Moisture-curable adhesive compositions and various applications thereof

Abstract

Moisture-curable adhesive compositions are disclosed that include at least a silylated modified polymer, a tackifier, and a crosslinker. Moisture curing conditions initiate a cross-linking reaction to form a moisture-cured adhesive from the moisture-curable adhesive composition. The moisture-cured adhesive formed from the moisture-curable adhesive compositions can be used to form various articles of manufacture in which the moisture-cured adhesive forms a moisture-cured adhesive layer bonded to a surface of a substrate.

Description

DESCRIPTIONMOISTURE-CURABLE ADHESIVE COMPOSITIONS AND VARIOUS APPLICATIONS THEREOFCROSS REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of priority to U.S. Provisional Patent Application Serial No. 63 / 532,241, filed August 11, 2023, hereby incorporated by reference in its entirety.BACKGROUND OF THE INVENTIONA. Field of the Invention

[0002] The invention generally concerns moisture-curable adhesive compositions and various applications thereof. In one aspect, the moisture-curable adhesive compositions can include particular ratios of components corresponding to a silylated modified polymer, a tackifier, and a crosslinker. The moisture-curable adhesive compositions can provide various advantages when compared with other adhesive compositions, such as adhesive compositions that are not moisture-curable (e.g., acrylic adhesive compositions that are ultraviolet (UV) curable) or solvent-based adhesive compositions, among other examples. Non-limiting examples of such advantages may include reduced energy consumption for curing, reduced costs (e.g., electricity costs, equipment costs, etc.), reduced carbon dioxide (CO2) emissions associated with reduced electricity demand, reduced CO2emissions from burned solvent (e.g., for solvent-based adhesive compositions), or a combination thereof (among other possible advantages).B. Description of Related Art

[0003] Adhesives can be utilized in numerous industries and / or applications. Adhesives that require curing may utilize a significant amount of energy (and correspondingly significant amount of carbon emissions). As an example, some acrylic adhesive compositions may be cured using UV light to initiate a cross-linking reaction. Relatively high electricity costs (and correspondingly high carbon emissions, in cases where electricity is generated by a fossil fuel burning power plant) may be associated with UV-curing operations to initiate cross-linking to form a UV-cured acrylic adhesive from such UV-curable acrylic adhesive compositions. As another example, curing of some solvent-based adhesive compositions may also be associated with relatively high electricity costs (and correspondingly high carbon emissions, in some cases) as well as CO2emissions from burned solvent. While attempts have been made toproduce high performance adhesives in a manner that reduces energy consumption and / or carbon emissions, current solutions can be complicated to use, costly, and / or can still result in poor adhesive performance or relatively insignificant reductions in energy consumption / carbon emissions.SUMMARY OF THE INVENTION

[0004] A discovery has been made that provides a solution to at least one or more of the problems associated with curing adhesive compositions. In one aspect, the solution can include the use of moisture-curable adhesive compositions that may be subjected to moisture curing conditions in order to initiate a cross-linking reaction to form moisture-cured adhesives from the moisture-curable adhesive compositions. In one aspect, the moisture-curable adhesive compositions can include a combination of multiple components, including at least: a first component corresponding to a hotmelt polymer (e.g., a silylated modified polymer); a second component corresponding to a crosslinker; and a third component corresponding to a tackifier. In one non-limiting aspect, it was discovered that the moisture curing conditions corresponded to a temperature of at least 100 °C to 200 °C, preferably 120 °C to 160 °C, or more preferably 130 °C to 150 °C and an absolute humidity that is at least 47.5 percent (e.g., within a range of 2.5 percent from 50 percent). In one non-limiting example, it was discovered that the moisture- curable adhesive compositions can have improved characteristics when compared with adhesive compositions that are not moisture-curable, such as UV-curable acrylic adhesive compositions. It was discovered that a first amount of energy input was associated with the moisture curing conditions, which was less than a second amount of energy input associated with UV curing conditions in order to form a UV-cured acrylic adhesive from a UV-curable acrylic adhesive composition. This discovery can be advantageous to the environment, for example, by providing an effective alternative to UV-cured acrylic adhesives having relatively high electricity costs associated with the UV curing operations required to form the UV-cured acrylic adhesives from UV-curable acrylic adhesive compositions. This discovery can be further advantageous to the environment, for example, as the energy input reduction associated with moisture curing may be associated with reduced carbon emissions. Specifically, the energy input reduction represents a difference between the amounts of energy input associated with the respective curing conditions, and the reduction in the amount of carbon emissions may correlate with this difference.

[0005] In another aspect of the present invention, it was also discovered that the use of specific ratios of the respective components of the moisture-curable adhesive compositions can provide the ability to specifically tailor or tune the material properties of the moisture-curableadhesive compositions. It was further discovered that the same manufacturing line can be used to produce different products having desired end-use applications (e.g., labels or tapes), and that the specific ratios can be easily tuned on the manufacturing line to create a moisture cure adhesive designed for a particular application. This allows for the ability to efficiently switch the manufacturing line from producing one product (e.g., label) to another (e.g., tape) in a cost- efficient and time-efficient manner. It was further discovered that the specific component ratios identified for the moisture-curable adhesive compositions in combination with specific adhesive thicknesses may provide particular characteristic material properties that can be advantageous when the moisture-cured composition is utilized for a particular end-use application (e.g., for an article of manufacture for a particular application, such as a label having a moisture-cured adhesive layer bonded to a surface of a substrate for a label application, a tape having a moisture-cured adhesive layer bonded to a surface of a substrate for a tape application, etc.).

[0006] In one aspect of the present invention, the moisture-curable adhesive compositions can include various combinations of the three components specifically tailored for various end- use applications. It was discovered that specific component ratios identified for the moisture- curable adhesive compositions provide particular characteristic material properties that can be advantageous when the composition is utilized for a particular end-use application (e.g., for a label application, for a tape application, etc.).

[0007] In some aspects of the present invention, moisture-curable adhesive compositions are described. A moisture-curable adhesive composition can include 86 wt. % to 94 wt. % of a mixture corresponding to PART A of the composition, the mixture comprising at least one or more silylated modified polymers, one or more tackifiers, and optionally a first set of additives. The moisture-curable adhesive composition can include 6 wt. % to 14 wt. % of a catalyst package corresponding to PART B of the composition, the catalyst package including at least a crosslinker and optionally a second set of additives. Moisture curing conditions in order to initiate a cross-linking reaction to form a moisture-cured adhesive from the moisture-curable adhesive composition may correspond to a temperature of at least 100 °C to 200 °C (or 100, 105, 110, 115, 120, 125, 130, 135, 140, 145, 150, 155, 160, 165, 170, 175, 180, 185, 190, 195, or 200 to 200 °C or any number or range therein) and an absolute humidity of 30 % to 100 % (or 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, or 100%).

[0008] Processes of producing a moisture-cured adhesive are also described. A process can include providing a mixture corresponding to PART A, where the mixture can include at least one or more silylated modified polymers, one or more tackifiers, and optionally a first set ofadditives. The process can include adding a catalyst package corresponding to PART B to the mixture to form a moisture-curable adhesive composition, where the catalyst package can include at least a crosslinker and optionally a second set of additives. In some aspects, 86 wt. % to 94 wt. % of the moisture-curable adhesive composition corresponds to PART A, and 6 wt. % to 14 wt. % of the moisture-curable adhesive composition corresponds to PART B. The process can include subjecting the moisture-curable adhesive composition to moisture curing conditions in order to initiate a cross-linking reaction to form a moisture-cured adhesive. Moisture curing conditions in order to initiate a cross-linking reaction to form a moisture-cured adhesive from the moisture-curable adhesive composition may correspond to a temperature of at least 100 °C to 200 °C (or 100, 105, 110, 115, 120, 125, 130, 135, 140, 145, 150, 155, 160, 165, 170, 175, 180, 185, 190, 195, or 200 to 200 °C or any number or range therein) and an absolute humidity of 30 % to 100 % (or 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, or 100%).

[0009] Processes of producing an article of manufacture are also described. A process can include forming a moisture-curable adhesive composition comprising 86 wt. % to 94 wt. % of a mixture corresponding to PART A of the composition. The mixture can include at least one or more silylated modified polymers, one or more tackifiers, and optionally a first set of additives. The moisture-curable adhesive composition further comprises 6 wt. % to 14 wt. % of a catalyst package corresponding to PART B of the composition, where the catalyst package includes at least a crosslinker and optionally a second set of additives. The process can include applying the moisture-curable adhesive composition to a surface of a substrate to form a coated substrate having a moisture-curable adhesive layer on the surface of the substrate. In some aspects, the process can include adding PART A with PART B to obtain a mixture and applying the mixture to the substrate. In another aspect, the process can include adding PART A to the substrate following by adding PART B to the substrate. The process can include subjecting the coated substrate to moisture curing conditions in order to initiate a cross-linking reaction within the moisture-curable adhesive layer to form an article of manufacture having a moisture- cured adhesive layer bonded to the surface of the substrate. Moisture can include water, water vapor, aqueous solutions, humid air (e.g., air having an absolute humidity of 30 % to 100% or preferably 40 % to 60 %, or more preferably 47 % to 53 %). Moisture curing conditions in order to initiate a cross-linking reaction to form a moisture-cured adhesive from the moisture- curable adhesive composition may correspond to a temperature of at least 100 °C to 200 °C (or 100, 105, 110, 115, 120, 125, 130, 135, 140, 145, 150, 155, 160, 165, 170, 175, 180, 185, 190,195, or 200 to 200 °C or any number or range therein) and an absolute humidity of 30 % to 100 % (or 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, or 100%).

[0010] Methods of using the moisture-curable adhesive compositions of the present invention are also described. In one aspect, a method can include using a moisture-curable adhesive composition according to the present invention to form a label (e.g., a durable label). In another aspect, a method can include using a moisture-cured adhesive formed from a moisture-curable adhesive composition according to the present invention in a label (e.g., a durable label). In yet another aspect, a method of labeling an article of manufacture can include applying the label to a surface of the article of manufacture. A label includes, but is not limited to, a carrier of information / data with an adhesive layer, which can be affixed to a product, a product packaging, or a component. Labels such as durable labels can be designed to resist harsh elements such as solvents, extreme temperatures, moisture, and / or other environments when such labels are in use. This resistance can help reduce or avoid degradation of any printed information (e.g., symbols, images, words, photos, etc.) present on the label. The adhesive used in the label can be designed to have adhesive properties to all types of materials (e.g., metals (e.g., steel, such as stainless steel, aluminum, etc.)), glass, plastics (e.g., thermoplastic / thermoset polymers, including but not limited to polypropylene (PP) polymers, polyethylene (PE) polymers such as high-density (HD) or low-density (LD) PE polymers, acrylonitrile butadiene styrene (ABS) polymers, polyethylene terephthalate (PET) polymers, nylon polymers, acrylic polymers, etc.), paper, etc. The adhesive can be applied to low surface energy or high surface energy materials.

[0011] In another aspect, there is disclosed a method of using a moisture-curable adhesive composition according to the present invention to form a tape. In another aspect, a method can include using a moisture-cured adhesive formed from a moisture-curable adhesive composition according to the present invention in a tape. In yet another aspect, a method of taping an article of manufacture can include applying the tape to a surface of the article of manufacture. The tape can help join two surfaces together, to enclose a container (e.g., a carboard box, envelope, or other enclosure), to affix one item to another, etc. The tape can include information (e.g., symbols, images, words, photos, etc.) or can be capable of receiving information (e.g., through printing or writing). The adhesive used in the tape can be designed to have adhesive properties to all types of materials (e.g., metals (e.g., steel, such as stainless steel, aluminum, etc.)), glass, plastics (e.g., thermoplastic / thermoset polymers, including but not limited to PP polymers, PE polymers such as HDPE or LDPE polymers, ABS polymers, PET polymers, nylon polymers,acrylic polymers, etc.), paper, etc. The adhesive can be applied to low surface energy or high surface energy materials.

[0012] Other embodiments of the invention are discussed throughout this application. Any embodiment discussed with respect to one aspect of the invention applies to other aspects of the invention as well and vice versa. Each embodiment described herein is understood to be embodiments of the invention that are applicable to other aspects of the invention. It is contemplated that any embodiment or aspect discussed herein can be combined with other embodiments or aspects discussed herein and / or implemented with respect to any method or composition of the invention, and vice versa. Furthermore, compositions of the invention can be used to achieve methods of the invention.

[0013] The following includes definitions of various terms and phrases used throughout this specification.

[0014] The term “absolute humidity” as used herein refers to a humidity level characterized by an atmosphere in which at least a particular percentage of the molecules are water molecules. As an illustrative, non-limiting example, an absolute humidity of 50 percent refers to a humidity level characterized by an atmosphere in which 50 percent of the molecules are water molecules.

[0015] The terms “about” or “approximately” are defined as being close to as understood by one of ordinary skill in the art. In one non-limiting embodiment, the terms are defined to be within 10%, preferably within 5%, more preferably within 1%, and most preferably within 0.5%.

[0016] The terms “wt.%”, “vol.%”, or “mol.%” refers to a weight percentage of a component, a volume percentage of a component, or molar percentage of a component, respectively, based on the total weight, the total volume of material, or total moles, which includes the component. In a non-limiting example, 10 grams of component in 100 grams of the material is 10 wt.% of component.

[0017] The terms “inhibiting” or “reducing” or “preventing” or “avoiding” or any variation of these terms, when used in the claims and / or the specification includes any measurable decrease or complete inhibition to achieve a desired result.

[0018] The term “effective,” as that term is used in the specification and / or claims, means adequate to accomplish a desired, expected, or intended result.

[0019] The use of the words “a” or “an” when used in conjunction with any of the terms “comprising,” “including,” “containing,” or “having” in the claims, or the specification, maymean “one,” but it is also consistent with the meaning of “one or more,” “at least one,” and “one or more than one.”

[0020] The words “comprising” (and any form of comprising, such as “comprise” and “comprises”), “having” (and any form of having, such as “have” and “has”), “including” (and any form of including, such as “includes” and “include”) or “containing” (and any form of containing, such as “contains” and “contain”) are inclusive or open-ended and do not exclude additional, unrecited elements or method steps.

[0021] The moisture-curable adhesive compositions of the present invention can “comprise,” “consist essentially of,” or “consist of’ particular ingredients, components, compositions, etc. disclosed throughout the specification. With respect to the transitional phrase “consisting essentially of,” in one non-limiting aspect, a basic and novel characteristic of the moisture-curable adhesive compositions of the present invention is that they can include particular preferred or particular ratios of: one or more hotmelt polymers (e.g., one or more silyl-modified polymers); a crosslinker; and a tackifier. These ratios can allow for specifically tailored moisture-curable adhesive compositions for particular end-use applications (e.g., creation of labels or tapes). The moisture-curable adhesive compositions, the moisture-cured adhesives, the articles of manufacture having a moisture-cured adhesive layer bonded to the surface of the substrate, and various processes of producing such materials of the present invention can provide various advantages when compared with other adhesive compositions that are not moisture-curable (e.g., acrylic adhesive compositions that are ultraviolet (UV) curable). Non-limiting examples of such advantages may include reduced energy consumption for curing, reduced costs (e.g., electricity costs, equipment costs, etc.), reduced carbon emissions associated with reduced electricity demand, or a combination thereof (among other possible advantages).

[0022] Other objects, features and advantages of the present invention will become apparent from the following figures, detailed description, and examples. It should be understood, however, that the figures, detailed description, and examples, while indicating specific embodiments of the invention, are given by way of illustration only and are not meant to be limiting. Additionally, it is contemplated that changes and modifications within the spirit and scope of the invention will become apparent to those skilled in the art from this detailed description. In further embodiments, features from specific embodiments may be combined with features from other embodiments. For example, features from one embodiment may be combined with features from any of the other embodiments. In further embodiments, additional features may be added to the specific embodiments described herein.BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Advantages of the present invention may become apparent to those skilled in the art with the benefit of the following detailed description and upon reference to the accompanying drawings.

[0024] FIG. 1 is a flow diagram depicting an example of a method of making a moisture- curable adhesive composition, according to some aspects of the present invention.

[0025] FIG. 2 is a diagram depicting an example of a process of subjecting the moisture- curable adhesive composition of FIG. 1 to moisture curing conditions in order to form a moisture-cured adhesive, according to some aspects of the present invention.

[0026] FIG. 3A shows data associated with various examples of articles of manufacture in which an example of a moisture-curable adhesive composition according to the present invention has been moisture cured to form a moisture-cured adhesive layer that is bonded to the surface of various substrates. V-344 represents a comparative example of a curable solvent- based pressure sensitive adhesive (PSA) composition.

[0027] FIG. 3B shows comparative data illustrating one example benefit of extended / improved production capacity associated with moisture-curable PSA compositions (that are not solvent-based) rather than solvent-based PSA compositions.

[0028] FIG.3C shows comparative data illustrating another example benefit of less energy consumption associated with moisture-curable PSA compositions (that are not solvent-based) rather than solvent-based PSA compositions.

[0029] FIG. 3D shows comparative data illustrating another example benefit of less carbon dioxide (CO2) emissions associated with moisture-curable PSA compositions (that are not solvent-based) rather than solvent-based PSA compositions.

[0030] FIG. 3E shows comparative data illustrating other example benefits of various cost reductions associated with moisture-curable PSA compositions (that are not solvent-based) rather than solvent-based PSA compositions.

[0031] FIG. 4 shows data associated with various examples of articles of manufacture in which an example of a moisture-curable adhesive composition according to the present invention has been moisture cured to form a moisture-cured adhesive layer that is bonded to the surface of various substrates.

[0032] FIG. 5 shows data associated with various examples of articles of manufacture in which an example of a moisture-curable adhesive composition according to the present invention has been moisture cured to form a moisture-cured adhesive layer that is bonded to the surface of various substrates.

[0033] FIG. 6 shows data associated with various examples of articles of manufacture in which an example of a moisture-curable adhesive composition according to the present invention has been moisture cured to form a moisture-cured adhesive layer that is bonded to the surface of various substrates.

[0034] While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings. The drawings may not be to scale.DETAILED DESCRIPTION OF THE INVENTION

[0035] A discovery has been made that provides a solution to at least one or more of the problems that may be associated with various adhesive compositions that are curable via means other than moisture curing (e.g., via UV curing). In one aspect, the solution can include the use of moisture-curable adhesive compositions that may be subjected to moisture curing conditions in order to initiate a cross-linking reaction to form a moisture-cured adhesive from the moisture-curable adhesive composition. In one aspect, the moisture-curable adhesive compositions can include a combination of multiple components, including at least: a first component corresponding to a hotmelt polymer (e.g., one or more “silyl-modified” or “silylated modified” polymers); a second component corresponding to a tackifier; a third component corresponding to a crosslinker; and (optionally) a fourth component corresponding to one or more sets of additives. It was discovered that the moisture curing conditions corresponded to a temperature of at least 100 °C (e.g., 100 °C to 200 °C, preferably 120 °C to 160 °C, or more preferably 130 °C to 150 °C, or even more preferably about 140 °C) and an absolute humidity that is 30 % to 100 % (or 40 % to 60 %, or 45 % to 55%, or about 47% to about 53 %). In one non-limiting example, it was discovered that the moisture-curable adhesive compositions can have improved characteristics when compared with adhesive compositions that are not moisture-curable, such as UV-curable acrylic adhesive compositions. In another non-limiting example, it was discovered that the moisture-curable adhesive compositions can have improved characteristics when compared with solvent-based pressure sensitive adhesive compositions.

[0036] It was also discovered that a first amount of energy input was associated with the moisture curing conditions, which was less than a second amount of energy input associated with either (1) UV curing conditions in order to form a UV-cured acrylic adhesive from a UV- curable acrylic adhesive composition, or (2) curing conditions in order to form a cured pressure sensitive adhesive composition from a solvent-based pressure sensitive adhesive composition. This discovery can be advantageous to the environment, for example, by providing an effective alternative to UV-cured and / or solvent-cured acrylic adhesives having relatively highelectricity costs associated with the curing operations required to form the cured acrylic adhesives from UV-curable or solvent-curable acrylic adhesive compositions. This discovery can be further advantageous to the environment, for example, as the energy input reduction associated with moisture curing may be associated with reduced carbon emissions. Specifically, the energy input reduction represents a difference between the amounts of energy input associated with the respective curing conditions, and the reduction in the amount of carbon emissions may correlate with this difference. It was also discovered that the use of specific ratios of the respective components of the moisture-curable adhesive compositions can provide the ability to specifically tailor the material properties of the moisture-curable adhesive compositions.

[0037] In one aspect of the present invention, the moisture-curable adhesive compositions can include various combinations of the three components specifically tailored for various end- use applications. It was discovered that specific component ratios identified for the moisture- curable adhesive compositions provide particular characteristic material properties that can be advantageous when the composition is to be utilized for a particular end-use application (e.g., for a label application, for a tape application, etc.). It was further discovered that the specific component ratios identified for the moisture-curable adhesive compositions in combination with specific adhesive thicknesses may provide particular characteristic material properties that can be advantageous when the moisture-cured composition is utilized for a particular end-use application (e.g., for an article of manufacture for a particular application, such as a label having a moisture-cured adhesive layer bonded to a surface of a substrate for a label application, a tape having a moisture-cured adhesive layer bonded to a surface of a substrate for a tape application, etc.).

[0038] These and other non-limiting aspects of the present invention are discussed in further detail in the following sections.A. Moisture-Curable Adhesive Compositions

[0039] The moisture-curable adhesive compositions of the present invention can include at least a first component corresponding to a hotmelt polymer, a second component corresponding to a tackifier, a third component corresponding to a cross-linker or a catalyst composition that includes a cross-linker, and optionally a fourth component corresponding to an additive or additive package. The moisture-curable adhesive compositions of the present invention can include at least two parts (referred to herein as “PART A” and PART B”). PART A and PART B can be combined together to create a moisture-curable adhesive composition. As explainedbelow, the first and second components can be included in PART A, and the third component can be included in PART B. The fourth component can be included in PART A or PART B or both PART A and PART B.

[0040] In some aspects, the moisture-curable adhesive composition may comprise 0.1 wt. % to 99.9 wt. % of the first component corresponding to the hotmelt polymer (or 0.1, 1, 2, 3, 4, 5, 6, 7, 8, 9, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 75, 76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, 95, 96, 97, 98, 99, or 99.9 to 99.9 wt. % or any number or range therein).

[0041] In some aspects, the moisture-curable adhesive composition may comprise 0.1 wt. % to 99.9 wt. % of the second component corresponding to the tackifier (or 0.1, 1, 2, 3, 4, 5, 6, 7, 8, 9, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 75, 76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, 95, 96, 97, 98, 99, or 99.9 to 99.9 wt. % or any number or range therein).

[0042] In some aspects, the moisture-curable adhesive composition may comprise 0.1 wt. % to 99.9 wt. % of the third component corresponding to the cross-linker (or 0.1, 1, 2, 3, 4, 5, 6, 7, 8, 9, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 75, 76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, 95, 96, 97, 98, 99, or 99.9 to 99.9 wt. % or any number or range therein).

[0043] In some aspects, the moisture-curable adhesive composition may comprise 0.001 wt. % to 99.999 wt. % of the (optional) fourth component corresponding to the set(s) of additives (or 0.001, 0.01, 0.1, 1, 2, 3, 4, 5, 6, 7, 8, 9, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21,22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46,47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71,72, 73, 74, 75, 76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, 95, 96,97, 98, 99, 99.9, 99.99, or 99.999 to 99.999 wt. % or any number or range therein).

[0044] FIG. 1 is a flow diagram 100 illustrating an example of a method of making a moisture-curable adhesive composition, according to some aspects of the present invention. Referring to FIG. 1, the method may include creating PART A, at 110. FIG. 1 illustrates thatcreating PART A may include forming a mixture that includes a first component (corresponding to one or more hotmelt polymers), a second component (corresponding to one or more tackifiers), and (optionally) a first set of additives, at 112. FIG. 1 further illustrates that creating PART A may include mixing the components in a mixing device at various ratios to provide specific adhesive properties for a particular industry or application, at 114. Referring to FIG. 1, the method may include creating PART B, at 120. FIG. 1 illustrates that creating PART B may include providing a catalyst package that includes a third component (corresponding to a crosslinker) and (optionally) a second set of additives, at 122. Referring to FIG. 1, the method may include forming a moisture-curable adhesive composition, at 130. FIG. 1 illustrates that forming the moisture-curable adhesive composition may include adding the catalyst package corresponding to PART B to the mixture corresponding to PART A (e.g., prior to subjecting the mixture to moisture curing conditions), at 132. In one aspect, the first set of additives and the second set of additives are the same additives. In another aspect, the first set of additive and the second set of additives are different additives.

[0045] Once PART A and PART B are combined to form the moisture-curable adhesive composition as previously described with respect to FIG. 1, the moisture-curable adhesive composition may be subjected to moisture curing conditions (e.g., temperature and humidity) in order to cure the composition and to form a moisture-cured adhesive.

[0046] Comparative data for PART A / PART B alternatives to V-344 (e.g., one example of a curable solvent-based PSA composition, available from FLEXcon); V-606 (e.g., another example of a curable solvent-based PSA composition, available from FLEXcon); and V-778 (e.g., another example of a curable solvent-based PSA composition, available from FLEXcon) is depicted below:

[0047] FIG. 2 is a diagram 200 illustrating a simplified example of a process of subjecting a moisture-curable adhesive composition (see e.g. FIG. 1) to moisture curing conditions in order to form a moisture-cured adhesive, according to some aspects of the present invention. The left side of FIG. 2 depicts various stages of the process, and the right side of FIG. 2 depicts a side view of a representative article corresponding to the particular stage of the process.

[0048] Referring to FIG. 2, the process includes providing a substrate, at 210. Referring to the right side of FIG. 2, an example of a substrate 212 having a characteristic thickness value 214 is also depicted for reference purposes. FIG. 2 also illustrates that the process includes applying a moisture-curable adhesive composition (see e.g. FIG. 1) to a surface of the substrate 212 to form a coated substrate having a moisture-curable adhesive layer on the surface of the substrate 212, at 220. Referring to the right side of FIG. 2, an example of an applied moisture- curable adhesive layer 222 having a characteristic thickness value 224 for an example of a coated substrate 226 is also depicted for reference purposes. FIG. 2 further illustrates that the process includes subjecting the coated substrate to moisture curing conditions in order to initiate a cross-linking reaction within the moisture-curable adhesive layer to form a moisture- cured adhesive layer, at 230. Referring to FIG. 2, at 231, the moisture curing conditions may correspond to a temperature of 100 °C to 200 °C (e.g., -140 °C, in some cases, as further described herein) and an absolute humidity of 30 % to 100 % (e.g., 50 % ± 2.5 %, in some cases, as further described herein). Referring to the right side of FIG. 2, an example of a moisture-cured adhesive layer 232 having a characteristic thickness value 234 is also depicted for reference purposes. FIG. 2 further illustrates that the result of subjecting the coated substrate 226 to the moisture curing conditions 231 is the formation of an article of manufacture (identified by reference character 236) having the moisture-cured adhesive layer 232 bonded to the surface of the substrate 212.

[0049] In some aspects, the simplified example of the curing process depicted in FIG. 2 can take place on a substrate during roll-2-roll manufacturing. Notably, such a process can be tuned to produce a desired product (e.g., a tape) such that the thickness (see e.g. the characteristic thickness values 224, 234 depicted on the right side of FIG. 2), overall cross- linking, and tackiness of the moisture-curable adhesive composition is designed for the desired product. If desired, the roll-2-roll manufacturing line can be switched to produce a different product (e.g., a label), and all of the components of the line can remain the same with the difference being the ratios used to produce PART A and PART B are modified or tuned to produce the different product (e.g., a label). This ease of switching the adhesive composition for a given end use product or application provides both cost and manufacturing efficienciesfor producing the end use products. In some aspects, referring to the example of FIG. 2, the article of manufacture 236 having the moisture-cured adhesive layer 232 bonded to the surface of the substrate 212 may be utilized in one or more of the following industries or applications: durable label; pharmaceutical; bonding and mounting; and health care industrial applications.1. Part A i. Part A.l (First Component)

[0050] In some aspects, the one or more silylated modified polymers may correspond to one or more monosilylated polymers, one or more polysilylated polymers, or a combination thereof. Illustrative, non-limiting examples of polysilylated and monosilylated polymers (including various combinations thereof) are described herein.

[0051] An example of a polysilylated polymer is a disilylated polymer with a number- average molecular weight of about 16,000 g / mol (or 20 kDa and a PI of approximately 1.6 if determined by GPC), comprising a main polyurethane chain and two hydrolysable propylene trimethoxysilane end groups, said silylated end groups being attached to the main polymer chain by a urethane function. Another example of a polysilylated polymer is a disilylated polymer with a number- average molecular weight of about 37,000 g / mol (or 38 kDa and a PI of approximately 1.9 if determined by GPC), comprising a main polyurethane chain and two hydrolysable propylene trimethoxysilane end groups, said silylated end groups being attached to the main polymer chain by a urethane function. Yet another example of a polysilylated polymer is a disilylated polymer having a number- average molar mass (Mn) of at least 20000 g / mol, comprising a polyether and / or polyurethane main chain and at least two hydrolysable silylated end groups, said silylated end groups being attached to the main chain of the polymer by a urethane or ether function (referred to as a connector group).

[0052] According to some aspects, a polysilylated polymer may correspond to GENIOSIL® STP-E 30 (available from Wacker), which is a disilylated polymer with a number- average molecular weight of about 18,500 g / mol (or 22 kDa and a PI of approximately 1.2 if determined by GPC), comprising a main polyurethane chain and two hydrolysable methylene trimethoxysilane end groups, said silylated end groups being attached to the main polymer chain by a urethane function

[0053] According to some aspects, a polysilylated polymer may correspond to GENIOSIL® STP-E 35 (available from Wacker), which is a disilylated polymer with a number- average molecular weight of about 18,600 g / mol (or 22 kDa and a PI of approximately 1.2 if determined by GPC), comprising a main polyurethane chain and two hydrolysablepropylene trimethoxysilane end groups, said silylated end groups being attached to the main polymer chain by a urethane function.

[0054] According to some aspects, a monosilylated polymer may correspond to GENIOSIL®XM20 (available from Wacker), which is a monosilylated polymer with an average molecular weight of about 6000 g / mol (or 8 kDa when determined by GPC), and a PI of approximately 1.1. It comprises a main chain of polyether and a hydrolysable methylene- methyldimethoxy silane end group, said silylated end group being attached to the main polymer chain by a urethane function.

[0055] According to some aspects, a monosilylated polymer may correspond to GENIOSIL®XM25 (available from Wacker), which is a monosilylated polymer with an average molecular weight of about 6000 g / mol (or 8 kDa when determined by GPC), and a PI of approximately 1.1. It comprises a main chain of polyether and a hydrolysable methylene- methyltrimethoxysilane end group, said silylated end group being attached to the main polymer chain by a urethane function. ii. Part A.2 (Second Component)

[0056] In some aspects, the tackifier may correspond to Sylvalite® RE 100 (available from Arizona Chemical) which is a rosin and pentaerythritol resin with an OHI of about 50 mg KOH / g, a number-average molecular mass of about 974 g / mol (e.g., a molecular weight Mn of around 1700 Da), and a softening point of 100° C.

[0057] In some aspects, the tackifier may correspond to DERTOPHENE® H150 (available from DRT) which is a terpene phenol resin, with an OHI of about 150 mg KOG / g, a number- average molecular mass of about 700 g / mol (e.g., a molecular weight Mn of around 630 Da) and a softening point of 120° C.

[0058] In some aspects, the tackifier may correspond to NORSOLENE® W85 (available from CRAY VALLEY) which is an alpha methyl styrene resin with an OHI of 0, a number- average molecular mass of about 600 g / mol, and a softening point of 85° C.

[0059] In some aspects, the tackifier may correspond to NORSOLENE® W 10 (available from CRAY VALLEY) which is an alpha methyl styrene resin with an OHI of 0, a number- average molecular mass of about 750 g / mol, and a softening point of 110° C.

[0060] In some aspects, the tackifier may correspond to PICCO® AR 100 (available from EASTMAN) which is a resin obtained by polymerisation of mixtures of aromatic hydrocarbons with mainly 9 carbon atoms and an OHI of 0, a number- average molecular mass of 550 g / mol, and a softening point of 100° C.

[0061] In some aspects, the tackifier may correspond to DERTOPHENE® 1510 (available from DRT) which has a molecular weight Mn of around 870 Da.

[0062] In some aspects, the tackifier may correspond to Sylvarez® TP240HME (available from Arizona Chemical). In some aspects, the tackifier may correspond to Sylvarez® TP95 (available from Arizona Chemical) having a molecular weight Mn of around 1200 Da.

[0063] In some aspects, the tackifier may correspond to NORSOLENE® W100 (available from CRAY VALLEY) having a molecular weight Mn of around 1200 Da. In some aspects, the tackifier may correspond to Sylvarez® 510 (available from Arizona Chemical) having a molecular weight Mn of around 1740 Da. iii. Mixture

[0064] In some aspects, “PART A” of the moisture-curable adhesive compositions of the present disclosure can include a mixture of at least: (A.l) one or more silylated modified polymers (also referred to herein as “hotmelt” polymers); and (A.2) one or more tackifiers. In some aspects, the mixture may optionally include a first set of additives. Examples of such mixtures are shown in Table 1.TABLE 12. Part B

[0065] In some aspects, crosslinking catalyst(s) that can be used in the composition according to the invention can be any catalyst known to the person skilled in the art for the condensation of silanol. Examples of such catalysts include organic derivatives of titanium such as titanium acetyl acetonate, of aluminum such as aluminum chelate, or amines such as 1,8-diazabicyclo [5.4.0] undec-7ene or DBU.

[0066] In some aspects, the crosslinker may correspond to TYZOR® AA75 (available from DuPont), which contains a titanium acetyl acetonate.

[0067] In some aspects, the crosslinker may correspond to TIB-KAT® 223 (available from King Industries).

[0068] In some aspects, the crosslinker may correspond to K-KAT® 5218 (available from King Industries), which contains an aluminum chelate.

[0069] In some aspects, “PART B” of the moisture-curable adhesive compositions of the present disclosure may comprise a catalyst package that can include at least a crosslinker and optionally a second set of additives. Examples of such catalyst packages are shown in Table 2.TABLE 23. Additives

[0070] The moisture-curable adhesive compositions of the present invention can include additional tackifiers, an additive or multiple additives, liquid resin(s) to change the glass transition temperature (Tg), etc. The moisture-curable adhesive compositions of the present invention can include an amount of additives, based on the total weight of the composition, of 0 and 1 wt. %, preferably 0.01 wt.% and less than 1 wt. % or between 0.5 wt. % and less than 1 wt. %, or 0 wt.%, 0.1 wt.%, 0.2 wt.%, 0.3 wt.%, 0.4 wt.%, 0.5 wt.%, 0.6 wt.%, 0.7 wt.%, 0.8 wt.%, 0.9 wt.%, or 1 wt.% or any range or value therebetween. The additives can be present in PART A and / or PART B of the moisture-curable adhesive compositions.

[0071] Non-limiting examples of additives include, but are not limited to, fillers, solvents, moisture absorbers, plasticizers, antioxidants, pigments, colorants, adhesion promoters, UV stabilizers, flame-retardant additives, rheological additives, waxes, or combinations thereof.

[0072] Non-limiting examples of fillers include organic fillers, inorganic fillers and mixtures thereof. As organic filler (s), one can use any (s) load (s) organic (s) and in particular polymeric (s) typically used (s) in the field of adhesives. For example, polyvinyl chloride (PVC), polyolefin (s), rubber, ethylene vinyl acetate (EVA), aramid fibers such as for example KEVLAR®, expandable or non-expandable thermoplastic polymer hollow microspheres (suchas, for example hollow microspheres made of vinylidene chloride / acrylonitrile), one or more thermoplastic polymer (s) chosen from those used in the preparation of HMPSA, such as ethylene vinyl acetate (EVA), or styrenic block copolymers (such as SIS, SBS, SIBS, SEBS, SEPS, and their derivatives grafted with for example maleic anhydride).

[0073] Non-limiting examples of solvents include hydrophilic solvents (e.g., water) or hydrophobic solvents (e.g., organic liquids such as dimethyl sulfoxide).

[0074] Non-limiting examples of moisture absorbers (or desiccant) include non-polymeric hydrolyzable alkoxysilane derivatives, with a molecular mass of less than 500 g / mol, preferably chosen from trimethoxy silane and triethoxy silane derivatives. Such an agent can typically extend the storage life of the composition during storage and transportation before it is used. Mention may be made, for example, of γ-methacryloxypropyltrimethoxysilane (for example available, under the trade name Silquest® A-174, from Momentive), methacryloxymethyltrimethoxysilane (for example available, under the name Geniosil® XL33, from Wacker), vinyltrimethoxysilane, isooctyltrimethoxysilane or phenyltrimethoxy silane .

[0075] Non-limiting examples of plasticizers include phthalates, benzoates, trimethylolpropane esters, trimethylolethane esters, trimethylolmethane esters, glycerol esters, pentaerythritol esters, naphthenic mineral oils, adipates, cyclohexyldicarboxylates, liquid paraffins, natural oils (optionally epoxidized), polypropylenes, polybutylenes, hydrogenated polyisoprenes, and mixtures thereof. Examples of the phthalates include diisononyl phthalate, diisobutyl phthalate, dioctyl phthalate, dicyclohexyl phthalate, diisooctyl phthalate, diisododecyl phthalate, dibenzyl phthalate or butylbenzyl phthalate. Examples of benzoates include neopentyl glycol dibenzoate (available, for example, under the name Uniplex® 512 from Lanxess), dipropylene glycol dibenzoate (available, for example, under the name Benzoflex® 9-88SG from Eastman), a mixture of diethylene glycol dibenzoate and of dipropylene glycol dibenzoate (available, for example, under the name K-Flex® 850 S from Kalama Chemical), or a mixture of diethylene glycol dibenzoate, dipropylene glycol dibenzoate and triethylene glycol dibenzoate (available, for example, under the name Benzoflex® 2088 from Eastman). Examples of pentaerythritol esters include pentaery thrityl tetravalerate (available, for example, under the name Pevalen™ from the company Perstorp). Examples of cyclohexanedicarboxylates include diisononyl 1,2-cyclohexanedicarboxylate (available, for example, under the name Hexamoll Dinch® from BASF).

[0076] Antioxidants can include compounds that may be introduced to protect the composition from degradation resulting from a reaction with oxygen which is liable to beformed by the action of heat or light. These compounds may include primary antioxidants which trap free radicals. The primary antioxidants may be used alone or in combination with other secondary antioxidants or UV stabilizers. Non-limiting examples of antioxidants include Irganox® 1010, Irganox® B561, Irganox® 245, Irganox® 1076 and Irgafos® 168 sold by BASF.

[0077] Non-limiting examples of pigments include organic or inorganic pigments (e.g., titanium dioxide), such as Kronos® 2059 sold by Kronos.

[0078] Non-limiting examples of rheological additives include thixotropic agents, PVC plastisols (corresponding to a suspension of PVC in a plasticizer miscible with PVC, obtained in situ by heating at temperatures ranging from 60 ° C to 80 ° C. These plastisols can be those described in particular in the book "Polyurethane Sealants", Robert M. Evans, ISBN 087762- 998-6), fumed silica, and / or urea derivatives resulting from the reaction of an aromatic diisocyanate monomer such as 4,4'-MDI with an aliphatic amine such as butylamine (the preparation of such urea derivatives is described in particular in application FR 1 591 172).

[0079] Non-limiting examples of micronized amide waxes include CRAYVALLAC ® SL, CRAYVALLAC ® SLX, CRAYVALLAC ® SLT marketed by ARKEMA.4. Moisture Curing Conditions

[0080] In another aspect, moisture curing conditions in order to initiate a cross-linking reaction to form a moisture-cured adhesive from the moisture-curable adhesive compositions of the present invention may correspond to a temperature of at least 100 °C and an absolute humidity of approximately 50 percent. In some aspects, the moisture curing conditions may correspond to a temperature of at least 100 °C to 200 °C (or 100, 105, 110, 115, 120, 125, 130, 135, 140, 145, 150, 155, 160, 165, 170, 175, 180, 185, 190, 195, or 200 to 200 °C or any number or range therein) and an absolute humidity of 30 % to 100 % (or 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, or 100%).

[0081] In some aspects, the moisture curing conditions for curing the moisture-curable adhesive compositions of the present invention may provide various advantages when compared to curing operations associated with other types of adhesive compositions that are not moisture-curable. In a non-limiting example, a minimum temperature of 100 °C to initiate a cross-linking reaction to form a moisture-cured adhesive from a moisture-curable adhesive composition of the present invention may be relatively low compared to a minimum temperature that is required to cure other types of adhesive compositions that are not moisture- curable.

[0082] As one non-limiting example, some adhesive coating solvent-based acrylic adhesives may require a curing temperature that is greater than the minimum temperature of 100 °C for moisture curing of the moisture-curable adhesive composition of the present invention. To illustrate, V-344, V-606, and V-778 (available from FLEXcon Company, Inc.) are each adhesive coating solvent-based acrylic adhesives that require a minimum temperature in excess of 100 °C for curing. As such, an amount of energy required to raise the temperature of the moisture-curable adhesive compositions of the present invention (e.g., from room temperature) to a minimum curing temperature of 100 °C may be relatively low compared to an amount of energy required to raise the temperature of other adhesive compositions that are not moisture-curable to a corresponding required minimum curing temperature.

[0083] In some aspects, the moisture-curability properties of the adhesive compositions of the present invention may provide various advantages when compared to other types of adhesive compositions that are not moisture-curable. Such advantages may include a reduction in energy consumption associated with curing the moisture-curable adhesive compositions to form moisture-cured adhesives, a reduction in costs associated with curing, a reduction in carbon emissions corresponding to reduced demand for electricity from carbon-emitting power sources, or a combination thereof (among other possible advantages). As one non-limiting example, UV-curable acrylic compositions require UV light (that may be provided via one or more electricity-consuming UV lamps) in order to initiate a cross-linking reaction to form a UV-cured acrylic adhesive. Such electricity-consuming UV lamps are not required for moisture curing of the moisture-curable adhesive compositions of the present invention. As such, the energy consumption associated the use of such electricity-consuming UV lamps for UV curing is eliminated. Further, the elimination of such UV lamps may result in reduced electricity costs and may result in other possible cost reductions (e.g., reduced equipment / operating costs, etc.). Still further, in cases where carbon-emitting power sources provide electricity for such UV lamps, the reduced demand for electricity associated with the elimination of such UV lamps may result in a corresponding reduction in carbon emissions. In the case of solvent-based curable pressure sensitive adhesive compositions, there may be a corresponding reduction of carbon dioxide emissions associated with burning solvent during curing operations.B. Methods of Making the Moisture-Curable Adhesive Compositions1. Forming a mixture of hotmelt polymer(s) and tackifier(s)

[0084] Prior to performing moisture curing operations, a mixture is formed that includes at least: one component corresponding to one or more hotmelt polymers (e.g., one or moresilylated modified polymers); and another component corresponding to one or more tackifiers. In some aspects, the mixture may optionally include a first set of additives. The components may be mixed in a suitable mixing device (e.g., using a Bostik® provided mixer just before the mixture enters a slot die coating head) at various ratios to dial-in specific adhesive properties for an industry or application. This mixture of components can create Part A (see e.g. FIG. 1, as previously discussed herein).

[0085] In some aspects, the one or more silylated modified polymers may correspond to at least 35 wt. % to 55 wt. % of the mixture of components corresponding to PART A of the composition (or 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, or 55 to 55 wt. % or any number or range therein).

[0086] In some aspects, the one or more tackifiers may correspond to at least 35 wt. % to 65 wt. % of the mixture of components corresponding to PART A of the composition (or 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, or 65 to 65 wt. % or any number or range therein).

[0087] In some aspects, the (optional) first set of additives may correspond to 0.1 wt. % to 2.0 wt. % of the mixture of components corresponding to PART A of the composition (or 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1.0, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, or 2.0 to 2.0 wt. % or any number or range therein).2. Adding catalyst package to the mixture to form a moisture-curable adhesive composition

[0088] Prior to subjecting the mixture of hotmelt polymer and tackifier to moisture curing conditions, a catalyst package is added to the mixture. The catalyst package may include at least a crosslinker and optionally a second set of additives. This catalyst package can create PART B. (see e.g. FIG. 1, as previously discussed herein).

[0089] In some aspects, the crosslinker may correspond to at least 98.0 wt. % to 99.9 wt. % of the catalyst package corresponding to PART B of the composition (or 0.1, 1, 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 99, or 99.9 to 99.9 wt. % or any number or range therein).

[0090] In some aspects, the (optional) second set of additives may correspond to 0.1 wt. % to 2.0 wt. % of the catalyst package corresponding to PART B of the composition (or 0, 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1.0, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, or 2.0 to 2.0 wt. % or any number or range therein).3. Applying the moisture-curable adhesive composition to a surface of a substrate

[0091] The moisture-curable adhesive composition can be applied to a surface of a substrate (and optional liner) to form a coated substrate having a moisture-curable adhesive layer on the surface of the substrate (see e.g. FIG. 2, as previously discussed herein). In one aspect, PART A and PART B are first combined together and then applied to a surface of a substrate prior to being subjected to moisture curing conditions. In another aspect, PART A is added to a surface of a substrate and then PART B is subsequently added to the surface of the substrate prior to being subjected to moisture curing conditions.C. Methods of Curing the Moisture- Curable Adhesive Compositions

[0092] The moisture-curable adhesive compositions can then be subjected to moisture curing conditions in order to initiate a cross-linking reaction to form a moisture-cured adhesive from the moisture-curable adhesive composition. For a substrate (and optional liner) having such a moisture-curable adhesive composition applied to a surface of the substrate / liner as a moisture-curable adhesive layer, such moisture curing conditions initiate a cross-linking reaction within the moisture-curable adhesive layer to form an article of manufacture having a moisture-cured adhesive layer bonded to the surface of the substrate (see e.g. FIG. 2, as previously discussed herein).D. Articles of Manufacture

[0093] The moisture-curable adhesive compositions and moisture-cured adhesive compositions, in aspects of the disclosure, have properties described above. Such compositions are appropriate for particular applications. Accordingly, the compositions of the present disclosure can be comprised in an article of manufacture and aspects of the disclosure also relate to articles including the moisture-cured adhesive compositions described herein. For example, such articles of manufacture may be utilized in one or more of the following industries or applications: durable label; pharmaceutical; bonding and mounting; and health care industrial applications.

[0094] The compositions as described herein can be adapted to be used in various label and / or tape applications. Furthermore, the compositions as described herein can be used to make various articles or components of the articles. In some aspects, the article can be a label and / or tape which may be utilized in one or more of the following industries or applications: durable label; pharmaceutical; bonding and mounting; and health care industrial applications.EXAMPLES

[0095] The present invention will be described in greater detail by way of specific examples. The following examples are offered for illustrative purposes only and are not intended to limit the invention in any manner. Those of skill in the art will readily recognize a variety of noncritical parameters which can be changed or modified to yield essentially the same results.

[0096] Table 3 shows different examples, specifying the components such as hotmelt polymer and tackifier of a mixture prior to the addition of a crosslinker.TABLE 3

[0097] Table 4 shows the different working examples, specifying the components such as the particular mixture of hotmelt polymer and tackifier (“PART A”), the particular catalyst package (“PART B”) used in the moisture-curable adhesive composition, and the particular ratio of PART A to PART B.TABLE 4

[0098] The substrate(s) used in the trials are shown in Table 5. The liner(s) used in the trials are shown in Table 6.TABLE 5TABLE 6

[0099] Table 7 shows the different working examples, specifying the components (such as hotmelt polymer, tackifier, and crosslinker package) of the moisture-curable adhesive composition and the substrate onto which the moisture-curable adhesive composition was applied to form a coated substrate having the moisture-curable adhesive layer on the surface of the substrate.TABLE 7

[0100] The moisture curing conditions used in the trials are shown in Table 8.TABLE 81. Example 1

[0101] In some specific aspects, the moisture-curable adhesive composition of the present invention can include: 94 wt. % of a mixture corresponding to PART A of the composition (HM2 / TK2); and 6 wt. % of a catalyst package (CP2) corresponding to PART B of the composition. This particular version of a moisture-curable adhesive composition according to the present invention was production coated using 50 micron polyester and 55 micron glassine liner. The targeted coating thickness was 22 microns, though 20 microns was the actualthickness across roughly 75 percent of the width of the web with the rest being closer to 30 microns.2. Example 2

[0102] In some specific aspects, the moisture-curable adhesive composition of the present invention can include: 94 wt. % of a mixture corresponding to PART A of the composition (HM2 / TK2); and 6 wt. % of a catalyst package (CP2) corresponding to PART B of the composition. This particular version of a moisture-curable adhesive composition according to the present invention was lab made using TRT. Transfer tape (HM2 / TK2) was supplied at 50GSM (40 Microns), and this was transfer coated onto corona-treated 50 micron clear polyester film and left to dwell for 72 hours before testing.3. Example 3

[0103] In some specific aspects, the moisture-curable adhesive composition of the present invention can include: 86.6 wt. % of a mixture corresponding to PART A of the composition (HM1 / TK1); and 13.4 wt. % of a catalyst package (CPI) corresponding to PART B of the composition. This particular version of a moisture-curable adhesive composition according to the present invention was lab made using TRT. Transfer tape (HM1 / TK1) was supplied at 50GSM (45 Microns), and this was transfer coated onto corona-treated 50 micron clear polyester film and left to dwell for 72 hours before testing.4. Example 4

[0104] In some specific aspects, the moisture-curable adhesive composition of the present invention can include: 86.6 wt. % of a mixture corresponding to PART A of the composition (HM1 / TK1); and 13.4 wt. % of a catalyst package (CPI) corresponding to PART B of the composition. This particular version of a moisture-curable adhesive composition according to the present invention was lab made using TRT. Transfer tape (HM1 / TK1) was supplied at 100GSM, and this was transfer coated onto corona-treated 50 micron clear polyester film and left to dwell for 72 hours before testing.E. Results

[0105] Subsequent testing of the constructions corresponding to each of the Examples 1-4 described above are depicted in the accompanying figures.

[0106] FIG. 3A shows data associated with various examples of articles of manufacture in which a moisture-cured adhesive layer (see Example 1, as previously described herein) is bonded to the surface of various substrates (identified as “Construction 1” in FIG. 3A). V-344(available from FEEXcon®) represents a comparative example of a curable solvent-based pressure sensitive adhesive (PSA) composition.

[0107] FIG. 3B shows comparative data illustrating one example benefit of extended / improved production capacity associated with moisture-curable PSA compositions (that are not solvent-based) rather than solvent-based PSA compositions.

[0108] FIG. 3C shows comparative data illustrating another example benefit of less energy consumption associated with moisture-curable PSA compositions (that are not solvent-based) rather than solvent-based PSA compositions.

[0109] FIG. 3D shows comparative data illustrating another example benefit of less carbon dioxide (CO2) emissions associated with moisture-curable PSA compositions (that are not solvent-based) rather than solvent-based PSA compositions.

[0110] FIG. 3E shows comparative data illustrating other example benefits include various cost reductions associated with moisture-curable PSA compositions (that are not solventbased) rather than solvent-based PSA compositions.

[0111] FIG. 4 shows data associated with various examples of articles of manufacture in which a moisture-cured adhesive layer (see Example 2, as previously described herein) is bonded to the surface of various substrates (identified as “Construction 2” in FIG. 4).

[0112] FIG. 5 shows data associated with various examples of articles of manufacture in which a moisture-cured adhesive layer (see Example 3, as previously described herein) is bonded to the surface of various substrates (identified as “Construction 3” in FIG. 5).

[0113] FIG. 6 shows data associated with various examples of articles of manufacture in which a moisture-cured adhesive layer (see Example 4, as previously described herein) is bonded to the surface of various substrates (identified as “Construction 4” in FIG. 6).

[0114] Although embodiments of the present application and their advantages have been described in detail, it should be understood that various changes, substitutions, and alterations can be made herein without departing from the spirit and scope of the embodiments as defined by the appended claims. Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification. As one of ordinary skill in the art will readily appreciate from the above disclosure, processes, machines, manufacture, compositions of matter, means, methods, or steps, presently existing or later to be developed that perform substantially the same function or achieve substantially the same result as thecorresponding embodiments described herein can be utilized. Accordingly, the appended claims are intended to include within their scope such processes, machines, manufacture, compositions of matter, means, methods, or steps.

Claims

CLAIMS1. A moisture-curable adhesive composition comprising:86 wt. % to 94 wt. % of a mixture corresponding to PART A of the composition, the mixture comprising at least: one or more silylated modified polymers; one or more tackifiers; and optionally a first set of additives; and6 wt. % to 14 wt. % of a catalyst package corresponding to PART B of the composition, wherein the catalyst package includes at least a crosslinker and optionally a second set of additives, wherein moisture curing conditions in order to initiate a cross-linking reaction to form a moisture-cured adhesive from the moisture-curable adhesive composition correspond to: a temperature of 100 °C to 200 °C; and an absolute humidity of 30 % to 100 %.

2. The moisture-curable adhesive composition of claim 1, wherein the one or more silylated modified polymers of PART A include at least a first hotmelt polymer, and wherein the moisture-curable adhesive composition comprises: at least 86 wt. % of the mixture corresponding to PART A; and at least 13 wt. % of the catalyst package corresponding to PART B.

3. The moisture-curable adhesive composition of claim 2, wherein the moisture-curable adhesive composition comprises:86.6 wt. % of the mixture corresponding to PART A; and13.4 wt. % of the catalyst package corresponding to PART B.

4. The moisture-curable adhesive composition of claim 1, wherein the one or more silylated modified polymers of PART A include at least a second hotmelt polymer, and wherein the moisture-curable adhesive composition comprises:89 wt. % to 94 wt. % of the mixture corresponding to PART A; and6 wt. % to 11 wt. % of the catalyst package corresponding to PART B.

5. The moisture-curable adhesive composition of claim 4, wherein the moisture-curable adhesive composition comprises:91.5 wt. % of the mixture corresponding to PART A; and8.5 wt. % of the catalyst package corresponding to PART B.

6. The moisture-curable adhesive composition of claim 4, wherein the moisture-curable adhesive composition comprises:89 wt. % of the mixture corresponding to PART A; and11 wt. % of the catalyst package corresponding to PART B.

7. The moisture-curable adhesive composition of claim 1, further comprising an additional package that includes one or more of: at least one additional tackifier; a third set of additives; a liquid resin to change a glass transition temperature (Tg) of the composition; or a combination thereof.

8. The moisture-curable adhesive composition of any of claims 1 to 7, wherein a first amount of energy input is associated with the moisture curing conditions in order to initiate the cross-linking reaction to form the moisture-cured adhesive from the moisture-curable adhesive composition, and wherein the first amount of energy input is less than a second amount of energy input associated with ultraviolet (UV) curing conditions in order to form a UV-cured acrylic adhesive from a UV-curable acrylic adhesive composition.

9. The moisture-curable adhesive composition of claim 8, wherein an energy input reduction representing a difference between the second amount of energy input and the first amount of energy input is associated with reduced carbon emissions, and wherein a carbon emissions reduction amount correlates with the difference between the second amount of energy input and the first amount of energy input.

10. A process of producing a moisture-cured adhesive, the process comprising: providing a mixture corresponding to PART A, the mixture comprising at least: one or more silylated modified polymers; one or more tackifiers; and optionally a first set of additives; adding a catalyst package corresponding to PART B to the mixture to form a moisture- curable adhesive composition, wherein the catalyst package includes at least a crosslinker and optionally a second set of additives; wherein 86 wt. % to 94 wt. % of the moisture-curable adhesive composition corresponds to PART A, and wherein 6 wt. % to 14 wt. % of the moisture- curable adhesive composition corresponds to PART B; and subjecting the moisture-curable adhesive composition to moisture curing conditions in order to initiate a cross-linking reaction to form a moisture-cured adhesive, the moisture curing conditions corresponding to: a temperature of 100 °C to 200 °C; and an absolute humidity of 30 % to 100 %.

11. The process of claim 10, wherein the catalyst package is added to the mixture prior to subjecting the mixture to the moisture curing conditions.

12. The process of claim 10, wherein the mixture corresponding to PART A is melted at a temperature of approximately 80 °C prior to adding the catalyst package corresponding to PART B to the mixture.

13. The process of claim 12, wherein the catalyst package corresponding to PART B is maintained at room temperature prior to addition to the mixture.

14. The process of claim 10, wherein the moisture curing conditions correspond to a temperature of approximately 140 °C, and wherein the absolute humidity is in a range of 47.5 percent to 52.5 percent.

15. A process of producing an article of manufacture, the process comprising: forming a moisture-curable adhesive composition comprising:86 wt. % to 94 wt. % of a mixture corresponding to PART A of the composition, the mixture comprising at least: one or more silylated modified polymers; one or more tackifiers; and optionally a first set of additives; and6 wt. % to 14 wt. % of a catalyst package corresponding to PART B of the composition, wherein the catalyst package includes at least a crosslinker and optionally a second set of additives; applying the moisture-curable adhesive composition to a surface of a substrate to form a coated substrate having a moisture-curable adhesive layer on the surface of the substrate; and subjecting the coated substrate to moisture curing conditions in order to initiate a cross- linking reaction within the moisture-curable adhesive layer to form an article of manufacture having a moisture-cured adhesive layer bonded to the surface of the substrate, the moisture curing conditions comprising: a temperature of 100 °C to 200 °C; and an absolute humidity of 30 % to 100 %.

16. The process of claim 15, wherein the moisture-cured adhesive layer has an adhesive thickness of 20 pm to 100 pm.

17. The process of claim 15, wherein: the one or more silylated modified polymers of PART A include at least a second hotmelt polymer, the moisture-curable adhesive composition comprising: 89 wt. % to 94 wt. % of the mixture corresponding to PART A; and6 wt. % to 11 wt. % of the catalyst package corresponding to PART B; and the moisture-cured adhesive layer has an adhesive thickness of 20 pm to 30 pm.

18. The process of claim 17, wherein the substrate includes a corona-treated clear polyester film, and wherein applying the moisture-curable adhesive composition includes transfer coating of a transfer tape of the second hotmelt polymer supplied at 50 GSM onto the clear polyester film.

19. The process of claim 15, wherein: the one or more silylated modified polymers of PART A include at least a first hotmelt polymer, the moisture-curable adhesive composition comprising: at least 86 wt. % of the mixture corresponding to PART A; and at least 13 wt. % of the catalyst package corresponding to PART B; and the moisture-cured adhesive layer has an adhesive thickness of 45 pm to 80 pm.

20. The process of claim 15, wherein the article of manufacture having the moisture-cured adhesive layer bonded to the surface of the substrate may be utilized in one or more of the following industries or applications: durable label; pharmaceutical; bonding and mounting; and health care industrial applications.

21. A method of using the moisture-curable adhesive composition of any of claims 1 to 9 to form a durable label.

22. A method of using a moisture-cured adhesive formed from the moisture-curable adhesive composition of any of claims 1 to 9 in a durable label.

23. A method of labeling an article of manufacture by applying a durable label to a surface of the article of manufacture, wherein a moisture-cured adhesive formed from the moisture-curable adhesive composition of any of claims 1 to 9 is used in the durable label.

24. A method of using the moisture-curable adhesive composition of any of claims 1 to 9 to form a tape.

25. A method of using a moisture-cured adhesive formed from the moisture-curable adhesive composition of any of claims 1 to 9 in a tape.

26. A method of taping an article of manufacture by applying a tape to a surface of the article of manufacture, wherein a moisture-cured adhesive formed from the moisture- curable adhesive composition of any of claims 1 to 9 is used in the tape.

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