Shake correction device and imaging apparatus

Abstract

To provide a shake correction device that corrects an image shake by moving a movable member including an imaging element and an imaging apparatus including the shake correction device.SOLUTION: In a shake correction device 1, a base 24 holding an imaging element 20 has a recess 200 on a side surface, a coil C3 of an actuator is fixed to a base 24 by entering a straight portion C3A of the coil C3 into the recess 200, and the base 24 and the straight portion C3A of the coil C3 are overlapped when the imaging element 20 is viewed from the optical axis K direction.SELECTED DRAWING: Figure 12

Description

[Technical field]

[0001] The present invention relates to a blur correction device for correcting image blur, and an imaging apparatus equipped with the blur correction device. [Background technology]

[0002] Patent Document 1 discloses a blur correction device that includes at least three coil groups, where one coil group is made up of two coils arranged opposite each other along a plane perpendicular to the optical axis, and in which the driving forces of the two coils that make up each coil group are different from each other. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2016-170339 A Summary of the Invention

[0004] One embodiment of the technique of the present disclosure provides a blur correction device that corrects image blur by moving a movable part including an imaging element, and an imaging device including this blur correction device. [Means for solving the problem]

[0005] The image stabilization device according to a first aspect of the present invention has a holding member that holds an image sensor, and is equipped with a movable part that is movable within a plane intersecting the optical axis, a fixed part that has a magnet and a yoke of an actuator, and a flexible substrate that is provided on the movable part and has a coil of the actuator mounted thereon, the holding member having a recessed portion on a side thereof, and the coil is fixed to the holding member with a portion of the coil extending into the recessed portion, and when the image sensor is viewed from the optical axis direction, the holding member and a portion of the coil overlap.

[0006] A blur correction device according to a second aspect of the present invention is configured in such a way that, in the first aspect, a first reinforcing member for reinforcing the strength of the flexible substrate is provided on a surface of the flexible substrate opposite to the surface on which the coil is mounted, a second reinforcing member is provided relative to the first reinforcing member at a first interval in a first direction intersecting the optical axis, and a third reinforcing member is provided relative to the second reinforcing member at a second interval in a second direction intersecting both the optical axis and the first direction.

[0007] A third aspect of the present invention relates to a motion compensation device according to the second aspect, wherein the connection portion electrically connected to the coil is provided in a region of the flexible substrate where the first reinforcing member is provided.

[0008] A fourth aspect of the present invention is a blur correction device according to the second or third aspect, wherein the flexible substrate has first and second openings that engage with the convex portion of the holding member, the first opening being provided in an area where the first reinforcing member is provided, and the second opening being provided in an area where the second reinforcing member is provided.

[0009] A fifth aspect of the present invention relates to the image stabilizer of the fourth aspect, wherein the first opening is a long hole extending in the first direction, and the second opening is a round hole.

[0010] A blur correction device according to a sixth aspect of the present invention is the fourth or fifth aspect, in which, when the amount of gap between the first opening and the convex portion is A and the amount of overlap is B, the relationships A<first spacing<5×A and B<second spacing<4×B are satisfied.

[0011] A blur correction device according to a seventh aspect of the present invention is, in any one of the second to sixth aspects, a magnetic member is provided on one of the two faces of the first reinforcing member opposite the face on the flexible substrate side, and at least a portion of the magnetic member overlaps with the holding member when the imaging element is viewed from the optical axis direction.

[0012] An imaging device according to a first aspect of the present invention includes a motion compensation device according to any one of the first to seventh aspects, and an optical system that forms an optical image of a subject on an imaging element. [Brief description of the drawings]

[0013] [Figure 1] FIG. 1 is a diagram showing a schematic configuration of a camera as an embodiment of an imaging device. [Diagram 2] FIG. 2 is a functional block diagram showing one embodiment of the internal configuration of the camera. [Diagram 3] FIG. 3 is a perspective view of the image stabilization device as viewed from the front side. [Figure 4] FIG. 4 is a perspective view of the image stabilization device as viewed from the rear side. [Diagram 5] FIG. 5 is an exploded perspective view of the fixing member of the image stabilization device as viewed from the front side. [Figure 6] FIG. 6 is a perspective view of the movable member of the image stabilization device as viewed from the front side. [Figure 7] FIG. 7 is a perspective view of the movable member as viewed from the rear side. [Figure 8] FIG. 8 is a perspective view of the FPC board and the yoke of the movable member. [Figure 9] FIG. 9 is a perspective view of the yoke as viewed from the front side. [Figure 10] FIG. 10 is a perspective view of the movable member to which the FPC board is connected. [Figure 11] FIG. 11 is an enlarged perspective view of a main portion, showing a configuration in which a part of the coil is inserted into a recessed portion of the base and fixed to the base. [Figure 12] FIG. 12 is an enlarged front view of a main portion, showing a configuration in which a part of the coil is inserted into a recessed portion of the base and fixed to the base. [Figure 13] FIG. 13 is a development view of the assembly part as seen from the front side. [Figure 14] FIG. 14 is a development view of the assembly part as seen from the rear side. [Figure 15] FIG. 15 is a front view of the base. [Figure 16] FIG. 16 is an explanatory diagram showing an enlarged view of the structure including the coil and its surroundings. [Figure 17] FIG. 17 is an explanatory diagram showing an enlarged view of the structure including the coil and its surroundings. [Figure 18] FIG. 18 is an explanatory diagram showing the amount of the gap between the long hole and the boss in the X direction. [Figure 19] FIG. 19 is a graph showing the relationship between the amount of movement of the movable member and the reaction force of the magnetic attraction plate in the in-plane direction. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0015] FIG. 1 is a diagram showing a schematic configuration of a digital camera 100 which is an embodiment of an imaging apparatus of the present invention.

[0016] 1 is composed of a camera body 102 and a lens 104 provided on the camera body 102. The camera 100 in this example is a camera in which the lens 104 is detachable (replaceable) from the camera body 102, but may also be a camera with an integrated lens.

[0017] The camera 100 comprises a camera body 102 and a lens 104 that includes imaging optics 106 .

[0018] The camera body 102 includes a blur correction device 1, an image sensor driver 108 that drives the image sensor 20, an analog front end (AFE) 110, an image processing unit 112, a motion detection sensor 114, an operation unit 116, a display unit 118, and a system control unit 120 that provides overall control of the entire camera 100.

[0019] The image stabilization device 1 includes a movable member 2 including an imaging element 20, and a fixed member 3 that movably supports the movable member 2. Note that the image stabilization device 1 is an example of a image stabilization device of the present invention. The movable member 2 is an example of a movable portion of the present invention, and the fixed member 3 is an example of a fixed portion of the present invention.

[0020] The imaging optical system 106 includes a lens group and an aperture, and forms an optical image of a subject on the imaging element 20 by moving a part or the entire lens group along an optical axis.

[0021] The imaging element 20 captures an image of a subject through an imaging optical system 106. The imaging element 20 includes a semiconductor chip on which a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor or the like is formed, and a package that houses the semiconductor chip. The imaging element 20 is an example of an imaging element of the present invention.

[0022] As will be described later, the light receiving surface 20A (see FIG. 3) of the image sensor 20 is configured in a rectangular shape. Note that the light receiving surface 20A refers to the pixel region T of the image sensor 20, and is a rectangular region having a smaller surface area than the region of the image sensor 20 including the package.

[0023] The image stabilization device 1 includes a movable member 2 including an image sensor 20, and a fixed member 3 that supports the movable member 2 and is fixed to a camera body 102. The fixed member 3 supports the movable member 2 movably within a plane that intersects with the optical axis K of the image sensor 20. In this embodiment, the movable member 2 is supported movably within a plane that is perpendicular to the optical axis K of the image sensor 20. The term "perpendicular" includes a range that is recognized as being substantially perpendicular.

[0024] The image blur correction device 1 corrects image blur in an image captured by the image sensor 20 by moving the light receiving surface 20A of the image sensor 20 within a plane perpendicular to the optical axis K of the image sensor 20 (within a plane intersecting the optical axis K). The optical axis K of the image sensor 20 is a virtual straight line that passes through the center P of the light receiving surface 20A of the image sensor 20 and is perpendicular to the light receiving surface 20A.

[0025] In this specification, a state in which the optical axis OA of the imaging optical system 106 and the optical axis K of the imaging element 20 are coaxially positioned is defined as a reference state. In the reference state, the center P of the light receiving surface 20A of the imaging element 20 is positioned on the optical axis OA of the imaging optical system 106.

[0026] A detailed configuration of the image blur correction device 1 will be described later, but in the above-mentioned reference state, the image blur is corrected by moving a movable member 2 including the image sensor 20 relative to a fixed member 3 in three directions: direction X which is the longitudinal direction of the light receiving surface 20A of the image sensor 20, direction Y which is the lateral direction of the light receiving surface 20A, and direction θ which is a direction around the optical axis (a rotational direction about the optical axis K).

[0027] The AFE 110 performs predetermined analog signal processing on the image signal output from the image sensor 20, converts it into a digital signal, and outputs it.

[0028] The image processing unit 112 performs digital signal processing on the imaging signal processed by the AFE 110 to generate captured image data.

[0029] The motion detection sensor 114 is a sensor for detecting the motion of the camera 100 (camera body 102), and is configured by an acceleration sensor or an angular velocity sensor, or both of these.

[0030] The system control unit 120 controls the image sensor driving unit 108 and the AFE 110 to cause the image sensor 20 to capture an image of a subject and to cause the image sensor 20 to output an image signal corresponding to the subject image.

[0031] An operation unit 116 includes various operation members such as a release switch for operating the timing of driving a shutter (not shown), a user interface unit for setting various settings such as the shooting mode for the camera 100, and a power switch.

[0032] Display unit 118 is provided on the rear surface of camera body 102, and displays live view images, playback images, information (menus) related to operations, etc. A user interface unit (not shown) of operation unit 116 also includes a touch panel disposed on top of display unit 118.

[0033] The system control unit 120 controls the image stabilization device 1 based on the motion information of the camera 100 detected by the motion detection sensor 114. The system control unit 120 controls the movement of the movable member 2 including the image sensor 20, and corrects image blur in the image captured by the image sensor 20 by moving the light receiving surface 20A of the image sensor 20 in at least one of the directions X, Y, and θ.

[0034] When the shake correction function is ON and no motion of the camera 100 is detected by the motion detection sensor 114, the system control unit 120 controls the operation of the shake correction device 1 so that the position of the light receiving surface 20A of the image sensor 20 becomes the position in the above-mentioned reference state. Note that when the shake correction function is OFF, the system control unit 120 controls the operation of the shake correction device 1 so that the position of the light receiving surface 20A of the image sensor 20 maintains the position in the above-mentioned reference state.

[0035] (Processor) In the above embodiment, the hardware structure of the processing units that execute various processes in the image sensor driving unit 108, the AFE 110, the image processing unit 112, and the system control unit 120 is various processors as shown below.

[0036] Various types of processors include a CPU (Central Processing Unit), which is a general-purpose processor that executes software (programs) and functions as various processing units, a Programmable Logic Device (PLD), which is a processor whose circuit configuration can be changed after manufacture, such as an FPGA (Field Programmable Gate Array), and a dedicated electrical circuit, such as an ASIC (Application Specific Integrated Circuit), which is a processor having a circuit configuration designed specifically to execute a specific process.

[0037] A single processing unit may be configured with one of these various processors, or may be configured with two or more processors of the same or different types (e.g., multiple FPGAs, or a combination of a CPU and an FPGA). Also, multiple processing units may be configured with a single processor.

[0038] As an example of configuring multiple processing units with one processor, first, there is a form in which one processor is configured with a combination of one or more CPUs and software, as typified by a computer such as a client or server, and this processor functions as multiple processing units. Second, there is a form in which a processor is used that realizes the functions of the entire system including multiple processing units with one IC (Integrated Circuit) chip, as typified by a system on chip (SoC). In this way, the various processing units are configured using one or more of the above various processors as a hardware structure.

[0039] Furthermore, the hardware structure of these various processors is, more specifically, an electric circuit that combines circuit elements such as semiconductor elements.

[0040] The above configurations and functions can be realized by any hardware, software, or a combination of both. For example, the present invention can be applied to a program that causes a computer to execute the above processing steps (processing procedures), a computer-readable recording medium (non-transitory recording medium) that records such a program, or a computer in which such a program can be installed.

[0041] FIG. 2 is a functional block diagram showing a schematic configuration of the image stabilization device 1 in the camera 100 shown in FIG.

[0042] As shown in FIG. 2, the image stabilization device 1 includes a movable member 2 that is movable in each of directions X, Y, and θ, and a fixed member 3 that supports the movable member 2 so that it is movable in each of directions X, Y, and θ.

[0043] The movable member 2 has a circuit board 22 on which the imaging element 20 is mounted, an X-axis / rotational drive coil C1, an X-axis / rotational drive coil C2, and a Y-axis drive coil C3.

[0044] The movable member 2 also has Hall elements h1, h2, and h3 that constitute a Hall sensor for position detection. Output signals from the Hall elements h1, h2, and h3 are input to a system control unit 120 (see FIG. 1). The system control unit 120 controls the control currents flowing through the coils C1, C2, and C3 based on the output signals from the Hall elements h1, h2, and h3, respectively, to move the movable member 2 and correct image blur. As will be described later, the coil C3 is an example of a coil of an actuator of the present invention.

[0045] The fixed member 3 has yokes 3A and 3B as described below. The yoke 3A has a magnet Mv1 for X-axis and rotational drive, a magnet Mv2 for X-axis and rotational drive, and a magnet Mv3 for Y-axis drive (see FIG. 5). The yoke 3B is disposed at a position facing the magnets Mv1, Mv2, and Mv3 (see FIG. 5).

[0046] The magnet Mv1, the magnet Mv2, and the magnet Mv3 are examples of the magnets of the actuator of the present invention, and the yoke 3A and the yoke 3B are examples of the yoke of the present invention.

[0047] Fig. 3 is a perspective view of the motion compensation device 1 as viewed from the front side (hereinafter abbreviated as "front side") of camera body 102. Fig. 4 is a perspective view of the motion compensation device 1 as viewed from the rear side (hereinafter abbreviated as "rear side") of camera body 102. As shown in Figs. 3 and 4, the motion compensation device 1 includes a movable member 2 and a fixed member 3.

[0048] The image stabilization device 1 includes a movable member 2 to which a circuit board 22 on which an image sensor 20 is mounted is fixed, and a fixed member 3 having yokes 3A and 3B.

[0049] The yoke 3A is disposed on the rear side of the movable member 2. The yoke 3B is disposed on the front side of the movable member 2. With the movable member 2 sandwiched between the yoke 3A and the yoke 3B, the yoke 3A and the yoke 3B are fixed to each other by a plurality of screws 4.

[0050] The image stabilizer 1 is fixed to the camera body 102 with the light receiving surface 20A of the image sensor 20 facing the imaging optical system 106 (see FIG. 1). In FIG. 3, a rectangular pixel region T of the light receiving surface 20A is indicated by a dashed line.

[0051] The image blur correction device 1 corrects image blur by moving the movable member 2 in a direction θ around the optical axis, in a direction X which is the longitudinal direction of the light receiving surface 20A, and in a direction Y which is the lateral direction of the light receiving surface 20A.

[0052] In the following description, a direction parallel to the optical axis K of the image sensor 20 is referred to as direction Z. In this embodiment, the movable member 2 moves along a plane (XY plane) that perpendicularly intersects with the optical axis K (direction Z). Note that the Z(+) direction of direction Z indicates the direction toward the front side, and the Z(-) direction indicates the direction toward the back side.

[0053] The movable member 2 can move from the reference state by the same distance in each of the X(+) direction (leftward) and the X(-) direction (rightward) of the X direction. Note that the X(+) direction and the X(-) direction refer to the directions when the camera 100 is viewed from the rear side. The same applies below.

[0054] The movable member 2 is movable from the reference state by the same distance in both the Y(+) direction (upward) and the Y(-) direction (downward) of the Y direction.

[0055] The movable member 2 is rotatable from a reference state by the same angle in one direction (right-handed rotation direction) and the other direction (left-handed rotation direction) of the direction θ.

[0056] In the camera 100 shown in FIG. 1, a posture in which the direction Y shown in FIG. 3 is parallel to the direction of gravity is regarded as a normal posture (a posture for taking a landscape shot).

[0057] FIG. 5 is an exploded perspective view of the fixed member 3 (yokes 3A, 3B) of the motion compensation device 1 shown in FIGS. 3 and 4, viewed from the front side.

[0058] 5, the yoke 3A has a plate-shaped base 10 having a flat surface perpendicular to the direction Z. The base 10 has through holes 12 for inserting and arranging three FPC boards (Flexible Printed Circuits) 50, 60, and 70 (see FIG. 4).

[0059] The yoke 3B is configured in an inverted L-shape when viewed from the front side. The yoke 3B is configured in an inverted L-shape with the X(+) direction side and the Y(-) direction side being open when viewed from the front side.

[0060] Magnets Mv1 and Mv2 are fixed to the surface of the portion extending along the direction Y on the front side of the yoke 3A with a gap therebetween.

[0061] A magnet Mv3 is fixed to the surface of a portion extending along the direction X on the front side of the yoke 3A.

[0062] In order to prevent leakage of magnetic flux to the surroundings, the yoke 3B is disposed in a position overlapping the magnets Mv1, Mv2, and Mv3 when viewed from the front side. The shape of the yoke 3B is not limited to a substantially L-shape, and may be a substantially U-shape, as long as it overlaps the magnets Mv1, Mv2, and Mv3.

[0063] On the front surface of the yoke 3A, flat plates 16A, 16B, and 16C are provided which are perpendicular to the direction Z. The flat plates 16A, 16B, and 16C are all located at the same position in the direction Z and are all formed on the same plane. These flat plates 16A, 16B, and 16C will be described later.

[0064] Fig. 6 is a perspective view of the movable member 2 of the image stabilizer 1 shown in Fig. 3 and Fig. 4, as viewed from the front side. Fig. 7 is a perspective view of the movable member 2 shown in Fig. 6, as viewed from the rear side.

[0065] 6 and 7, the movable member 2 includes a rectangular base 24 that holds the imaging element 20. The base 24 has an opening 25 for exposing a part of the circuit board 22 on the rear side, as shown in Fig. 7. The base 24 is an example of a holding member of the present invention.

[0066] 8 is a perspective view of the yoke 3A and the FPC board 14 (FPC board 14 having wiring for supplying control current to coils C1, C2, and C3) provided on the movable member 2, as viewed from the front side. The FPC board 14 is configured integrally with the FPC board 50 (see FIG. 4). The FPC board 14 and the FPC board 50 are an example of a flexible board of the present invention on which the coil (coil C3) of the actuator is mounted.

[0067] Fig. 9 is a perspective view of the yoke 3A as viewed from the front side. Note that Fig. 9 also shows coils C1, C2, and C3 mounted on the FPC board 14 (see Fig. 8).

[0068] As shown in FIG. 9, a coil C1 is disposed at a position facing the magnet Mv1, a coil C2 is disposed at a position facing the magnet Mv2, and a coil C3 is disposed at a position facing the magnet Mv3.

[0069] Coil C1 and magnet Mv1 form a VCM (Voice Coil Motor) for driving the X-axis.

[0070] The X-axis driving VCM moves the movable member 2 in the X direction by the Lorentz force between the coil C1 and the magnet Mv1 when a control current flows through the coil C1.

[0071] Coil C2 and magnet Mv2 form a VCM. This VCM and the above-mentioned X-axis drive VCM form a rotation drive VCM.

[0072] The VCM for rotational drive rotates the movable member 2 around the optical axis K with the center P of the light receiving surface 20A as the center of rotation by using the Lorentz force between coil C1 and magnet Mv1 and the Lorentz force between coil C2 and magnet Mv2, by reversing the direction of the control current passed through coil C1 and coil C2.

[0073] Coil C3 and magnet Mv3 form a VCM for driving the Y-axis.

[0074] The Y-axis driving VCM moves the movable member 2 in the Y direction by the Lorentz force between the coil C3 and the magnet Mv3 by passing a control current through the coil C3.

[0075] As shown in Fig. 7, a Hall element h1 is disposed at the center of the coil C1, and a Hall element h2 is disposed at the center of the coil C2. A Hall element h3 is disposed at the center of the magnet M for position detection. The Hall elements h1 and h2 are fixed to the FPC board 14. The magnet M is fixed to the base 10 of the yoke 3A (see Fig. 9). The Hall element h3 is fixed to the circuit board 22.

[0076] The Hall element h1 is fixed at a position facing the midpoint between the south pole and the north pole of the magnet Mv1 (see FIG. 5).

[0077] The hall element h2 is fixed at a position facing the midpoint between the south pole and the north pole of the magnet Mv2.

[0078] The Hall element h3 is fixed at a position facing the midpoint between the south pole and the north pole of the magnet M. In addition, the Hall element h3 is disposed within the pixel region T of the image sensor 20 when the image sensor 20 is viewed from the optical axis K direction (see FIG. 3).

[0079] The Hall element h1 outputs a signal corresponding to the magnetic field generated by the magnet Mv1, and the system control unit 120 detects the position of the movable member 2 in the direction X based on a change in the output of this signal.

[0080] The Hall element h2 outputs a signal corresponding to the magnetic field generated by the magnet Mv2, and the system control unit 120 detects the position of the movable member 2 in the direction X based on a change in the output of this signal.

[0081] The Hall element h3 outputs a signal corresponding to the magnetic field generated by the magnet M, and the system control unit 120 detects the position of the movable member 2 in the Y direction.

[0082] Based on the change in the output signal of the Hall element h1 and the change in the output signal of the Hall element h2, the system control unit 120 detects the rotation angle of the movable member 2 about the optical axis K as the position of the movable member 2 in the direction θ.

[0083] 8, the FPC board 14 is provided with a plurality of magnetic attraction plates 18 that urge the movable member 2 toward the fixed member 3 by the magnetic forces of magnets Mv1, Mv2, and Mv3. By urging the movable member 2 toward the fixed member 3, the movable member 2 is prevented from floating up from the fixed member 3. This allows the movable member 2 to be movably held relative to the fixed member 3. Note that a coil spring may be used instead of the magnetic attraction plates 18. Also, a combination of a coil spring and a magnetic attraction plate may be used.

[0084] 7, recesses 28A, 28B, and 28C are disposed on the base 24 of the movable member 2 at positions facing the planar plates 16A, 16B, and 16C of the yoke 3A. The bottom surface of each of the recesses 28A, 28B, and 28C is formed as a plane perpendicular to the direction Z. The recesses 28A, 28B, and 28C each house a rolling element 26 for supporting the movable member 2 movably within the XY plane.

[0085] The bottom surfaces of the recesses 28A, 28B, and 28C are all located at the same position in the direction Z and are all formed on the same plane. In this example, the three bottom surfaces are arranged on the same plane, but they do not have to be on the same plane as long as they are in a relatively parallel positional relationship. The movable member 2 moves smoothly within a plane (XY plane) intersecting the optical axis K (direction Z) by the rolling action of the three rolling bodies 26.

[0086] As shown in FIG. 7, connectors 32 and 34 are disposed on the rear side of the movable member 2.

[0087] The connectors 32 and 34 are disposed along the direction X at the end of the circuit board 22 on the Y(-) direction side. The connector 32 is a connector for high-speed communication. The connector 34 is a connector for driving the imaging element.

[0088] An FPC board 60 (see FIG. 4), which is a flexible board, is connected to the connector 32. This FPC board 60 is an FPC board having wiring for communicating imaging data (image data obtained by imaging; so-called RAW data) between the imaging element 20 and a main board (a board on which the system control unit 120 and the like are formed: not shown), and the imaging element 20 and the main board are electrically connected via the FPC board 60.

[0089] An FPC board 70 (see FIG. 4), which is a flexible board, is connected to the connector 34. The FPC board 70 has wiring for supplying power to the imaging element 20 and a ground wiring, and the imaging element 20 and the main board are electrically connected via the FPC board 70.

[0090] The flexible FPC board 50 (see FIG. 4) is an FPC board having wiring for driving each VCM, and each coil C1, C2, C3 of each VCM is electrically connected to the main board via the FPC board 50 (including the FPC board 14).

[0091] FIG. 10 is a perspective view of the movable member 2 to which the FPC boards 60 and 70 are connected, as viewed from the rear side.

[0092] 10, FPC boards 60, 70 are respectively connected to movable member 2. One end of FPC boards 60, 70 is respectively connected to connectors 32, 34. FPC boards 60, 70 are routed from connectors 32, 34 in the Y(+) direction and drawn out to the rear side of yoke 3A through through hole 12 of yoke 3A, then bent in the Y(-) direction midway, and the other end is respectively connected to the main board. The above is the main configuration of camera 100 of the embodiment.

[0093] Here, a digital camera, which is an example of an imaging device, is equipped with a shake correction function to deal with image blur caused by camera shake. Conventionally, optical image stabilization (OIS) in the lens was mainstream, but in recent years, due to improved performance of digital cameras and the miniaturization of the overall size of cameras and lenses, an increasing number of models are equipped with in-body image stabilization (BIS) that drives the image sensor to correct image blur. Note that BIS is also adopted in the shake correction device 1 of the embodiment.

[0094] Image sensors are becoming larger due to higher pixel counts and improved image quality processing performance. Therefore, in order to miniaturize the BIS, it is necessary to devise the layout of the actuator that drives the image sensor, the layout of the sensor that detects the position of the image sensor, and the routing of the FPC board that connects the image sensor circuit board and the main board.

[0095] In BIS, a VCM is generally used as an actuator to drive the image sensor, and a Hall sensor is generally used as a sensor to detect the position of the image sensor. In a VCM, a magnetic circuit is composed of a coil, a magnet, and a yoke, while in a Hall sensor, a magnetic circuit is composed of a Hall element, a magnet, and a yoke.

[0096] In order to reduce the size (thinness) of the camera, it is preferable to place the VCM on the side of the holding member (corresponding to base 24 in the embodiment) that holds the image sensor, rather than on the back side of the holding member, but there are various designs to suit the space around the BIS and the camera exterior parts. For example, a magnetic circuit design that shares a magnet between the VCM and the Hall sensor can be selected, or a design that prioritizes miniaturization can be selected for a specific VCM magnetic circuit, and the BIS can be made smaller by combining these designs.

[0097] On the other hand, to drive the VCM, it is necessary to solder the lead wire of the VCM coil to a solder pad formed on the FPC board or the circuit board of the image sensor to electrically connect the coil and the main board. However, styling and soldering the lead wire is a process that requires assembly skills and therefore requires a lot of man-hours. The solder pad is an example of a connection part that is connected to the lead wire of the coil.

[0098] For these reasons, the mainstream design for BIS is to first glue (mount) the VCM coil onto an FPC board and solder the coil's lead wires to the solder pads of the FPC board to create an FPC board assembly component (hereafter referred to as the assembly component), and then assemble this assembly component into the holding member for the image sensor.

[0099] However, if a configuration is adopted in which the VCM coil is simply placed on the side of the above-mentioned holding member, while the device can be made smaller (thinner) in the optical axis direction, there is a problem in that the device becomes larger in the direction intersecting the optical axis direction by the amount that the coil protrudes in that direction (laterally).

[0100] Therefore, one technique of the present disclosure is to provide a motion compensation device and an imaging device that can solve the problem of large size. Means for solving this problem will be described below.

[0101] 11 and 12 are an enlarged perspective view and an enlarged front view of a main part, showing a configuration in which straight portion C3A of coil C3 is inserted into recessed portion 200 formed in the side surface of base 24 and fixed to base 24. Note that recessed portion 200 is an example of a recess of the present invention. Also, straight portion C3A of coil C3 is an example of a part of the present invention that enters recessed portion 200.

[0102] 11 and 12, the recessed portion 200 is formed on a side surface 202 along the direction X on the Y(+) direction side among multiple side surfaces of the base 24. Moreover, the recessed portion 200 does not refer to a portion recessed in the Y(-) direction from the imaginary side surface 202 indicated by the imaginary line D toward the bottom surface 204 of the recessed portion 200, but refers to a recessed portion for accommodating the straight portion C3A along the direction X on the Y(-) direction side of the coil C3.

[0103] That is, the recessed portion 200 refers to a portion recessed from the imaginary line E located on the Y(-) direction side of the imaginary line D toward the bottom surface 204 of the recessed portion 200. Note that the imaginary line E is an imaginary line connecting, along the direction X, each end 208 on the Y(+) direction side of a pair of curved portions 206 that accommodate the arc-shaped ends at both ends of the straight portion C3A.

[0104] With this configuration, in the image stabilization device 1 of the embodiment, the base 24 and the straight portion C3A of the coil C3 overlap when the image sensor 20 is viewed from the direction of the optical axis K. In other words, the straight portion C3A in FIG. 12 is accommodated in the recessed portion 200 of the base 24 and overlaps with the recessed portion 200.

[0105] Therefore, according to the image stabilizer 1 of the embodiment, the base 24 has a recessed portion 200 on its side, the coil C3 has straight portion C3A that enters recessed portion 200 and is fixed to the base 24, and since a configuration is adopted in which the base 24 and straight portion C3A overlap when the image sensor 20 is viewed from the direction of the optical axis K, it is possible to reduce the amount of protrusion of the coil C3 in the direction Y intersecting with the direction of the optical axis K by the amount of overlap B. This makes it possible to reduce the size of the image stabilizer 1, and as a result, the size of the camera 100.

[0106] The amount of overlap B mentioned above refers to the amount of overlap between recessed portion 200 and straight portion C3A in direction Y. Moreover, since image stabilization device 1 of the embodiment employs a structure in which straight portion C3A of coil C3 is assembled into recessed portion 200 formed in the side surface of base 24 (hereinafter referred to as an assembly under structure), image stabilization device 1 does not overlap with coil C3 when image stabilization device 20 is viewed from the optical axis K direction. In other words, image stabilization device 1 is also made thinner.

[0107] Incidentally, the above-mentioned assembly part (the FPC board on which the VCM coil is mounted) may be subjected to a load when it is attached to the base 24. In this case, assembly defects such as peeling of the coil adhesive, peeling of the solder, and breakage of the lead wires may occur.

[0108] Therefore, another technique of the present disclosure is to provide a vibration reduction device and an imaging device that can eliminate the problem of assembly defects while employing an under-assembly structure. Several means for solving this problem will be described below.

[0109] 13 and 14 are developments of the assembly part 5 in which the coils C1, C2, and C3 are mounted on the FPC board 14 (including the FPC board 50), as viewed from the front and rear sides.

[0110] In the assembly part 5 of this example, a plurality of reinforcing members 210, 212, 214, 216 for reinforcing the strength of the assembly part 5 are provided on the FPC board 14. Examples of means for providing these reinforcing members 210 to 216 on the FPC board 14 include fixing with an adhesive and fixing with a double-sided adhesive tape. Note that reinforcing members 218, 220, 222 are also provided on the FPC board 50. The reinforcing members 210 to 222 are, for example, plate-shaped members made of resin.

[0111] To reduce the height of the camera, it is necessary to reduce the size of the VCM magnetic circuit and the DR (dust reduction) unit fixing structure that are placed between the image sensor and the viewfinder. In this example, an under-assembly structure is adopted to achieve a low height, and the image stabilization device 1 is reduced in size by placing the coil C3 close to the image sensor 20 by the amount of overlap B.

[0112] Here, since the under-assembly structure can be said to be a structure that makes it difficult to assemble the coil C3 to the base 24, it is desirable to improve the ease of assembly of the coil C3 without affecting the VCM performance. Also, since the VCM performance is sensitive to the gap between the coil C3 and the magnet Mv3, it is necessary to position the coil C3 with high precision in the assembly height direction (direction Z).

[0113] Therefore, in the assembly part 5 of this embodiment, at least reinforcing members 210, 212, and 214 are provided on the surface of the FPC board 14 opposite to the surface on which the coil C3 is mounted, thereby suppressing the occurrence of lifting and warping of the FPC board 14. This makes it possible to improve the ease of assembling the coil C3 to the base 24.

[0114] 15, a plurality of height correction surfaces 230 are provided around the recessed portion 200 on the surface on the front side of the base 24. As a result, the straight portion C3A is assembled into the recessed portion 200 with the Assy part 5 pressed against the height correction surfaces 230. This makes it possible to accurately position the coil C3 in the assembly height direction (direction Z).

[0115] The height correction surface 230 is a disk-shaped protruding portion protruding in the Z(+) direction from the surface of the base 24. The height correction surface 230 is also provided around each of the recessed portions 224 and 226 in which the coils C1 and C2 are accommodated. This makes it possible to accurately position the coils C1 and C2 in the assembly height direction (Z direction).

[0116] It is also necessary to position the coil C3 with high precision in the in-plane (XY) directions. For this reason, the base 24 has bosses 232, 234 (see FIG. 15) protruding in the Z (+) direction from the front surface of the base 24. The assembly part 5 is assembled to the base 24 by fitting (engaging) the long hole 236 (see FIG. 13) for preventing rotation of the assembly part 5 and the round hole 238 for positioning into the bosses 232 and 234.

[0117] The long hole 236 is provided in an area where the reinforcing member 210 is provided, and the round hole 238 is provided in an area where the reinforcing member 212 is provided. The long hole 236 is provided so as to penetrate the reinforcing member 210, and the round hole 238 is provided so as to penetrate the FPC board 14 and the reinforcing member 212.

[0118] The bosses 232 and 234 are examples of the convex portion of the present invention. The long hole 236 and the round hole 238 are examples of the first opening and the second opening of the present invention. The round hole 238 is a hole formed in a circular or elliptical shape when viewed from an axis passing through its center, and the long hole 236 is a hole obtained by moving the round hole parallel to the axis passing through its center.

[0119] In order to prevent assembly defects such as wire breakage when the Assy part 5 is handled and attached to the base 24, reinforcing members 210 to 222 are provided on the fixed parts of the Assy part 5 other than the bent parts and the movable parts.

[0120] Since the attachment range (area) of the reinforcing members 210 to 222 in the assembly part 5 is wide, the assembly part 5 becomes hard overall. In other words, the assembly part 5 has the property of being difficult to bend and twist. Therefore, with this configuration, it is difficult to easily assemble the straight part C3A of the coil C3 into the recessed part 200 of the base 24.

[0121] In particular, in the assembled under structure, the reinforcing member needs to be temporarily distorted in order to insert the straight portion C3A into the recessed portion 200, but the reinforcing member has a strong reaction force against bending and twisting, which makes assembly defects likely to occur. In other words, after the assembly part 5 is assembled due to variations in the assembly part 5 and the assembly, the straight portion C3A is likely to float relative to the recessed portion 200 due to residual distortion of the reinforcing member, and the assembly part 5 floats or warps at high temperatures and over time, causing problems such as deterioration of vibration-proofing performance.

[0122] 13 and 14, the assembly part 5 of this example is provided with a reinforcing member 210 on the surface of the FPC board 14 opposite to the surface on which the coil C3 is mounted. Further, a reinforcing member 212 is provided with a first interval F (see FIG. 16) on the side of the reinforcing member 210 in a direction X (first direction) intersecting with the optical axis K. Further, a reinforcing member 214 is provided with a second interval G on the side of the reinforcing member 212 in a direction Y (second direction) intersecting with both the optical axis K and the direction X. Note that the reinforcing members 210, 212, and 214 are examples of the first, second, and third reinforcing members of the present invention, respectively.

[0123] By adopting such an arrangement of the reinforcing members 210, 212, 214, it becomes possible to bend or twist the portion of the assembly part 5 on which the coil C3 is mounted independently of the other portions. As a result, the ease of assembling the straight portion C3A to the recessed portion 200 is improved. In other words, by arranging the multiple reinforcing members 210, 212, 214 at intervals from each other, it becomes easier to assemble the straight portion C3A to the recessed portion 200.

[0124] In addition, since the portions of the assembly part 5 at the first interval F and the second interval G are thin and easily bent and twisted, these portions always begin to distort before the reinforcing members 210, 212, and 214. This prevents distortion from remaining in the reinforcing members 210, 212, and 214 during assembly, and as a result, it is possible to suppress lifting and warping of the assembly part 5.

[0125] Furthermore, when the portions of the first gap F and the second gap G are designed to have a thin FPC board layer configuration with a single-sided pattern, the degree of freedom in bending and twisting increases, making assembly even easier.

[0126] Furthermore, the first interval F and the second interval G are utilized to adjust bending and twisting during assembly of the assembly part 5. For this reason, it is preferable not to place the solder pads 240 (see FIG. 14) in the first interval F and the second interval G in order to prevent solder peeling, and it is preferable to place the solder pads 240 on the inside of the coil C3 (see FIG. 17), or even if they are placed on the outside of the coil C2, they are placed so as not to straddle the first interval F and the second interval G (FIG. 16). In other words, it is preferable that the solder pads 240 connected to the coils C3 and C2 are provided in the areas where the reinforcing members 210 and 212 are provided in order to prevent solder peeling.

[0127] 16 is an explanatory diagram showing an enlarged view of the structure including the coil C2 and its vicinity, and FIG 17 is an explanatory diagram showing an enlarged view of the structure including the coil C3 and its vicinity.

[0128] Moreover, the assembly part 5 has a first interval F along the direction X and a second interval G along the direction Y. By having these two intervals F and G intersecting with each other, the following effects are obtained.

[0129] That is, the portion of the first gap F can be used as a hinge to bend the portion on which the coil C3 is mounted in both the Z(+) and Z(-) directions. Also, the portion of the second gap G can be used as a hinge to bend the portion on which the coil C3 is mounted in both the Y(+) and Y(-) directions. This further improves the ease of assembly of the straight portion C3A to the recessed portion 200.

[0130] In the assembly part 5, the wider the first interval F and the second interval G, the easier the assembly part 5 is to bend and twist, and therefore the greater the tolerance of variations in assembly part 5 and assembly. However, if the intervals are too wide, the assembly part 5 may bend or twist too much, which may make assembly difficult.

[0131] From this viewpoint, it is desirable that the widths of the first interval F and the second interval G have the following dimensional relationship. Here, assuming that the amount of the gap in the direction X between the elongated hole 236 extending in the direction X, which is the first direction, and the boss 232 is A (see FIG. 18), and the amount of overlapping described above is B (see FIG. 12), A<first interval F<5×A B<2nd interval G<4×B It is desirable to satisfy the following relationship.

[0132] By satisfying the above relationship, the portion of the assembly part 5 on which the coil C3 is mounted can be effectively bent or twisted, so that the ease of assembling the straight portion C3A to the recessed portion 200 is improved.

[0133] The following describes the specific values.

[0134] A=0.5mm B=0.8mm in the case of, 0.5mm<First interval F<2.5mm 0.8mm<Secondary G<3.2mm It becomes.

[0135] The under-assembly structure also has the effect of improving the design performance of the magnetic attraction plate 18 that is attached to one of the two surfaces of the reinforcing member 210 opposite the surface on the FPC board 14 side.

[0136] The magnetic attraction plate 18 generates a magnetic biasing force by being disposed opposite the magnet Mv3. The pressing force (force in the optical axis K direction) by the magnetic attraction plate 18 is designed so that the movable member 2 of the BIS does not float up from the fixed member 3 of the BIS, but a force is also generated in the in-plane (XY) direction. At the balance position of the magnetic forces in the in-plane direction, the movable member 2 is stationary and so no reaction force occurs, but if it moves from the balance position, a reaction force will be applied.

[0137] 19 is a graph showing the relationship between the amount of movement (mm) of the movable member 2 and the reaction force (N) of the magnetic attraction plate 18 in the in-plane direction. It is preferable to design the above reaction force so as to satisfy the following three requirements. The magnetic attraction plate 18 is an example of the magnetic member of the present invention.

[0138] Requirement 1: Linearity.

[0139] Requirement 2: Reduce the slope.

[0140] Requirement 3: The balancing position is aligned with the center of the image sensor 20 (the center holding position of the BIS).

[0141] If it becomes possible to design and arrange the magnetic attraction plate 18 by utilizing the area (recessed portion 200) of the assembly under structure, it becomes possible to arrange the magnetic attraction plate 18 under the coil C3 by offsetting it. This makes it possible to align the balance position with the center holding position (reference state) of the BIS and reduce the reaction force of the control end, which contributes to improving control performance and reducing power consumption.

[0142] 13, the reinforcing member 210 has two surfaces, and the surface opposite the surface on the FPC board 14 side is provided with the magnetic attraction plate 18, so that at least a portion of the magnetic attraction plate 18 overlaps with the base 24 when the imaging element 20 is viewed from the optical axis K direction. In other words, the above-mentioned effect can be obtained by adopting an under-arrangement configuration in which the lower portion 18A (see FIG. 15) of the magnetic attraction plate 18 is inserted into the recessed portion 200.

[0143] While the image stabilization device and the image capture device according to the embodiment have been described above, the present invention may be improved or modified in several ways without departing from the gist of the present invention. [Explanation of symbols]

[0144] 1 Image stabilization device 2 Movable parts 3 Fixing material 3A York 3B York 4 screws 5 Assy parts 10 Base 12 Through hole 14 FPC board 16A flat plate 16B flat plate 16C flat plate 18 Magnetic Sticking Board 18A Bottom of magnetic sticking plate 20. Image sensor 20A light receiving surface 22 Circuit Board 24 Base 25 Opening 26 Rolling elements 28A Recess 28B Recess 28C Recess 32 Connectors 34 Connector 40 Gap 50 FPC board 60 FPC board 70 FPC board 100 Digital Camera 102 Camera body 104 Lens 106 Imaging Optical System 108 Image sensor driver 110 Analog Front End 112 Image processing section 114 Motion Detection Sensor 116 Operation section 118 Display section 120 System control section 200 Recess 202 Side 204 Bottom 206 Curved surface part 208 End of curved surface 210 Reinforcement member 212 Reinforcement members 214 Reinforcement members 216 Reinforcement members 218 Reinforcement members 220 Reinforcement members 222 Reinforcement members 224 Depression 226 Depression 230 Height correction surface 232 Boss 234 Boss 236 long hole 238 Round Hole 240 solder pad C1 Coil C2 coil C3 Coil Straight section of C3A coil h Hall element h1 Hall element h2 Hall element h3 Hall element M Magnet Mv1 Magnet Mv2 Magnet Mv3 Magnet A Gap Amount B. Amount of overlap D Virtual line E Virtual line F 1st Interval G Second Interval K optical axis OA optical axis P center T pixel region X direction Y direction Z direction

Claims

1. a movable section having a holding member for holding an image sensor and movable within a plane intersecting an optical axis; a fixed portion having a magnet and a yoke of the actuator; a flexible substrate provided in the movable portion and having a coil of the actuator mounted thereon; Equipped with The holding member has a recess on a side surface, a portion of the coil extends into the recess and is fixed to the holding member, and when the imaging element is viewed from an optical axis direction, the holding member and a portion of the coil overlap with each other; Image stabilization device.

2. a first reinforcing member for reinforcing strength of the flexible substrate is provided on a surface of the flexible substrate opposite to a surface on which the coil is mounted; a second reinforcing member is provided at a first interval from the first reinforcing member in a first direction intersecting the optical axis; a third reinforcing member is provided at a second interval from the second reinforcing member in a second direction intersecting the optical axis and the first direction, The image stabilization device according to claim 1 .

3. a connection portion electrically connected to the coil is provided in a region of the flexible substrate where the first reinforcing member is provided; The image stabilization device according to claim 2 .

4. the flexible substrate has first and second openings that engage with the protrusions of the holding member; The first opening is provided in a region where the first reinforcing member is provided, The second opening is provided in a region where the second reinforcing member is provided.

4. The image stabilization device according to claim 2.

5. The first opening is a slot extending in the first direction, The second opening is a round hole. The image stabilization device according to claim 4.

6. When the amount of the gap between the first opening and the protrusion is A and the amount of the overlap is B, A<the first interval<5×A B<the second interval<4×B Satisfy the relationship The image stabilization device according to claim 5 .

7. a magnetic member is provided on one of the two surfaces of the first reinforcing member opposite to the surface on the flexible substrate side; When the imaging element is viewed from the optical axis direction, at least a portion of the magnetic member overlaps with the holding member. The image stabilization device according to claim 2 .

8. A motion compensation device according to claim 1 or 2; an optical system that forms an optical image of a subject on the image sensor; Equipped with Imaging device.

Images