Ceramic substrate, light source device, and method of manufacturing ceramic substrate and method of manufacturing light source device
By adding high thermal conductivity solid particles into the through holes of the ceramic substrate and forming continuous conductive members, the problem of insufficient thermal dissipation of the ceramic substrate is solved, and a better thermal discharge effect is achieved.
JP2025037781APending Publication Date: 2025-03-18NICHIA CORP
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Patent Information
- Application Number
- JP2024048003
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-09-06
- Filing Date
- 2024-03-25
- Publication Date
- 2025-03-18
AI Technical Summary
Technical Problem
The existing ceramic substrates have shortcomings in thermal dissipation and need to improve the thermal discharge effect.
Method used
A solid particles with high thermal conductivity are added to the through holes of the ceramic substrate, and a continuous conductive member is formed in the holes, with the thermal conductivity of the conductive member being lower than the solid particles, and the first port diameter of the hole is greater than the second port diameter.
Benefits of technology
By increasing solid particles with high thermal conductivity, the thermal dissipation capability of the ceramic substrate is improved and the thermal discharge effect is improved.
✦ Generated by Eureka AI based on patent content.
Abstract
To provide a ceramic substrate capable of improving heat dissipation, a light source device, and a method of manufacturing the ceramic substrate and a method of manufacturing the light source device.SOLUTION: A ceramic substrate has: a base material which has a first surface and a second surface on the opposite side from the first surface, and also has a through hole, a first aperture diameter on the first diameter being larger than a second aperture diameter on the second surface; one or more solid particles which are arranged in the through hole; and an electrically conductive member which is arranged in the through hole, wherein the solid particles have larger heat conductivity than the electrically conductive member, which is continuous between the first surface and the second surface.SELECTED DRAWING: Figure 2B
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