Imaging device

Abstract

To provide an imaging device that has a vibration prevention function by using movement of an imaging unit and can efficiently cool the imaging element without increasing the size of the imaging device.SOLUTION: An imaging device 1 includes: an imaging element substrate 16 equipped with an imaging element; a vibration prevention mechanism using movement of the imaging element substrate 16; movable first ducts (10a, 10b) having an air flow passage; a fixed second duct 12 having an air flow passage, the second duct connecting to the first duct; a cooling fan 15 for circulating outside air in the first ducts (10a, 10b) and the second duct 12. The imaging element substrate 16 is held by the first ducts (10a, 10b).SELECTED DRAWING: Figure 9B

Description

Technical Field

[0001] The present invention relates to an imaging device capable of cooling an imaging element or the like.

Background Art

[0002] In recent years, imaging devices have been evolving towards higher image quality, such as higher resolution and higher frame rate of recorded images. Such imaging devices have a large signal processing load and power consumption. As a result, signal processing parts such as the imaging part and the data recording part generate significant heat. Since the performance of the electronic components built into the imaging device deteriorates under high temperatures, it has been necessary to provide a cooling structure inside the imaging device.

[0003] Conventional cooling structures transfer the heat generated by the heat-generating part to a high thermal conductivity member for heat dissipation. For example, regarding heat dissipation means for forced air cooling of the imaging part, imaging devices described in Patent Document 1 and Patent Document 2 have been proposed.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] The imaging device disclosed in Patent Document 1 cools the image sensor by forcibly cooling a heat dissipation component that is thermally coupled to the image sensor through an opening created by opening a part of the housing. However, since the area where the heat dissipation component thermally coupled to the image sensor is cooled is limited to the area near the opening created by opening a part of the housing, the heat dissipation capacity of the image sensor and other components was not sufficient. Furthermore, the imaging device disclosed in Patent Document 2 requires the attachment of a cooling device to the outside of the main body in order to forcibly cool the image sensor, which resulted in the imaging device becoming large. Moreover, although imaging devices equipped with a vibration damping function that prevents image blur by absorbing vibrations applied to the imaging device from the outside by moving the imaging unit within a predetermined range have recently been developed, the imaging unit could not be sufficiently cooled.

[0006] The object of the present invention is to provide an imaging device that has a vibration damping function due to the movement of the imaging unit (image sensor), and that can effectively cool the image sensor without increasing the size of the imaging device. [Means for solving the problem]

[0007] To achieve the above objective, the imaging apparatus of the present invention comprises an image sensor substrate on which an image sensor is mounted, a vibration isolation mechanism for the movement of the image sensor substrate, a movable first duct having an air passage, a fixed second duct having an air passage and connected to the first duct, and a cooling fan for circulating outside air between the first duct and the second duct, wherein the image sensor substrate is held in the first duct.

[0008] Furthermore, an imaging device according to another aspect of the present invention includes an image sensor substrate on which an image sensor is mounted, a vibration isolation mechanism for the movement of the image sensor substrate, a first duct having an air passage and fixedly positioned between the image sensor substrate and the mount, a second duct having an air passage and thermally connected to a control circuit board, a cooling fan connected to the second duct for releasing hot air from inside the device, and a third duct having an air passage and fixedly connected to an air intake. The device comprises a fourth duct having an air passage and connecting to the first duct and the third duct, wherein the third duct is located on the side of a shutter or ND unit, which is positioned between the image sensor substrate and the mount. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide an imaging device that has a vibration damping function due to the movement of the imaging unit, and that can effectively cool the image sensor without increasing the size of the imaging device. [Brief explanation of the drawing]

[0010] [Figure 1] This is a front perspective view of the imaging device 1. [Figure 2] This is a rear perspective view of the imaging device 1. [Figure 3] This is a rear perspective view showing the internal components of the imaging device 1. [Figure 4] This is a front perspective view showing the internal components of the imaging device 1. [Figure 5] This is a rear exploded perspective view showing the internal components of the imaging device 1. [Figure 6] This is a forward exploded perspective view showing the internal components of the imaging device 1. [Figure 7A] This is an explanatory diagram for attaching the image sensor substrate 16. [Figure 7B] This is an explanatory diagram for attaching the image sensor substrate 16. [Figure 8] This is a lower side view showing the heat dissipation structure of the imaging device 1, and is a cross-sectional view AA in Figure 8(a). [Figure 9A] This is a rear side view of the imaging device 1. [Figure 9B] Figure 9A is a cross-sectional view of BB. [Figure 9C] Figure 9A is a cross-sectional view of CC. [Figure 9D] Figure 9A is a cross-sectional view of CC. [Figure 10]Perspective view of the first duct 10, the second duct 12, and the third duct 13, right side view of FIG. 10(a), and front view of FIG. 10(a). [Figure 11] It is a cross-sectional view taken along the line M1-M1 in FIG. 10(b). [Figure 12] It is a cross-sectional view taken along the line M2-M2 in FIG. 10(c). [Figure 13] It is a diagram showing the connection of the thin-walled connecting member 2000. [Figure 14] It is a diagram showing the connection structure of the ducts by the bellows member. [Figure 15] It is a diagram showing another example of the connection structure of the ducts by the bellows member. [Figure 16] It is a view taken in the direction of the arrow OA in FIG. 15. [Figure 17] It is a cross-sectional view taken along the line OB-OB in FIG. 16. [Figure 18] It is a diagram showing the arrangement of the first duct 10 in the second embodiment. [Figure 19] It is a cross-sectional view taken along the line OC-OC in FIG. 18. [Figure 20] It is a cross-sectional view taken along the line OD-OD in FIG. 18. [Figure 21] It is a diagram showing the thermal connection structure between the first duct 10 and the imaging element 4001.<0000​​​​​​​​​​​​​​​​​​​​​ [Figure 29] This is an exploded perspective view showing the duct configuration of the fourth embodiment. [Figure 30] This is a front view of the imaging device 7000. [Figure 31] This is a K1-K1 cross-sectional view of the imaging device 7000. [Figure 32] This is a front view of the fifth duct, 7001. [Figure 33] This is a front view of the image sensor substrate 7005. [Figure 34] Figure 32 shows a cross-sectional view of the K2-K2 section. [Modes for carrying out the invention]

[0011] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, the configurations described in the following embodiments are merely illustrative, and the scope of the present invention is not limited to the configurations described in the embodiments. First, a first embodiment of the present invention will be described. In this specification, "duct" refers to a member having an air passage.

[0012] <First Embodiment> <Description of components of imaging device 1> First, the configuration of the imaging device 1 will be explained with reference to Figures 1 and 2. For the sake of simplicity in the following explanation, the XYZ coordinate system will be defined as follows: The "Z axis" is the optical axis direction of the imaging device 1, and the direction of the subject being photographed is defined as "positive". On a plane perpendicular to the Z axis, the width direction of the imaging device 1 is defined as the "X axis," and the right side from the subject towards the imaging device 1 is defined as "positive". The vertical direction of the imaging device 1 is defined as the "Y axis," and the direction toward the sky is defined as "positive".

[0013] Figures 1 and 2 are perspective views showing the general configuration of the imaging device 1. Figure 1 is a front perspective view of the imaging device 1, and Figure 2 is a rear perspective view of the imaging device 1. As shown in Figure 1, the imaging device 1 comprises an imaging device body 2 and a lens 3. The imaging device body 2 contains a main circuit board with a control unit and an image processing unit that control the entire imaging device 1. The imaging device body 2 also incorporates the main functions of an imaging device, such as an image sensor that converts light incident through the lens 3 into an electrical signal, a power supply unit, a recording unit for recording images, and various operation units. As shown in Figure 1, the lens 3 is mounted on the front side of the imaging device 1 (the side facing the subject (+Z direction)), and it is possible to change to various lenses depending on the shooting conditions.

[0014] Furthermore, as shown in Figure 1, a first exhaust port 4 is provided on the right side (+X direction) of the imaging device body 2 when viewed from the subject side, for expelling hot air (heated air) from inside the body to the outside using a forced air cooling mechanism with a cooling fan, which will be described later. Also, as shown in Figure 2, a first intake port 5 is provided on the bottom side (-Y direction) of the imaging device body 2 for drawing in cold outside air into the body using a forced air cooling mechanism with a cooling fan, which will be described later. Furthermore, a second intake port 6 is provided on the left side (-X direction) of the imaging device body 2 when viewed from the subject side, for drawing in cold outside air into the body using a forced air cooling mechanism with a cooling fan, which will also be described later.

[0015] <Outline of internal components of imaging device 1> Next, the internal components of the imaging device 1 will be outlined with reference to Figures 3, 4, 5, and 6. Figure 3 is a rear perspective view showing the internal components of the imaging device 1, and Figure 4 is a front perspective view showing the internal components of the imaging device 1. Figure 5 is a rear exploded perspective view showing the internal components of the imaging device 1, and Figure 6 is a front exploded perspective view showing the internal components of the imaging device 1.

[0016] As shown in Figures 3 to 6, the imaging device 1 includes an image sensor unit 7, an image sensor substrate 16 on which an image sensor is mounted, a vibration isolation unit 8, a vibration isolation unit retaining plate 9, and a first duct 10. The first duct 10 is composed of a first duct base 10a and a first duct retaining portion 10b. The imaging device 1 also includes a control circuit board 11, a second duct 12, a third duct 13, a fourth duct 14, and a cooling fan 15. In this embodiment, only components relevant to the present invention are described, and illustrations and descriptions of other components are omitted.

[0017] Figures 7A and 7B are explanatory diagrams for attaching the image sensor substrate 16. As shown in Figures 7A and 7B, the image sensor substrate 16 is attached to and held on the first duct base 10a. This creates a thermal connection between the image sensor substrate 16 and the first duct base 10a. Therefore, the heat dissipation structure described later enables effective heat dissipation from the image sensor substrate 16 to the first duct base 10a.

[0018] As shown in Figures 3, 4, 5, and 6, the image sensor unit 7, including the image sensor substrate 16 attached to the first duct base 10a, is held in place by the vibration isolation unit 8 and the vibration isolation unit retaining plate 9. The first duct retaining portion 10b ensures an air passage for heat dissipation in the heat dissipation structure described later. The control circuit board 11, which controls the various functions of the imaging device 1, is thermally connected to the second duct 12 by a heat conductive member (not shown). Furthermore, the third duct 13 is connected to the first air intake 5 shown in Figure 2, and the fourth duct 14 is connected to the second air intake 6 shown in Figure 2. The cooling fan 15 is a so-called centrifugal fan, configured to draw in air from the surface and discharge it in the centrifugal (side) direction.

[0019] Here, although the detailed airflow will be described later, the imaging device 1 is configured to take in air from the first intake port 5 and the second intake port 6 (see Figure 2, etc.) via a cooling fan 15 and exhaust it from the first exhaust port 4 to dissipate heat. Furthermore, although a detailed explanation of the vibration isolation mechanism for vibration isolation control of the image sensor will be omitted as it is publicly known, the image sensor unit 7 is configured to move within a predetermined range for vibration isolation. As a result, as mentioned above, the first duct 10 to which the image sensor substrate 16 is attached and held also moves within a predetermined range in conjunction with the image sensor unit 7. On the other hand, the second duct 12, the third duct 13, and the fourth duct 14 are fixed in place as they are not related to vibration isolation.

[0020] <Explanation of the heat dissipation structure of imaging device 1> The heat dissipation structure of the imaging device 1 will be described with reference to Figures 8(a), 8(b), 9A, 9B, 9C, and 9D. Figure 8(a) is a lower side view showing the heat dissipation structure of the imaging device 1, and Figure 8(b) is a cross-sectional view of AA in Figure 8(a). Figure 9A is a rear side view of the imaging device 1, Figure 9B is a cross-sectional view of BB in Figure 9A, and Figures 9C and 9D are cross-sectional views of CC in Figure 9A.

[0021] As mentioned above, the heat generated by the image sensor substrate 16 is transferred via thermal connection to the first duct 10, which is made of a metal such as aluminum with high thermal conductivity. The cooled outside air taken in by the cooling fan 15 enters the inside of the imaging device 1 through the first air intake 5, as shown in Figure 8(b), and passes through the third duct 13. Then, as shown in Figure 9B, it flows into the first duct 10, which has a closed space formed by the first duct base 10a and the first duct retaining part 10b. This allows for heat exchange between the cooled outside air and the air inside the first duct 10, which has become hot due to the heat generated by the image sensor substrate 16. After that, the hot air passes through the second duct 12 and is taken in by the cooling fan 15.

[0022] As shown in Figure 9C, the air taken in by the cooling fan 15 is discharged to the outside through the first exhaust port 4 via the fourth duct 14. Also, as shown in Figure 9D, the heat generated by the control circuit board 11 is transferred to the second duct 12, which is made of a metal such as aluminum with high thermal conductivity, through thermal connection by a heat conductive member (not shown). The cooled outside air taken in by the cooling fan 15 enters the inside of the imaging device 1 through the second intake port 6 (see Figure 2, etc.) and flows into the second duct 12. As a result, the incoming cold air exchanges heat with the hot air in the second duct 12. The hot air is then taken in by the cooling fan 15 and discharged to the outside through the first exhaust port 4 (see Figure 2, etc.) via the fourth duct 14.

[0023] With the configuration described above, it is possible to provide an imaging device 1 that has a vibration damping function due to the movement of the imaging unit (image sensor) and can effectively cool the image sensor without increasing the size of the imaging device 1.

[0024] <Explanation of how to connect the first duct 10 (movable), the second duct 12 (fixed), and the third duct 13 (fixed)> Next, the method of connecting the first duct 10 (movable) with the second duct 12 (fixed) and the third duct 13 (fixed) will be described. Figure 10(a) is a perspective view of the first duct 10, the second duct 12, and the third duct 13. Figure 10(b) is a right side view of Figure 10(a) (viewed in the +X direction), and Figure 10(c) is a front view of Figure 10(a) (viewed in the +Z direction). Figure 11 is a cross-sectional view of M1-M1 in Figure 10(b), and Figure 12 is a cross-sectional view of M2-M2 in Figure 10(c). In Figure 10(a), the first duct 10 is provided with a protrusion 1021 to prevent foreign matter that has entered the duct from flowing out through the joint between the ducts. Here, foreign matter refers to liquids such as rain, dust, gravel, etc.

[0025] In Figure 11, the first duct 10 is installed in the third duct 13 with an overlap length ΔYB greater than the maximum movable distance (maximum length) of the first duct 10 by the vibration isolation unit 8 (see Figure 5, etc.). Here, "overlap length" refers to the length of the overlap between the two ducts. As a result, even if the first duct 10 moves due to the vibration isolation unit 8, no gap is created between the first duct 10 and the third duct 13 in the XZ plane. Therefore, even if foreign matter enters the duct, it is less likely to flow out of the duct. Furthermore, the first duct 10, which is on the upper side in the direction of gravity, is installed inside the third duct 13, which is on the lower side in the direction of gravity. As a result, even if foreign matter enters the first duct 10, the foreign matter will fall into the third duct 13, thus making it less likely to flow out of the duct from the joint between the first duct 10 and the third duct 13.

[0026] Furthermore, in Figures 11 and 12, a gap "ΔXR, ΔXL, ΔYT" larger than the maximum movable distance (maximum length) of the first duct 10 by the vibration isolation unit 8 is provided between the first duct 10 and the third duct 13. In addition, even in the direction in which the first duct 10 is not movable, a predetermined gap ΔF, ΔRE is provided between the first duct 10 and the third duct 13. Therefore, a decrease in vibration isolation performance due to contact between the first duct 10 and the third duct 13 can be prevented. The method of connecting the first duct 10 and the second duct 12 is the same as the method of connecting the first duct 10 and the third duct 13. The explanation of that is omitted.

[0027] In other words, when connecting the first duct 10 and the second duct 12, the outside of the first duct 10 (one duct) is positioned inside the second duct 12 (the other duct) with a predetermined gap length and a predetermined overlap length. This predetermined gap length and predetermined overlap length can be set to be longer than the maximum movable length of the first duct 10.

[0028] Furthermore, as shown in Figure 13, in the region where the first duct 10 and the third duct 13 overlap, the inside of the third duct 13 and the outside of the first duct 10 may be connected without gaps by a thin-walled connecting member 2000 in a direction perpendicular to the airflow path. The thin-walled connecting member 2000 is made of a thin, flexible material such as vinyl. The thin-walled connecting member 2000 is connected with a sufficiently long excess length compared to ΔXR, ΔXL, and ΔYB. Therefore, even if the first duct 10 moves to its end, the thin-walled connecting member 2000 is always connected to both with an excess length. As a result, the thin-walled connecting member 2000 does not hinder the movement of the first duct 10 and the image sensor unit 7. Furthermore, the thin-walled connecting member 2000 itself will not tear due to being pulled by movement.

[0029] In other words, the first duct 10 and the second duct 12 are connected by a flexible thin-walled connecting member, and the thin-walled connecting member can be configured to extend longer than the maximum movable length of the first duct 10.

[0030] As explained above, by using the thin-walled connecting member 2000 to connect the first duct 10 and the third duct 13, it is possible to improve airtightness. Therefore, it is possible to improve the heat dissipation effect of the exhaust air passage from the first intake port 5 and the second intake port 6 to the first exhaust port 4. In particular, the heat dissipation effect is high because the image sensor substrate 16 is in contact with the first duct 10. Note that the method of connecting the first duct 10 and the second duct 12 is the same as the method of connecting the first duct 10 and the third duct 13, so the explanation is omitted here.

[0031] <Connection using expandable bellows-type member> Next, with reference to Figures 14, 15, 16, and 17, the connection of the first duct 10 (movable), the second duct 12 (fixed), and the third duct 13 (fixed) by the expandable bellows member will be explained. For the purpose of explanation, in Figures 14 and 15, the control circuit board 11 and the cooling fan 15 are shown with dotted lines. The cooling fan 15 draws in air from the first air intake 5 (see Figure 2, etc.), which flows into the third duct 13, the first duct 10, and the second duct 12 in that order, and then passes through the cooling fan 15. Since the air drawn in from the outside contains dust, if the dust gets mixed inside the imaging device body 2 and adheres to electronic components or electronic circuit boards, malfunctions may occur. Therefore, it is desirable that the air passage formed by connecting the first duct 10, the second duct 12, and the third duct 13 be configured so that air taken in from the outside does not enter the inside of the imaging device body 2.

[0032] Furthermore, since the first duct 10 moves together with the image sensor unit 7 which moves due to the vibration isolation mechanism, the connection points between the first duct 10, the second duct 12, and the third duct 13 need to be shaped to deform in accordance with the movement of the first duct 10. Figure 14 shows an example of a duct connection configuration using bellows members. In the configuration example shown in Figure 14, the first duct 10 and the second duct 12 are connected by a bellows member 3000, and the first duct 10 and the third duct 13 are connected by a bellows member 3001. The bellows members 3000 and 3001 have one or more mountain folds or valley folds and are expandable and contractible in a direction perpendicular to the optical axis direction (Z axis direction).

[0033] The bellows members 3000 and 3001 expand and contract in accordance with the movement of the first duct 10, which moves together with the image sensor unit 7, thereby ensuring airtightness of the air passage at the connection point. The expansion and contraction of the bellows members is not only uniform throughout, but also allows for deformation in which parts expand and parts contract. Therefore, even when the image sensor unit 7 moves in rotation along the optical axis (Z axis), the bellows members 3000 and 3001 can deform in accordance with it. Furthermore, by using a material with high thermal conductivity for the bellows members 3000 and 3001, the heat generated by the image sensor unit 7 can be diffused from the first duct 10 to the second duct 12 and the third duct 13 by thermal conduction.

[0034] Figure 15 also shows another embodiment in which the position of the connection between the first duct 10 (movable), the second duct 12 (fixed), and the third duct 13 (fixed) is changed. Figure 16 is a "view along the OA arrow" in Figure 15, and Figure 17 is an "OB-OB cross-sectional view" in Figure 16. The bellows shape can be deformed to follow the multi-directional movement of the first duct 10. Therefore, as shown in Figure 17, the connection direction between the first duct 10 and the second duct 12 does not have to be the same as the connection direction between the first duct 10 and the third duct 13 (fixed). The position and direction of the connection can be arbitrarily selected to match the layout of the device.

[0035] In other words, the first duct 10 and the second duct 12 are connected by a bellows member 3000 (expandable member). The bellows member 3000 (expandable member) expands and contracts in a direction perpendicular to the optical axis in accordance with the movement of the first duct 10. Furthermore, the bellows member 3000 (expandable member) is made of a material with high thermal conductivity.

[0036] <Second Embodiment> <Placement of the first duct 10 (movable)> Next, with reference to Figures 18, 19, 20, and 21, the arrangement of the first duct 10 (movable) in the second embodiment will be described. As an example of a method for driving the movable part to realize the vibration isolation mechanism, there is an embodiment in which a voice coil motor is used as the drive unit (drive source). In this embodiment, the drive unit 4003 (4003a, 4003b, 4003c) is equipped with a coil 4004 (4004b, 4004c) as a movable part and a magnet 4005 (4005b, 4005c) as a fixed part. The Lorentz force generated by energizing the coil 4004 in the magnetic circuit formed by the magnet 4005 is used as the driving force to move the movable part (coil 4004). In addition, since there are multiple directions of movement of the movable part by the vibration isolation mechanism (translational movement in the X-axis and Y-axis directions and rotational movement around the Z-axis), multiple drive units 4003 are also provided.

[0037] Figure 18 is a schematic diagram illustrating the arrangement of the first duct 10 as viewed from the optical axis direction (Z axis direction). When viewed from the optical axis direction (Z axis direction), the first duct 10 is positioned to overlap with the image sensor 4001. Multiple drive units (drive units 4003a, 4003b, and 4003c) are arranged so that the movable parts can move in multiple directions (translational movement in the X and Y axes and rotational movement around the Z axis) through control. In this case, they are often arranged along the outline of the image sensor 4001. Note that the reference numeral "4008 (4008a, 4008b)" in Figure 18 indicates the connection between the first duct 10 and the second duct 12 (or third duct 13).

[0038] Figure 19 is an OC-OC cross-sectional view in Figure 18, and Figure 20 is an OD-OD cross-sectional view in Figure 18. Both figures show the arrangement of the first duct 10 when viewed from a direction perpendicular to the optical axis. As can be seen by referring to both figures, when viewed from a direction perpendicular to the optical axis, the first duct 10 and the magnet 4005 of the drive unit 4003 are positioned to overlap in that direction. In other words, the first duct 10 overlaps with the image sensor 4001 when viewed from the direction of the optical axis, and is positioned to overlap with the drive unit of the movable (vibration-damping mechanism) of the first duct 10 when viewed from the direction perpendicular to the optical axis.

[0039] This allows the first duct 10 to be positioned near the image sensor 4001, and enables the heat generated by the image sensor 4001 to be transferred to the first duct 10 via a simple path. For example, the image sensor substrate 4002 on which the image sensor 4001 is mounted and the first duct 10 can be connected via a highly thermally conductive material such as heat dissipation rubber 4006. Alternatively, as shown in Figure 21, the first duct 10 can be connected to an opening 4007 provided in the image sensor substrate 4002 on which the image sensor 4001 is mounted, by providing a highly thermally conductive material such as heat dissipation rubber 4006. In this way, the first duct 10 is connected to the back surface of the image sensor 4001 via a highly thermally conductive material at an opening 4007 provided in the image sensor substrate 4002 on which the image sensor 4001 is mounted.

[0040] Furthermore, it is desirable that the connection points between the first duct 10 (movable), the second duct 12 (fixed), and the third duct 13 (fixed) be positioned so as not to overlap with the image sensor 4001 when viewed from the optical axis direction (Z axis direction). On the back side of the image sensor 4001 in the optical axis direction (Z axis direction), many components such as the control circuit board 11 and the cooling fan 15 are arranged in overlapping positions. Therefore, by avoiding a position where the connection point 4008 overlaps with the image sensor 4001, it is possible to suppress an increase in the size of the imaging device body 2 in the "-Z direction". In other words, the first duct 10 is positioned so as to overlap with the image sensor 4001 when viewed from the optical axis direction, and so as to overlap with the drive unit of the vibration isolation mechanism in a direction perpendicular to the optical axis. The airflow paths of the first duct 10 and the second duct 12 are positioned so as not to overlap with the image sensor 4001 when viewed from the optical axis direction.

[0041] <Third Embodiment> Figures 22 to 28 are configuration diagrams of the third embodiment. Figure 22 is a perspective view showing the coupling state from the image sensor to the cooling fan in the third embodiment, and Figure 23 is an unfolded perspective view of Figure 22. Figure 24 is a perspective view showing the coupling state from the image sensor to the first duct, Figure 25 is a perspective view showing the state with the first duct cover removed from Figure 24, and Figure 26 is a front view showing the state with the first duct cover removed from Figure 24. Figures 27(a) and 27(b) are perspective views showing the form of the flexible wiring material and heat dissipation sheet. Figure 27(a) is a perspective view seen from the first duct side, Figure 27(b) is a perspective view seen from the image sensor substrate side, and Figure 27(c) is a perspective view showing the flexible wiring material and heat dissipation sheet unfolded on the first duct side. Figure 28(b) is a cross-sectional view of the coupling state of Figure 22 in the vertical direction of XX in Figure 28(a).

[0042] In Figure 28(b), the reference numeral "5000" indicates an image sensor substrate, on which an image sensor 5001 is mounted. Similar to the first embodiment, the image sensor substrate 5000 and the image sensor 5001 are vibration-damped during imaging by the vibration damping mechanism 5002. As shown in Figure 28(b), a first duct body 5003 and a first duct cover 5004 that closes it are coupled to the side of the image sensor substrate 5000 opposite to the image sensor 5001. This forms a first duct 5005 with an internal space. This first duct 5005, along with the image sensor substrate 5000 and the image sensor 5001, is vibration-damped by the vibration damping mechanism 5002.

[0043] On the first duct cover 5004 side of the first duct 5005, a control circuit board 5006, fixed to a main body fixing part (not shown), is positioned and electrically connected to the image sensor board 5000 using flexible wiring material 5007. On the opposite side of the control circuit board 5006 from the first duct 5005 side, a second duct 5008, a control circuit board 5006 connected by a connection part (not shown), and a cooling fan 5009 are positioned and fixed. Furthermore, a third duct 5010 (see Figures 22, 23, etc.) that draws in air as indicated by the arrow in Figure 24, and a fourth duct 5011 (see Figures 22, 23, etc.) that exhausts air, are fixed to a main body fixing part (not shown) and connected to the first air intake port 5 of the imaging device body 2 shown in the first embodiment.

[0044] Furthermore, the second duct 5008 has a second duct first exhaust port 5013 formed therein, which draws in air from the second duct first intake port 5012 connected to the second intake port 6 of the imaging device body 2 (see Figure 2, etc.) as shown by the arrow in Figure 23, and exhausts air into the cooling fan 5009 as shown by the arrow in the figure. With this configuration, the cooling fan 5009 rotates under the control of the control circuit board 5006. As a result, outside air is drawn in from the second duct first intake port 5012 of the second duct 5008, and the internal heat is discharged to the outside of the imaging device from the fourth duct 5011 via the second duct first exhaust port 5013 and the cooling fan 5009, forming a forced cooling channel.

[0045] Furthermore, as shown in Figure 23, the second duct 5008 is provided with a second intake port 5014, which is connected to the first exhaust port 5015 of the first duct cover 5004. Also, the first intake port 5016 of the first duct 5005 (see Figure 28, etc.) is connected to the third duct 5010. The second intake port 5014 and the first exhaust port 5015, and the first intake port 5016 and the third duct 5010, are connected by the vibration-damping drive of the first duct 5005. During this movement, gaps are left between them to prevent interference and collision. When the cooling fan 5009 is driven to rotate, it draws in outside air from the third duct 5010 and flows into the first duct 5005 (see Figure 28, etc.) from the first duct intake port 5016. The incoming outside air is then discharged from the first duct exhaust port 5015 to the second duct second intake port 5014, and exhausted from the second duct first exhaust port 5013 to the fourth duct 5011, forming a forced cooling flow path.

[0046] The first duct 5005 is provided with a slit insertion opening 5017 (insertion opening) on ​​the first duct body 5003 side and a slit removal opening 5018 (removal opening: see Figure 24, etc.) on the first duct cover 5004 side. The flexible wiring material 5007 is configured to be inserted into the first duct 5005 through the slit insertion opening 5017 provided in the first duct 5005. Furthermore, a through-hole 5021 is provided on the side of the control circuit board 5006 located inside the imaging device (within the device) for removing the flexible wiring material 5007 through the slit removal opening 5018. The flexible wiring material 5007 is then removed from the slit removal opening 5018 and connected to the control circuit board 5006 using a control board connection part 5022 (circuit connection part). Thus, the image sensor 5001 and the control circuit board 5006 are connected by the flexible wiring material 5007.

[0047] The connecting section (continuing section) 5024 (see Figure 24, etc.) extends from the through section 5021 through the flexible wiring material 5007 to below the control circuit board 5006, and then makes an upward U-turn at the lower end of the control circuit board 5006. The control board connection section 5022 is then connected to the control circuit board 5006. As a result, even if the image sensor 5001, image sensor board 5000, and first duct 5005 are driven and moved together by the vibration isolation mechanism 5002, vertical movement is absorbed by the displacement of the U-turn section of the connecting section 5024. Horizontal movement is absorbed by the torsional displacement at the U-turn section from the through section 5021. The extended length of the connecting section 5024 also contributes to reducing the load on the U-turn section.

[0048] In this way, the load on the flexible wiring material 5007 is reduced by the connecting portion 5024 and does not adversely affect the vibration isolation mechanism. As shown in Figure 28(b), after assembling the flexible wiring material 5007, the slit insertion opening 5017 and the slit removal opening 5018 are sealed with the filler 5040 to reduce airflow loss.

[0049] As described above, the flexible wiring material 5007 is inserted into the first duct 5005 through a slit insertion opening 5017 provided in the duct. A through-hole 5021 is provided for removing the flexible wiring material 5007 from a slit removal opening 5018 located on the side of the control circuit board 5006 located inside the imaging device body (within the device). After removing the flexible wiring material 5007 from the slit removal opening 5018, it is connected to the control circuit board 5006 using a control board connection part 5022. A connecting part 5024 (continuous part) is provided that extends from the through-hole 5021 to the control board connection part 5022. The connecting part 5024 absorbs the movement of the image sensor board. The flexible wiring material 5007 is also forcibly air-cooled by a cooling fan 5009 in the first duct 5005.

[0050] The flexible wiring material 5007 has signal lines and GND wired with copper patterns, and the heat generated when the image sensor 5001 is operating is transmitted from the image sensor substrate 5000 to the copper patterns of the flexible wiring material 5007, causing the flexible wiring material 5007 itself to heat up. Air drawn in from the outside air flows from the first duct intake port 5016 of the first duct 5005 (see Figure 28, etc.) to the first duct exhaust port 5015 (see Figure 24, etc.) and passes between the guide ribs 5019 of the first duct body 5003. As a result, air flows as shown by the dashed arrows in Figure 26. Then, the flexible wiring material 5007 dissipates heat into the air as it comes into contact with the surface of the penetration portion 5021.

[0051] Furthermore, the airflow at this time flows approximately parallel to the sheet surface of the penetration portion 5021 of the flexible wiring material 5007, due to the guide rib 5019 (see Figure 23, etc.), so the airflow is not obstructed by the penetration portion 5021. In this way, the heat transferred from the flexible wiring material 5007 to the control circuit board 5006 can be reduced, and the temperature rise of the control circuit board 5006 can be suppressed. Also, as shown in Figure 27, the flexible wiring material 5007 is constructed with a heat dissipation sheet 5030 superimposed at the image sensor board connection portion 5020, so that the heat generated by the flexible wiring material 5007 is transferred to the heat dissipation sheet 5030 side.

[0052] After the flexible wiring material 5007 and the heat dissipation sheet 5030 are inserted into the first duct 5005 through the slit insertion opening 5017 of the first duct body 5003, the bifurcated tip portion 5031 of the heat dissipation sheet (see Figure 27(c)) is folded. As a result, it moves away from overlapping with the flexible wiring material 5007, and the airflow path between the guide ribs 5019 inside the first duct 5005 (see Figure 28, etc.) is formed as follows. That is, as shown in Figure 27(a), a heat dissipation sheet air contact portion 5032 ("air contact portion" is the part that comes into contact with air) with the sheet surface being approximately parallel, and a heat dissipation sheet fixing portion 5033 that contacts and is fixed to the inner wall of the first duct 5005 (see Figure 28) are formed. In this state, heat is dissipated from the surface of the heat dissipation sheet air contact portion 5032 of the heat dissipation sheet 5030 to the air flowing in the first duct 5005, and heat is also dissipated from the heat dissipation sheet fixing portion 5033 through contact with the first duct 5005. This also suppresses the temperature rise of the flexible wiring material 5007.

[0053] As described above, the flexible wiring material 5007 is in sheet form, and its sheet surface is arranged substantially parallel to the direction of airflow within the first duct. Furthermore, a heat dissipation sheet 5030 with high thermal conductivity can be inserted together with the flexible wiring material 5007 through the slit insertion opening 5017. The heat dissipation sheet air contact portion 5032, where the sheet surface of the heat dissipation sheet 5030 is arranged substantially parallel to the direction of airflow within the first duct, is cooled by a cooling fan. Additionally, the slit insertion opening 5017 into which the flexible wiring material is inserted and the slit removal opening 5018 from which it is removed can be sealed.

[0054] <Fourth Embodiment> Figure 29 is an exploded perspective view showing the duct configuration in the fourth embodiment. The first exhaust duct and the second exhaust duct in Figure 29 correspond to the first duct 10 and the second duct 12 described above, respectively. In the fourth embodiment, the flow path is formed by sealing the intake duct 6010, the cooling fan 15, the first exhaust duct 6020, the flexible member 6030, and the second exhaust duct 6040. The intake duct 6010 is connected to the first intake port 5 (see Figure 2, etc.), which is not shown in Figure 29, and takes in outside air into the imaging device body 2. The intake duct 6010 is also positioned close to the control circuit board 11, and can cool the control circuit board 11. The cooling fan 15 can generate airflow in the flow path by rotating.

[0055] The first exhaust duct 6020, the flexible member 6030, and the second exhaust duct 6040 together constitute an exhaust duct. More specifically, a flow path is formed by connecting and sealing openings 6021 and 6031, and by connecting and sealing openings 6033 and 6041. The flexible member 6030 is a flexible material such as vinyl with low elasticity. The flexible member 6030 is provided with an image sensor side opening 6032, which is connected to the side of the image sensor unit 7 opposite to the light-receiving surface.

[0056] The second exhaust duct 6040 is connected to the first exhaust port 4 (see Figure 1, etc.) by an adhesive member (not shown). The adhesive member (member having adhesive properties) is preferably an adhesive with high thermal conductivity or double-sided tape. Alternatively, the outer circumferential surface of the flexible member 6030 may be connected to the image sensor unit 7 without providing the image sensor side opening 6032. Furthermore, when the image sensor unit 7 moves for vibration isolation, the flexibility of the flexible member 6030 allows the image sensor side opening 6032 to move together with the image sensor unit 7.

[0057] Furthermore, because the elastic force of the flexible member 6030 is small, less current is required to the circuit that drives the image sensor unit 7, which allows for miniaturization and weight reduction of the circuit and surrounding components that drive the image sensor unit 7. In addition, the flexible member 6030 has sufficient flexibility between the opening 6031, the image sensor side opening 6032, and the opening 6033. As a result, all parts move flexibly when the image sensor unit 7 moves, increasing the degree of freedom of the movable range of the image sensor unit 7.

[0058] Focusing on the components that constitute the flow path as described above, the flexible member 6030 is positioned on the exhaust side of the cooling fan 15. As a result, the space inside the flexible member 6030 is under positive pressure, making it possible to form a flow path without the flexible member 6030 deforming. Note that the shape of the flexible member 6030 is not limited to the example shown in Figure 29, and any shape is acceptable as long as it is possible to connect the opening 6031, the image sensor side opening 6032, and the opening 6033 with sufficient flexibility.

[0059] Based on the above, at least a portion of the first exhaust duct 6020 can be formed from the flexible member 6030, and at least a portion of the image sensor substrate can be thermally connected to the flexible member 6030. Alternatively, a cooling fan may be connected to the second exhaust duct 6040, and the flexible member 6030 may be connected to the exhaust side of the cooling fan. Furthermore, the flexible member 6030 has an image sensor side opening (opening) 6032 of a predetermined size, and it is preferable that this image sensor side opening (opening) 6032 is connected so as to cover the surface of the image sensor opposite to the light-receiving surface.

[0060] Furthermore, the flexible member 6030 deforms in accordance with the movement of the image sensor substrate within the movable range of the image sensor substrate. In addition, a heat dissipation fin can be arranged inside the flexible member 6030 on the side of the image sensor substrate opposite to the light-receiving surface. The flexible member 6030 is made of vinyl or the like.

[0061] <Fifth Embodiment> Next, a fifth embodiment will be described with reference to Figures 30 and 31. The imaging device 1 of the fifth embodiment differs from the first embodiment in that the duct and air intake connected to the imaging unit (image sensor) for thermal purposes are different. On the other hand, the cooling of the control circuit board and the imaging vibration isolation mechanism are the same as in the first embodiment, so the explanation of the same parts will be omitted.

[0062] <Description of the duct arrangement in the fifth embodiment> The internal components of the imaging device 7000 will be described in general terms with reference to Figures 30 and 31. Figure 30 is a front view of the imaging device 7000, and Figure 31 is a cross-sectional view taken along the line K1-K1 shown in Figure 30. As shown in Figure 30, an air intake port 7002 is provided for drawing in outside air into the fifth duct 7001, which will be described later.

[0063] As shown in Figure 31, the imaging device 7000 is connected to the air intake 7002, and a seventh duct 7003 fixed inside the imaging device 7000 is located thereon. The image sensor board 7005 on which the image sensor 7004 is mounted has an anti-vibration mechanism for image stabilization and is movable relative to the imaging device 7000. The anti-vibration mechanism is well known and will not be explained further. The image sensor board 7005 is fixed to the imaging device 7000 and moves together with the image sensor board 7005. A fifth duct 7001 is also located thereon, which operates together with the image sensor board 7005. The fifth duct 7001 is located between the mount 7006 and the image sensor board 7005 and is fixed to the image sensor board 7005.

[0064] Furthermore, an eighth duct 7007 is provided, connecting the fifth duct 7001 and the seventh duct 7003. The eighth duct 7007 is an elastic member. This reduces mechanical stress between the seventh duct 7003, which is fixed to the imaging device 7000, and the fifth duct 7001, which is fixed to the image sensor substrate 7005 and movable relative to the imaging device 7000. The seventh duct is also located on the side of a shutter or ND unit positioned between the image sensor substrate 7005 and the mount 7006. The sixth duct 7008 is thermally connected to a control circuit board (not shown). The control circuit board has components such as a CPU, memory, and other electronic components mounted on it. Alternatively, one end of the fifth duct 7001 may be connected to the eighth duct 7007, which is an elastic member, and the other end may also be connected to a duct (not shown) which is also an elastic member. In other words, the fifth duct may be configured so that both ends are ducts made of elastic material.

[0065] The arrows in Figure 31 indicate the airflow. Outside air is drawn in through the intake port 7002, passes through the seventh duct 7003 and the eighth duct 7007, and flows into the fifth duct 7001. The air is heated by the heat from sensors, etc., and the structure is designed to release the hot air to the outside by the rotational drive of the cooling fan 7009 connected to the sixth duct 7008.

[0066] As explained above, a seventh duct 7003, an eighth duct 7007, and a fifth duct 7001 are placed between the mount 7006 and the image sensor 7004, and forced air cooling is performed by the rotational drive of the cooling fan 7009. This creates a structure that can effectively cool the image sensor 7004, and enables miniaturization of the product.

[0067] <Explanation of the placement of the fifth duct> Next, the structure of the fifth duct 7001 and the image sensor substrate 7005 will be described with reference to Figures 32, 33, and 34. Figure 32 is a front view of the image sensor 7004, the fifth duct 7001, and the image sensor substrate 7005, while Figure 33 is a view of Figure 32 with the fifth duct 7001 hidden. As shown in Figure 32, the fifth duct 7001 surrounds the image sensor 7004. The space between the fifth duct 7001 and the image sensor substrate 7005 is also sealed in the thickness direction of the image sensor. The space between the fifth duct 7001 and the shutter or ND unit, etc., and the space between the image sensor 7004 and the mount 7006 are also sealed. Therefore, the structure prevents dust and other debris from entering the image sensor 7004 from inside the imaging device 7000.

[0068] As shown in Figure 33, the image sensor 7004 is mounted on the image sensor substrate 7005, and exposed copper foil portions 7010 are placed on the surface of the image sensor substrate 7005 around the image sensor 7004. The heat generated by the image sensor 7004 is transferred to the image sensor substrate 7005. Therefore, by applying cool air to the exposed copper foil portions 7010 placed on the surface of the image sensor substrate 7005, the image sensor substrate 7005 can be cooled, and the image sensor 7004 can be effectively cooled.

[0069] Thus, the heat dissipation section can be positioned on the mount 7006 side of the image sensor substrate 7005, with at least a portion of the heat dissipation section connected to the fifth duct 7001, and this heat dissipation section can be positioned on the outer periphery of the image sensor 7004. In other words, the heat dissipation section can be positioned on the mount 7006 side of the image sensor substrate 7005, with at least a portion of the heat dissipation section connected to the fifth duct (first duct), and this heat dissipation section can be positioned on the outer periphery of the image sensor 7004.

[0070] Figure 34 shows a cross-sectional view of the K2-K2 section of Figure 32. As shown in Figure 34, the contact surface of the fifth duct 7001 with the image sensor substrate 7005 is open, allowing air to be directly directed onto the image sensor substrate 7005. As explained above, the fifth duct 7001 prevents dust and other debris from entering the image sensor 7004 and opens the surface of the fifth duct 7001 on the side facing the image sensor substrate 7005. This allows air to be directly directed onto the exposed copper foil portion 7010, enabling effective cooling of the image sensor 7004. Furthermore, this makes it possible to miniaturize the product.

[0071] In the fifth embodiment, the fifth duct 7001, the sixth duct 7008, the seventh duct 7003, and the eighth duct 7007 may be referred to as the "first duct" through the "fourth duct" in the claims. However, these are different from the "first duct" through the "fourth duct" in the first through fourth embodiments.

[0072] As described above, the configuration of the imaging device 1 in the embodiment of the present invention is as follows. Specifically, it comprises an image sensor substrate 16 on which an image sensor is mounted, a vibration isolation mechanism that allows the image sensor substrate 16 to move, a movable first duct 10 having an air passage, and a fixed second duct 12 having an air passage and connected to the first duct. Furthermore, it comprises a cooling fan 15 for circulating outside air through the first duct 10 and the second duct 12. The image sensor substrate 16 is held in the first duct.

[0073] Another aspect of the present invention has the following configuration: It comprises an image sensor substrate 7005 on which an image sensor is mounted, a vibration isolation mechanism that allows the image sensor substrate 7005 to move, and a fifth duct 7001 (first duct) having an air passage and fixedly positioned between the image sensor substrate 7005 and the mount 7006. It also comprises a sixth duct 7008 (second duct) having an air passage and thermally connected to a control circuit board, and a cooling fan 7009 having an air passage and connected to the sixth duct 7008 (second duct) for releasing hot air from inside the device.

[0074] Furthermore, it includes a seventh duct 7003 (third duct) having an air passage and connected to and fixed to the air intake port 7002. It also includes an eighth duct 7007 (fourth duct) having an air passage and connected to the fifth duct 7001 (first duct) and the seventh duct 7003 (third duct). The seventh duct 7003 (third duct) is configured to be located on the side of the shutter or ND unit positioned between the image sensor substrate and the mount.

[0075] Although preferred embodiments of the present invention have been described above, the present invention is not limited to these specific embodiments, and various modifications and changes are possible without departing from the spirit of the invention. [Explanation of Symbols]

[0076] 1. Imaging device 2. Imaging device main unit 3 lenses 4. First exhaust port 5. First air intake 6. Second air intake 7 Image sensor unit 8 Vibration isolation unit 9. Vibration isolation unit retaining plate 10. First duct 10a First duct base 10b First duct retaining section 11 Control circuit board 12. Second duct 13. Third duct 14. Fourth duct 15 Cooling fan 16 Image sensor substrate 1021 Convex part 1022 Convex part 2000 Thin-walled connecting member 3000 bellows member 3001 Bellows member 4001 Image sensor 4002 Image sensor substrate 4006 Heat dissipation rubber 4007 Aperture 4008 Connection part 4008a Connection 4008b Connection 5000 Image sensor substrate 5001 Image sensor 5002 Vibration Isolation Mechanism 5003 First duct body 5005 First duct 5006 Control circuit board 5007 Flexible Wiring 5009 Cooling Fan 5010 Third duct 5011 Fourth duct 5008 Second duct 5017 Slit insertion opening 5018 Slit removal opening 5020 Image sensor substrate connection section 5021 Penetration section 5024 Connection part 5022 Control board connection section 5030 Heat Dissipation Sheet 5032 Heat dissipation sheet air contact area 5040 Filler 6010 Intake duct 6020 First exhaust duct 6030 Flexible member 6040 Second exhaust duct 7000 Imaging device 7001 Fifth duct 7002 Air intake 7003 Duct No. 7 7004 Image sensor 7005 Image sensor substrate 7007 Duct No. 8 7008 Duct No. 6 7009 Cooling Fan

Claims

1. 1. An imaging device, comprising: an imaging element substrate on which an imaging element is mounted; a vibration isolation mechanism using the movement of the imaging element substrate; a movable first duct having an air passage; a second duct having an air passage and fixed to the first duct; a cooling fan for circulating outside air through the first duct and the second duct, An imaging device, characterized in that the imaging element substrate is held in the first duct.

2. When connecting the first duct and the second duct, an outer side of one duct is disposed inside the other duct with a predetermined gap length and a predetermined overlap length; 2. The imaging device according to claim 1, wherein the predetermined gap length and the predetermined overlap length are longer than a maximum movable length of the first duct.

3. 3. The imaging device according to claim 1, wherein the first duct and the second duct are connected by a flexible thin-walled connecting member, and the thin-walled connecting member extends longer than a maximum movable length of the first duct.

4. 3. The imaging device according to claim 1, wherein the first duct and the second duct are connected by an expandable member.

5. 5. The imaging device according to claim 4, wherein the expandable member expands and contracts in a direction perpendicular to the optical axis direction in accordance with movement of the first duct.

6. The imaging device according to claim 5 , wherein the expandable member is made of a material having high thermal conductivity.

7. 7. The imaging device according to claim 6, wherein the expandable member is a bellows member.

8. the first duct is disposed at a position overlapping the imaging element when viewed from an optical axis direction and overlapping a movable drive unit of the first duct in a direction perpendicular to the optical axis, 3. The imaging device according to claim 1, wherein air flow paths of the first duct and the second duct are disposed at positions not overlapping with the imaging element when viewed from the optical axis direction.

9. The first duct comprises:

3. The imaging device according to claim 1, wherein the imaging element substrate has an opening on which the imaging element is mounted, and the imaging element substrate is connected to a rear surface of the imaging element via a member having high thermal conductivity.

10. The first duct comprises: an insertion opening through which a flexible wiring material can be inserted into the first duct; a removal opening through which the flexible wiring material can be removed from the first duct, The flexible wiring material is a penetration portion penetrating the first duct from the insertion opening to the removal opening; 3. The imaging device according to claim 1, further comprising a circuit connection portion for connecting the flexible wiring material taken out from the outlet opening to a control circuit board.

11. The flexible wiring material is a connecting portion that is continuous from the through portion to the circuit connection portion and absorbs movement of the imaging element substrate, 11. The imaging device according to claim 10, wherein the flexible wiring material connected to the circuit connection portion is cooled by the cooling fan within the first duct.

12. The flexible wiring material is in a sheet form, The imaging device according to claim 10 , wherein the sheet-like surface is disposed substantially parallel to a direction of air flow within the first duct.

13. The imaging device is configured so that a heat dissipation sheet having high thermal conductivity can be inserted together with the flexible wiring material through the insertion opening, The imaging device according to claim 10, characterized in that the heat dissipation sheet is arranged in the first duct with a sheet surface of the heat dissipation sheet approximately parallel to the air flow direction, comes into contact with the air flowing in the first duct, and has an air contact portion that is cooled by the cooling fan.

14. 11. The imaging device according to claim 10, wherein the insertion opening and the removal opening are sealed.

15. 2. The imaging device according to claim 1, wherein at least a portion of the first duct is formed of a flexible member, and at least a portion of the imaging element substrate is thermally connected to the flexible member.

16. 16. The imaging apparatus according to claim 15, wherein the cooling fan is connected to the second duct, and the flexible member is connected to an exhaust side of the cooling fan.

17. The flexible member has an opening of a predetermined size, 16. The imaging device according to claim 15, wherein the opening is provided so as to cover a surface of the imaging element opposite to a light receiving surface.

18. 16. The imaging device according to claim 15, wherein the flexible member is deformed in accordance with the movement of the imaging element substrate within a movable range of the imaging element substrate.

19. 19. The imaging device according to claim 15, wherein a heat dissipation fin is disposed inside the flexible member on a surface opposite to a light receiving surface of the imaging element substrate.

20. 19. The imaging device according to claim 15, wherein the flexible member is made of a vinyl material.

21. 19. The imaging device according to claim 15, wherein the flexible member is connected to the imaging element substrate by an adhesive member.

22. 1. An imaging device, comprising: an imaging element substrate on which an imaging element is mounted; a vibration isolation mechanism using the movement of the imaging element substrate; a first duct having an air flow path and fixedly disposed between the image pickup element substrate and the mount; a second duct having an air flow path and thermally connected to a control circuit substrate; a cooling fan connected to the second duct for discharging hot air from within the device; a third duct having an air flow passage and connected to the air intake port; a fourth duct having an air flow path and connected to the first duct and the third duct; The third duct is An imaging device, characterized in that the shutter is disposed between the imaging element substrate and the mount, or on a side of the ND unit.

23. 23. The imaging device according to claim 22, wherein the fourth duct is made of an elastic member.

24. the first duct is connected at both ends to the duct of the elastic member; 23. The imaging device according to claim 22, wherein the third duct has an end opposite to the fourth duct, the end being provided with the intake port.

25. a heat dissipation unit is disposed on a mount side of the imaging element substrate, and at least a portion of the heat dissipation unit is connected to the first duct; 25. The imaging device according to claim 22, wherein the heat dissipation portion is disposed on an outer periphery of the imaging element.

Images