Vibration device
The vibration device addresses handling challenges and chipping risks by incorporating a multilayer substrate with a recessed area and a conductive connection member, enhancing both mechanical protection and miniaturization.
JP2025039875AActive Publication Date: 2025-03-21SEIKO EPSON CORP
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Patent Information
- Application Number
- JP2025006627
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-01-17
- Publication Date
- 2025-03-21
- Estimated Expiration
- 2041-05-31
AI Technical Summary
Technical Problem
Miniaturized vibration devices face handling difficulties and are prone to chipping due to the use of silicon substrates or quartz crystals.
Method used
The vibration device features a multilayer substrate with a recessed area housing a vibrating element, a connection wiring layer, and a conductive connection member that electrically connects the wiring layer to a connection terminal on the outer surface, enhancing mechanical protection and handling.
Benefits of technology
This configuration improves handling and reduces the risk of cracking or chipping, while maintaining the miniaturized size of the vibration device.
✦ Generated by Eureka AI based on patent content.
Abstract
To provide a vibration device which remedies the difficulty in handling and suppresses cracking or chipping of a vibrator.SOLUTION: A vibration device 1 comprises: a multilayer substrate 2 including a first face 101, a second face 102 positioned on the opposite side of the first face 101, a first insulation layer 21 including the first face 101, a second insulation layer 22 including the second face 102, a bottomed recess 40 including an opening 41 in the first face 101 and penetrating the first insulation layer 21, and a connection wiring layer 25 disposed between the first insulation layer 21 and the second insulation layer 22; a vibrator 5 which includes a container 51 including a storage space 52, a vibration element 6 stored in the storage space 52 and a connection terminal 70 disposed on an outer surface of the container 51 and electrically connected with the vibration element 6, and is disposed inside of the recess 40; and a conductive connection member 8 electrically connecting the connection wiring layer 25 and the connection terminal 70 to each other.SELECTED DRAWING: Figure 2
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