Manufacturing process for a micromechanical sensor component and corresponding micromechanical sensor component

By applying selective access areas with filter elements directly to sensor chips, the invention addresses material and manufacturing issues in media sensors, enhancing reliability and efficiency while maintaining sensitivity.

DE102023209592A1Pending Publication Date: 2025-04-03ROBERT BOSCH GMBH
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Patent Information

Application Number
DE102023209592
Authority / Receiving Office
DE · DE
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-09-29
Publication Date
2025-04-03

AI Technical Summary

Technical Problem

Existing media sensors face issues such as large material consumption, potential leaks, and complex manufacturing processes due to integrated filter membranes within the sensor housing, which affect their performance and reliability.

Method used

The solution involves applying selective access areas directly to the sensor chip surface, allowing defined media access while protecting individual chip components from environmental influences, using filter elements to prevent contamination and simplifying the manufacturing process.

Benefits of technology

This approach reduces material consumption, enhances sealing, improves manufacturing efficiency, and maintains sensor sensitivity by isolating sensitive areas from harmful influences, while allowing for easier production in large quantities.

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Abstract

The present invention provides a manufacturing method for a micromechanical sensor component and a corresponding micromechanical sensor component.The manufacturing process comprises the following steps: providing a sensor wafer (WS) with a plurality of micromechanical sensor chips (SC1, SC2) which have one or more respective sensor areas (S1, S2, S3); forming an access wafer (WZ) with a corresponding plurality of access chips (ZC1, ZC2) which each have one or more access areas (Z1, Z2, Z3) to the sensor areas (S1, S2, S3), forming respective media access areas for the sensor areas (S1, S2, S3); attaching the access wafer (WZ) to the sensor wafer (WS) such that the access areas (Z1, Z2, Z3) are arranged over the corresponding sensor area(s) (S1, S2, S3); and separating the sensor chips (SC1, SC2) with the access chips (ZC1, ZC2) glued onto them to obtain a plurality of sensor component chips (C1, C2).
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