Method for producing a transfer structure and transfer structure

EP4747084A1Pending Publication Date: 2026-05-27GIESECKE & DEVRIENT CURRENCY TECHNOLOGY GMBH
0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
EP · EP
Patent Type
Applications
Current Assignee / Owner
GIESECKE & DEVRIENT CURRENCY TECHNOLOGY GMBH
Filing Date
2024-07-08
Publication Date
2026-05-27

AI Technical Summary

Technical Problem

Existing transfer structures for valuable documents lack efficient adhesion methods and adequate protection for security features, leading to potential detachment and manipulation risks.

Method used

A transfer structure comprising a carrier substrate with a release layer, a film layer having an adhesion-promoting surface, and a functional multilayer structure with a connecting adhesive layer, allowing for direct anchoring and enhanced chemical and mechanical resistance, and a method involving sequential lamination and application steps to reduce complexity and thickness.

Benefits of technology

The solution provides a secure, permanent bond to the target substrate, protecting security features and preventing manipulation, while reducing manufacturing complexity and costs by eliminating the need for additional adhesives and improving stacking and flatness.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure EP2024069198_23012025_PF_FP_ABST
    Figure EP2024069198_23012025_PF_FP_ABST
Patent Text Reader

Abstract

The invention relates to a method for producing a transfer structure comprising a temporary support and a multi-layer transfer material. The transfer material has, in particular, a transfer element which is characterised in that the film layer of the transport element has, on one side, an adhesion-promoting surface such that subsequent coating layers can be anchored adhesively directly on the film layer of the transfer element by means of pressing.
Need to check novelty before this filing date? Find Prior Art