Transportation heating apparatus
The introduction of a shielding member in the vacuum chamber of a reflow device addresses the issue of substrate vibration caused by gas flow, thereby reducing soldering defects and ensuring more precise mounting.
JP2025053415APending Publication Date: 2025-04-07TAMURA KK
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Patent Information
- Application Number
- JP2023162412
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-09-26
- Publication Date
- 2025-04-07
AI Technical Summary
Technical Problem
In reflow devices, the strong gas flow during vacuum chamber operations can cause substrates to vibrate, leading to misalignment and defective soldering.
Method used
A conveying and heating device with a vacuum chamber that includes a shielding member positioned to reduce the gas flow impact on the substrate during vacuum pulling and opening operations.
Benefits of technology
The shielding member effectively suppresses substrate vibration and reduces the likelihood of soldering defects by moderating the gas flow within the vacuum chamber.
✦ Generated by Eureka AI based on patent content.
Abstract
To suppress vibration of a heated material at the time of a defoaming treatment, and prevent a soldering failure.SOLUTION: A transportation heating apparatus comprises: a heating apparatus in which a plurality of heating furnaces is arranged, and a heated material is heated by each heating furnace; transportation means of transporting the heated material; and a vacuum chamber that is provided into the heating apparatus, and performs a defoaming treatment to a melting solder of the heated material. A vacuum leading hole and a vacuum opening hole are provided to the vacuum chamber, and a shielding member is arranged to at least one direction of the vacuum leading hole and the vacuum opening hole.SELECTED DRAWING: Figure 3
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