicant to generally refer to the set of components that perform specific functions in their solution. They do not directly correspond to a specific publicly disclosed model or unique structure on the market. Their structures are well known to those skilled in the art, and their core functions (photoelectric conversion by the detector and signal reading and processing by the circuit board) are clear. The specific technical details of their implementation (such as pixel scale, pixel size, packaging form, chip model, etc.) are common technologies in the field and will vary depending on different manufacturers and product series. The focus of protection of this utility model is on the spatial layout and connection relationship between these modules and between them and the supporting structure. The structural design of this utility model can adapt to a variety of HK detector modules 116 and UFPA board modules 117 that conform to the interface and size specifications.
[0022] In this embodiment of the utility model, a tail plate component 126 is fixedly installed below the UFPA plate bracket 114. A plurality of tail plate bolts 127 are sleeved around the corners of the tail plate component 126. The tail plate bolts 127 are fixedly installed on the mounting plate 122. A buffer sleeve 128 is sleeved on the tail plate bolt 127. The lower end of the buffer sleeve 128 is elastically engaged with the tail plate component 126, and the upper end of the buffer sleeve 128 is elastically engaged with the mounting plate 122. By setting a tail plate 126 below the UFPA plate bracket 114 and connecting the tail plate 126 to the mounting plate 122 above it with a tail plate bolt 127 fitted with a buffer sleeve 128, the tail plate bolt 127 provides the main rigid connection to maintain the integrity of the structure, while the buffer sleeve 128 fitted on the tail plate bolt 127 serves as a key elastic element. The upper and lower ends of the buffer sleeve 128 elastically abut against the mounting plate 122 and the tail plate 126 respectively, thereby constructing a highly efficient vibration isolation buffer layer in the vertical direction, which can actively absorb and dissipate the impact and vibration energy transmitted from the tail. While ensuring a stable structural connection, it isolates and reduces the direct transmission of impact stress to the core imaging modules (such as HK detector module 116 and UFPA board module 117).
[0023] In this embodiment of the present invention, a lens mounting hole 129 is provided on the inner bottom surface of the lens mounting groove 101, and a lens mounting hole that aligns with and cooperates with the lens mounting hole is provided on the lower end surface of the lens component 103. By opening a lens mounting hole on the bottom surface of the lens mounting slot 101 and aligning it with the corresponding lens mounting hole on the lower end face of the lens component 103, fasteners (such as bolts) are used to securely lock the lens component 103 onto the base bracket 100 through the alignment hole. At the same time, combined with the rubber gasket 105 pre-installed below the lens component 103, a combination of rigid fixation and flexible buffering is achieved. This ensures that the lens component 103 will not shift or loosen when subjected to severe recoil impact, maintaining the precise alignment of the optical components. Furthermore, the buffering effect of the gasket effectively disperses local stress, preventing the lens component 103 from cracking or deforming due to rigid installation.
[0024] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
Claims
1. A thermal imaging aiming device bracket structure, characterized in that, The system includes a base bracket (100), the upper end surface of which is provided with a recessed lens mounting groove (101), the inner bottom surface of which is provided with a shutter mounting groove (102), a lens component (103) is installed in the lens mounting groove (101), and a shutter component (104) is installed in the shutter mounting groove (102). A rubber gasket (105) is installed below the lens component (103). A shutter buffer pad (106) is installed below the shutter component (104). The shutter mounting groove (102) has corner locking grooves (107) at its four corners. The shutter buffer pad (106) has corner locking parts (108) that are fixed and locked in the corner locking grooves (107). The corner locking parts (108) have buffer extensions (109) that fit against the inner wall of the shutter mounting groove (102) on both sides. The shutter component (104) has shutter locking holes (110) at its four corners. The shutter buffer pad (106) has shutter mounting holes (111) that are aligned with the shutter locking holes (110).
2. The thermal imaging aiming device bracket structure according to claim 1, characterized in that, The lower end face of the base bracket (100) is formed with a positioning bracket (112), and the lower end face of the positioning bracket (112) is fixedly mounted with a chip assembly (113). The chip assembly (113) includes a UFPA board bracket (114) fixedly mounted on the lower end face of the positioning bracket (112), and a UFPA buffer pad (115) is installed between the UFPA board bracket (114) and the positioning bracket (112). The UFPA cushioning pad (115) is arranged around the periphery of the positioning bracket (112); The UFPA board bracket (114) is equipped with an HK detector module (116) and a UFPA board module (117), which are respectively inserted into each other from the upper and lower end faces of the UFPA board bracket (114).
3. The thermal imaging aiming device bracket structure according to claim 2, characterized in that, A limiting spring (118) is installed between the UFPA buffer pad (115) and the positioning bracket (112). The inner ring of the limiting spring (118) is formed with an inwardly extending elastic limiting part (119), which elastically limits the upper end face of the HK detector module (116).
4. The thermal imaging aiming device bracket structure according to claim 2, characterized in that, The periphery of the UFPA board bracket (114) has multiple UFPA mounting holes (120), and the lower end face of the positioning bracket (112) has multiple UFPA locking holes (121) that are respectively aligned and engaged with the UFPA mounting holes (120).
5. The thermal imaging aiming device bracket structure according to claim 3, characterized in that, The UFPA board bracket (114) is equipped with a mounting plate (122), and the mounting plate (122) has a through slot (123). The HK detector module (116) is mounted above the mounting plate (122), and the UFPA board module (117) is mounted below the mounting plate (122). The PIN pin group of the HK detector module (116) passes through the through slot (123) downward and is aligned and plugged into the PIN pin socket on the UFPA board module (117). The lower end face of the mounting plate (122) is provided with a plurality of UFPA buffer blocks (124) along the periphery, and the UFPA buffer blocks (124) are elastically abutted against the upper end face of the UFPA board module (117).
6. The thermal imaging aiming device bracket structure according to claim 5, characterized in that, The UFPA board module (117) is fixedly equipped with a UFPA elastic pad (125), which is fixedly installed between the PIN pin holes. The UFPA elastic pad (125) is elastically abutted against the lower end face of the mounting plate (122).
7. The thermal imaging aiming device bracket structure according to claim 6, characterized in that, A tail plate component (126) is fixedly installed below the UFPA plate bracket (114). Multiple tail plate bolts (127) are sleeved around the corners of the tail plate component (126). The tail plate bolts (127) are fixedly installed on the mounting plate (122). A buffer sleeve (128) is sleeved on the tail plate bolt (127). The lower end of the buffer sleeve (128) is elastically abutted against the tail plate component (126), and the upper end of the buffer sleeve (128) is elastically abutted against the mounting plate (122).
8. The thermal imaging aiming device bracket structure according to claim 1, characterized in that, The inner bottom surface of the lens mounting groove (101) is provided with a lens locking hole, and the lower end surface of the lens component (103) is provided with a lens mounting hole that aligns with the lens locking hole.
Citation Information
Patent Citations
Mounting structure of thermal imaging sighting telescope
CN210119162U
