Method for manufacturing substrate with cured film, substrate with cured film, photosensitive resin composition, cured film formed by curing photosensitive resin composition, and display device having cured film or substrate with cured film

JP2024174046A5Pending Publication Date: 2026-06-12NIPPON STEEL CHEM & MATERIAL CO LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
NIPPON STEEL CHEM & MATERIAL CO LTD
Filing Date
2024-09-25
Publication Date
2026-06-12

AI Technical Summary

⚠Technical Problem

Existing photosensitive resin compositions for forming patterns on plastic substrates and organic devices suffer from insufficient film strength, solvent resistance, and adhesion issues, particularly when used at both high and low temperatures, leading to film thinning, surface roughness, and pattern peeling.

⚗Method used

A photosensitive resin composition containing alkali-soluble resins with unsaturated groups, photopolymerizable monomers, and metal oxide fine particles is applied, exposed, and developed to form a cured film pattern, which is then cured at temperatures up to 150°C, ensuring excellent adhesion, solvent resistance, and light scattering properties.

🎯Benefits of technology

The composition achieves a cured film with improved adhesion, solvent resistance, and light scattering properties, suitable for both high and low-temperature applications, enhancing the performance of display devices.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide a method for manufacturing a substrate with a cured film.SOLUTION: The method for manufacturing a substrate with a cured film of the present invention is a method for manufacturing a substrate with a cured film by forming a cured film pattern having a light-scattering property on a substrate. In the method, a photosensitive resin composition containing inorganic particles having an average particle diameter of 100 to 700 nm is applied on a substrate, exposed through a photomask, developed to remove an unexposed portion, and heated to form a predetermined cured film pattern.SELECTED DRAWING: None
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