Lead frame and manufacturing method thereof

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The lead frame design addresses the challenges of lead frame deformation and resin filling by thinning lead portions from the backside and strategically thinning metal connection portions, resulting in enhanced stability and manufacturing efficiency.

JP2025063901AActive Publication Date: 2025-04-16DAI NIPPON PRINTING CO LTD

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Patent Information

Application Number: JP2025002950
Authority / Receiving Office: JP · JP
Patent Type: Applications
Current Assignee / Owner
Priority Date: 2023-08-03
Filing Date: 2025-01-08
Publication Date: 2025-04-16
Estimated Expiration: 2043-11-15

Application Information

Patent Timeline

03 Aug 2023

Priority

08 Jan 2025

Application

JP2025002950

16 Apr 2025

Publication

JP2025063901A

IPC: H01L23/50

CPC: H10W74/00; H10W72/00

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Application Domain

Semiconductor/solid-state device details Solid-state devices

Technology Topics

Structural engineering Lead frame

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AI Technical Summary

Technical Problem

Conventional lead frames face challenges in maintaining strength as they thin, leading to deformation during wire bonding, and struggle with sufficient resin filling due to narrow backside spaces.

Method used

A lead frame design featuring a die pad, lead portions, a metal connection portion, and a resin portion, where the lead portions are thinned from the backside and filled with resin, and the metal connection portion is strategically located and thinned to enhance stability and resin filling.

Benefits of technology

This design effectively suppresses lead portion deformation during wire bonding and ensures adequate resin filling, thereby improving the manufacturing process and product reliability.

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Abstract

To provide a lead frame and a manufacturing method thereof which are capable of suppressing deformation of a lead portion during wire bonding.SOLUTION: A lead frame (10) includes a die pad (11), lead portions (12) arranged around the die pad (11), a metal connecting portion (16) connecting the die pad (11) and the lead portion (12), and resin portions (18) arranged around the die pad (11) and the lead portions (12) on the back side of the lead frame (10). The metal connecting portion (16) is thinned from the front side, and at least a portion of the lead portions (12) is thinned from the back side. The thinned portion of the lead portion (12) is filled with the resin portion (18).SELECTED DRAWING: Figure 3

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