Bonding device and bonding method

Abstract

To efficiently perform flux-less bonding between a semiconductor wafer 2 and an electronic component 1.SOLUTION: In a state where a periphery of an electronic component loading position which is set on a semiconductor wafer 2 (substrate) is substituted with an atmosphere gas, a bonding head 5 which does not hold an electronic component 1 is moved to the electronic component loading position on the semiconductor wafer 2; a solder bump B of the semiconductor wafer 2 is heated and molten by transmitting a laser beam L through a tool base 15; and a bump re-forming step is performed (Fig. 5 (a)) in which an oxidized coating on a surface of the solder bump B is removed. Thereafter, the electronic component 1 is held by the bonding head 5 (Fig. 5 (c)); the electronic component 1 is moved to the electronic component loading position on the semiconductor wafer 2; the electronic component 1 is heated by transmitting the laser beam L through the tool base 15; and a bonding step (Fig. 5 (d)) is performed in which the solder bump B is molten and the electronic component 1 is bonded to the semiconductor wafer 2.SELECTED DRAWING: Figure 5