Solder joint element, semiconductor device, solder joint process and method for manufacturing a semiconductor device

A soldering connection element with a multi-phase structure using SN, AG, CU, and BI addresses thermal contraction issues in semiconductor devices, enhancing reliability and strength by evenly distributing thermal stresses and preventing cracks.

DE112022007400T5Pending Publication Date: 2025-04-03MITSUBISHI ELECTRIC CORP
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Patent Information

Application Number
DE112022007400
Authority / Receiving Office
DE · DE
Patent Type
Applications
Current Assignee / Owner
Filing Date
2022-06-20
Publication Date
2025-04-03

AI Technical Summary

Technical Problem

Existing soldering connections between semiconductor elements and circuit boards are prone to defects due to thermal contraction and oxidation, leading to electrical property changes and potential damage, as conventional lead-free soldering agents with added elements like Bi form uneven phases with different melting points, causing gaps and cracks.

Method used

A soldering connection element composed of SN, AG, CU, and BI with specific mass percentages, forming a multi-phase structure with melting points ranging from 135°C to 220°C, including an SN-BI alloy phase with a low melting point, an SN-BI-SB alloy phase with a medium melting point, and a main phase with a high melting point, to mitigate thermal contraction stresses.

Benefits of technology

The multi-phase structure reduces defects by evenly distributing thermal stresses, maintaining high reliability and strength in the connection, preventing cracks and ensuring stable electrical properties.

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Abstract

A solder joint element (4) for joining a first object (2) and a second object (3) contains Sn, serving as a main component, 3 wt% or more and less than 4 wt% of Ag, 0.5 wt% or more and less than 1.0 wt% of Cu, 2.5 wt% or more and less than 4 wt% of Bi and 0.5 wt% or more and less than 3 wt% of Sb and comprises: a main phase (12) containing Sn, Ag and Cu and having a melting point of 210 °C or more and less than 220 °C; an Sn-Bi alloy phase (10) covering at least part of the main phase (12) and having a melting point of 135 °C or more and less than 145 °C; and an Sn-Bi-Sb alloy phase (11) covering at least part of the Sn-Bi alloy phase (10) and having a melting point of 170 °C or more and less than 180 °C.
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