A gait analysis system with intelligent insoles
The intelligent gait analysis system addresses the limitations of existing technologies by integrating a layered shoe cushion design with flexible conductive traces and a grid structure, enhancing accuracy and comfort while extending the product's lifespan.
Patent Information
- Authority / Receiving Office
- DE · DE
- Patent Type
- Utility models
- Current Assignee / Owner
- Filing Date
- 2025-12-22
- Publication Date
- 2026-03-26
Smart Images

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Abstract
Description
TECHNICAL AREA
[0001] The present utility model solution concerns the field of intelligent wearable devices and relates in particular to a system for analyzing gait patterns using intelligent foot pads. TECHNICAL BACKGROUND
[0002] Current gait analysis technologies primarily rely on large, specialized devices in laboratory settings—such as pressure platforms or motion capture systems—which are expensive and do not allow for continuous, daily monitoring. The few smart shoe insoles available on the market for private use, however, often have limited functionality and offer restricted monitoring accuracy. They typically use simple single-sensor systems or electronic components with a crude layout, making it difficult to achieve stable and precise measurement of pressure distribution across multiple points on the sole of the foot while maintaining wearing comfort.
[0003] Furthermore, current products typically lack effective protection for flexible internal conductor tracks and user-friendly maintenance of the electronic modules, which negatively impacts both the lifespan and the user experience. CONTENT OF THE PRESENT APPLICATION
[0004] To overcome the disadvantages of the existing technology, the present utility model solution offers an intelligent system for analyzing gait using foot pads, which solves the problems mentioned in the preceding technology. To achieve this goal, the following technical solution is proposed: An intelligent gait analysis system with a footpad, comprising the following components: The shoe cushion body consists of an upper and lower cushion cover arranged over another.
[0005] An electronic module that is detachably attached to the main body of the insole.
[0006] The surface of the lower housing plate of the shoe sole is integrally connected to the electronic housing, the sensor housing, and the conductive trace running between them. The electronic module consists of a battery box within the electronic housing and a rigid plate for the flexible pressure sensor array within the sensor housing. The two components are electrically connected via flexible conductive traces arranged in the conductor grooves.
[0007] In addition, a retaining groove is provided on the inside of the electronic housing, and a charging port socket is located on the side wall of the battery compartment, one end of which protrudes into the retaining groove.
[0008] In addition, the bottom wall of the sensor chamber is equipped with a grid of net cavities.
[0009] Furthermore, the conductor channels comprise a first and a second long, engraved channel arranged in the surface of the lower housing of the inner sole; their depth is chosen so that the flexible circuitry contained therein is not directly stressed after pressure bonding of the upper housing of the inner sole.
[0010] Furthermore, the electronic module includes an MCU control board; a mounting socket for the control board is provided on the top of the lower housing of the shoe pad, allowing it to be electrically connected to the battery compartment via a flexible circuit board. This flexible circuit also includes a first and a second flexible conductor: the first serves as the electrical connection between the rigid plate of the flexible pressure sensor system and the battery housing, while the second provides the electrical connection between the microcontroller system's (MCU) control board and the battery housing.
[0011] Furthermore, the first flexible cable is embedded in the first narrow-long joint, the second flexible cable in the second narrow-long joint.
[0012] Furthermore, at least one elongated groove is provided on the fixed plate of the flexible pressure sensor system.
[0013] Furthermore, a cutout is provided at the lower end of the upper shoe sole, which is associated with the electronic casing; at the upper end of the lower shoe sole, a protrusion is provided at the corresponding location, which engages in this cutout, thereby accommodating the electronic casing in the protrusion.
[0014] Furthermore, the surface of the inner sole in the area of the sensor chamber forms a flat pressure load surface.
[0015] Compared to existing technologies, this utility model solution offers an intelligent system for gait analysis using foot pads, providing the following advantages: This utility model solution, through the layering of the upper and lower shoe pads and the integrated design of the lower pad cover—where the electronic assembly, sensor chamber, and conductive track are formed as a single unit—allows for easy disassembly and separate cleaning of the electronic modules. This significantly improves the product's lifespan and hygienic handling. The integrated conductive track and sensor chamber effectively protect the internal flexible conductors from bending and impact caused by walking movements. Long-term reliability of signal transmission is ensured. The grid design positioned in the forefoot area optimizes the pressure transmission path, reduces interference, and increases measurement accuracy.The lightweight, thin, and flexible overall structure ensures comfortable wear. The modular architecture allows for the integration of additional biomechanical sensor elements, thus expanding the range of applications. BRIEF DESCRIPTION OF THE DRAWINGS Fig. shows the schematic representation of the main structure of the shoe cushion according to the present utility model solution. Fig. shows the schematic representation of the mesh hole array structure according to the present utility model solution. Fig. shows the schematic division of the main body of the shoe padding according to the present utility model solution. Fig. shows the structure of an electronic module according to the present utility model solution. Fig. shows the structure of an electronic module according to the present utility model solution.
[0016] Figure: 1. Main body of the insole; 11. Upper housing of the insole; 12. Lower housing of the insole; 13. Electronics container; 131. Card slot; 14. Sensor unit; 141. Grid array; 15. Conductor channel; 151. First narrow channel; 152. Second narrow channel; 16. Control board space; 17. Cutout; 18. Protrusion; 19. Flat pressure surface; 2. Electronics module; 21. Battery housing; 211. Charging port; 22. Flexible pressure sensor retaining washer; 221. Longitudinal strip joint; 23. Flexible printed circuit board material; 231. First flexible conductor; 232. Second flexible conductor; 24. Microcontroller module (MCU) control board. DETAILED DESCRIPTION
[0017] The technical solution according to an embodiment of the present utility models is clearly and completely described with reference to the accompanying drawings.
[0018] As in Fig. As shown, an embodiment of the present utility model solution comprises an intelligent gait analysis system with foot cushioning, comprising the following components: The shoe cushion body 1 consists of an upper and lower cushioning cover 11 and 12 arranged one above the other.
[0019] Electronic module 2, which is detachably attached to the main body 1 of the insole.
[0020] The surface of the lower housing plate 12 is integrally connected to the electronic housing 13, the sensor housing 14 and the conductor track 15, which connects the electronic housing 13 to the sensor housing 14.
[0021] The electronic module 2 comprises a battery container 21, which is housed in the electronic enclosure 13, and a fixed plate 22 for the flexible pressure sensor system, which is arranged in the sensor housing 14. The battery container 21 and the fixed plate 22 are electrically connected to each other via a flexible circuit board 23, which is mounted in the conductor track 15.
[0022] The rigid plate 22 of the flexible pressure sensor system is a one-piece manufactured, flexible substrate material, with silicone or thermoplastic polyurethane (TPU) being considered optimal materials. A pressure sensor array consisting of several independent sensor units is integrated onto the flexible substrate plate using pressure bonding, adhesive bonding, or embedding processes. The array exhibits high flexibility, adapts to the shape of the sole of the foot, and can withstand the dynamic deformations during walking, thus ensuring the accuracy of the pressure measurement and the durability of the component.
[0023] Flexible conductors are FPCs (flexible printed circuit boards) or flexible foil conductors made from flexible substrates such as polyimide (PI). An etching process creates precise copper traces within the substrate, exhibiting excellent resilience. These traces are precisely embedded in the routing box 15 of the lower sleeve 12 and can stretch during the daily flexing of the shoe sole 1 without tearing. This ensures the long-term reliability of the power and signal electronics between the sensor set and the electronic module 2.
[0024] The layered structure of the upper and lower shoe soles 11 and 12 within the main body 1 of the shoe sole creates space for housing and protecting the internal functional components. The key innovation lies in the integrated surface of the lower shoe sole 12, on which the electronic housings 13, the sensor housings 14, and the conductive track 15 are located – together they form a structured support platform inside. The removable electronic module 2 consists of two main components: the battery box 21 in the electronic housing 13, which provides the power supply and basic connections, and the fixed plate 22 for the flexible pressure sensor array in the sensor housing 14, which is responsible for data acquisition. The electrical connection and signal transfer between the two components are carried out via the flexible conductive track 23, which is arranged in the protected conductive channel 15.
[0025] The integration of suitable connecting elements between the upper and lower shoe cushion housings 11 and 12 increases assembly stability. Furthermore, the separate design of the two housings facilitates assembly and maintenance. The internal support platform of the lower sleeve 12 of the shoe sole ensures precise positioning of the internal components and organized wiring, thus enabling the reliable implementation of the modular design. This guarantees the maintainability and expandability of the product and makes assembly significantly easier and more reliable. The battery box 21 and the sensor array are positioned separately in the physiological functional areas of the heel and sole of the foot, thereby optimizing the weight distribution system and space utilization, and improving the wearing experience and comfort.
[0026] As in Fig. As shown, in some embodiments the side wall of the battery box 21 has a charging connection point 211, one end of which extends into the card joint 131.
[0027] A clamping point 131 is provided on the inside of the electronic housing 13, while a correspondingly positioned charging port 211 is located on the side edge of the battery pack 21. The clamping point 131 not only prevents the charging port 211 from being touched, but also forms a simple clamping mechanism for securing the battery pack. The user can easily remove the battery pack 21 for separate charging or replacement. This also allows for thorough cleaning or drying of the shoe cushion body 1 (without electronic components), significantly improving the product's functionality and hygiene and extending the shoe cushion body's lifespan. This design ensures that the battery pack 21 remains securely in place even during strenuous physical activity.
[0028] As in Fig. As shown, in some embodiments a grid hole array 141 is provided on the bottom wall of the sensor chamber 14.
[0029] The network of 141 sensors is densely arranged and extends across the material of the insole 12 in the sensor area. This minimizes the cushioning and propagation of foot pressure through the insole material 12, allowing the pressure profile to be transmitted directly and without loss to the upper flexible pressure sensor plate 22. This significantly increases the sensitivity and spatial resolution of the pressure measurement. At the same time, the network structure increases the air permeability of the area, allowing for better heat dissipation and moisture removal from the sole of the foot, and provides the area with additional flexibility to adapt to dynamic deformations of the sole.
[0030] How Fig. As shown, in some embodiments the conductor point 15 is designed as first and second narrow-elongated channels 151 and 152, which are embedded in the surface of the lower sleeve 12 of the shoe pad. Their depth is chosen such that the flexible circuit 23 housed therein is not directly stressed after the upper sleeve 11 of the shoe pad has been pressure-bonded.
[0031] This corresponds to at least two main connection paths in the system—for example, between the sensor input signal line and the power or control line—each path having its own dedicated, deep, specially designed physical channel. The deep design of the conductor track 15, so that the embedded flexible circuit board lies below the surface of the insole 12, ensures that after pressing down on the upper sole 11, the foot pressure is primarily absorbed by the housing without directly stressing the sensitive flexible circuit board 23. This design fundamentally prevents fatigue fracture of the circuit board 23 due to repeated actuation and significantly increases the long-term reliability of the electrical connections in the system.
[0032] How Fig. As shown, in some embodiments the electronic module 2 additionally includes an MCU control board 24. A control board recess 16 is provided on the top of the lower housing 12 of the shoe pad, in which the MCU control board 24 is housed. The MCU control board 24 is electrically connected to the battery pack 21 via a flexible circuit board 23.
[0033] The MCU control board 24 is connected to the battery pack 21 via a flexible circuit board 23 for power supply and data exchange. This arrangement promotes efficient heat dissipation and avoids concentrated heat generation. At the same time, it allows for future upgrades of the processor or algorithms by simply replacing the relevant portion of the MCU control board 24, without requiring modifications to the battery pack 21 or the fixed plate 22 of the flexible pressure sensor system 22. The special control board with its mounting cavity 16 provides a stable mounting position and physical protection.
[0034] The MCU control board 24 also integrates a Bluetooth radio module, which is implemented together with the MCU chip on the same printed circuit board (PCB) and thus forms an integrated core component for data processing, control and wireless transmission.
[0035] During operation, the MCU collects and processes raw data in real time from the fixed plate 22 of the flexible pressure sensor array, as well as potentially integrated data from the inertial measurement unit (IMU). The resulting gait characteristic data packets—such as the pressure distribution matrix, step frequency, or landing frequency—are directly controlled by the MCU and converted into wireless signals for output via the integrated Bluetooth module. This Bluetooth module typically supports the Bluetooth Low Energy (BLE) protocol, enabling a stable, energy-efficient wireless connection to smartphones, smartwatches, or dedicated receiver devices.
[0036] The integrated Bluetooth module is crucial for the system's wireless and portable functionality. This allows the shoe cushion body 1 to transmit measurement data to a mobile device in real time without the need for external cables. Users can synchronize the data seamlessly during sports or everyday activities, significantly improving usability and the user experience. Through a continuous or on-demand connection via the Bluetooth module, the user's smartphone app can receive and display the floor pressure and temperature map, as well as walking parameters, in real time and even provide instant feedback. Simultaneously, the app can send configuration commands via Bluetooth—such as adjusting the sampling rate or starting / stopping recording—to the MCU control board 24, enabling bidirectional intelligent interaction.
[0037] The control board 24 preferably uses a flexible printed circuit board (FPC) material as a substrate. The MCU chip, a Bluetooth module (e.g., a BLE chip), necessary passive components, and an antenna—for example, with an inverted F-antenna—are integrated onto this board using surface-mount technology (SMT). This flexible board construction gives the entire system a degree of flexibility, allowing it to adapt to the deformations of the shoe cushion body 1 during walking. To ensure reliability, reinforcement ribs can be strategically placed in the core area of the chip, or a combination of rigid and flexible board methods can be used to achieve local reinforcement. This achieves a harmonious balance between flexible adaptability and stable electrical performance characteristics, ensuring the reliability of Bluetooth signal transmission under dynamic bending conditions.
[0038] As in Fig. As shown, the flexible circuit 23 in some embodiments comprises a first flexible line 231 and a second flexible line 232. The first flexible line 231 serves as the electrical connection between the fixed plate 22 of the flexible pressure sensor 23 and the battery housing 21, while the second flexible line 232 establishes the electrical connection between the control board 24 of the MCU and the battery housing 21.
[0039] “First flexible line 231” (connects the fixed plate 22 of the flexible pressure sensor system to the battery run 21) and “second flexible line 232” (connects the control board 24 of the MCU to the battery run 21); Through the customized configuration of the flexible lines - including conductor layer thickness, conductor layer spacing and protection requirements - the first flexible line 231 can optimally transmit multiple analog sensor signals, while the second flexible line 232 ensures stable digital control signal transmission.
[0040] As in Fig. In some embodiments, the first flexible conductor 231 is embedded in the first narrow-elongated groove 151, while the second flexible conductor 232 is embedded in the second narrow-elongated groove 152.
[0041] This design enables precise control according to the principle of "one conductor - one track"; the physical separation completely eliminates any risks from interference, friction, or entanglement between conductors of different functions. Each conductor is securely guided and enclosed in its specific, shape-conformed channel, ensuring that the bending radius and stress states of the conductor remain within the design-compliant safety range during the daily bending deformation of the inner sole 1, thus optimally utilizing the durability of the flexible conductor 23.
[0042] As in Fig. As shown, in some embodiments at least one elongated groove 221 is provided on the fixed plate 22 of the flexible pressure sensor system.
[0043] The elongated groove 221 forms a designated flexible joint zone on the rigid plate 22 of the flexible pressure sensor system. This significantly reduces the bending stiffness of the plate 22 in the direction of the longitudinal axis of the groove 221, allowing it to easily adapt to the movements of the sole of the foot during walking. This not only eliminates the interference with natural foot movements caused by the rigid plate 22 of the flexible pressure sensor system, thus increasing wearing comfort, but, more importantly, protects the integrated precision sensor elements on the plate 22 by ensuring that deformation occurs precisely within the defined, elongated groove area 221. This prevents uncontrolled bending stresses and guarantees the long-term stability of the sensor properties.
[0044] As in Fig. As shown, in some embodiments the upper sole 11 has a cutout 17 at the lower end of the electronic housing 13, while the lower sole 12 has a protrusion 18 at the corresponding upper end which engages in the cutout 17; the electronic housing 13 is arranged in this protrusion 18.
[0045] A cutout 17 is provided at the lower edge of the upper shoe sole 11. The lower shoe sole 12 has a corresponding protrusion 18 that is inserted into the cutout 17. The electronic housing unit 13 is located precisely within this protrusion 18. The inserted arrangement of the cutout 17 and the protrusion 18 ensures, on the one hand, high precision and alignment during the assembly of the upper and lower housing plates, thus increasing the stability of the overall construction. On the other hand, this design often results in the area for the battery box 21 forming a natural reinforcement on the side contour of the inner sole. This provides additional protection for the battery box 21 and simultaneously creates an ideal position for visible components such as the charging port 211, facilitating operation without compromising the appearance or comfort of the shoe.Later, the battery box becomes visible through special access openings located on the side wall of the cutout 17 or the projection 18. The user can plug in the charging cable directly, enabling convenient, continuous charging. The engraved design effectively prevents daily wear and tear on the charging port 211 and the ingress of foreign objects, while ensuring ease of use, protection, and visual consistency with the main body of the shoe sole 1.
[0046] How Fig. As shown, in the area of the sensor chamber 14, the upper housing section 11 of the insole is in some embodiments a flat pressure load surface 19.
[0047] The flat pressure-bearing surface 19 is the crucial prerequisite for accurate pressure measurement: It prevents pressure distortions that could arise from the irregular surface shape of the shoe sole's upper toecap 11 and ensures that the pressure exerted on the sole of the foot is transmitted unchanged and accurately via the mesh array 141 to the rigid plate 22 of the flexible pressure sensor system. This forms the essential physical basis for recording real and reliable data on sole pressure and simultaneously ensures a stable, comfortable feel in the foot area – without any foreign objects.
[0048] During use, pressure is applied to the foot in such a way that, when standing or walking, it acts on the flat pressure surface 19 of the upper shoe sole 11 and is transmitted directly and uniformly via the network of holes 141 at the lower end of the sensor chamber 14 to the internal flexible pressure sensor unit 22. The several independent sensor units on the arrangement, which are mostly based on the principle of piezoresistivity or piezocapacitance, generate corresponding changes in resistance or capacitance under pressure; these analog signals are transmitted via the first flexible conductor 231 arranged in the conductor track 15 to the battery box 21 and the MCU control board 24. The MCU control board 24 performs the real-time acquisition, analog-to-digital conversion, and fusion processing of multiple signals—inertial data from an integrated IMU can also be processed simultaneously.The processed gait data is then transmitted via the integrated Bluetooth module to end devices such as the user's smartphone. After the application (app) on the end device receives the data, it analyzes it and visualizes it as a dynamic heat map of the foot pressure distribution in order to recognize and analyze gait characteristics using algorithms. The electronic module 2 can be easily removed from the shoe cushion body 1 using the charging port structure 211, allowing the latter to be washed independently – without the electronic components. This significantly improves the handling and lifespan of the product.
[0049] Finally, it should be noted that the examples mentioned above merely represent preferred embodiments of the present utility model solution and do not limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art in the respective field may further develop the technical solutions described therein or replace individual technical features with equivalent variants. All modifications, equivalent replacements, or improvements made in the spirit and according to the principles of the present utility model solution shall be subject to the scope of protection of this utility model solution. SUMMARY
[0050] The present utility model solution relates to the field of intelligent wearable devices and specifically to a system for analyzing gait using intelligent insoles, including the insole, which consists of an overlapping upper and lower shell, and an electronic module that can be detachably mounted on the insole. By layering the upper and lower insole shells and by integrating the design of the lower shell—which contains electronic assemblies, sensor chambers, and conductive traces in a single unit—this invention allows for easy disassembly and separate cleaning of the electronic modules. This significantly extends the product's lifespan and considerably improves hygiene and user-friendliness. The integrated conductive traces and sensor chambers effectively protect the inner flexible conductors from deformation caused by bending or footsteps.Long-term reliability of signal transmission is guaranteed. The grid design positioned in the forefoot area optimizes the pressure transmission path, reduces interference, and increases monitoring accuracy. The lightweight, thin, and flexible overall structure ensures comfortable wear during sports activities.
Claims
[1] A gait analysis system with intelligent insoles, characterized by the following components: The shoe cushion body (1) consists of a superimposed upper (11) and Under-sleeve (12) of the shoe padding. Electronic module (2) which is detachably attached to the shoe cushion body (1). The surface of the lower housing plate (12) of the said shoe pad is integrally connected with the electronic housing (13), the sensor housing (14) and the conductor track (15) that connects the electronic housing (13) to the sensor housing (14). The electronic module (2) comprises a battery compartment (21) within the electronics compartment (13) and a fixed plate (22) for the flexible pressure sensor array plate within the sensor compartment (14). The battery compartment (21) and the fixed plate (22) are electrically connected to each other via a flexible printed circuit board (23) arranged in the conductor track recess (15). [2] A gait analysis system with intelligent insoles according to claim 1, characterized by , that the inside of the electronic housing (13) has a clamping point (131) and the side wall of the battery charger (21) has a charging connection point (211) whose end extends into the clamping point (131). [3] A gait analysis system with intelligent insoles according to claim 1, characterized by , that the bottom wall of the sensor chamber (14) has a grid arrangement (141). [4] A gait analysis system with intelligent insoles according to claim 1, characterized by , that the guide track (15) consists of a first, elongated track (151) and a second, elongated track (152) which are embedded in the surface of the lower insole shell (12), the depth being designed such that the flexible circuit (23) built therein is not directly loaded after pressure bonding of the upper insole shell (11). [5] A gait analysis system with intelligent insoles according to claim 1, characterized by , that the electronic module (2) also includes an MCU control board (24), wherein the surface of the lower housing plate (12) has a control board insert (16) which houses the MCU control board (24). The MCU control board (24) is electrically connected to the battery charger (21) via a flexible circuit board (23). [6] A gait analysis system with intelligent insoles according to claim 1, characterized by The flexible circuit (23) comprises a first flexible line (231) and a second flexible line (232), wherein the first flexible line (231) serves for the electrical connection between the fixed plate of the flexible pressure sensor (22) and the battery box (21). The second flexible line (232) serves for the electrical connection between the MCU control board (24) and the battery drive (21). [7] A gait analysis system with intelligent insoles according to claim 6, characterized by , that the first flexible conductor (231) is embedded in the first narrow elongated groove (151) and the second flexible conductor (232) is embedded in the second narrow elongated groove (152). [8] A gait analysis system with intelligent insoles according to claim 1, characterized by , that at least one elongated groove (221) is provided on the fixed plate (22) of the flexible pressure sensor system. [9] A gait analysis system with intelligent insoles according to claim 1, characterized by, that a recess (17) is provided at the lower edge of the upper insole housing (11) on the side of the electronic housing (13), and that a protrusion (18) is arranged at the upper end of the lower insole housing (12) on the corresponding side, which is inserted into the recess (17), with the electronic housing (13) being arranged within this protrusion (18). [10] A gait analysis system with intelligent insoles according to claim 1, characterized by , that the insole top cap (11) has a flat pressure load surface (19) in the area of the sensor chamber (14).