DISPLAY PANEL AND A MANUFACTURING METHOD THEREOF
The display panel design addresses sub-pixel interference in high-resolution micro LED panels by converting blue light to red and filtering blue light, eliminating the need for a bank structure to prevent shot mura and color shifts.
Patent Information
- Application Number
- DE102024132142
- Authority / Receiving Office
- DE · DE
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-11-05
- Publication Date
- 2025-10-30
AI Technical Summary
In high-resolution display devices, particularly micro LED display panels, the small distance between sub-pixels leads to interference issues such as shot mura and color shifts due to light leakage through gaps in the bank structure, especially in flexible or stretchable panels.
A display panel design incorporating a first light emitting element, a first color conversion layer, a first color filter layer, and an encapsulation layer, where the color conversion layer converts blue or ultraviolet light into red light, and the color filter layer filters out blue light while allowing red light to pass, eliminating the need for a bank structure.
This design effectively mitigates interference between sub-pixels, preventing shot mura and color shifts by ensuring proper light emission and transmission, even in deformed panels.
Smart Images
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Abstract
Description
BACKGROUND Technical area
[0001] The disclosure relates to a display board and a manufacturing process for it. Description of the state of the art
[0002] With advances in science and technology, the resolution of display devices is constantly improving. In a high-resolution display, the distance between adjacent subpixels is very small, so subpixels of different colors can easily interfere with each other, affecting the quality of the displayed image. In a micro-LED display panel, each subpixel contains a micro-LED. Generally, a bank structure is provided between two adjacent micro-LEDs, and this can be used to block light and prevent different subpixels from interfering with each other. However, with the improvement in resolution, the distance between the micro-LEDs becomes too small, making it difficult to produce a bank structure that meets the requirements.Furthermore, in some flexible or stretchable display boards, the light emitted by the micro-LEDs may pass through gaps in the bank structure after the board has deformed, leading to problems such as column or shot mura, or color shifts in the images. SUMMARY
[0003] The revelation refers to a display board that reduces the problem of shot mura, or color shift in images.
[0004] At least one embodiment of the disclosure provides a display panel comprising a circuit substrate, a first light-emitting element, a first color-conversion layer, a first color filter layer, a second light-emitting element, and an encapsulation layer. The first light-emitting element is electrically connected to the circuit substrate and configured to emit blue light and / or ultraviolet light. The first color-conversion layer covers the first light-emitting element and is configured to convert blue light and / or ultraviolet light into red light. The first color filter layer covers and contacts an upper surface of the first color-conversion layer and is configured to have a transmission or transmittance of 0% to 5% for blue light and / or ultraviolet light.The first color filter layer is configured to have a transmittance of 60% to 99% for red light. The second light-emitting element is electrically connected to the circuit substrate and configured to emit blue light. The first color conversion layer and the first color filter layer are arranged separately from the second light-emitting element. The encapsulation layer surrounds the first light-emitting element, the first color conversion layer, the first color filter layer, and the second light-emitting element.
[0005] At least one embodiment of the disclosure provides a display panel comprising a circuit substrate, a first light-emitting element, a first color-conversion layer, a first color filter layer, a second light-emitting element, and an encapsulation layer. The first light-emitting element is electrically connected to the circuit substrate and configured to emit blue light and / or ultraviolet light. The first color-conversion layer covers the first light-emitting element and is configured to convert blue light and / or ultraviolet light into red light. The first color filter layer completely covers the first color-conversion layer and is configured to have a transmittance of 0% to 5% for blue light and / or ultraviolet light. The first color filter layer is configured to have a transmittance of 60% to 99% for red light.The second light-emitting element is electrically connected to the circuit substrate and configured to emit blue light. The first color conversion layer and the first color filter layer are separated from the second light-emitting element. The encapsulation layer surrounds the first light-emitting element, the first color conversion layer, the first color filter layer, and the second light-emitting element.
[0006] At least one embodiment of the disclosure provides a manufacturing process for a display panel comprising the following steps. A first light-emitting element and a second light-emitting element are electrically connected to a circuit substrate, the first light-emitting element being configured to emit blue light and / or ultraviolet light, and the second light-emitting element being configured to emit blue light. A first color-conversion layer is formed to cover the first light-emitting element, and the first color-conversion layer is separated from the second light-emitting element. The first color-conversion layer is configured to convert blue light and / or ultraviolet light into red light.A first color filter layer is formed on the first color conversion layer, and the first color filter layer is separated from the second light-emitting element. The first color filter layer is configured to have a transmittance of 0% to 5% for blue light and / or ultraviolet light, and the first color filter layer is configured to have a transmittance of 60% to 99% for red light. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1A to Fig. Figure 1D are schematic top views of a manufacturing process for a display board according to an embodiment of the disclosure. Fig. 2A to Fig. Figures 2E are schematic cross-sectional views of the manufacturing process of the display board according to one embodiment of the disclosure. Fig. 3A to Fig. 3D are schematic top views of a manufacturing process for a display board according to another embodiment of the disclosure. Fig. 4A to Fig. Figure 4E are schematic cross-sectional views of the manufacturing process of the display board according to another embodiment of the disclosure. DESCRIPTION OF THE EXECUTION FORMS
[0007] Fig. 1A to Fig. Figure 1D are schematic top views of a manufacturing process of a display panel 10 according to an embodiment of the disclosure. Fig. 2A to Fig. Figures 2E are schematic cross-sectional views of the manufacturing process of the display panel 10 according to an embodiment of the disclosure, wherein Fig. 2A to Fig. 2D each corresponds to the positions of line AA' in Fig. 1A to Fig. 1D corresponds. With reference to Fig. 1A and Fig. 1B provides a circuit substrate 100. In some embodiments, the circuit substrate 100 comprises a substrate and a circuit structure located thereon. The substrate is, for example, a rigid substrate whose material can be glass, quartz, organic polymers, or opaque / reflective materials (such as conductive materials, metals, wafers, ceramics, or other suitable materials), or other suitable materials. However, the disclosure is not limited thereto. In other embodiments, the substrate can also be a flexible substrate or a stretchable substrate. In other words, the circuit substrate 100 can be a flexible circuit substrate or a stretchable circuit substrate.In some embodiments, a material of the flexible substrate and the stretchable substrate contains polyimide (PI), polydimethylsiloxane (PDMS), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyester (PES), polymethyl methacrylate (PMMA), polycarbonate (PC), polyurethane (polyurethane PU) or other suitable materials.
[0008] The circuit structure in the circuit substrate 100 contains, for example, several layers of conductive layers (not shown) and several layers of insulating layers (not shown). In some embodiments, the circuit structure contains a plurality of active components (not shown) and / or a plurality of passive components (not shown), and the active components (not shown) may be thin-film transistors. In some embodiments, the circuit structure contains a plurality of contact surfaces or bonding pads 102.
[0009] The first light-emitting element 210, the second light-emitting element 220, and the third light-emitting element 230 are electrically connected to the circuit substrate 100. In this embodiment, the first light-emitting element 210 is electrically connected to the corresponding bond pad 102 via a first conductive structure 212; the second light-emitting element 220 is electrically connected to the corresponding bond pad 102 via a second conductive structure 222; and the third light-emitting element 230 is electrically connected to the corresponding bond pad 102 via a third conductive structure 232. The number of the first light-emitting element 210, the second light-emitting element 220, and the third light-emitting element 230 can be adjusted according to the actual requirements.
[0010] The first light-emitting element 210, the second light-emitting element 220, and the third light-emitting element 230 are horizontal or vertical light-emitting diodes. Fig. In section 2A, a horizontal light-emitting diode is used as an example for explanation.
[0011] The first light-emitting element 210 is configured to emit blue light and / or ultraviolet light. The second light-emitting element 220 is configured to emit blue light. The third light-emitting element 230 is configured to emit green light. In some embodiments, the first light-emitting element 210 and the second light-emitting element 220 contain the same light-emitting diodes (for example, both are blue light-emitting diodes). In some embodiments, the blue light mentioned above means light with a wavelength between 380 nm and 500 nm, the ultraviolet light mentioned above means light with a wavelength between 100 nm and 380 nm, and the green light mentioned above means light with a wavelength between 501 nm and 570 nm.
[0012] In some embodiments, a barrier layer 110 is optionally formed on the circuit substrate 100. The barrier layer 110 has an opening 110h that overlaps the first light-emitting element 210. Although in this embodiment the barrier layer 110 is formed only around the first light-emitting element 210, the disclosure is not limited thereto. In other embodiments, the barrier layer 110 is also formed around the second light-emitting element 220 and the third light-emitting element 230. In other words, in other embodiments the barrier layer 110 can surround not only the first light-emitting element 210, but also the second light-emitting element 220 and the third light-emitting element 230.
[0013] In some embodiments, the barrier layer 110 contains a light-blocking material suitable for reducing the crosstalk between different subpixels or partial pixels. In some embodiments, a method for forming the barrier layer 110 comprises: first, forming a photoresist material on the circuit substrate 100, and then structuring the photoresist material by a photolithographic process to form the barrier layer 110. In some embodiments, the aforementioned photoresist material contains a hydrophobic material.
[0014] In this embodiment, the circuit substrate 100 includes a first repair area 210D, a second repair area 220D, and a third repair area 230D. During a repair operation, light-emitting diodes for repair can be arranged in the first repair area 210D, the second repair area 220D, and the third repair area 230D. For example, if the first light-emitting element 210 fails or is not properly connected to the bond pad 102, a light-emitting diode for repair is arranged in the first repair area 210D. In some embodiments, bond pads for repair (not shown) are arranged in the first repair area 210D, the second repair area 220D, and the third repair area 230D, and the light-emitting diodes for repair are bonded to these bond pads.
[0015] Referring to Fig. 1B and Fig. In 2B, a first color conversion layer 310 is formed to cover the first light-emitting element 210. The first color conversion layer 310 is separated from the second light-emitting element 220 and the third light-emitting element 230.
[0016] In some embodiments, the first color conversion layer 310 is produced by a photolithographic process. For example, a photoresist material layer is first formed on the circuit substrate 100, the photoresist material layer covering the first light-emitting element 210, the second light-emitting element 220, and the third light-emitting element 230. The photoresist material layer is then patterned by a photolithographic process to form the first color conversion layer 310 and expose the second light-emitting element 220 and the third light-emitting element 230.
[0017] In other embodiments, the first color conversion layer 310 is produced by inkjet printing. The first color conversion layer 310 is located in the opening 110h of the barrier layer 110. In this case, the hydrophobic barrier layer 110 can be used to prevent uncured ink from flowing to unwanted areas, which helps to prevent the first color conversion layer 310 from coming into contact with the second light-emitting element 220 or the third light-emitting element 230.
[0018] In some embodiments, the first color-conversion layer 310 is configured to convert blue light and / or ultraviolet light emitted by the first light-emitting element 210 into red light. In some embodiments, the aforementioned red light is light with a wavelength between 600 nm and 750 nm. In some embodiments, the first color-conversion layer 310 comprises a polymeric material (or organic material) and color-conversion particles dispersed therein. The aforementioned color-conversion particles comprise at least one quantum dot material, one fluorescent material, and one perovskite material. In some embodiments, the first color-conversion layer 310 may also comprise a scattering material (such as TiO₂). X , and so on).
[0019] With reference to Fig. 1C and Fig. In 2C, a first color filter layer 320 is formed on the first color conversion layer 310. The first color filter layer 320 covers and contacts a top surface 310t and a side surface 310s of the first color conversion layer 310. In some embodiments, the first color filter layer 320 completely covers the first color conversion layer 310 in a top view. In some embodiments, the first color filter layer 320 extends from the top surface 310t of the first color conversion layer 310 toward the circuit substrate 100 along the side surface 310s of the first color conversion layer 310. For example, the first color filter layer 320 extends to a top surface 110t of the barrier layer 110. The first color filter layer 320 is separated from the second light-emitting element 220 and the third light-emitting element 230.
[0020] In some embodiments, the first color filter layer 320 is formed by a photolithographic process. For example, a photoresist material layer is first formed on the circuit substrate 100, the first color conversion layer 310, the second light-emitting element 220, and the third light-emitting element 230, the photoresist material layer covering the first color conversion layer 310, the second light-emitting element 220, and the third light-emitting element 230. The photoresist material layer is then structured by a photolithographic process to form the first color filter layer 320 and expose the second light-emitting element 220 and the third light-emitting element 230.
[0021] The first color filter layer 320 is configured to have a transmittance of 0% to 5% for blue light and / or ultraviolet light and a transmittance of 60% to 99% for red light. Therefore, the first color filter layer 320 can block blue light and / or ultraviolet light emitted by the first light-emitting element 210 from passing through directly and can transmit red light emitted by the first color-conversion layer 310.
[0022] Furthermore, blue light emitted by the second light-emitting element 220 next to the first light-emitting element 210 can also be filtered by the first color filter layer 320, thus preventing the first color conversion layer 310 from being excited by the second light-emitting element 220. Based on the above, the problem of mutual interference between blue and red subpixels can be mitigated.
[0023] Furthermore, in this embodiment, the mutual interference between two subpixels can be attenuated by the arrangement of the first color conversion layer 310, without the need to configure a bank structure between the first light-emitting element 210 and the second light-emitting element 220. Therefore, problems of shot mura or color shift in images caused by deformation of the bank structure can be avoided.
[0024] Referring to Fig. 1D and Fig. In step 2D, after the formation of the first color filter layer 320, an encapsulation layer 330 is formed on the circuit substrate 100. The encapsulation layer 330 surrounds the first light-emitting element 210, the first color conversion layer 310, the first color filter layer 320, the second light-emitting element 220, and the third light-emitting element 230. In some embodiments, the encapsulation layer 330 contacts the second light-emitting element 220 and the third light-emitting element 230, and the encapsulation layer 330 is separated from the first light-emitting element 210 and the first color conversion layer 310. In some embodiments, the encapsulation layer 330 contacts the first color filter layer 320.
[0025] In this embodiment, the encapsulation layer 330 contains a transparent material, and red, blue, and green light can all penetrate through the encapsulation layer 330.
[0026] Finally, with reference to Fig. 2E, an opposing substrate 400 is optionally bonded to the encapsulation layer 330. In some embodiments, the opposing substrate 400 is connected to the encapsulation layer 330 by an adhesive layer 420. In some embodiments, a black matrix 410 is formed on the opposing substrate 400.
[0027] Fig. 3A to Fig. 3D are schematic top views of a manufacturing process for a display board 20 according to another embodiment of the disclosure. Fig. 4A to Fig. Figure 4E are schematic cross-sectional views of the manufacturing process of the display board according to another embodiment of the disclosure, wherein Fig. 4A to Fig. 4D each corresponds to the positions of lines BB' and CC' in Fig. 3A to Fig. 3D. It should be noted here that the embodiment of Fig. 3A to Fig. 4E the component numbers and part of the content of the embodiment of Fig. 1A to Fig. 2E is used, whereby the same or similar numbers are used to represent the same or similar elements, and descriptions of the same technical content are omitted. For the descriptions of the omitted parts, reference may be made to the preceding embodiments, which are not repeated.
[0028] With reference to Fig. 3A and Fig. 4A A plurality of first light-emitting elements 210, a plurality of second light-emitting elements 220, and a plurality of third light-emitting elements 230 are electrically connected to the circuit substrate 100. In this embodiment, the first light-emitting elements 210 are each electrically connected to the corresponding bond pads 102 via the first conductive structures 212; the second light-emitting elements 220 are each electrically connected to the corresponding bond pads 102 via the second conductive structures 222; and the third light-emitting elements 230 are each electrically connected to the corresponding bond pads 102 via the third conductive structures 232.
[0029] In some embodiments, at least one of the first light-emitting elements 210 is surrounded by four of the third light-emitting elements 230, and at least one of the second light-emitting elements 220 is surrounded by four of the third light-emitting elements 230.
[0030] Referring to Fig. 3B and Fig. In step 4B, an encapsulation layer 330A is formed on the circuit substrate 100. The encapsulation layer 330A surrounds the first light-emitting elements 210, the second light-emitting elements 220, and the third light-emitting elements 230.
[0031] In some embodiments, the encapsulation layer 330A is formed by a photolithographic process. For example, a photoresist material layer is first formed on the circuit substrate 100, the photoresist material layer covering the first light-emitting elements 210, the second light-emitting elements 220, and the third light-emitting elements 230. The photoresist material layer is then patterned by a photolithographic process to form the encapsulation layer 330A and expose the first light-emitting elements 210 and the second light-emitting elements 220. The encapsulation layer 330A has a plurality of first grooves 332, each overlapping the plurality of first light-emitting elements 210, and a plurality of second grooves 334, each overlapping the plurality of second light-emitting elements 220.
[0032] In some embodiments, the encapsulation layer 330A surrounds and touches the third light-emitting elements 230, and the encapsulation layer 330A is configured to have a transmittance of 0% to 5% for blue light and a transmittance of 60% to 99% for green light. In this embodiment, the encapsulation layer 330A can also be referred to as a green filter element. Even if the encapsulation layer 330A covers an upper surface of the third light-emitting element 230, green light emitted by the third light-emitting element 230 can pass through the encapsulation layer 330A. On the other hand, it is difficult for blue light emitted by the first light-emitting element 210 to pass through the encapsulation layer 330A.
[0033] As in Fig. 3C and Fig. As shown in Figure 4C, a plurality of first color conversion layers 310 are formed in the plurality of first grooves 332. Each first color conversion layer 310 does not fill the corresponding first groove 332. The plurality of first color conversion layers 310 each cover the plurality of first light-emitting elements 210 and are configured to convert blue light and / or ultraviolet light emitted by the first light-emitting elements 210 into red light. The first color conversion layers 310 are separated from the second light-emitting elements 220 and the third light-emitting elements 230. The encapsulation layer 330A contacts the side walls of the first color conversion layers 310.
[0034] In some embodiments, the first color conversion layers 310 are formed by a photolithographic process. For example, a photoresist material layer is first formed on the circuit substrate 100, the photoresist material layer covering the first light-emitting elements 210, the second light-emitting elements 220, and the encapsulation layer 330A. The photoresist material layer is then structured by a photolithographic process to leave the first color conversion layers 310, located in the first grooves 332, exposed and to expose the second light-emitting elements 220.
[0035] In other embodiments, the first color conversion layers 310 in the first grooves 332 are formed by inkjet printing.
[0036] In this embodiment, blue light emitted by the second light-emitting element 220 adjacent to the first light-emitting element 210 can be filtered by the encapsulation layer 330A, thus preventing the first color conversion layer 310 from being excited by the second light-emitting element 220. Based on the above, the problem of mutual interference between blue and red subpixels can be mitigated. Therefore, by arranging the encapsulation layer 330A, the mutual interference between two subpixels can be reduced without configuring a bank structure between the first light-emitting element 210 and the second light-emitting element 220. Consequently, problems such as shot mura or color shift in images caused by bank structure distortion can be avoided.
[0037] Referring to Fig. 3D and Fig. 4D, a plurality of first color filter layers 320 are formed in the sections of the plurality of first grooves 332 that are not filled by the first color conversion layers 310. The plurality of first color filter layers 320 cover and contact the upper surfaces 310t of the plurality of first color conversion layers 310. In some embodiments, the first color filter layers 320 fill the first grooves 332 and contact a portion of an upper surface 330t of the encapsulation layer 330A, but the disclosure is not limited thereto. In other embodiments, an upper surface of the first color filter layer 320 is lower than the upper surface of the encapsulation layer 330A. The first color filter layers 320 are separated from the second light-emitting elements 220 and the third light-emitting elements 230. The encapsulation layer 330A contacts the side walls of the first color filter layers 320.In some embodiments, the first color conversion layers 310 are completely covered by the encapsulation layer 330A and the first color filter layers 320.
[0038] In some embodiments, the first color filter layer 320 is formed by a photolithographic process. For example, a photoresist material layer is first formed on the first color conversion layers 310, the second light-emitting elements 220, and the encapsulation layer 330A. Then, the photoresist material layer is structured by a photolithographic process to form the first color filter layers 320 and expose the second light-emitting elements 220.
[0039] In this embodiment, the first color filter layers 320 can prevent blue light and / or ultraviolet light emitted by the first light-emitting elements 210 from passing through directly and allow red light emitted by the first color conversion layers 310 to pass through.
[0040] Referring to Fig. 4E, after the first color filter layers 320 have been formed, an optional cover layer 340 is formed on the encapsulation layer 330A and the first color filter layers 320. In this embodiment, the cover layer 340 contains a transparent material, and red, blue, and green light can all pass through the cover layer 340.
[0041] Optionally, the opposing substrate 400 is bonded to the cover layer 340. In some embodiments, the opposing substrate 400 is connected to the cover layer 340 by an adhesive layer 420. In some embodiments, the black matrix 410 is formed on the opposing substrate 400.
[0042] In summary, it can be said that in some embodiments of the disclosure, the design of the first color filter layer and / or the encapsulation layer can mitigate the problem of mutual interference between neighboring subpixels, and that the bank structure can be omitted to avoid the problems of shot mura or color shift in images caused by the deformation of the bank structure. [Description of reference symbols] 10, 20 Scoreboard 100 circuit substrate 102 Bondpad 110 barrier layer 110h opening 110t, 310t, 330t upper surface 210 first light-emitting element 210D first repair area 212 first leading structure 220 second light-emitting element 220D second repair area 222 second leading structure 230 third light-emitting element 230D third repair area 232 third leading structure 310 first color conversion layer 310s side surface 320 first color filter layer 330, 330A encapsulation layer 332 first groove 334 second groove 340 Cover layer 400 opposite substrate 410 black matrix 420 adhesive layer
Claims
[1] Display board (10, 20), comprising: a circuit substrate (100); a first light-emitting element (210) that is electrically connected to the circuit substrate (100) and configured to emit blue light and / or ultraviolet light; a first color conversion layer (310) covering the first light-emitting element (210) and configured to convert blue light and / or ultraviolet light into red light; a first color filter layer (320) covering and touching an upper surface (110t, 310t, 330t) of the first color conversion layer (310) configured to have a transmittance of 0% to 5% for blue light and / or ultraviolet light, and configured to have a transmittance of 60% to 99% for red light; a second light-emitting element (220) electrically connected to the circuit substrate (100) and configured to emit blue light, wherein the first color conversion layer (310) and the first color filter layer (320) are separated from the second light-emitting element (220); and an encapsulation layer (330, 330A) that surrounds the first light-emitting element (210), the first color conversion layer (310), the first color filter layer (320) and the second light-emitting element (220). [2] Display panel (10, 20) according to claim 1, wherein the first color filter layer (320) extends from the upper surface (110t, 310t, 330t) of the first color conversion layer (310) to the circuit substrate (100) along a lateral surface (310s) of the first color conversion layer (310). [3] Display panel (10, 20) according to claim 1, further comprising: a barrier layer (110) located on the circuit substrate (100) and having an opening (110h) overlapping the first light-emitting element (210), wherein the first color conversion layer (310) is located in the opening (110h) and the first color filter layer (320) extends from the top surface (110t, 310t, 330t) of the first color conversion layer (310) to a top surface (110t, 310t, 330t) of the barrier layer (110) along a side surface (310s) of the first color conversion layer (310). [4] Display panel (10, 20) according to claim 1, further comprising: a third light-emitting element (230) electrically connected to the circuit substrate (100) and configured to emit green light, wherein the encapsulation layer (330, 330A) surrounds the third light-emitting element (230) and the encapsulation layer (330, 330A) is configured to have a transmittance of 0% to 5% for red light and a transmittance of 60% to 99% for green light. [5] Display panel (10, 20) according to claim 4, further comprising: a plurality of first light-emitting elements (210) which are electrically connected to the circuit substrate (100) and configured to emit blue light and / or ultraviolet light; a plurality of first color conversion layers (310) each covering the first light-emitting elements (210) and configured to convert blue light and / or ultraviolet light into red light; a plurality of first color filter layers (320) each covering and touching the upper surface (110t, 310t, 330t) of the first color conversion layers (310); a plurality of second light-emitting elements (220) electrically connected to the circuit substrate (100) and configured to emit blue light, wherein the first color conversion layers (310) and the first color filter layers (320) are separated from the second light-emitting elements (220); and a plurality of third light-emitting elements (230) electrically connected to the circuit substrate (100) and configured to emit green light, wherein at least one of the first light-emitting elements (210) is surrounded by four of the third light-emitting elements (230) and at least one of the second light-emitting elements (220) is surrounded by the other four of the third light-emitting elements (230). [6] Display panel (10, 20) according to claim 1, wherein the encapsulation layer (330, 330A) touches the second light-emitting element (220) and the encapsulation layer (330, 330A) is separated from the first light-emitting element (210). [7] Display board (10, 20), comprising: a circuit substrate (100); a first light-emitting element (210) that is electrically connected to the circuit substrate (100) and configured to emit blue light and / or ultraviolet light; a first color conversion layer (310) covering the first light-emitting element (210) and configured to convert blue light and / or ultraviolet light into red light; a first color filter layer (320) that completely covers the first color conversion layer (310) and is configured to have a transmittance of 0% to 5% for blue light and / or ultraviolet light and is configured to have a transmittance of 60% to 99% for red light; a second light-emitting element (220) electrically connected to the circuit substrate (100) and configured to emit blue light, wherein the first color conversion layer (310) and the first color filter layer (320) are separated from the second light-emitting element (220); and an encapsulation layer (330, 330A) that surrounds the first light-emitting element (210), the first color conversion layer (310), the first color filter layer (320) and the second light-emitting element (220). [8] Manufacturing process of a display board (10, 20), comprising: electrically connecting a first light-emitting element (210) and a second light-emitting element (220) to a circuit substrate (100), wherein the first light-emitting element (210) is configured to emit blue light and / or ultraviolet light, and the second light-emitting element (220) is configured to emit blue light; Forming a first color conversion layer (310) to cover the first light-emitting element (210), and separating the first color conversion layer (310) from the second light-emitting element (220), wherein the first color conversion layer (310) is configured to convert blue light and / or ultraviolet light into red light; and Forming a first color filter layer (320) on the first color conversion layer (310) and separating the first color filter layer (320) from the second light-emitting element (220), wherein the first color filter layer (320) is configured to have a transmittance of 0% to 5% for blue light and / or ultraviolet light, and the first color filter layer (320) is configured to have a transmittance of 60% to 99% for red light. [9] Manufacturing method of a display board (10, 20) according to claim 8, further comprising: After forming the first color filter layer (320), forming an encapsulation layer (330, 330A) to surround the first light-emitting element (210), the first color conversion layer (310), the first color filter layer (320) and the second light-emitting element (220). [10] Manufacturing method of a display board (10, 20) according to claim 8, further comprising: electrically connecting a third light-emitting element (230) to the circuit substrate (100), wherein the third light-emitting element (230) is configured to emit green light; prior to forming the first color conversion layer (310), forming an encapsulation layer (330, 330A) surrounding the first light-emitting element (210), the second light-emitting element (220) and the third light-emitting element (230), wherein the encapsulation layer (330, 330A) has a first groove (332) overlapping the first light-emitting element (210) and a second groove (334) overlapping the second light-emitting element (220); Forming the first color conversion layer (310) in the first groove (332), wherein the first color conversion layer (310) does not fill the first groove (332); and Forming the first color filter layer (320) in a section of the first groove (332) that is not filled by the first color conversion layer (310), wherein the encapsulation layer (330, 330A) contacts a side wall of the first color conversion layer (310) and a side wall of the first color filter layer (320).