Radiation image-capturing device, and radiation image-capturing device manufacturing method

Abstract

To provide a radiation image-capturing device that can perform alignment of a connector easily and highly accurately.SOLUTION: A radiation image-capturing device 1 comprises: a sensor panel 31; a control unit 50; and a housing 10 that accommodates the sensor panel 31 and the control unit 50. The control unit 50 has: a control substrate 55 that controls reading signals from the sensor panel 31; a mount member 59 in which the control substrate 55 is built; a side plate 60 that has a side wall part 61 being fixed to the mount member 59, and having an opening part 61b provided; and a connector 57 that is provided in the control substrate 55 for connecting the control substrate 55 and the outside, and passes through the opening part 61b of the side wall part 61. In the housing 10, an opening part 13a is provided that is for inserting the control unit into the housing 10 along an X axis direction.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present disclosure relates to a radiation imaging device and a method for manufacturing a radiation imaging device. [Background technology]

[0002] There is known a radiation imaging device (X-ray image capturing device) that includes a sensor panel (X-ray detection sensor) and a housing that houses the sensor panel and the like (see, for example, Patent Document 1). The radiation imaging device disclosed in Patent Document 1 is provided with a cover that is configured to be openable and closable in order to house components such as the sensor panel in the housing. In the radiation imaging device as described above, a control board for reading out signals from the sensor panel may be housed in the housing together with the sensor panel. Also, a connector for transmitting and receiving signals to and from the outside may be provided on the control board. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2002-311527 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the above-described configuration of the radiation imaging device, when it is necessary to arrange the portion including the connector insertion port so as to be exposed to the outside of a side portion (e.g., a lid portion) of the housing, it is necessary to position the connector with respect to the side portion after the control board is housed in the housing. In this case, it may be difficult to position the connector easily and accurately.

[0005] An object of the present disclosure is to provide a radiation imaging device and a method for manufacturing a radiation imaging device that enable easy and accurate positioning of a connector. [Means for solving the problem]

[0006] The present disclosure includes the following radiation imaging apparatuses [1] to

[16] and methods for manufacturing the radiation imaging apparatuses

[17] to

[20] .

[0007] [1] A sensor panel for detecting radiation; A control unit; a housing that houses the sensor panel and the control unit; The control unit a control board having a main surface facing the sensor panel along a first direction perpendicular to the sensor panel and a back surface opposite to the main surface, the control board controlling reading of signals from the sensor panel; a mounting member on which the control board is mounted; a side plate fixed to the mounting member and having a side wall portion with a first opening; at least one connector provided on the control board for connecting the control board to an external device and passing through the first opening of the side wall portion; the housing has a second opening for inserting the control unit into the housing along a second direction perpendicular to the first direction; the side wall portion is disposed at a position corresponding to the second opening portion when the sensor panel and the control unit are housed in the housing.

[0008] The radiation imaging device of [1] above includes a control unit. In this control unit, a control board and a side plate are mounted (fixed) on a mounting member. That is, the control board and the side plate are positioned relative to each other via the mounting member. As a result, the connector provided on the control board is positioned reliably and accurately with respect to the side plate (side wall portion). Furthermore, in the radiation imaging device of [1] above, after assembling the control unit outside the housing, the control unit can be housed in the housing by inserting the control unit into the housing through the second opening of the housing. As a result, the connector can be positioned with respect to the side plate (side wall portion) before housing the control unit in the housing. As described above, according to the radiation imaging device of [1] above, the connector provided on the control board can be positioned easily and accurately.

[0009] [2] The radiation imaging device of [1], wherein when the sensor panel and the control unit are housed in the housing, the side wall portion is positioned at a position corresponding to the second opening.

[0010] According to the configuration [2] above, the accuracy of the positioning of the connector (e.g., the length by which the connector protrudes from the side wall portion) performed before the control unit was housed in the housing can be easily maintained even when the sensor panel and the control unit are housed in the housing.

[0011] [3] The radiation imaging device of [1] or [2], wherein the sensor panel is fixed to the control unit.

[0012] According to the above configuration [3], the sensor panel and the control unit can be inserted into the housing as a unit, so that the sensor panel and the control unit can be easily accommodated in the housing.

[0013] [4] The radiation imaging device according to any one of [1] to [3], wherein the at least one connector is attached to the side wall portion.

[0014] According to the above configuration [4], the position of the connector positioned relative to the side plate (side wall portion) can be easily maintained.

[0015] [5] The at least one connector is provided on at least one of the main surface and the back surface of the control board, the mounting member has an opposing wall portion that faces one of the main surface and the back surface of the control board on which the at least one connector is provided, The radiation imaging device according to [4], wherein the opposing wall portion has at least one notch provided at a position overlapping with at least a portion of the at least one connector in the first direction.

[0016] According to the configuration [5] above, the connector can be easily accessed through the notch provided in the opposing wall portion of the mounting member, thereby facilitating the installation work of the connector to the side wall portion.

[0017] [6] The at least one connector has a plurality of connectors, the at least one notch comprises a plurality of notches; The opposing wall portion is located between two adjacent connectors when viewed from the first direction, separating the two adjacent cutouts from each other, and has a protrusion portion that contacts the side wall portion. [5] A radiation imaging device according to claim 1.

[0018] According to the configuration of [6] above, even if multiple connectors are provided on the control board, each connector can be easily attached to the side wall portion through each notch. Furthermore, since the side wall portion is supported by the protrusion portion that contacts the side wall portion, bending of the side wall portion toward the control board can be suppressed.

[0019] [7] Further comprising a pair of nuts arranged on either side of the side wall portion, the at least one connector has a shaft portion passing through the first opening and threadedly engaged with each of the pair of nuts, The radiation imaging device according to any one of [4] to [6], wherein the at least one connector is attached to the side wall portion by screwing the pair of nuts to the shaft portion from both sides of the side wall portion.

[0020] According to the configuration [7] above, the connector can be firmly attached to the side wall by screwing a pair of nuts onto the shaft of the connector from both sides of the side wall. Furthermore, since the connector is positioned relative to the side plate (side wall), the accuracy of the connector positioning (e.g., the length by which the connector protrudes from the side wall) can be ensured when screwing the nuts onto the shaft of the connector.

[0021] [8] Further comprising a pair of nuts arranged on either side of the side wall portion, the at least one connector has a shaft portion passing through the first opening and threadedly engaged with each of the pair of nuts, the at least one connector is attached to the side wall portion by screwing the pair of nuts onto the shaft portion from both sides of the side wall portion, The radiation imaging device of [5] or [6], wherein the at least one notch is provided at a position overlapping with the nut on the control board in the first direction.

[0022] According to the above-mentioned configuration [8], since the worker can visually check the nuts on the control board side through the notches, the worker can easily screw the pair of nuts onto the shafts of the connector. As a result, the connector can be firmly and easily attached to the side wall.

[0023] [9] The radiation imaging device according to any one of [1] to [8], wherein the at least one connector is provided on the rear surface of the control board.

[0024] Normally, a light-emitting element such as an LED for checking the operation of a connector is provided on the same surface as the connector. According to the configuration [8] above, since the light-emitting element is provided on the back surface of the control board, the influence of radiation on the light-emitting element can be reduced compared to when the connector and the light-emitting element are provided on the main surface of the control board (the surface facing the sensor panel where radiation is incident). As a result, the reliability of the members (light-emitting elements) constituting the radiation imaging device can be improved, and ultimately the reliability of the radiation imaging device itself can be improved.

[0025]

[10] The housing has a bottom wall portion located on the opposite side to the side where radiation is incident, The radiation imaging device according to any one of [1] to [9], wherein at least one through hole is provided in the bottom wall portion.

[0026] According to the configuration

[10] above, it is possible to easily realize a configuration in which the mounting member is fixed to the housing, or a configuration in which the mounting member is fixed to a member disposed outside the housing.

[0027]

[11] The radiation imaging device according to

[10] , wherein the at least one through hole has at least one first through hole through which a first fixing member for fixing the mounting member to the housing is inserted.

[0028] According to the configuration of

[11] above, the mounting member can be fixed to the housing through the through hole. Also, when the housing is set to the ground potential, the member housed in the housing (the mounting member) can be easily connected to the GND.

[0029]

[12] The radiation imaging device of

[11] , wherein the at least one through hole further includes at least one second through hole through which a second fixing member for fixing the mounting member to a member arranged outside the housing is inserted.

[0030] According to the configuration

[12] above, it is possible to realize fixing of the mounting member to the housing as described above, and also to realize fixing of the radiation imaging device itself by fixing the mounting member to a member arranged outside the housing.

[0031]

[13] Further comprising a cover member, a third opening is provided in the housing at a position facing the sensor panel on a side where radiation is incident, The radiation imaging device according to any one of [1] to

[12] , wherein the cover member is attached to the housing so as to cover the third opening.

[0032] According to the configuration of

[13] above, since the cover member and the housing are provided separately, the sensor panel, etc. can be inspected through the third opening by removing the cover member. That is, the sensor panel, etc. can be inspected through the third opening without removing the sensor panel, etc. from the housing. As a result, the sensor panel, etc. can be inspected easily.

[0033]

[14] The radiation imaging device according to

[13] , wherein the housing and the cover member are formed from different materials.

[0034] According to the configuration of

[14] above, the housing and the cover member can be formed from materials suitable for each. For example, the housing can be made of a material suitable for blocking radiation, and the cover member can be made of a material suitable for transmitting radiation. As a result, it is possible to reduce the effect of radiation on the members inside the housing, and to suitably allow the radiation to be detected to enter the sensor panel through the cover member.

[0035]

[15] A radiation imaging device according to

[13] or

[14] , wherein the cover member is fixed to both the housing and the side plate at a position overlapping both the housing and the side plate when viewed from the first direction.

[0036] According to the above configuration

[15] , the housing and the side plate can be firmly fixed to each other via the cover member.

[0037]

[16] The housing has a side portion extending in the first direction and having the second opening, The radiation imaging device according to any one of [1] to

[15] , wherein the mounting member is not in contact with the side surface portion.

[0038] According to the configuration

[16] above, by separating the side portion of the housing from the mounting member, even if an impact is applied to the housing from the outside, the impact is less likely to be transmitted to the mounting member.

[0039]

[17] A method for manufacturing a radiation imaging device according to any one of [1] to

[16] , assembling the control unit; and inserting the control unit into the housing along the second direction, The step of assembling the control unit includes: mounting the control board on the mounting member; and fixing the side plate to the mounting member.

[0040] The manufacturing method of the radiation imaging device of

[17] above includes a step of assembling a control unit. In the step of assembling the control unit, a control board is mounted on a mounting member, and a side plate is fixed to the mounting member. That is, the control board and the side plate are positioned relative to each other via the mounting member. This allows the connector provided on the control board to be positioned reliably and accurately with respect to the side plate (side wall portion). Then, by inserting the control unit into the housing along the second direction, the control unit can be housed in the housing while maintaining the state in which the connector is positioned relative to the side plate. As described above, according to the manufacturing method of the radiation imaging device of

[17] above, the connector provided on the control board can be positioned easily and accurately.

[0041]

[18] The method for manufacturing a radiation imaging device according to

[17] , further comprising the step of fixing the sensor panel to the control unit before the step of inserting the control unit.

[0042] According to the configuration

[18] above, the sensor panel can be easily positioned and electrically connected to the control unit outside the housing, and the sensor panel and the control unit can be easily accommodated as a single unit in the housing.

[0043]

[19] The method for manufacturing a radiation imaging device according to

[17] or

[18] , wherein the step of assembling the control unit further includes a step of attaching the at least one connector to the side wall portion after the step of fixing the side plate.

[0044] According to the configuration

[19] above, since the connector is attached to the side wall portion with the connector positioned, the position of the connector positioned relative to the side wall portion can be easily maintained.

[0045]

[20] The at least one connector has a shaft portion that passes through the first opening, The method for manufacturing a radiation imaging device according to

[19] , wherein in the step of attaching the at least one connector, a pair of nuts are screwed onto the shaft portion from both sides of the side wall portion, thereby attaching the at least one connector to the side wall portion.

[0046] According to the configuration of

[20] above, the connector can be firmly attached to the side wall by screwing a pair of nuts onto the shaft of the connector from both sides of the side wall. Furthermore, since the connector is positioned relative to the side plate (side wall), the accuracy of the connector positioning (e.g., the length by which the connector protrudes from the side wall) can be ensured when screwing the nuts onto the shaft of the connector. Effect of the Invention

[0047] According to one aspect of the present disclosure, it is possible to provide a radiation imaging device and a method for manufacturing a radiation imaging device that allow for easy and accurate positioning of a connector. [Brief description of the drawings]

[0048] [Figure 1] 1 is a perspective view of a radiation imaging apparatus according to an embodiment; [Diagram 2] FIG. 2 is an exploded perspective view of the radiation imaging apparatus. [Diagram 3] FIG. 2A is a perspective view of the housing, and FIG. [Figure 4] FIG. [Diagram 5] FIG. [Figure 6] 6 is a cross-sectional view of the radiation imaging device taken along line VI-VI in FIG. [Figure 7] 7 is a cross-sectional view of the radiation imaging device taken along line VII-VII in FIG. [Figure 8] FIG. 4 is a bottom view of the mounting member on which the control board is mounted. [Figure 9] FIG. [Figure 10] FIG. 13A is an enlarged bottom view of a portion of the mounting member on which the control board is mounted, and FIG. 13B is a view showing the state in which the connector is attached to the side plate. [Figure 11] 1A to 1C are diagrams for explaining a method for manufacturing a radiation imaging device. [Figure 12] 1A to 1C are diagrams for explaining a method for manufacturing a radiation imaging device. [Figure 13] 1A to 1C are diagrams for explaining a method for manufacturing a radiation imaging device. [Figure 14] FIG. 4 is an enlarged cross-sectional view of a portion of the detection unit. [Figure 15] FIG. 2A is a cross-sectional view of a sensor panel of a comparative example, and FIG. 2B is a cross-sectional view of a sensor panel of an embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0049] Hereinafter, an embodiment of the present disclosure will be described in detail with reference to the drawings. In the following description, the same or equivalent elements will be designated by the same reference numerals, and duplicated descriptions will be omitted. In addition, in the drawings, some features of the embodiment are exaggerated to make them easier to understand. For this reason, the dimensional ratios of each part in the drawings may differ from the actual dimensional ratios.

[0050] [Overall configuration of radiation imaging device] As shown in FIG. 1 and FIG. 2, a radiation imaging device 1 according to an embodiment includes a housing 10, a cover member 20, a detection unit 30, and a control unit 50. The radiation imaging device 1 is, for example, a flat panel sensor (X-ray imaging device) used in a medical X-ray imaging system. The detection unit 30 is fixed to the control unit 50 by a plurality of screws S11 described later. In this specification, a direction perpendicular to the cover member 20 (a direction perpendicular to a sensor panel 31 described later) is referred to as a Z-axis direction (first direction). Of the directions perpendicular to the Z-axis direction, a direction perpendicular to a side wall portion 61 of a side plate 60 described later is referred to as an X-axis direction (second direction), and a direction perpendicular to the Z-axis direction and the X-axis direction is referred to as a Y-axis direction. The radiation imaging device 1 is disposed such that radiation to be detected is incident on the cover member 20 along the Z-axis direction. Thus, in the radiation imaging device 1, radiation that passes through the cover member 20 and enters the detection unit 30 is detected.

[0051] As shown in (a) and (b) of FIG. 3, the housing 10 is a hollow container having a substantially rectangular parallelepiped shape. The housing 10 houses the detection unit 30 and the control unit 50 with the detection unit 30 fixed to the control unit 50. The housing 10 has a top wall 11, a bottom wall 12, and a side surface 13. The housing 10 is formed of, for example, a metal material (e.g., iron, aluminum, stainless steel, etc.) that shields radiation. In this embodiment, the housing 10 is formed of aluminum. The top wall 11 and the bottom wall 12 are disposed to face each other at a distance along the Z-axis direction. The top wall 11 is located on the side where radiation is incident (i.e., the side facing the lid member 20). The bottom wall 12 is located on the opposite side to the side where radiation is incident.

[0052] The top wall 11 is a rectangular annular plate member. That is, a rectangular opening 11a (third opening) is provided in the center of the top wall 11. The opening 11a is provided at a position facing the sensor panel 31 (see Figs. 6 and 7) in the Z-axis direction. The top wall 11 is provided with three through holes 11b and two screw holes 11c. The three through holes 11b are provided at two corners located on one side of the top wall 11 in the X-axis direction (the right side in Fig. 3(a), the side where an opening 13a described later is provided) and between the two corners. The two screw holes 11c are provided at two corners located on the other side of the top wall 11 in the X-axis direction (the left side in Fig. 3(a)).

[0053] The bottom wall portion 12 is a rectangular plate member. The bottom wall portion 12 is provided with a plurality of through holes 12a. The plurality of through holes 12a include five first through holes 12b and eight second through holes 12c. The five first through holes 12b and the eight second through holes 12c are not threaded. The five first through holes 12b are located at a portion slightly shifted from two corners of the bottom wall portion 12 on one side in the X-axis direction (the left side in FIG. 3(b)) to the other side in the X-axis direction (the right side in FIG. 3(b)), at two corners of the bottom wall portion 12 on the other side in the X-axis direction, and at a portion slightly shifted from the approximate center of the bottom wall portion 12 to the other side in the X-axis direction. The eight second through holes 12c are located at three locations between two first through holes 12b on one side in the Y-axis direction (upper side in Figure 3(b)), three locations between two first through holes 12b on the other side in the Y-axis direction (lower side in Figure 3(b)), one location between two first through holes 12b on one side in the X-axis direction (left side in Figure 3(b)), and one location between two first through holes 12b on the other side in the X-axis direction (right side in Figure 3(b)).

[0054] The side surface portion 13 extends in the Z-axis direction and connects the top wall portion 11 and the bottom wall portion 12. The side surface portion 13 has a first portion 131, a second portion 132, and a third portion 133. The first portion 131 and the second portion 132 are both formed in a rectangular plate shape and are arranged to face each other at a distance in the Y-axis direction. The third portion 133 extends along the YZ plane and is formed in a rectangular plate shape so as to connect the first portion 131 and the second portion 132. The side surface portion 13 is provided with a rectangular opening 13a (second opening) at a position facing the third portion 133. The opening 13a functions as an opening (insertion port) for inserting the control unit 50 into the housing 10 along the X-axis direction. That is, after the control unit 50 is assembled outside the housing 10, the control unit 50 can be inserted into the housing 10 through the opening 13a of the housing 10.

[0055] A through hole 131a is provided in a corner of the first portion 131 on the side of the top wall 11 and the side of the opening 13a. A through hole (not shown) similar to the through hole 131a is also provided in a corner of the second portion 132 on the side of the top wall 11 and the side of the opening 13a. This through hole is provided at a position overlapping with the through hole 131a in the Y-axis direction.

[0056] As shown in FIG. 1 and FIG. 2, the cover member 20 is formed in a rectangular plate shape. The cover member 20 has a function of protecting the members inside the housing 10 and a function of transmitting the radiation to be detected. For this purpose, the cover member 20 is formed of a material different from the housing 10 (aluminum in this embodiment). More specifically, the cover member 20 is formed of a material that transmits radiation (e.g., carbon fiber, etc.). The cover member 20 is attached to the top wall portion 11 so as to close the opening 11a of the housing 10. The cover member 20 is provided with three through holes 20a. The three through holes 20a are provided at two corners on one side in the X-axis direction (the right side in FIG. 2) and between the two corners. The cover member 20 is provided with two through holes 20b located at two corners on the other side in the X-axis direction (the left side in FIG. 2).

[0057] 1 and 2, the shank of screw S1 is inserted through through hole 20a of cover member 20 and through hole 11b of top wall portion 11 in that order, and is screwed into screw hole 62a of side plate 60, thereby fixing cover member 20, top wall portion 11, and side plate 60 to each other. The shank of screw S2 is inserted through through hole 20b of cover member 20 and is screwed into screw hole 11c of top wall portion 11, thereby fixing cover member 20 and top wall portion 11 to each other. The shank of screw S3 is inserted through through hole 131a of first portion 131, and is screwed into screw hole 63a of side plate 60, thereby fixing first portion 131 and side plate 60 to each other. The shaft portion of screw S4 (see FIG. 13) is inserted into a through hole (not shown) of second part 132 and screwed into screw hole 64a (see FIG. 9) of side plate 60, thereby fixing second part 132 and side plate 60 to each other.

[0058] (Detection unit) The detection unit 30 will be described with reference to Figures 4, 6 and 7. The detection unit 30 has a sensor panel 31, a protective member 32, a shield member 33, an intervening member 34, and a pressing plate 35. The sensor panel 31 has a sensor substrate 41, a chip 42, an OCA tape 43, and an FOS 44.

[0059] The sensor substrate 41 is formed in a rectangular plate shape. The sensor substrate 41 is, for example, a glass epoxy substrate. The sensor substrate 41 has a main surface 41a on which the chip 42 is provided, and a back surface 41b opposite to the main surface 41a. The chip 42, the OCA tape 43, and the FOS 44 are provided in this order on the main surface 41a of the sensor substrate 41. The main surface 41a is a surface facing the cover member 20, and the back surface 41b is a surface facing the bottom wall portion 12. A plurality of through holes 41c and a plurality of through holes 41d are provided in a portion along the outer edge of the sensor substrate 41.

[0060] The protective member 32 is a substantially rectangular annular member for protecting the wires 47 (see FIG. 14). That is, the protective member 32 is provided with a rectangular opening 32a. The protective member 32 is formed of, for example, a metal material (e.g., aluminum, etc.). The protective member 32 is disposed on the main surface 41a of the sensor substrate 41 so as to surround the chip 42, the OCA tape 43, and the FOS 44. That is, the chip 42, the OCA tape 43, and the FOS 44 are located inside the outer edge of the opening 32a when viewed from the Z-axis direction. A plurality of screw holes 32b, a plurality of screw holes 32c, and a plurality of through holes 32d are provided in the portion of the protective member 32 surrounding the opening 32a.

[0061] The shielding member 33 is a substantially rectangular annular member for protecting the circuit provided on the chip 42 from radiation. That is, the shielding member 33 is provided with a rectangular opening 33a. The shielding member 33 is formed of, for example, a metal material (e.g., lead or the like) that blocks radiation. The shielding member 33 is provided on a surface 32e of the protective member 32 on the side where radiation is incident. The shielding member 33 is fixed to the protective member 32 with a double-sided tape 48 (see FIG. 14). The double-sided tape 48 is not shown in FIGS. 4, 6, and 7. A plurality of through holes 33b and a plurality of through holes 33c are provided in a portion surrounding the opening 33a in the shielding member 33.

[0062] Intermediate member 34 is arranged to press down FOS 44 and suppress warping of FOS 44. Intermediate member 34 is a conductive sponge made of resin such as urethane. Intermediate member 34 is arranged on surface 44a of FOS 44 on the side on which radiation is incident (surface 46a of scintillator 46 described later on the side on which radiation is incident). Intermediate member 34 is arranged inside opening 33a of shield member 33 when viewed from the Z-axis direction.

[0063] The pressing plate 35 is a rectangular plate member for pressing the intervening member 34 toward the FOS 44. The pressing plate 35 is made of a material (such as carbon fiber) that transmits radiation. The pressing plate 35 is formed to a size that covers the entire opening 33a provided in the shielding member 33 when viewed from the Z-axis direction. The pressing plate 35 is disposed on the surface 33d of the shielding member 33 on the side where radiation is incident, and is disposed on the surface 44a of the FOS 44 with the intervening member 34 in between. The inner surface 35a of the pressing plate 35 facing the surface 33d of the shielding member 33 is in contact with the intervening member 34. A plurality of through holes 35b and a plurality of through holes 35c are provided in a portion along the outer edge of the pressing plate 35.

[0064] The chip 42, the OCA tape 43, the FOS 44, and the interposed member 34 are arranged within a space defined by the sensor substrate 41, the protective member 32 (opening 32a), the shielding member 33 (opening 33a), and the pressure plate 35.

[0065] 4, the shank of screw S5 is inserted through through hole 41c of sensor board 41 and screwed into screw hole 32b of protective member 32, thereby fixing sensor board 41 and protective member 32 to each other. The shank of screw S6 is inserted through through hole 35b of presser plate 35 and through hole 33b of shield member 33 in this order and screwed into screw hole 32c of protective member 32, thereby fixing presser plate 35, shield member 33, and protective member 32 to each other.

[0066] (Control Unit) The control unit 50 will be described with reference to Figures 5, 6, and 7. The control unit 50 has a support member 51, a double-sided tape 52, a shield member 53, a protective member 54, a control board 55, three connectors 56, 57, and 58, a mounting member 59, a side plate 60, a pair of nuts 81A and 81B (see Figure 10), and a pair of nuts 82A and 82B.

[0067] The support member 51 is a member for supporting (fixing) the sensor panel 31. The support member 51 is formed in a rectangular plate shape. The support member 51 is formed of, for example, a metal material (for example, aluminum, etc.). The support member 51 has a support surface 51a that supports the sensor panel 31 and a back surface 51b opposite to the support surface 51a. The support surface 51a is in contact with the back surface of the sensor panel 31 (the back surface 41b of the sensor board 41). The support surface 51a is provided with a recess 51c recessed toward the back surface 51b side (see Figs. 5 and 7). The back surface 51b is provided with a recess 51d recessed toward the support surface 51a side (see Fig. 7). The support member 51 is provided with a through hole 51e for inserting a member for connecting the sensor board 41 and the control board 55. A plurality of screw holes 51f and a plurality of through holes 51g are provided in the upper end portion (the end portion located on the upper side in FIG. 5) and the lower end portion (the end portion located on the lower side in FIG. 5) of the support member 51. In addition, a plurality of screw holes 51h are provided in the peripheral portion of the recess 51c so as to surround the recess 51c.

[0068] The surface of the double-sided tape 52 facing the support member 51 is attached to the bottom of the recess 51d of the support member 51, and the shield member 53 is fixed to the opposite surface of the double-sided tape 52. In this way, the shield member 53 is fixed to the support member 51. The double-sided tape 52 is provided with a recess 52a that communicates with the through hole 51e.

[0069] The shielding member 53 is a member for protecting the circuit provided on the control board 55 from radiation. The shielding member 53 is formed of, for example, a metal material (e.g., lead) that blocks radiation. The shielding member 53 is accommodated and fixed in the recess 51d of the support member 51 by double-sided tape 52. The shielding member 53 is provided with a recess 53a that communicates with the recess 52a.

[0070] The protective member 54 is a member for protecting the shield member 53. The protective member 54 is formed of, for example, a metal material (for example, stainless steel, etc.). The protective member 54 is in contact with the back surface 51b of the support member 51 so as to close the recess 51d of the support member 51. The protective member 54 is provided with a through hole 54a that communicates with the through hole 51e via the recesses 52a and 53a. A plurality of through holes 54b and a plurality of through holes 54c are provided in the upper end portion (the end portion located on the upper side of FIG. 5) and the lower end portion (the end portion located on the lower side of FIG. 5) of the protective member 54.

[0071] The control board 55 is a board that controls the reading of signals from the sensor panel 31. The control board 55 has a main surface 55a and a back surface 55b opposite to the main surface 55a. The main surface 55a faces the sensor panel 31 via the protective member 54, the shielding member 53, the double-sided tape 52, and the support member 51. The control board 55 is mounted on the mounting member 59 such that the back surface 55b contacts the support posts 59b of the mounting member 59. A plurality of through holes 55c are provided in a portion along the outer edge of the control board 55.

[0072] As an example, signals are transmitted and received between the control board 55 and the sensor board 41 (sensor panel 31) via a connector C1 provided on the rear surface 41b of the sensor board 41 and a connector C2 provided on the main surface 55a of the control board 55 (see FIG. 6). The connectors C1 and C2 are configured to be connectable to each other via the through-hole 51e of the support member 51, the recess 52a of the double-sided tape 52, the recess 53a of the shield member 53, and the through-hole 54a of the protection member 54.

[0073] The connector 56 (at least one connector) is a connector for supplying power supplied from an external source to the control board 55. The connector 57 is a connector for transmitting and receiving electric signals between the control board 55 and the outside (for example, a PC device equipped with a display for displaying a radiation image detected by the radiation imaging apparatus 1). The connector 58 is a LAN port for connecting the radiation imaging apparatus 1 to a local area network. The connectors 56 to 58 are provided on the rear surface 55b of the control board 55. Light-emitting elements such as LEDs (not shown) for checking the operation of the connectors 56 to 58 are arranged on the rear surface 55b of the control board 55.

[0074] The mounting member 59 is a plate-like member for mounting the control board 55. The mounting member 59 is formed of, for example, a metal material (for example, aluminum, etc.). The mounting member 59 has an opposing wall portion 591 and a pair of side portions 592. The opposing wall portion 591 is formed in a rectangular plate shape. The opposing wall portion 591 faces the back surface 55b of the control board 55. The pair of side portions 592 are formed on both sides of the opposing wall portion 591 along the Y-axis direction and extend along the X-axis direction. Each side portion 592 protrudes toward the control board 55 side (the side where radiation is incident) relative to the opposing wall portion 591. As shown in FIG. 6, the control board 55 is sandwiched between the pair of side portions 592 of the mounting member 59 in the Y-axis direction. The mounting member 59 has an end surface 59a on one side (side plate 60 side) in the X-axis direction. The end face 59a is a face on one side of the mounting member 59 in the X-axis direction that is not provided with notches 593, 594 (described later) (see FIGS. 5 and 8). The end face 59a faces an inner face 61d of the side plate 60 (see FIG. 9). A plurality of posts 59b protruding toward the control board 55 are provided along the outer edge of the face of the facing wall 591 that faces the control board 55. A screw hole is provided in each post 59b. A plurality of screw holes 59c are provided in each side 592 along the X-axis direction. Three screw holes 59d are provided in the end face 59a of the facing wall 591.

[0075] 8, five first screw holes 59e and eight second screw holes 59f are provided on the bottom surface (surface facing the bottom wall portion 12 of the housing 10) of the mounting member 59. The five first screw holes 59e are located at a portion slightly shifted from two corners of the mounting member 59 on one side in the X-axis direction (the left side in FIG. 8) to the other side in the X-axis direction (the right side in FIG. 8), at two corners of the mounting member 59 on the other side in the X-axis direction (the right side in FIG. 8), and at a portion slightly shifted from the approximate center of the mounting member 59 to the other side in the X-axis direction. The eight second screw holes 59f are located at three locations between the two first screw holes 59e on one side in the Y-axis direction (upper side in Figure 8), three locations between the two first screw holes 59e on the other side in the Y-axis direction (lower side in Figure 8), one location between the two first screw holes 59e on one side in the X-axis direction (left side in Figure 8), and one location between the two first screw holes 59e on the other side in the X-axis direction (right side in Figure 8).

[0076] As shown in FIG. 6, the mounting member 59 is fixed to the bottom wall 12 of the housing 10 by a first fixing member 71. The first fixing member 71 is, for example, a screw. The shaft portion of the first fixing member 71 is inserted into the first through hole 12b of the bottom wall 12 and screwed into the first screw hole 59e of the mounting member 59, thereby fixing the mounting member 59 and the bottom wall 12 to each other. The mounting member 59 is fixed to a member M arranged outside the housing 10 by a second fixing member 72. The second fixing member 72 is, for example, a screw. The member M is any member for supporting (fixing) the radiation imaging device 1. In this embodiment, the member M is illustrated in FIG. 6 as a plate member. The shaft portion of the second fixing member 72 is inserted into the through hole M1 provided in the member M and the second through hole 12c of the bottom wall 12 in this order, and screwed into the second screw hole 59f, thereby fixing the mounting member 59 and the member M to each other. When the mounting member 59 is fixed to the housing 10, the mounting member 59 is not in contact with the side portion 13 (the first portion 131, the second portion 132, and the third portion 133) of the housing 10. In other words, there is a slight gap between the mounting member 59 and the side portion 13 of the housing 10.

[0077] As shown in FIG. 8, the connector 56 has a shaft portion 56a on which a screw groove is formed. The connector 56 is provided at an end portion 55d on one side (left side in FIG. 8) in the X-axis direction of the rear surface 55b of the control board 55. A part of the shaft portion 56a including the tip 56b of the connector 56 does not overlap with the control board 55 when viewed from the Z-axis direction. That is, the tip 56b of the connector 56 protrudes to the outside of the control board 55 when viewed from the Z-axis direction. A space is formed in the shaft portion 56a for inserting a part of a mating connector (not shown). The connector 57 has a shaft portion 57a ​​on which a screw groove is formed. The connector 57 is provided at the end portion 55d and is located on one side (upper side in FIG. 9) in the Y-axis direction with respect to the connector 56. A part of the shaft portion 57a ​​including the tip 57b of the connector 57 does not overlap with the control board 55 when viewed from the Z-axis direction. That is, tip 57b of connector 57 protrudes outside control board 55 when viewed from the Z-axis direction. A space (see FIG. 7) for inserting a part of a mating connector (not shown) is formed in shaft portion 57a. Connector 58 is provided at end portion 55d, and is located on one side in the Y-axis direction (upper side in FIG. 9) of connector 57. A part of connector 58, including tip 58a of connector 58, does not overlap with control board 55. That is, tip 58a of connector 58 protrudes outside control board 55 when viewed from the Z-axis direction.

[0078] When viewed from the Z-axis direction, end surface 59a of mounting member 59 does not overlap with control board 55. That is, when viewed from the Z-axis direction, end surface 59a of mounting member 59 is located outside control board 55. When viewed from the Z-axis direction, tip 56b of connector 56, tip 57b of connector 57, and tip 58a of connector 58 are located outside (to the left in FIG. 9) end surface 59a of mounting member 59.

[0079] The opposing wall portion 591 has cutouts 593 and 594. The cutouts 593 and 594 are provided at an end of the opposing wall portion 591 on one side in the X-axis direction (the left side in FIG. 8). The cutout 593 is provided at a position in the Z-axis direction overlapping with each of the end portion 55d of the control board 55 and at least a portion of the connector 56 (in this embodiment, the entire connector 56 excluding a portion including the tip 56b (a portion protruding outward beyond the end face 59a in the X-axis direction)). The cutout 593 has a rectangular recessed shape toward the other side in the X-axis direction (the right side in FIG. 8). The cutout 594 is provided at a position overlapping with each of the end 55d of the control board 55, at least a portion of the connector 57 (in this embodiment, the entire connector 57 excluding a portion including the tip 57b (a portion protruding outward beyond the end face 59a in the X-axis direction)), and at least a portion of the connector 58 (in this embodiment, substantially the entire connector 58). The cutout 594 is located on one side in the Y-axis direction (the upper side in FIG. 8) of the cutout 593. The cutout 594 has a rectangular recessed shape toward the other side in the X-axis direction (the right side in FIG. 8), similar to the cutout 593. The length (width) of the cutout 594 along the Y-axis direction is longer than the width of the cutout 593. The length (depth) of the cutout 594 along the X-axis direction is approximately the same as the depth of the cutout 593.

[0080] The opposing wall 591 has a protrusion 595. The protrusion 595 is provided between the cutouts 593 and 594. That is, the protrusion 595 is located between the adjacent connectors 56 and 57 when viewed from the Z-axis direction, and separates the adjacent cutouts 593 and 594 from each other. The protrusion 595 protrudes to one side in the X-axis direction (the left side in FIG. 8). A tip surface 595a of the protrusion 595 constitutes a part of an end surface 59a of the mounting member 59. That is, the tip surface 595a is located on the same plane (a plane perpendicular to the X-axis direction) as the end surfaces 59a of both ends of the mounting member 59 in the Y-axis direction. The tip portion including the tip surface 595a of the protrusion 595 is located outside the control board 55 when viewed from the Z-axis direction.

[0081] The side plate 60 will be described with reference to FIG. 9. The side plate 60 is a member constituting a part of the side of the radiation imaging device 1 (in this embodiment, a part corresponding to one of the four sides of the radiation imaging device 1 when viewed from the Z-axis direction). The side plate 60 has a side wall portion 61 and wall portions 62, 63, and 64. The side plate 60 is formed of, for example, a metal material (for example, iron, aluminum, stainless steel, etc.) that shields radiation, similar to the housing 10. In this embodiment, the side plate 60 is formed of aluminum. The side wall portion 61 is a rectangular plate member extending along the YZ plane. The side wall portion 61 is provided with three openings 61a, 61b, and 61c (first openings). The openings 61a, 61b, and 61c are arranged along the Y-axis direction so as to correspond to the connectors 56, 57, and 58, respectively. The opening 61a is a circular through-hole for passing the shaft portion 56a of the connector 56 and exposing it to the outside of the side wall portion 61. The opening 61b is a circular through-hole for passing the shaft portion 57a ​​of the connector 57 and exposing it to the outside of the side wall portion 61. The opening 61c is a rectangular through-hole for passing the connector 58 and exposing it to the outside of the side wall portion 61. An inner surface 61d (the surface facing the mounting member 59) of the side wall portion 61 is in surface contact with an end face 59a of the mounting member 59. Three through holes 61e are provided in a portion of the inner surface 61d that is in surface contact with the end face 59a.

[0082] 7, in a state in which the detection unit 30 (sensor panel 31) and the control unit 50 are housed in the housing 10, the side wall portion 61 is disposed at a position corresponding to the opening 13a. More specifically, the side wall portion 61 is disposed at a position to close the opening 13a provided in the side surface portion 13 of the housing 10. That is, when viewed from the Z-axis direction, three sides of the storage space within the housing 10 of the radiation imaging device 1 are defined by the side surface portion 13 of the housing 10, and the remaining side of the storage space (the side not defined by the side surface portion 13) is defined by the side wall portion 61.

[0083] As shown in FIG. 9, the wall 62 is a rectangular plate member extending along the XY plane. The wall 62 extends from the outer edge of one side (upper side in FIG. 9) of the side wall 61 in the Z axis direction toward the inner surface 61d side. When the control unit 50 is accommodated in the housing 10, the wall 62 overlaps with the cover member 20 across the top wall 11 when viewed from the Z axis direction (see FIG. 7). The wall 62 is provided with three screw holes 62a along the Y axis direction. As described above, the screw S1 shown in FIG. 1 is inserted through the through hole 20a of the cover member 20 and the through hole 11b of the top wall 11 and screwed into the screw hole 62a of the wall 62, whereby the cover member 20, the housing 10 (top wall 11), and the side plate 60 (wall 62) are fixed to each other. That is, the cover member 20 is fixed to both the housing 10 and the side plate 60 at a position where the cover member 20 overlaps both the housing 10 and the side plate 60 when viewed from the Z-axis direction.

[0084] The wall portion 63 is a rectangular plate member extending along the XZ plane. The wall portion 63 extends from the outer edge of one side (the front side in FIG. 9) of the side wall portion 61 in the Y axis direction toward the inner surface 61d side. The wall portion 63 is connected to the outer edge of one side of the wall portion 62 in the Y axis direction. When the control unit 50 is accommodated in the housing 10, the wall portion 63 overlaps with the first portion 131 in the Y axis direction (see FIG. 6). The wall portion 63 is provided with a screw hole 63a. As described above, the screw S3 shown in FIG. 1 is inserted into the through hole 131a of the first portion 131 and screwed into the screw hole 63a of the wall portion 63, whereby the first portion 131 and the side plate 60 (wall portion 63) are fixed to each other.

[0085] The wall portion 64 is a rectangular plate member extending along the XZ plane. The wall portion 64 is provided at a position facing the wall portion 63 in the Y-axis direction. That is, the wall portion 64 extends from the outer edge of the other side (the back side in FIG. 9) of the side wall portion 61 in the Y-axis direction toward the inner surface 61d side. The wall portion 64 is connected to the outer edge of the other side in the Y-axis direction of the wall portion 62. When the control unit 50 is accommodated in the housing 10, the wall portion 64 overlaps with the second portion 132 in the Y-axis direction (see FIG. 6). The wall portion 64 is provided with a screw hole 64a. As described above, the screw S4 shown in FIG. 13 is inserted into the through hole (not shown) of the second portion 132 and screwed into the screw hole 64a of the wall portion 64, whereby the second portion 132 and the side plate 60 (wall portion 64) are fixed to each other.

[0086] Next, the fixing structure of the control unit 50 will be described. As shown in Fig. 5, the shaft portion of the screw S7 is inserted into the through hole 54b of the protective member 54 and screwed into the screw hole 51f of the support member 51, thereby fixing the support member 51 and the protective member 54 to each other. The shaft portion of the screw S8 is inserted into the through hole 55c of the control board 55 and screwed into the support column 59b of the mounting member 59, thereby fixing the control board 55 and the mounting member 59 to each other. The shaft portion of the screw S9 is inserted into the through hole 51g of the support member 51 and the through hole 54c of the protective member 54 in this order, and screwed into the screw hole 59c of the mounting member 59, thereby fixing the support member 51, the protective member 54, and the mounting member 59 to each other. The shaft portion of the screw S10 is inserted into the through hole 61e of the side plate 60 and screwed into the screw hole 59d of the mounting member 59, whereby the mounting member 59 and the side plate 60 are fixed to each other.

[0087] Next, the positional relationship and fixing structure between the side plate 60 (side wall portion 61) and each connector provided on the control board 55 will be described. As shown in FIG. 10(a), the connector 56 is positioned at a predetermined position with respect to the mounting member 59. Specifically, the distance T1 between the tip 56b and the end face 59a of the connector 56 in the X-axis direction is adjusted to a predetermined design value. In this state, as shown in FIG. 10(b), the side plate 60 is fixed to the mounting member 59, whereby the connector 56 is positioned with respect to the side plate 60. Specifically, when the thickness of the side wall portion 61 of the side plate 60 in the X-axis direction is represented as T2, the shaft portion 56a of the connector 56 protrudes to the outside of the side wall portion 61 by "T1-T2". That is, in the radiation imaging device 1, it is possible to appropriately determine the amount of protrusion "T1-T2" of the connector 56 from the side plate 60 (side wall 61) by adjusting the distance T1 and the thickness T2 of the side wall 61. The connector 57 is also positioned with respect to the side plate 60, similar to the above-mentioned connector 56. In this embodiment, the tip 58a of the connector 58 is positioned with respect to the side plate 60 so as to be substantially flush with the outer surface of the side wall 61, as shown in FIG.

[0088] As shown in FIG. 10B, the shaft portion 56a is attached to the side wall portion 61 by a pair of nuts 81A and 81B arranged to sandwich the side wall portion 61 when passing through the opening 61a of the side wall portion 61. The notch 593 is provided at a position overlapping the nut 81A when viewed from the Z-axis direction. The nut 81A is screwed to a portion of the shaft portion 56a that is on the inside of the side wall portion 61. The nut 81B is screwed to a portion of the shaft portion 56a that protrudes outward from the side wall portion 61. Similarly, the shaft portion 57a ​​of the connector 57 is attached to the side wall portion 61 by a pair of nuts 82A and 82B arranged to sandwich the side wall portion 61 when passing through the opening 61b of the side wall portion 61 (see FIG. 7). The connector 58 is not attached to the side wall portion 61.

[0089] Next, a fixing structure of the detection unit 30 to the control unit 50 will be described. As shown in FIG. 11, the shaft of the screw S11 is inserted into the through hole 41d of the sensor board 41 and screwed into the screw hole 51h of the support member 51, thereby fixing the sensor board 41 and the support member 51 to each other. That is, the detection unit 30 (sensor panel 31) is fixed to the control unit 50. The above-mentioned through hole 35c of the pressing plate 35, the through hole 33c of the shielding member 33, and the through hole 32d of the protective member 32 are provided to allow the screw S11 to pass through. The head of the screw S11 located near the upper end (upper end of FIG. 11) and near both end portions (left and right side end portions of FIG. 11) of the pressing plate 35 is inserted into the through hole 35c, the through hole 33c, and the through hole 32d (see FIG. 4) in that order, and is in contact with the main surface 41a of the sensor board 41. The head of the screw S11 located near the lower end of the shield member 33 (the lower end in FIG. 11) is inserted through the through hole 33c and the through hole 32d in that order, and is in contact with the main surface 41a of the sensor board 41. The head of the screw S11 located near the lower end of the sensor board 41 (the lower end in FIG. 11) is in contact with the main surface 41a of the sensor board 41 so as to be located inside recesses provided in the lower ends of the protection member 32 and the shield member 33 (the lower ends in FIG. 11).

[0090] [Manufacturing method of radiation imaging device] Next, a description will be given of an example of a manufacturing method for the radiation imaging device 1. The manufacturing method for the radiation imaging device 1 includes a step of assembling a detection unit, a step of assembling a control unit, a step of fixing the detection unit (sensor panel) to the control unit, a step of inserting the control unit into a housing, and a step of fixing a cover member to the housing.

[0091] (1. Assembling the detection unit) With reference to FIG. 4, the process of assembling the detection unit 30 will be described. First, the chip 42 and the FOS 44 are fixed to each other by the OCA tape 43. Next, the chip 42 is fixed to the main surface 41a of the sensor substrate 41 by die bonding. At this time, the chip 42 and the sensor substrate 41 are electrically connected by the wire 47 (see FIG. 14). Then, the back surface 33e of the shielding member 33 and the front surface 32e of the protective member 32 are fixed to each other by the double-sided tape 48 (see FIG. 14). Then, the protective member 32 is placed on the main surface 41a so as to cover at least a part of the wire 47, and the sensor substrate 41 and the protective member 32 are fixed to each other by a plurality of (15 in this embodiment) screws S5. Next, the interposing member 34 is placed on the front surface 44a of the FOS 44, and the interposing member 34 is pressed toward the FOS 44 by the pressing plate 35. In this state, the pressing plate 35, the shielding member 33, and the protective member 32 are fixed to one another by a plurality of (15 in this embodiment) screws S6. In this manner, the detection unit 30 is assembled.

[0092] (2. Assembling the control unit) The process of assembling the control unit 50 will be described with reference to Figs. 5 to 7, Figs. 10(a) and (b), and Fig. 11. First, the control board 55 is prepared with the connectors 56 to 58 provided on the back surface 55b. The connectors 56, 57 may be attached to the back surface 55b at any time prior to the process of attaching the connectors 56, 57 to the side wall portion 61. The process of assembling the control unit 50 includes the process of mounting the control board on a mounting member, the process of fixing a side plate to the mounting member, and the process of attaching a connector to the side wall portion. An example of each process in this embodiment will be described below.

[0093] (2-1. Process of mounting the control board on the mounting member) In this embodiment, the control board 55 is mounted on the mounting member 59 with the back surface 55b facing the opposing wall portion 591, and the control board 55 and the mounting member 59 are fixed to each other by a plurality of (16 in this embodiment) screws S8. This allows the connector 56 to be appropriately positioned with respect to the mounting member 59. Specifically, as shown in FIG. 10(a), the distance T1 is set to a predetermined design value. The connectors 57 and 58 are also appropriately positioned with respect to the mounting member 59, similar to the connector 56. Next, the shielding member 53 is fixed to the recess 51d of the support member 51 by the double-sided tape 52. Then, the support member 51 and the protective member 54 are fixed to each other by a plurality of (five in this embodiment) screws S7. Next, the protective member 54 and the support member 51, which are fixed to each other, are placed on the main surface 55a of the control board 55 fixed to the mounting member 59, and the support member 51, the protective member 54, and the mounting member 59 are fixed to each other by a plurality of screws S9 (six in this embodiment). In this manner, the members of the control unit 50 other than the side plate 60 are fixed to each other.

[0094] (2-2. Step of fixing the side plate to the mounting member) 10(b) and 11, the mounting member 59 and the side plate 60 are fixed to each other by a plurality of screws S10 (three in this embodiment) with the inner surface 61d of the side plate 60 (side wall portion 61) in surface contact with the end surface 59a of the mounting member 59. This determines the relative positions of the control board 55 and the side plate 60 via the mounting member 59. That is, the connectors 56 to 58 provided on the control board 55 are positioned relative to the side plate 60 (side wall portion 61). The nuts 81A and 82A (see FIG. 7) disposed on the inner side of the side wall portion 61 may be attached to the shaft portion 56a of the connector 56 and the shaft portion 57a ​​of the connector 57 before the side plate 60 is attached to the mounting member 59.

[0095] (2-3. Steps for attaching the connector to the side wall) After the step of fixing the side plate 60 to the mounting member 59 described above, a step of attaching the connectors 56, 57 to the side wall portion 61 (a step of attaching at least one connector) is performed. Specifically, as shown in (b) of Fig. 10, a pair of nuts 81A, 81B are screwed onto the shaft portion 56a of the connector 56 from both sides of the side wall portion 61, thereby attaching the connector 56 to the side wall portion 61. At this time, the notch 593 is provided at a position overlapping with at least a part of the connector 56 (the entire connector 56 excluding a portion including the tip 56b of the shaft portion 56a (a portion protruding outward from the end face 59a in the X-axis direction) in this embodiment), so that the worker can rotate the pair of nuts 81A, 81B and screw them onto the shaft portion 56a while checking the position of the pair of nuts 81A, 81B. This makes it possible to make the fastening forces applied by the pair of nuts 81A, 81B from both sides of the side wall portion 61 approximately uniform, thereby preventing the side wall portion 61 from deforming (for example, the side wall portion 61 from bending inward or outward). Similarly, the pair of nuts 82A, 82B are screwed onto the shaft portion 57a ​​of the connector 57 from both sides of the side wall portion 61, thereby attaching the connector 57 to the side wall portion 61. With the above, the assembly work of the control unit 50 is completed.

[0096] (3. Step of fixing the sensor panel to the control unit) 11, a process of fixing the detection unit 30 (sensor panel 31) to the control unit 50 will be described. This process is performed before the process of inserting the control unit into the housing. In this embodiment, as described above, the sensor board 41 and the support member 51 are fixed to each other by a plurality of screws S11 (16 screws in this embodiment), thereby fixing the detection unit 30 to the control unit 50. As a result, the sensor panel 31 included in the detection unit 30 is fixed to the control unit 50.

[0097] (4. Inserting the control unit into the housing) With reference to FIG. 12, a process of inserting the control unit 50 into the housing 10 will be described. In this embodiment, since the detection unit 30 is fixed to the control unit 50, the detection unit 30 and the control unit 50 integrated with each other are inserted (housed) in the housing 10 along the X-axis direction through the opening 13a. As a result, as shown in FIG. 13, the detection unit 30 and the control unit 50 are inserted into the housing 10, and the side wall portion 61 is disposed at a position corresponding to the opening 13a. After the control unit 50 is inserted into the housing 10, the mounting member 59 and the bottom wall portion 12 are fixed to each other by a plurality of (five in this embodiment) first fixing members 71, as shown in FIG. 6.

[0098] (5. Step of fixing the cover member to the housing) 13, the first portion 131 and the side plate 60 (wall portion 63) are fixed to each other by a screw S3, and the second portion 132 and the side plate 60 (wall portion 64) are fixed to each other by a screw S4. The lid member 20 and the top wall portion 11 are fixed to each other by a plurality of screws S2 (two in this embodiment), and the lid member 20, the top wall portion 11 and the side plate 60 (wall portion 62) are fixed to each other by a plurality of screws S1 (three in this embodiment). In this manner, the radiation imaging device 1 is manufactured.

[0099] [Effects] The radiation imaging device 1 described above includes a control unit 50. In the control unit 50, a control board 55 and a side plate 60 are mounted (fixed) on a mounting member 59. That is, the control board 55 and the side plate 60 are positioned relative to each other via the mounting member 59. As a result, the connectors 56 to 58 provided on the control board 55 are positioned reliably and accurately with respect to the side plate 60 (side wall portion 61). Furthermore, in the radiation imaging device 1, after assembling the control unit 50 outside the housing 10, the control unit 50 can be inserted into the housing 10 through the opening 13a of the housing 10, thereby allowing the control unit 50 to be housed in the housing 10. As a result, the connectors 56 to 58 can be positioned relative to the side plate 60 (side wall portion 61) before the control unit 50 is housed in the housing 10. As described above, according to the radiation imaging device 1, the connectors 56 to 58 provided on the control board 55 can be positioned easily and accurately.

[0100] Furthermore, in a state in which the detection unit 30 (sensor panel 31) and the control unit 50 are housed in the housing 10, the side wall portion 61 is disposed at a position corresponding to the opening 13a. According to the above configuration, the accuracy of the positioning of the connectors 56-58 (for example, the length by which the connectors 56-58 protrude from the side wall portion 61) performed before the control unit 50 is housed in the housing 10 can be easily maintained even in a state in which the detection unit 30 (sensor panel 31) and the control unit 50 are housed in the housing 10.

[0101] Moreover, the detection unit 30 (sensor panel 31) is fixed to the control unit 50. According to the above configuration, the sensor panel 31 and the control unit 50 can be inserted into the housing 10 as a unit, so that the sensor panel 31 and the control unit 50 can be easily accommodated in the housing 10.

[0102] Moreover, the connectors 56, 57 are attached to the side wall portion 61. According to the above-described configuration, the positions of the connectors 56, 57 positioned relative to the side plate 60 (side wall portion 61) can be easily maintained.

[0103] Moreover, the connectors 56, 57 are provided on the back surface 55b of the control board 55, and the mounting member 59 has an opposing wall portion 591 facing the back surface 55b of the control board 55, and the opposing wall portion 591 is provided with a notch 593 at a position overlapping with at least a part of the connector 56 in the Z-axis direction, and a notch 594 at a position overlapping with at least a part of the connector 57 in the Z-axis direction. According to the above configuration, the connectors 56, 57 can be easily accessed via the notches 593, 594 provided in the opposing wall portion 591 of the mounting member 59, and therefore the installation work of the connectors 56, 57 to the side wall portion 61 can be facilitated.

[0104] Moreover, the opposing wall portion 591 is located between the two adjacent connectors 56, 57 when viewed from the Z-axis direction to separate the two adjacent cutouts 593, 594 from each other, and has a protrusion 595 that comes into contact with the side wall portion 61. According to the above configuration, even if the connectors 56, 57 are provided on the control board 55, each connector 56, 57 can be easily attached to the side wall portion 61 via each cutout 593, 594. Furthermore, since the side wall portion 61 is supported by the protrusion 595 that comes into contact with the side wall portion 61, bending of the side wall portion 61 toward the control board 55 side can be suppressed.

[0105] The radiation imaging device 1 also includes a pair of nuts 81A and 81B disposed on either side of the side wall 61, and the connector 56 has a shaft portion 56a that passes through the opening 61a and is screwed into each of the pair of nuts 81A and 81B, and the connector 56 is attached to the side wall 61 by screwing the pair of nuts 81A and 81B onto the shaft portion 56a from both sides of the side wall 61. According to the above configuration, the connector 56 can be firmly attached to the side wall 61 by screwing the pair of nuts 81A and 81B onto the shaft portion 56a of the connector 56 from both sides of the side wall 61. Furthermore, since the connector 56 is positioned with respect to the side plate 60 (side wall 61), the accuracy of the positioning of the connector 56 (for example, the length (T1-T2) of the connector 56 protruding from the side wall 61) can be ensured when screwing the pair of nuts 81A and 81B onto the shaft portion 56a of the connector 56. Similarly, the connector 57 is attached to the side wall portion 61 by a pair of nuts 82A, 82B arranged on either side of the side wall portion 61. This allows the connector 57 to be firmly attached to the side wall portion 61. Furthermore, when the pair of nuts 82A, 82B are screwed onto the shaft portion 57a ​​of the connector 57, the accuracy of the positioning of the connector 57 (for example, the length by which the connector 57 protrudes from the side wall portion 61) can be ensured.

[0106] Moreover, the notch 593 is provided at a position overlapping the nut 81A on the control board 55 side in the Z-axis direction. According to the above configuration, the worker can visually check the nut 81A on the control board 55 side through the notch 593, and therefore can easily screw the pair of nuts 81A, 81B onto the shaft portion 56a of the connector 56. As a result, the connector 56 can be firmly and easily attached to the side wall portion 61. Moreover, the notch 594 is provided at a position overlapping the nut 82A on the control board 55 side in the Z-axis direction. According to the above configuration, the worker can visually check the nut 82A on the control board 55 side through the notch 594, and therefore can easily screw the pair of nuts 82A, 82B onto the shaft portion 57a ​​of the connector 57. As a result, the connector 57 can be firmly and easily attached to the side wall portion 61.

[0107] The connectors 56 to 58 are provided on the back surface 55b of the control board 55. Usually, light-emitting elements such as LEDs for checking the operation of the connectors 56 to 58 are provided on the same surface on which the connectors 56 to 58 are provided. According to the above configuration, the light-emitting elements are provided on the back surface 55b of the control board 55, so that the influence of radiation on the light-emitting elements can be reduced compared to the case where the connectors 56 to 58 and the light-emitting elements are provided on the main surface 55a (the surface facing the sensor panel 31 to which radiation is incident) of the control board 55. Similarly, according to the above configuration, the influence of radiation on the connectors 56 to 58 can be reduced. As a result, the reliability of the members (the connectors 56 to 58 and the light-emitting elements) constituting the radiation imaging device 1 can be improved, and thus the reliability of the radiation imaging device 1 itself can be improved. From the viewpoint of further reducing the influence of radiation on the light-emitting elements, at least a part of the light-emitting elements may overlap the top wall 11, the support member 51, the shield member 53, the protection member 54, the wall 62, etc. when viewed from the Z-axis direction, or the entire light-emitting elements may overlap the above-mentioned members. Similarly, from the viewpoint of further reducing the influence of radiation on connector 56, at least a portion of connector 56 may overlap with the above-mentioned members when viewed from the Z-axis direction, or the entire connector 56 may overlap with the above-mentioned members. The same applies to connectors 57 and 58.

[0108] Moreover, the housing 10 has a bottom wall 12 located on the side opposite to the side where radiation is incident, and a plurality of through holes 12a are provided in the bottom wall 12. According to the above configuration, it is possible to easily realize a configuration in which the mounting member 59 is fixed to the housing 10, or a configuration in which the mounting member 59 is fixed to a member M arranged outside the housing 10.

[0109] Furthermore, the multiple through holes 12a have multiple first through holes 12b through which first fixing members 71 for fixing the mounting member 59 to the housing 10 are inserted. According to the above configuration, the mounting member 59 can be fixed to the housing 10 via the first through holes 12b. Furthermore, when the housing 10 is set to a ground potential, the member (mounting member 59) accommodated in the housing 10 can be easily connected to GND.

[0110] The plurality of through holes 12a also have a plurality of second through holes 12c through which second fixing members 72 for fixing the mounting member 59 to a member M arranged outside the housing 10 are inserted. According to the above configuration, it is possible to realize the fixing of the mounting member 59 to the housing 10 as described above, and also to realize the fixing of the radiation imaging device 1 itself by fixing the mounting member 59 to a member M arranged outside the housing 10. Furthermore, since the mounting member 59 and the member M are directly fixed to each other, when an external device having the member M moves, for example, the relative position between the external device and a member (for example, the sensor panel 31) fixed to the mounting member 59 can be fixed. That is, the external device and the member fixed to the mounting member 59 are less likely to shift from each other.

[0111] The radiation imaging device 1 also includes a cover member 20, and an opening 11a is provided on the side of the housing 10 where radiation is incident and at a position facing the sensor panel 31, and the cover member 20 is attached to the housing 10 so as to cover the opening 11a. According to the above configuration, since the cover member 20 and the housing 10 are provided separately, the sensor panel 31 and the like can be inspected through the opening 11a by removing the cover member 20. In other words, the sensor panel 31 and the like can be inspected through the opening 11a without removing the sensor panel 31 and the like from the housing 10. As a result, the sensor panel 31 and the like can be easily inspected.

[0112] Furthermore, the housing 10 and the lid member 20 are made of different materials. According to the above configuration, the housing 10 and the lid member 20 can be made of materials suitable for each. For example, a material suitable for shielding radiation can be used for the housing 10, and a material suitable for transmitting radiation can be used for the lid member 20. As a result, it is possible to reduce the effect of radiation on the members inside the housing 10, and to suitably allow the radiation to be detected to enter the sensor panel 31 via the lid member 20.

[0113] Moreover, the cover member 20 is fixed to both the housing 10 and the side plate 60 at a position where the cover member 20 overlaps with both the housing 10 and the side plate 60 when viewed from the Z-axis direction. According to the above configuration, the housing 10 and the side plate 60 can be firmly fixed to each other via the cover member 20.

[0114] Moreover, the housing 10 has a side surface portion 13 that extends in the Z-axis direction and is provided with an opening 13a, and the mounting member 59 is not in contact with the side surface portion 13. According to the above configuration, by separating the side surface portion 13 of the housing 10 from the mounting member 59, when an impact is applied to the housing 10 from the outside, the impact is less likely to be transmitted to the mounting member 59.

[0115] The manufacturing method of the radiation imaging device 1 includes a step of assembling the control unit 50. In the step of assembling the control unit 50, the control board 55 is mounted on a mounting member 59, and the side plate 60 is fixed to the mounting member 59. That is, the control board 55 and the side plate 60 are positioned relative to each other via the mounting member 59. As a result, the connectors 56 to 58 provided on the control board 55 are positioned reliably and accurately with respect to the side plate 60 (side wall portion 61). Then, the control unit 50 can be housed in the housing 10 by inserting the control unit 50 into the housing 10 along the X-axis direction. As described above, according to the manufacturing method of the radiation imaging device 1, the connectors 56 to 58 provided on the control board 55 can be positioned easily and accurately.

[0116] Furthermore, the manufacturing method of the radiation imaging device 1 includes a step of fixing the detection unit 30 to the control unit 50 before the step of inserting the control unit 50. According to the above configuration, the detection unit 30 (sensor panel 31) can be easily positioned and electrically connected to the control unit 50 outside the housing 10, and the detection unit 30 (sensor panel 31) and the control unit 50 can be easily accommodated in the housing 10 as a single unit.

[0117] Furthermore, the process of assembling the control unit 50 includes a process of attaching the connectors 56, 57 to the side wall portion 61 after the process of fixing the side plate 60. According to the above-described configuration, the connectors 56, 57 are attached to the side wall portion 61 with the connectors 56, 57 positioned, so that the positions of the connectors 56, 57 positioned relative to the side wall portion 61 can be easily maintained.

[0118] In addition, in the process of attaching the connector 56, the pair of nuts 81A, 81B are screwed onto the shaft portion 56a from both sides of the side wall portion 61, thereby attaching the connector 56 to the side wall portion 61. According to the above configuration, the pair of nuts 81A, 81B are screwed onto the shaft portion 56a of the connector 56 from both sides of the side wall portion 61, thereby allowing the connector 56 to be firmly attached to the side wall portion 61. Furthermore, since the connector 56 is positioned with respect to the side plate 60 (side wall portion 61), the accuracy of the positioning of the connector 56 can be ensured when the pair of nuts 81A, 81B are screwed onto the shaft portion 56a of the connector 56. Similarly, in the process of attaching the connector 57, the connector 57 is attached to the side wall portion 61 by the pair of nuts 82A, 82B arranged on either side of the side wall portion 61. This allows the connector 57 to be firmly attached to the side wall portion 61. Furthermore, when the pair of nuts 82A, 82B are screwed onto the shaft portion 57a ​​of the connector 57, the accuracy of positioning of the connector 57 can be ensured.

[0119] [Detailed configuration of the detection unit] The detailed configuration of the detection unit 30 will be described with reference to FIG.

[0120] The chip 42 is, for example, a CMOS image sensor formed in a rectangular shape. The chip 42 is provided with a light receiving section (not shown) for receiving light from a scintillator 46 described later. The chip 42 is provided on the main surface 41a of the sensor substrate 41, and is fixed to the main surface 41a by die bonding. The chip 42 has a main surface 42a opposite to the surface facing the main surface 41a of the sensor substrate 41. The surface of the chip 42 is mirror-polished. An FOS 44 is provided on the main surface 42a via an OCA tape 43.

[0121] The OCA tape 43 is a rectangular double-sided tape made of an optically clear adhesive (OCA). The FOS 44 is a fiber optic plate with a scintillator (FOS). The thickness of the OCA tape 43 is, for example, 5 μm or more and less than 30 μm.

[0122] The FOS 44 has a FOP 45 which is a fiber optic plate (FOP) and a scintillator 46 formed by deposition on the FOP 45. The FOS 44 is provided on the chip 42 with the OCA tape 43 sandwiched therebetween. The surface of the FOP 45 is mirror-polished. The scintillator 46 is formed of a scintillator material mainly composed of, for example, CsI, GOS (terbium-activated gadolinium oxysulfide), NaI (sodium iodide), or the like. In this embodiment, the scintillator 46 is formed of a scintillator material mainly composed of GOS. The main surface 42a of the chip 42 is fixed to one surface of the OCA tape 43. The surface of the FOP 45 opposite to the surface on which the scintillator 46 is deposited is fixed to the other surface of the OCA tape 43. That is, the chip 42 and the FOS 44 are fixed to each other by the OCA tape 43.

[0123] The refractive index of the OCA tape 43 may be close to the refractive index of the FOS 44 or may be the same as the refractive index of the FOS 44. In this case, when light is incident on the OCA tape 43 from the FOS 44 side, reflection of the light can be suppressed, thereby improving the efficiency of radiation detection. The refractive index of the OCA tape 43 may be close to the refractive index of the chip 42 or may be the same as the refractive index of the chip 42. In this case, when light is incident on the chip 42 from the OCA tape 43 side, reflection of the light can be suppressed, thereby improving the efficiency of radiation detection.

[0124] In the detection unit 30 configured as above, radiation incident through the cover member 20 is converted into light by the scintillator 46. The scintillator 46 outputs the converted light to a light receiving section (not shown) of the chip 42. The light received by the light receiving section is converted into an electrical signal and transmitted from the chip 42 to the sensor substrate 41 via a wire 47 described below.

[0125] The outer edge 431 of the OCA tape 43 and the outer edge 441 of the FOS 44 are located inside the outer edge 421 of the chip 42 when viewed from the Z-axis direction. That is, a portion of the chip 42 near the outer edge 421 is exposed. One end of a wire 47 is connected to the exposed portion. The other end of the wire 47 is connected to the sensor substrate 41. When viewed from the Z-axis direction, the wire 47 extends to the side of the OCA tape 43 and the side of the FOS 44. In this embodiment, the outer edge 431 of the OCA tape 43 is located inside the outer edge 441 of the FOS 44 when viewed from the Z-axis direction. As an example, the outer edge 431 is located inside the outer edge 441 by a predetermined distance of 1.0 mm or less.

[0126] The protective member 32 has a side portion 321 along the outer edge of one side (the right side in FIG. 14) of the opening 32a in the Y-axis direction. The side portion 321 extends along the X-axis direction. The side portion 321 is provided with a step portion 321a that protrudes toward the opening 32a along the Y-axis direction. With the main surface 41a of the sensor substrate 41 as a reference, the step portion 321a is located above (at a higher position) than the main surface 42a of the chip 42. The wire 47 is located below the step portion 321a in the Z-axis direction (the lower side in FIG. 14). The step portion 321a overlaps at least a part of the wire 47 when viewed from the Z-axis direction. As a result, the wire 47 is protected by the protective member 32 (the step portion 321a). In this embodiment (Figure 14), the portion of the wire 47 including the end connected to the main surface 42a of the chip 42 does not overlap with the step portion 321a in the Z-axis direction, but the step portion 321a may be arranged to overlap the entire wire 47.

[0127] When viewed from the Z-axis direction, the outer edge 33f of the opening 33a of the shielding member 33 is located inside (on the side of the intervening member 34) of the outer edge 441 (the outer edge 451 of the FOP 45 and the outer edge 461 of the scintillator 46) of the FOS 44. That is, when viewed from the Z-axis direction, the outer edge 33f of the shielding member 33 is located inside the outer edge of the opening 32a of the protective member 32, the outer edge 421 of the chip 42, and the outer edge 431 of the OCA tape 43. That is, when viewed from the Z-axis direction, the shielding member 33 overlaps the outer peripheral edge of the chip 42 (a portion including the outer edge 421), the outer peripheral edge of the OCA tape 43 (a portion including the outer edge 431), and the outer peripheral edge of the FOS 44 (a portion including the outer edge 451 of the FOP 45 and the outer edge 461 of the scintillator 46). A signal readout circuit, for example, including a charge amplifier, is provided in a portion of the chip 42 that overlaps the shielding member 33 and the FOS 44 in the Z-axis direction.

[0128] The shield member 33 is fixed to the surface 32e of the protective member 32 on the side where radiation is incident, by a double-sided tape 48. The shield member 33 has a back surface 33e facing the surface 32e of the protective member 32. The back surface 33e of the shield member 33 is fixed to one surface of the double-sided tape 48, and the surface 32e of the protective member 32 is fixed to the other surface of the double-sided tape 48. The double-sided tape 48 is provided on the entire back surface 33e of the shield member 33. That is, the double-sided tape 48 also covers a portion of the back surface 33e of the shield member 33 that does not overlap with the surface 32e of the protective member 32. In addition, in the Z-axis direction, the surface 32e of the protective member 32 is disposed at a higher position (closer to the pressing plate 35) than the surface 44a (surface 46a of the scintillator 46) of the FOS 44. That is, the shield member 33 and the double-sided tape 48 are disposed above the FOS 44 (closer to the pressing plate 35) in the Z-axis direction. Moreover, the interposition member 34 is located inside the outer edge 33f of the opening 33a of the shield member 33.

[0129] The screw S6 penetrates the double-sided tape 48 and is then screwed into the screw hole 32c of the protective member 32. The presser plate 35, the shield member 33, and the protective member 32 are fixed to one another by the screw S6. At the same time, the inner surface 35a of the presser plate 35 presses the interposed member 34 toward the scintillator 46 (the FOS 44).

[0130] In the process of assembling the detection unit included in the manufacturing method of the radiation imaging device 1 described above, a process of fixing the chip 42 to the main surface 41a of the sensor substrate 41 by die bonding is performed after a process of fixing the chip 42 and the FOS 44 to each other by the OCA tape 43. That is, with the chip 42 and the FOS 44 fixed to each other via the OCA tape 43, the chip 42 is fixed to the main surface 41a of the sensor substrate 41 by die bonding.

[0131] The detection unit 30 of the radiation imaging device 1 described above has a sensor substrate 41 having a main surface 41a, a chip 42 provided on the main surface 41a, an OCA tape 43 provided on the chip 42, and an FOS 44 provided on the chip 42 with the OCA tape 43 in between, and the FOS 44 is fixed to the chip 42 by the OCA tape 43. The effects of the sensor panel 31 configured in this manner will be described in comparison with the configuration of a sensor panel 31A which is a comparative example.

[0132] As shown in FIG. 15(a), the sensor panel 31A of the comparative example includes a sensor substrate 41, a chip 42 provided on the sensor substrate 41, and an FOS 44 provided on the chip 42. In the sensor panel 31A, unlike the sensor panel 31, the FOS 44 is not fixed to the chip 42. Specifically, in the sensor panel 31A, an air layer is formed between the chip 42 and the FOS 44, and the chip 42 and the FOS 44 are air-coupled. Therefore, when the chip 42 is fixed to the sensor substrate 41 by die bonding, the chip 42 is curved in accordance with the warping of the sensor substrate 41. In this case, the thickness of the air layer between the chip 42 and the FOS 44 changes, and there is a risk that interference fringes are reflected in the image captured by the radiation imaging device 1. For example, the chip 42 and the FOP 45 are mirror-polished, and light is reflected on the surfaces of the chip 42 and the FOP 45, causing interference fringes such as Newton's rings.

[0133] 15(b), in the sensor panel 31 of this embodiment, the FOS 44 is fixed to the chip 42 by the OCA tape 43. This makes it possible to prevent the chip 42 from curving in accordance with the warping of the sensor substrate 41, thereby making it possible to prevent the occurrence of interference fringes as described above. Therefore, the radiation imaging device 1 can improve the accuracy of images.

[0134] The detection unit 30 has a shield member 33 provided on the main surface 41a of the sensor substrate 41, and an opening 33a is provided in the shield member 33, and an outer edge 33f of the opening 33a is located inside an outer edge 421 of the chip 42, an outer edge 431a of the OCA tape 43, and an outer edge 441a of the FOS 44 when viewed from the Z-axis direction. This makes it possible to protect a signal readout circuit provided in a part of the chip 42 that overlaps with the shield member 33 and the FOS 44 in the Z-axis direction from radiation, thereby improving the reliability of the signal readout circuit. Furthermore, a part of the OCA tape 43 that overlaps with the shield member 33 in the Z-axis direction is also protected from radiation, thereby suppressing deterioration of the adhesiveness of the OCA tape 43.

[0135] The detection unit 30 has a protective member 32 provided on the main surface 41a of the sensor substrate 41, and the shield member 33 is fixed to the surface 32e of the protective member 32 on the side where radiation is incident by a double-sided tape 48, and the double-sided tape 48 is provided on the entire back surface 33e of the shield member 33 facing the front surface 32e of the protective member 32. This makes it possible to prevent powder particles (e.g., particles made of lead) generated from the shield member 33 from adhering to the sensor substrate 41, the chip 42, and the FOS 44. That is, the part of the double-sided tape 48 located inside the opening 32a of the protective member 32 plays a role in preventing the above-mentioned particles from peeling off. In addition, since the double-sided tape 48 is provided on the entire back surface 33e of the shield member 33, the member to be the shield member 33 can be processed together with the double-sided tape 48 in a state where the double-sided tape 48 is attached to the member. This makes it possible to easily process the double-sided tape 48 according to the shape of the shield member 33.

[0136] The detection unit 30 has an intervening member 34 arranged on a surface 44a of the FOS 44 on which radiation is incident, and a pressing plate 35 arranged on the surface 44a of the FOS 44 across the intervening member 34 for pressing the intervening member 34 towards the FOS 44. According to the above configuration, the pressing of the intervening member 34 can suppress the occurrence of warping of the sensor board 41.

[0137] The thickness of the OCA tape 43 may be less than 30 μm. By configuring the OCA tape 43 to be somewhat thin as described above, it is possible to suppress a decrease in resolution of an image captured by the radiation imaging device 1 due to the thickness of the OCA tape 43. On the other hand, the thinner the OCA tape 43, the higher the risk of air bubbles being mixed in when the OCA tape 43 is adhered, and the higher the risk of interference fringes due to the air bubbles appearing in the image. Therefore, the thickness of the OCA tape 43 may be 5 μm or more. By ensuring a certain thickness or more of the OCA tape 43 as described above, it is possible to reduce the risk of air bubbles being mixed in, and thus to suppress the occurrence of interference fringes due to the air bubbles.

[0138] The sensor substrate 41 and the chip 42 are connected by a wire 47, which extends laterally of the OCA tape 43 and the FOS 44 when viewed from the Z-axis direction, and the outer edge 431 of the OCA tape 43 is located inside the outer edge 441 of the FOS 44 when viewed from the Z-axis direction. This makes it possible to prevent the OCA tape 43 from contacting the wire 47. To add to the above, as shown in FIG. 14, the wire 47 and the FOS 44 are very close to each other. Therefore, if the area of ​​the OCA tape 43 is increased (for example, if the outer edge 431 of the OCA tape 43 is extended outside the outer edge 441 of the FOS 44), the risk of contact between the OCA tape 43 and the wire 47 increases. From the viewpoint of reducing such a risk, it is preferable to configure the outer edge 431 of the OCA tape 43 to be located slightly inside the outer edge 441 of the FOS 44, as described above.

[0139] On the other hand, if the area of ​​the OCA tape 43 is made too small (i.e., if the outer edge 431 of the OCA tape 43 is located inside the outer edge 441 of the FOS 44 and the distance between the outer edges 431 and 441 is made too large), there may be a portion on the outer edge of the light receiving section of the chip 42 where the OCA tape 43 is not arranged. In this case, the presence or absence of the OCA tape 43 between the chip 42 and the FOS 44 may cause variation in light receiving sensitivity within the light receiving section. Therefore, from the viewpoint of suppressing the variation in light receiving sensitivity as described above (i.e., so that substantially the entire light receiving section of the chip 42 is covered with the OCA tape 43), the outer edge 431 of the OCA tape 43 may be provided so as to be located inside the outer edge 441 of the FOS 44 by a predetermined distance of 1.0 mm or less when viewed from the Z-axis direction.

[0140] In the manufacturing method of the radiation imaging device 1, a step of fixing the chip 42 to the main surface 41a of the sensor substrate 41 is performed after a step of fixing the chip 42 and the FOS 44 to each other with the OCA tape 43. As a result, when the chip 42 is fixed to the main surface 41a of the sensor substrate 41, it is possible to prevent the chip 42 from curving in accordance with the warping of the sensor substrate 41, because the chip 42 and the FOS 44 are fixed to each other in advance.

[0141] [Variations] The present disclosure is not limited to the above embodiment. The materials and shapes of the above-mentioned components are not limited to the above-mentioned materials and shapes, and various materials and shapes can be adopted. In addition, some of the components included in the radiation imaging device 1 according to the above embodiment may be omitted or changed as appropriate. For example, in the above embodiment, some characteristic components included in the radiation imaging device 1 and some effects exerted by each component have been described, but the radiation imaging device according to the present disclosure does not necessarily need to be configured to exert all the effects described in the above embodiment, and may be configured to exert only some of the effects described in the above embodiment. In the latter case, the radiation imaging device only needs to have a configuration essential for exerting at least the part of the effect, and the configuration that is not essential for exerting the part of the effect may be omitted or changed as appropriate. Note that, when focusing on one effect, the configuration essential for exerting the one effect should be reasonably understood based on technical common sense and the description of this specification, based on the standard of a person skilled in the art. Below, some specific modified examples of the radiation imaging device of the present disclosure are illustrated.

[0142] In the above embodiment, the sensor panel 31 (detection unit 30) is fixed to the control unit 50, but the sensor panel 31 does not have to be fixed to the control unit 50. For example, the sensor panel 31 may be attached to the housing 10 separately from the control unit 50. In this case, the sensor panel 31 may be electrically connected to the control unit 50 via the housing 10 or via a connection member connected to the housing 10.

[0143] In the above embodiment, in a state in which the control unit 50 is accommodated in the housing 10, the side wall portion 61 is disposed at a position corresponding to the opening 13a. However, the side wall portion 61 does not necessarily have to be disposed at a position corresponding to the opening 13a. For example, the side wall portion 61 may be disposed at a position overlapping the side surface portion 13 (a position overlapping any one of the first portion 131, the second portion 132, and the third portion 133). In this case, an opening (an opening different from the opening 13a; hereinafter, referred to as "another opening") for exposing the connectors 56 to 58 to the outside of the housing 10 may be provided in the portion of the side surface portion 13 that overlaps with the side wall portion 61. That is, the opening 13a for inserting the control unit 50 into the housing 10 and the opening for exposing the connectors 56 to 58 of the control unit 50 accommodated in the housing 10 to the outside of the housing 10 may be different from each other. Even in such a case, the connectors 56 to 58 can be positioned relative to the side plate 60 (side wall portion 61) outside the housing 10, and then the control unit 50 is accommodated and positioned at a predetermined position relative to the housing 10, so that the connectors 56 to 58 positioned relative to the side wall portion 61 can be exposed to the outside of the housing 10 through another opening in the side surface portion 13. When the side wall portion 61 is arranged at a position overlapping the side surface portion 13 in this way, the control unit 50 may have another side plate (a side plate provided separately from the side plate 60) for closing the position corresponding to the opening 13a. However, as in this embodiment, by configuring the side wall portion 61 to be arranged at a position corresponding to the opening 13a when the control unit 50 is accommodated in the housing 10, the following advantages can be obtained. First, there is no need to provide another opening or another side plate as described above. Furthermore, in the configuration in which the side wall portion 61 overlaps the side surface portion 13 as described above, if a slight positional misalignment occurs between the housing 10 and the control unit 50, the positions of the connectors 56-58 relative to the housing 10 (for example, the amount of protrusion of the connectors 56-58 relative to the outer wall of the housing 10) will also be affected by the above-mentioned positional misalignment.In contrast, according to the configuration of this embodiment in which the side wall 61 is disposed at a position corresponding to the opening 13a, even if a slight positional misalignment occurs between the housing 10 and the control unit 50 (for example, variation in the amount of pressing of the control unit 50 into the housing 10), the amount of protrusion of the connectors 56-58 from the side wall 61 is not affected by the positional misalignment. Therefore, according to the configuration of this embodiment, the positioning accuracy of the connectors 56-58 can be more reliably ensured.

[0144] In the above embodiment, the opening 61a of the side plate 60 is a through hole, but the opening 61a may have any shape that allows the shaft portion 56a of the connector 56 to pass through. For example, the opening 61a may be a notch. Similarly, the openings 61b and 61c may have a shape other than a through hole (for example, a notch).

[0145] In the above embodiment, the side wall portion 61 of the side plate 60 extends along the YZ plane, but the side wall portion 61 may extend along two or more surfaces. For example, the side wall portion 61 may have a portion extending along the YZ plane and a portion extending along the XZ plane. Specifically, the side wall portion 61 may be formed in an L-shape when viewed from the Z-axis direction to define two sides of the storage space in the housing 10. Alternatively, the side wall portion 61 may be formed in a C-shape when viewed from the Z-axis direction to define three sides of the storage space in the housing 10. In addition, in the above embodiment, the opening 13a is provided only at a position facing the third portion 133 of the side surface portion 13, but an opening may also be provided in the first portion 131 or the second portion 132 so as to correspond to the shape of the side wall portion 61 of the side plate 60. For example, the side surface portion 13 may be configured to have an L-shaped or C-shaped opening surface when viewed from the Z-axis direction.

[0146] In the above embodiment, the multiple connectors 56-58 are provided on the control board 55, but at least one connector may be provided on the control board 55. Similarly, in the above embodiment, the opposing wall portion 591 is provided with multiple notches 593, 594, but for example, when there is only one connector, only one notch corresponding to the connector may be provided. Also, the connectors 56-58 may be provided on the main surface 55a of the control board 55. Also, the mounting member 59 may have a wall portion facing the main surface 55a of the control board 55. When the connectors 56-58 are provided on the main surface 55a of the control board 55 and the mounting member 59 has a wall portion facing the main surface 55a, the wall portion may be provided with notches similar to the notches 593, 594 in the above embodiment. [Explanation of symbols]

[0147] 1...radiation imaging device, 10...housing, 11a...opening (third opening), 12...bottom wall portion, 12a...through hole, 12b...first through hole, 12c...second through hole, 13...side portion, 13a...opening (second opening), 20...cover member, 31...sensor panel, 50...control unit, 55...control board, 55a...main surface, 55b...rear surface, 56, 57, 58...connectors, 56a, 57a...shaft portion, 59...mounting member, 60...side plate, 61...side wall portion, 61a, 61b, 61c...openings, 71...first fixing member, 72...second fixing member, 81A, 81B, 82A, 82B...nuts, 591...opposing wall portion, 593, 594...cutout, 595...protrusion, M...member.

Claims

1. A sensor panel for detecting radiation; A control unit; a housing that houses the sensor panel and the control unit; The control unit a control board having a main surface facing the sensor panel along a first direction perpendicular to the sensor panel and a back surface opposite to the main surface, the control board controlling reading of signals from the sensor panel; a mounting member on which the control board is mounted; a side plate fixed to the mounting member and having a side wall portion with a first opening; at least one connector provided on the control board for connecting the control board to an external device and passing through the first opening of the side wall portion; The radiation imaging device, wherein the housing has a second opening for inserting the control unit into the housing along a second direction perpendicular to the first direction.

2. When the sensor panel and the control unit are housed in the housing, the side wall portion is disposed at a position corresponding to the second opening. The radiation imaging apparatus according to claim 1 .

3. The sensor panel is fixed to the control unit.

3. The radiation imaging apparatus according to claim 1.

4. the at least one connector is attached to the sidewall; 3. The radiation imaging apparatus according to claim 1.

5. the at least one connector is provided on at least one of the main surface and the back surface of the control board, the mounting member has an opposing wall portion that faces one of the main surface and the back surface of the control board on which the at least one connector is provided, At least one notch is provided in the opposing wall portion at a position overlapping with at least a portion of the at least one connector in the first direction. The radiation imaging apparatus according to claim 4 .

6. The at least one connector comprises a plurality of connectors; the at least one notch comprises a plurality of notches; the opposing wall portion is located between two adjacent connectors when viewed from the first direction to separate the two adjacent cutouts from each other, and has a protrusion portion in contact with the side wall portion; The radiation imaging apparatus according to claim 5 .

7. The side wall portion is further provided with a pair of nuts disposed on either side of the side wall portion. the at least one connector has a shaft portion passing through the first opening and threadedly engaged with each of the pair of nuts; The at least one connector is attached to the side wall portion by screwing the pair of nuts onto the shaft portion from both sides of the side wall portion. The radiation imaging apparatus according to claim 4 .

8. The side wall portion is further provided with a pair of nuts disposed on either side of the side wall portion. the at least one connector has a shaft portion passing through the first opening and threadedly engaged with each of the pair of nuts; the at least one connector is attached to the side wall portion by screwing the pair of nuts onto the shaft portion from both sides of the side wall portion, The at least one notch is provided at a position overlapping with the nut on the control board side in the first direction. The radiation imaging apparatus according to claim 5 .

9. The at least one connector is provided on the back surface of the control board.

3. The radiation imaging apparatus according to claim 1.

10. The housing has a bottom wall portion located on the opposite side to a side on which radiation is incident, The bottom wall portion is provided with at least one through hole.

3. The radiation imaging apparatus according to claim 1.

11. The at least one through hole includes at least one first through hole through which a first fixing member for fixing the mounting member to the housing is inserted. The radiation imaging apparatus according to claim 10.

12. the at least one through hole further includes at least one second through hole through which a second fixing member for fixing the mounting member to a member disposed outside the housing is inserted; The radiation imaging apparatus according to claim 11.

13. Further comprising a cover member, a third opening is provided in the housing at a position facing the sensor panel on a side where radiation is incident, The cover member is attached to the housing so as to cover the third opening.

3. The radiation imaging apparatus according to claim 1.

14. The housing and the cover member are formed of different materials. The radiation imaging apparatus according to claim 13.

15. the cover member is fixed to both the housing and the side plate at a position where the cover member overlaps both the housing and the side plate when viewed from the first direction; The radiation imaging apparatus according to claim 13.

16. the housing has a side surface portion extending in the first direction and having the second opening portion provided therein; The mounting member is not in contact with the side surface.

3. The radiation imaging apparatus according to claim 1.

17. A method for manufacturing the radiation imaging device according to claim 1, comprising the steps of: assembling the control unit; inserting the control unit into the housing along the second direction; The step of assembling the control unit includes: mounting the control board on the mounting member; and fixing the side plate to the mounting member. A method for manufacturing a radiation imaging device.

18. before the step of inserting the control unit, fixing the sensor panel to the control unit; The method for manufacturing a radiation imaging device according to claim 17.

19. The step of assembling the control unit further includes the step of attaching the at least one connector to the side wall portion after the step of fixing the side plate. The method for manufacturing a radiation imaging device according to claim 17 or 18.

20. the at least one connector has a shaft that passes through the first opening; In the step of attaching the at least one connector, a pair of nuts are screwed onto the shaft portion from both sides of the side wall portion, thereby attaching the at least one connector to the side wall portion. The method for manufacturing a radiation imaging device according to claim 19.

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