Electronic apparatus

Abstract

To provide a structure suitable for a portable information terminal or a wearable device, or to provide an electronic apparatus with a new structure having various appearance shapes.SOLUTION: A buffer layer absorbing the difference in the amount of deformation is preferably provided between film substrates overlapping and adjacent to each other, and gel-like resin material, rubber-like resin material, liquid material, or an air layer can be used as the buffer layer. An optical film such as a polarizing film and a color filter may be used as the buffer layer. A plurality of buffer layers may be provided in an electronic apparatus.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an article, a method, or a manufacturing method. Alternatively, the present invention relates to a process, a machine , a manufacture, or a composition of matter. Further more, one aspect of the present invention relates to a semiconductor device, a display device, a light-emitting device, a power storage device, a driving method thereof , or a manufacturing method thereof. In particular, the present invention relates to an electronic device.

[0002] Note that in this specification, the electronic device refers to all devices having a secondary battery, and an electro-optical device having a secondary battery, an information terminal device having a secondary battery, a vehicle having a secondary battery, etc. are all electronic devices.

Background Art

[0003] In recent years, portable information terminals typified by smartphones have been actively developed. As one type of electronic device, a portable information terminal is desired by users to be lightweight and compact.

[0004] Regardless of location and without restricting the freedom of both hands, information can be obtained through vision. As an example of a wearable device, Patent Document 1 is disclosed. Patent Document 1 discloses a goggle-type display device capable of communication and including a CPU. The device of Patent Document 1 is also included in one type of electronic device.

[0005] Wearable devices and portable information terminals often carry a secondary battery capable of repeated charging or discharging. Wearable devices and portable information terminals have a problem that, although they are lightweight and compact, the operation time of wearable devices and portable information terminals is limited. Therefore, ​​As a secondary battery mounted on an air wearable device or a mobile information terminal, it is required to be lightweight, small-sized, and capable of long-time use.

[0006] Examples of the secondary battery include a nickel-hydrogen battery and a lithium-ion secondary battery. Among them, since the lithium-ion secondary battery can achieve high capacity and miniaturization, its development is actively underway.

[0007] In a lithium-ion secondary battery, as the electrode functioning as the positive electrode or the negative electrode, lithium metal, a carbon-based material, etc. are used.

Prior Art Documents

Patent Documents

[0008]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0009] To provide an electronic device with a novel structure. Specifically, it is also an object to provide an electronic device with a novel structure that can have various external shapes, or an electronic device with a novel structure having various external shapes and a secondary battery having a shape suitable for the shape thereof. To provide an electronic device with a novel structure. Or, to provide an electronic device with a novel structure having various external shapes and a secondary battery having a shape suitable for the shape thereof is also one of the problems.

[0010] Note that the description of these problems does not prevent the existence of other problems. Note that one aspect of the present invention does not necessarily need to solve all of these problems. Note that other problems will naturally become clear from the descriptions in the specification, drawings, claims, etc., and it is possible to extract these other problems from the descriptions in the specification, drawings, claims, etc. [Means for solving the problem]

[0011] When making an electronic device into a complex external shape, the housing is designed to have a complex external shape, and the inside of the housing Electronic components (power supplies, wiring, transistors, resistors, capacitors, etc.) are placed in the space. If the electronic device is large and heavy, it is okay to use it in a relatively empty space inside the case. Because the space between them is large, electronic components can be arranged relatively freely.

[0012] When electronic equipment with a complex external shape is required to be small and lightweight, The volume of the internal space is small, so electronic components and their sizes are selected and arranged according to that volume. In this case, the smaller the electronic components are, the more expensive they become, and the higher the manufacturing costs become. It ends up like this.

[0013] In addition, in the case of secondary batteries, the capacity increases as the volume or weight of the secondary battery increases. Therefore, there are limitations on the size and placement of secondary batteries when they are built into small electronic devices.

[0014] If an electronic device is deformed by applying external force, the case, display, secondary battery, etc. may be damaged. When stress is applied to the material, a part of it becomes deformed. When applied intentionally, the entire electronic device can be flexibly deformed and is not easily broken, which is what makes it a wearable device. It can be said that this electronic device is suitable for use as a vice.

[0015] In the display section, a pair of substrates are made of film substrates, and a display element is provided between the pair of substrates. This is preferable, and thus a flexible display module can be realized.

[0016] When providing a touch panel, it is preferable that the substrate provided with the touch input sensor is a film substrate. It is preferably a flexible touch panel.

[0017] In addition, when used in an electronic device, if the number of film substrates overlapping each other increases, displacement or the like will occur when each film is bent. Therefore, it is preferable to reduce the number, and it is preferable to provide a display element and a touch sensor element between a pair of film substrates. Since displacement or the like occurs when each film is bent, it is preferable to reduce the number, and it is preferable to provide a display element and a touch sensor element between a pair of film substrates. It is preferably provided between a pair of film substrates.

[0018] In addition, it is preferable to provide a buffer layer (also called a buffer layer) that absorbs the difference in the amount of deformation between adjacent film substrates that overlap each other. As the buffer layer, a gel-like resin material, a rubber-like resin material, a liquid material, an air layer, etc. can be used. Also, an optical film such as a polarizing film or a color filter may be used as the buffer layer. Also, a plurality of buffer layers may be provided in the electronic device. It is preferably provided between adjacent film substrates that overlap each other. As the buffer layer, a gel-like resin material, a rubber-like resin material, a liquid material, an air layer, etc. can be used. Also, an optical film such as a polarizing film or a color filter may be used as the buffer layer. Also, a plurality of buffer layers may be provided in the electronic device. It is preferably provided between adjacent film substrates that overlap each other. As the buffer layer, a gel-like resin material, a rubber-like resin material, a liquid material, an air layer, etc. can be used. Also, an optical film such as a polarizing film or a color filter may be used as the buffer layer. Also, a plurality of buffer layers may be provided in the electronic device. In addition, an optical film such as a polarizing film or a color filter may be used as the buffer layer. Also, a plurality of buffer layers may be provided in the electronic device. It is also possible.

[0019] One form of the configuration of the invention disclosed in this specification is an electronic device having a first buffer layer on a holding structure having a curved portion, a protective film having a curved portion on the first buffer layer, a display portion having a curved portion on the protective film having a curved portion, a second buffer layer on the display portion having a curved portion, and a touch input portion having a curved portion on the second buffer layer. On the first buffer layer, a protective film having a curved portion, on the protective film having a curved portion, a display portion having a curved portion, on the display portion having a curved portion, a second buffer layer, and on the second buffer layer, a touch input portion having a curved portion. On the display portion having a curved portion, a second buffer layer, and on the second buffer layer, a touch input portion having a curved portion. It is an electronic device.

[0020] Another form of the configuration is an electronic device having a first buffer layer on a holding structure having a curved portion, a protective film having a curved portion on the first buffer layer, a display portion having a curved portion on the protective film having a curved portion, a touch input portion having a curved portion on the display portion having a curved portion, and a second buffer layer on the touch input portion having a curved portion. On the first buffer layer, a protective film having a curved portion, on the protective film having a curved portion, a display portion having a curved portion, on the display portion having a curved portion, a touch input portion having a curved portion. On the touch input portion having a curved portion, a second buffer layer. It is an electronic device.

[0021] In each of the above configurations, the curved portion of the display unit and the curved portion of the protective film overlap each other. The protective film is made of a material with higher rigidity than the display unit (display panel), and the film substrate of the display unit is curved along the surface shape of the protective film.

[0022] In each of the above configurations, when there is a second buffer layer on the display unit, it is preferably made of a material having light transmittance.

[0023] Moreover, it is preferable to use a flexible secondary battery as the power source of the electronic device.

[0024] For example, when an external force is applied to change the shape of the secondary battery, an external force is applied to an object such as a film used for the exterior of the secondary battery, stress is applied to the object, and there is a risk that part of it may be deformed or partially destroyed.

[0025] The secondary battery has a structure for relaxing the strain caused by stress. Strain is a measure of deformation that indicates the displacement of a material point in an object relative to the reference (initial state) length of the object. The secondary battery provides a secondary battery that suppresses the influence of deformation caused by an external force, that is, strain, within an allowable range.

[0026] One form of the configuration of the invention disclosed in this specification is an electronic device having a secondary battery with a curved portion on a holding structure having a curved portion, a buffer layer on the secondary battery having a curved portion, a protective film having a curved portion on the buffer layer, a display unit having a curved portion on the protective film having a curved portion, and a touch input unit having a curved portion on the display unit having a curved portion.

[0027] In the above configuration, the display unit includes a pair of films and a light-emitting element sandwiched between the pair of films. When having a touch input unit sandwiched between a pair of films, the number of components can be reduced and the device can be made thinner.

[0028] In the above configuration, the radius of curvature at the curved portion of the holding structure is smaller than the radius of curvature at the curved portion of the display unit. Since the holding structure is on the side in contact with the forearm, it is smaller than the radius of curvature at the curved portion of the display unit located on the outside, and it is preferable that the radius of curvature of the display unit is large because the visibility of the display image is improved. Since the holding structure is on the side in contact with the forearm, it is smaller than the radius of curvature at the curved portion of the display unit located on the outside, and it is preferable that the radius of curvature of the display unit is large because the visibility of the display image is improved. In the above configuration, the radius of curvature at the curved portion of the holding structure is smaller than the radius of curvature at the curved portion of the display unit. Since the holding structure is on the side in contact with the forearm, it is smaller than the radius of curvature at the curved portion of the display unit located on the outside, and it is preferable that the radius of curvature of the display unit is large because the visibility of the display image is improved. In the above configuration, the radius of curvature at the curved portion of the holding structure is smaller than the radius of curvature at the curved portion of the display unit. Since the holding structure is on the side in contact with the forearm, it is smaller than the radius of curvature at the curved portion of the display unit located on the outside, and it is preferable that the radius of curvature of the display unit is large because the visibility of the display image is improved.

[0029] In the above configuration, the exterior body of the secondary battery is formed as a film having unevenness formed by press working, and the secondary battery has flexibility. In the above configuration, the exterior body of the secondary battery is formed as a film having unevenness formed by press working, and the secondary battery has flexibility.

[0030] Also, the above configuration is the case where the holding structure is in the form of a film, and the shape of the holding structure is not particularly limited, and it may be a shape such as a monocoque structure having a hollow space or a semi-monocoque structure having a partial opening. One form of the configuration in that case is an electronic device having a secondary battery having a curved portion in a region surrounded by a holding structure having a concave portion or a convex portion, a buffer layer overlapping the secondary battery, a protective film having a curved portion overlapping the buffer layer, a display portion having a curved portion overlapping the protective film, and a touch input portion overlapping the display portion. Also, the above configuration is the case where the holding structure is in the form of a film, and the shape of the holding structure is not particularly limited, and it may be a shape such as a monocoque structure having a hollow space or a semi-monocoque structure having a partial opening. One form of the configuration in that case is an electronic device having a secondary battery having a curved portion in a region surrounded by a holding structure having a concave portion or a convex portion, a buffer layer overlapping the secondary battery, a protective film having a curved portion overlapping the buffer layer, a display portion having a curved portion overlapping the protective film, and a touch input portion overlapping the display portion. Also, the above configuration is the case where the holding structure is in the form of a film, and the shape of the holding structure is not particularly limited, and it may be a shape such as a monocoque structure having a hollow space or a semi-monocoque structure having a partial opening. One form of the configuration in that case is an electronic device having a secondary battery having a curved portion in a region surrounded by a holding structure having a concave portion or a convex portion, a buffer layer overlapping the secondary battery, a protective film having a curved portion overlapping the buffer layer, a display portion having a curved portion overlapping the protective film, and a touch input portion overlapping the display portion. Also, the above configuration is the case where the holding structure is in the form of a film, and the shape of the holding structure is not particularly limited, and it may be a shape such as a monocoque structure having a hollow space or a semi-monocoque structure having a partial opening. One form of the configuration in that case is an electronic device having a secondary battery having a curved portion in a region surrounded by a holding structure having a concave portion or a convex portion, a buffer layer overlapping the secondary battery, a protective film having a curved portion overlapping the buffer layer, a display portion having a curved portion overlapping the protective film, and a touch input portion overlapping the display portion. Also, the above configuration is the case where the holding structure is in the form of a film, and the shape of the holding structure is not particularly limited, and it may be a shape such as a monocoque structure having a hollow space or a semi-monocoque structure having a partial opening. One form of the configuration in that case is an electronic device having a secondary battery having a curved portion in a region surrounded by a holding structure having a concave portion or a convex portion, a buffer layer overlapping the secondary battery, a protective film having a curved portion overlapping the buffer layer, a display portion having a curved portion overlapping the protective film, and a touch input portion overlapping the display portion. Also, the above configuration is the case where the holding structure is in the form of a film, and the shape of the holding structure is not particularly limited, and it may be a shape such as a monocoque structure having a hollow space or a semi-monocoque structure having a partial opening. One form of the configuration in that case is an electronic device having a secondary battery having a curved portion in a region surrounded by a holding structure having a concave portion or a convex portion, a buffer layer overlapping the secondary battery, a protective film having a curved portion overlapping the buffer layer, a display portion having a curved portion overlapping the protective film, and a touch input portion overlapping the display portion.

[0031] By making a part of the device contact a part of the user's body (such as the wrist or arm), that is, by having the user wear the device, the user can feel that the device is lighter than the actual weight. By using a flexible secondary battery in an electronic device having an external shape with a curved surface along a part of the user's body, the secondary battery can be fixed and disposed in a shape suitable for the electronic device. By making a part of the device contact a part of the user's body (such as the wrist or arm), that is, by having the user wear the device, the user can feel that the device is lighter than the actual weight. By using a flexible secondary battery in an electronic device having an external shape with a curved surface along a part of the user's body, the secondary battery can be fixed and disposed in a shape suitable for the electronic device. By making a part of the device contact a part of the user's body (such as the wrist or arm), that is, by having the user wear the device, the user can feel that the device is lighter than the actual weight. By using a flexible secondary battery in an electronic device having an external shape with a curved surface along a part of the user's body, the secondary battery can be fixed and disposed in a shape suitable for the electronic device. By making a part of the device contact a part of the user's body (such as the wrist or arm), that is, by having the user wear the device, the user can feel that the device is lighter than the actual weight. By using a flexible secondary battery in an electronic device having an external shape with a curved surface along a part of the user's body, the secondary battery can be fixed and disposed in a shape suitable for the electronic device. By making a part of the device contact a part of the user's body (such as the wrist or arm), that is, by having the user wear the device, the user can feel that the device is lighter than the actual weight. By using a flexible secondary battery in an electronic device having an external shape with a curved surface along a part of the user's body, the secondary battery can be fixed and disposed in a shape suitable for the electronic device.

[0032] In addition, when the user moves the part of the body where the electronic device is worn, the electronic device has a curved surface that conforms to the part of the body. Even if they are using electronic devices, they may feel uncomfortable and perceive them as a nuisance, which may cause stress. Therefore, the electronic device is configured so that at least a part of it is deformed in accordance with the body movement. In this way, the electronic device can be made in such a way that the user does not feel any discomfort, and the deformation of the electronic device can be prevented. A flexible secondary battery can also be provided in the portion.

[0033] Alternatively, the external shape of the electronic device is not limited to curved or complex shapes, but may be a simple shape. For example, the inside of an electronic device with a simple external appearance may be The number and size of components that can be built into an electronic device are determined by the volume of the space formed by the electronic device's housing. In many cases, the design is decided by placing a flexible secondary battery in the gap between components other than the secondary battery. This allows the space created by the housing of the electronic device to be used effectively, and also makes it possible to reduce the size of the device. Cut.

[0034] In addition, wearable devices include wearable cameras, wearable microphones, Wearable input devices such as wearable sensors, wearable displays, and wearable Wearable output devices such as speakers and wearable input devices that combine these functions Also, wearable devices include devices that control each device, calculate data, or This includes a device that performs processing, typically a wearable computer with a CPU. A wearable device is a device that stores, transmits, and receives data. This also includes portable information terminals and memory. Effect of the Invention

[0035] It is possible to realize an electronic device with a novel structure that can bend at least a part thereof. For example, it is possible to realize an electronic device that can bend a display unit having a flat display surface.

[0036] Also, it is possible to realize an electronic device with a novel structure having a portion that is bent at least in part. For example, it is possible to realize an electronic device having a display unit with a bent display surface. Or, a novel electronic device can be realized. Note that the description of these effects does not preclude the existence of other effects. Note that one aspect of the present invention does not necessarily have to have all of these effects. Note that other effects will be obvious from the description in the specification, drawings, claims, etc., and it is possible to extract other effects from the description in the specification, drawings, claims, etc.

Brief Description of the Drawings

[0037]

Figure 1

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Embodiments for Carrying Out the Invention

[0038] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and those skilled in the art can easily understand that the form and details can be variously changed. Also, the present invention is not construed as being limited to the description of the embodiments shown below. be easily understood. Further, the present invention is not to be construed as being limited to the description of the embodiments shown below. be construed as being limited thereto.

[0039] (Embodiment 1) In this embodiment, an example of an electronic device that can be worn on the user's forearm is shown.

[0040] FIG. 1 is a schematic cross-sectional view of the electronic device, and FIG. 2 is a perspective view of the charger 300 and the electronic device. are shown.

[0041] The electronic device shown in FIGS. 1 and 2 is a display device that can be worn on the arm and can display images and information. Since a flexible lithium-ion secondary battery is used, a shape that fits the arm can be realized. The appearance is also excellent in design and can be used as an accessory (ornament). (ornament) ) can also be used.

[0042] The electronic device shown in FIGS. 1 and 2 includes a holding structure 101, a secondary battery 103, a control board 107, a display unit 102, a protective film 813, and a cover 104. Specifically, the holding structure 1 It has a secondary battery 103 in contact with 01, a control board 107 on the secondary battery 103, and a protective film 813 on the control board 107, and a display unit 102 and a cover 104 on the protective film 813. Further, the electronic device has an antenna 815 for wireless charging, and as shown in FIG. 2, by approaching or placing it on a charger 300, wireless charging according to the Qi standard can be performed. Also, the electronic device has a communication device 817 for wireless communication with an external device for data used for display.

[0043] The exterior body of the secondary battery 103 is a thin and flexible film, and the film is embossed processed and attached to a holding structure 101 having a curved surface, and can be deformed following the curved surface portion in a region with a large radius of curvature of the holding structure 101.

[0044] Also, the holding structure 101 has flexibility. The holding structure 101 is a member that encloses the built-in components of the electronic device or constitutes a surface that touches the outside air. For example, when placing a display panel on a holding structure 101 that is more rigid than a flexible display panel in order to hold a flexible display panel the holding structure 101 can also be called a support structure.

[0045] The holding structure 101 is not limited to a film shape, and may be a shape such as a monocoque structure having a hollow space, or a semi-monocoque structure composed of concave or convex portions and having a partial opening . When the holding structure 101 is a monocoque structure or a semi-monocoque structure, elements are arranged inside or in the inner region of the holding structure 101. The holding structure 101 has a region that can be easily bent. Note that as the holding structure 101, a material other than plastic ( 101, and elements are arranged inside or in the inner region of the holding structure 101. The holding structure 101 has a region that can be easily bent. Note that as the holding structure 101, a material other than plastic ( such as metal or ceramic) can also be used. rubber, expanded polystyrene, sponge, silicone resin, stainless steel, aluminum, paper, carbon a sheet containing artificial spider silk fibers including cellulose fibers having a fiber width of 4 nm or more and 100 nm or less, protein called fibroin, or a composite obtained by mixing these with a resin, a laminate of a nonwoven fabric made of such cellulose fibers and a resin film, a laminate of a sheet containing artificial spider silk fibers and a resin film, etc.) can also be used. Further, in order to hold the flexible display panel, even if the rigidity of the material of the holding structure 101 is lower than that of the flexible display panel, a structure surrounding the display panel in a shape, a first holding structure holding one side surface of the display panel, and a second holding structure holding the other side surface may hold the display panel. a sheet containing artificial spider silk fibers including cellulose fibers having a fiber width of 4 nm or more and 100 nm or less, protein called fibroin, or a composite obtained by mixing these with a resin, a laminate of a nonwoven fabric made of such cellulose fibers and a resin film, a laminate of a sheet containing artificial spider silk fibers and a resin film, etc.) can also be used. Further, in order to hold the flexible display panel, even if the rigidity of the material of the holding structure 101 is lower than that of the flexible display panel, a structure surrounding the display panel in a shape, a first holding structure holding one side surface of the display panel, and a second holding structure holding the other side surface may hold the display panel. a sheet containing artificial spider silk fibers including cellulose fibers having a fiber width of 4 nm or more and 100 nm or less, protein called fibroin, or a composite obtained by mixing these with a resin, a laminate of a nonwoven fabric made of such cellulose fibers and a resin film, a laminate of a sheet containing artificial spider silk fibers and a resin film, etc.) can also be used. Further, in order to hold the flexible display panel, even if the rigidity of the material of the holding structure 101 is lower than that of the flexible display panel, a structure surrounding the display panel in a shape, a first holding structure holding one side surface of the display panel, and a second holding structure holding the other side surface may hold the display panel. a sheet containing artificial spider silk fibers including cellulose fibers having a fiber width of 4 nm or more and 100 nm or less, protein called fibroin, or a composite obtained by mixing these with a resin, a laminate of a nonwoven fabric made of such cellulose fibers and a resin film, a laminate of a sheet containing artificial spider silk fibers and a resin film, etc.) can also be used. Further, in order to hold the flexible display panel, even if the rigidity of the material of the holding structure 101 is lower than that of the flexible display panel, a structure surrounding the display panel in a shape, a first holding structure holding one side surface of the display panel, and a second holding structure holding the other side surface may hold the display panel. a sheet containing artificial spider silk fibers including cellulose fibers having a fiber width of 4 nm or more and 100 nm or less, protein called fibroin, or a composite obtained by mixing these with a resin, a laminate of a nonwoven fabric made of such cellulose fibers and a resin film, a laminate of a sheet containing artificial spider silk fibers and a resin film, etc.) can also be used. Further, in order to hold the flexible display panel, even if the rigidity of the material of the holding structure 101 is lower than that of the flexible display panel, a structure surrounding the display panel in a shape, a first holding structure holding one side surface of the display panel, and a second holding structure holding the other side surface may hold the display panel. a sheet containing artificial spider silk fibers including cellulose fibers having a fiber width of 4 nm or more and 100 nm or less, protein called fibroin, or a composite obtained by mixing these with a resin, a laminate of a nonwoven fabric made of such cellulose fibers and a resin film, a laminate of a sheet containing artificial spider silk fibers and a resin film, etc.) can also be used. Further, in order to hold the flexible display panel, even if the rigidity of the material of the holding structure 101 is lower than that of the flexible display panel, a structure surrounding the display panel in a shape, a first holding structure holding one side surface of the display panel, and a second holding structure holding the other side surface may hold the display panel. a sheet containing artificial spider silk fibers including cellulose fibers having a fiber width of 4 nm or more and 100 nm or less, protein called fibroin, or a composite obtained by mixing these with a resin, a laminate of a nonwoven fabric made of such cellulose fibers and a resin film, a laminate of a sheet containing artificial spider silk fibers and a resin film, etc.) can also be used. Further, in order to hold the flexible display panel, even if the rigidity of the material of the holding structure 101 is lower than that of the flexible display panel, a structure surrounding the display panel in a shape, a first holding structure holding one side surface of the display panel, and a second holding structure holding the other side surface may hold the display panel.

[0046] The shape of the holding structure 101 is, for example, a bracelet type obtained by curving a belt-like structure. Further, at least a part of the holding structure 101 has flexibility, and the holding structure 101 can be fitted around the wrist without being deformed. When it is deformed, a displacement between the holding structure 101 and the display unit 102, or a displacement between the holding structure 101 and the protective film 813 may occur. When it is deformed, even if a displacement occurs, the display unit 102 and the holding structure 101 are not fixed to each other, and the protective film 813 maintains a space so that the control board 107 and the display unit 102 do not come into contact with each other, and has a buffer layer 801 as a buffer layer provided between the control board 107 and the protective film 813. The shape of the holding structure 101 is, for example, a bracelet type obtained by curving a belt-like structure. Further, at least a part of the holding structure 101 has flexibility, and the holding structure 101 can be fitted around the wrist without being deformed. When it is deformed, a displacement between the holding structure 101 and the display unit 102, or a displacement between the holding structure 101 and the protective film 813 may occur. When it is deformed, even if a displacement occurs, the display unit 102 and the holding structure 101 are not fixed to each other, and the protective film 813 maintains a space so that the control board 107 and the display unit 102 do not come into contact with each other, and has a buffer layer 801 as a buffer layer provided between the control board 107 and the protective film 813. The shape of the holding structure 101 is, for example, a bracelet type obtained by curving a belt-like structure. Further, at least a part of the holding structure 101 has flexibility, and the holding structure 101 can be fitted around the wrist without being deformed. When it is deformed, a displacement between the holding structure 101 and the display unit 102, or a displacement between the holding structure 101 and the protective film 813 may occur. When it is deformed, even if a displacement occurs, the display unit 102 and the holding structure 101 are not fixed to each other, and the protective film 813 maintains a space so that the control board 107 and the display unit 102 do not come into contact with each other, and has a buffer layer 801 as a buffer layer provided between the control board 107 and the protective film 813. The shape of the holding structure 101 is, for example, a bracelet type obtained by curving a belt-like structure. Further, at least a part of the holding structure 101 has flexibility, and the holding structure 101 can be fitted around the wrist without being deformed. When it is deformed, a displacement between the holding structure 101 and the display unit 102, or a displacement between the holding structure 101 and the protective film 813 may occur. When it is deformed, even if a displacement occurs, the display unit 102 and the holding structure 101 are not fixed to each other, and the protective film 813 maintains a space so that the control board 107 and the display unit 102 do not come into contact with each other, and has a buffer layer 801 as a buffer layer provided between the control board 107 and the protective film 813. The shape of the holding structure 101 is, for example, a bracelet type obtained by curving a belt-like structure. Further, at least a part of the holding structure 101 has flexibility, and the holding structure 101 can be fitted around the wrist without being deformed. When it is deformed, a displacement between the holding structure 101 and the display unit 102, or a displacement between the holding structure 101 and the protective film 813 may occur. When it is deformed, even if a displacement occurs, the display unit 102 and the holding structure 101 are not fixed to each other, and the protective film 813 maintains a space so that the control board 107 and the display unit 102 do not come into contact with each other, and has a buffer layer 801 as a buffer layer provided between the control board 107 and the protective film 813. The shape of the holding structure 101 is, for example, a bracelet type obtained by curving a belt-like structure. Further, at least a part of the holding structure 101 has flexibility, and the holding structure 101 can be fitted around the wrist without being deformed. When it is deformed, a displacement between the holding structure 101 and the display unit 102, or a displacement between the holding structure 101 and the protective film 813 may occur. When it is deformed, even if a displacement occurs, the display unit 102 and the holding structure 101 are not fixed to each other, and the protective film 813 maintains a space so that the control board 107 and the display unit 102 do not come into contact with each other, and has a buffer layer 801 as a buffer layer provided between the control board 107 and the protective film 813. The shape of the holding structure 101 is, for example, a bracelet type obtained by curving a belt-like structure. Further, at least a part of the holding structure 101 has flexibility, and the holding structure 101 can be fitted around the wrist without being deformed. When it is deformed, a displacement between the holding structure 101 and the display unit 102, or a displacement between the holding structure 101 and the protective film 813 may occur. When it is deformed, even if a displacement occurs, the display unit 102 and the holding structure 101 are not fixed to each other, and the protective film 813 maintains a space so that the control board 107 and the display unit 102 do not come into contact with each other, and has a buffer layer 801 as a buffer layer provided between the control board 107 and the protective film 813. The shape of the holding structure 101 is, for example, a bracelet type obtained by curving a belt-like structure. Further, at least a part of the holding structure 101 has flexibility, and the holding structure 101 can be fitted around the wrist without being deformed. When it is deformed, a displacement between the holding structure 101 and the display unit 102, or a displacement between the holding structure 101 and the protective film 813 may occur. When it is deformed, even if a displacement occurs, the display unit 102 and the holding structure 101 are not fixed to each other, and the protective film 813 maintains a space so that the control board 107 and the display unit 102 do not come into contact with each other, and has a buffer layer 801 as a buffer layer provided between the control board 107 and the protective film 813.

[0047] The protective film 813 protects the internal structures of the electronic device, particularly the control board 107, from unexpected external impacts. The protective film 813 has an opening through which the FPC 819 passes. The protective film 813 protects the internal structures of the electronic device, particularly the control board 107, from unexpected external impacts. The protective film 813 has an opening through which the FPC 819 passes. It exists. Also, since the display unit is thin, the protective film 813 functions as a support for the display unit to maintain the curvature of the display surface. The protective film 813 deforms as part of the electronic device. , the same materials as those of the holding structure 101 (resin films such as polyimide (PI), aramid resin, polyethylene terephthalate (PET), polyethersulfone (PES), polyethylene naphthalate (PEN), polycarbonate (PC), nylon, polyetheretherketone (PE (EK), polysulfone (PSF), polyetherimide (PEI), polyarylate (P AR), polybutylene terephthalate (PBT), silicone resin, etc.), metal films, paper, prepregs, films containing carbon fibers, etc.) can be used. However, a material different from that of the holding structure 101 may be used for the material of the protective film 813.

[0048] The cover 104 is a light-shielding film with an adhesive applied on one side, wraps part of the electronic device, has the function of integrating each structure, and has an opening overlapping the display unit 102. Since the cover 104 has light-shielding properties, it can hide the internal structure and improve the design of the electronic device. However, the electronic device can also be designed to allow the internal structure to be visible from the outside. In that case, the cover 104 does not necessarily need to have light-shielding properties. Also, even when the protective film 813 has light-shielding properties, the cover 104 does not necessarily need to have light-shielding properties. Further, a cover may also be provided on the side surface of the electronic device so that the internal structure cannot be seen from the side surface.

[0049] The control board 107 has slits for bending and is compliant with the Bluetooth (registered trademark) standard. Communication device 817, microcomputer, storage device, FPGA, DA converter, charge control IC, level shifter, etc. are provided. As shown in FIG. 1, ICs 820a, 820b, 820c (microcomputer, storage device, FPGA, DA converter, charge control IC, level shifter, etc.) are mounted on the flat surface between the slits and slots of the control board 107. Also, The control board 107 is connected to a display module having a display unit 102 via an input / output connector 814. Also, the control board 107 is connected to an antenna 815 via a wiring 818, and is connected to a secondary battery 103 via a lead electrode 804 and a connection part 810. A power supply control circuit 816 controls the charge and discharge of the secondary battery 103. The display module refers to at least a display panel attached up to an FPC 819. The electronic device shown in FIG. 1 has a display unit 102, an FPC 819, and a drive circuit, and further has a converter for supplying power from the secondary battery 103. The display module has a display unit 102 having flexibility, and display elements on a flexible film. As a method of fabricating display elements on a flexible film, there are a method of directly fabricating display elements on a flexible film, a method of forming a layer including display elements on a rigid substrate such as a glass substrate, removing the substrate by etching, polishing, etc., and then bonding the layer including the display elements to a flexible film, and a method of providing a release layer on a rigid substrate such as a glass substrate, forming a layer including display elements thereon, and then using the release layer to separate the rigid substrate.

[0050]

[0051]

[0052] ​​​​​​​​​​​​​Separate the layer including the substrate and the display element, and bond the layer including the display element and the flexible film There are methods such as bonding.

[0053] As the flexible film, plastic films using organic materials (polyimide (PI), aramid resin, polyethylene terephthalate (PET), polyethersulfone (PES), polyethylene naphthalate (PEN), polycarbonate (PC), nylon , polyetheretherketone (PEEK), polysulfone (PSF), polyetherimide (PEI), polyarylate (PAR), polybutylene terephthalate (PBT ), silicone resin, etc.), in addition to metal plates or inorganic materials such as glass plates in the form of thin plates with a thickness of 10 μm or more and 50 μm or less can be used. As the flexible film, for example , fibrous or particulate metals, glass or inorganic materials dispersed in a resin or resin film The composite material thus obtained can be used

[0054] It is preferably arranged at a position where the secondary battery 103 and the display unit 102 partially overlap. By arranging it at a position where part or all overlap, the power path from the secondary battery 103 to the display unit 102 is Shortened, that is, the wiring distance is shortened, and the power consumption is reduced. Also, by providing a display module between the protective film 813 and the cover 104, the display module can be protected from unexpected deformations such as wrinkles and twists, and the life of the electronic device as a product can be improved The cover 104 has an adhesive layer and is adhered to the protective film 813, the display unit 102, and the holding structure 101

[0055] In addition, a touch input sensor is mounted on the display unit 102, and the touch input sensor is used for the electronic device​​ Information can be input to and operations can be performed on the device.

[0056] FIG. 3(A) is a view showing a part of the cross-sectional structure extracted from the dotted-line portion of FIG. 1. The display unit 102 In the overlapping region, the holding structure 101 and the secondary battery 103 are in contact with each other, but are not adhered and fixed to each other. Also, the exterior body of the secondary battery 103 is embossed, and even when in contact with the holding structure 101, it has a structure that allows easy sliding between them. Also, although there is a portion where the protective film 813 and the control board 107 are in contact with each other, they are not adhered and fixed to each other. By not adhering and fixing to each other between the laminated films, when the electronic device is bent, each of them slides and the stress is relaxed.

[0057] The display unit 102 has a configuration in which a display element and a touch input sensor are provided between a pair of films.

[0058] In the present embodiment, an active matrix method having an organic EL element is used on one film, a capacitive touch sensor is provided on the other film, and the two films are bonded together so that the organic EL element and the touch sensor are arranged between the two films. Note that the present invention is not limited to a capacitive touch sensor, and various sensors that can detect the proximity or contact of a detection target such as a finger (for example, an optical sensor using a photoelectric conversion element, a pressure sensor using a pressure-sensitive element) can also be applied. In this specification, the touch input unit is not limited to performing an input operation by contacting the display unit with a finger or the like, and includes a device that can also perform an input operation by bringing a finger close to the display unit without contact.

[0059] FIG. 3(B) shows a schematic cross-sectional view when the display unit 102 is touched with a finger. When the display unit 102 is touched with a finger 800, the touched area is pushed and deformed. In FIG. 3(B), the deformation states of the display unit 102 and the protective film 813 are shown. A protective film 813 having higher rigidity than the display unit 102 is used to suppress the amount of deformation. When a layer made of a material capable of dispersing pressure (for example, an aramid resin layer, etc.) is used as the protective film 813, the protective film itself also has the function of a buffer layer. In addition, since the buffer layer 801 is provided between the control board 107 and the protective film 813, the control board 107 maintains its shape without being deformed.

[0060] In this embodiment, the buffer layer 801 is air, and the electronic device has a structure in which air escapes to the outside when the display unit is pushed by a finger or the like. The buffer layer 801 is not limited to air, and a gel-like resin material, a rubber-like resin material, a liquid material, etc. can be used. For example, silicone gel or silicone gel containing low molecular siloxane is used as the gel-like resin material.

[0061] The electronic device shown in this embodiment can be bent by pushing the display unit 102 with a finger or the like, and is an electronic device with a novel structure having flexibility. Also, even when the holding structure 101 is deformed when worn on the forearm, the display unit 102,

[0062] (Embodiment 2) In this embodiment, an example in which a part of the internal structure of the electronic device shown in Embodiment 1 is different will be described below with reference to FIGS. 4 and

[0063] The structure shown in FIG. 4(A) is an example in which the position of the secondary battery is different from that in the first embodiment.

[0064] The control board 107 is disposed on the holding structure 101, and the secondary battery 103 is controlled via the buffer layer 801. In FIG. 4(A), a protective film 8 is fixed to a substrate 107. The battery 13 and the secondary battery 103 may be fixed to each other by an adhesive layer or the like.

[0065] Moreover, the structure shown in FIG. 4B is different from that of the first embodiment in that a second buffer layer is further provided on the display unit 102. The second buffer layer 802 may be a polarizing film or the like. An optical film or a film for preventing scratches on the surface of the display unit 102 is used. A touch panel may be used as the second buffer layer 802. When a touch panel is used, the display unit 102 does not need to include a touch sensor. The second buffer layer 802 may include an adhesive layer that adheres to the display unit 102. However, the adhesive layer may be Since the display portion 102 overlaps with the display portion 102, it is preferable to use a light-transmitting material.

[0066] Moreover, the structure shown in FIG. 4C differs from that of the first embodiment in that it further includes buffer layers above and below the display unit 102. The second buffer layer 802 provided on the display portion 102 is shown in FIG. The same film and touch panel can be used.

[0067] The third buffer layer 803 provided between the display unit 102 and the protective film 813 is a gel-like Resin materials, rubber-like resin materials, liquid materials, etc. can be used. For example, gel-like resin materials Silicone gel or silicone gel containing low molecular weight siloxane is used as the material. By providing the buffer layer 803, when a force is applied from the outside, the display unit 102 and the protective film 813 can slide to relieve stress.

[0068] Also, the structure shown in Fig. 5(A) is different from that of Embodiment 1 in that the secondary battery and the control circuit are provided at positions where they do not overlap the display unit, and this is an example having a buffer layer 801 between the holding structure 101 and the protective film 813. Regarding the second buffer layer 802 provided on the display unit 102, the same film or touch panel as in Fig. 4 (B) may be used. (B) may be used.

[0069] In the structure shown in Fig. 5(A), since the secondary battery and the control circuit are not provided at positions overlapping the display unit, it has a buffer layer 801 that can tolerate dents even when the display unit is pressed. Therefore, an electronic device having a flexible and robust display unit can be realized. an electronic device having a flexible and robust display unit can be realized.

[0070] Also, the structure shown in Fig. 5(B) is configured to prioritize the thinness of the display unit, and has a second buffer layer 802 on the display unit 102, and is an example in which a third buffer layer 803 is provided between the display unit 102 and the holding structure 101. Also, although not shown in Fig. 5(B), it is an electronic device having a buffer layer made of air at locations where it does not overlap the display unit 102. overlap the display unit 102. overlap the display unit 102.

[0071] This embodiment can be freely combined with Embodiment 1.

[0072] (Embodiment 3) In this embodiment, an example of manufacturing a lithium-ion secondary battery using a film having an embossed pattern on its surface is shown. In this embodiment, an example of manufacturing a lithium-ion secondary battery using a film having an embossed pattern on its surface is shown.

[0073] First, a sheet made of a flexible substrate is prepared. The sheet uses a laminate and is a metal film Use a material having an adhesive layer (also called a heat-sealing layer) on one or both surfaces. The adh sive layer uses a heat-sealable resin film containing polypropylene, polyethylene, etc. In this em bodiment, as the sheet, a metal sheet is used which has a nylon resin on the surface of an aluminum foil and is provided with a laminate of an acid-resistant polypropylene film and a polypropylene film on the back surface of the aluminum foil. Cut this sheet to prepare the film 410 shown in Fig. 6(A).

[0074] Then, perform embossing on this film 410 to form irregularities on the film surface as shown in Fig. 6(B) to form a visible pattern. Here, an example is shown where embossing is performed after cutting the sheet, but the order is not particularly limited, and embossing may be performed before cutting the sheet and then cut. Also, it may be cut after folding the sheet and performing thermocompression bonding.

[0075] The following is an explanation of embossing, which is a type of pressing process.

[0076] Fig. 8 is a cross-sectional view showing an example of embossing. Note that embossing is a type of pressing process, which refers to a process of pressing an embossing roll with irregularities on the surface against a film to form irregularities corresponding to the irregularities of the embossing roll on the film surface. The embossing roll is a roll with a pattern engraved on the surface.

[0077] Fig. 8(A) is an example of performing embossing on one surface of the film.

[0078] In Fig. 8(A), the film 50 is sandwiched between the embossing roll 53 in contact with one surface of the film and the roll 54 in contact with the other surface, and the film 50 moves in the film progress direction ​​​​​​​​​​ It shows the film 58 being sent out. Patterns are formed on the film surface by pressure or heat.

[0079] Figure 8(A) shows an example of single-sided embossing, which is a combination of an embossing roll 53 and a roll 54 (a metal roll or an elastic roll such as a rubber roll).

[0080] Also, Figure 8(B) shows an example of embossing both sides of the film.

[0081] In Figure 8(B), the film 51 is sandwiched between an embossing roll 53 in contact with one side of the film and an embossing roll 55 in contact with the other side, showing the film 51 being sent out in the advancing direction 58 of the film.

[0082] Figure 8(B) is also called double-sided embossing and is a combination of an embossing roll 53 with a male pattern and an embossing roll 55 (female pattern).

[0083] Also, patterns are formed on the surface of the film 51 by the unevenness where an embossing that raises a part of the film surface and a debossing that depresses the surface are continuous.

[0084] In Figure 8(C), the film 52 is sandwiched between an embossing roll 56 in contact with one side of the film and an embossing roll 57 in contact with the other side, showing the film 52 being sent out in the advancing direction 58 of the film.

[0085] Figure 8(C) is also called Tip to Tip double-sided embossing and is a combination of an embossing roll 5 6 and an embossing roll 57 with the same pattern as the embossing roll 56. The same ​​​​​​​​It is aligned with the phases of the convex and concave portions of the embossing roll, and there is almost no difference between the front and back of the film 52, and a pattern with almost no difference can be formed.

[0086] Also, it is not limited to using an embossing roll, and an embossing plate may be used. Also, it is not limited to embossing, and a relief may be formed on a part of the film. That's it.

[0087] In this embodiment, unevenness is provided on both sides of the film 411 to form a pattern, and the film 411 is bent at the center so that two ends overlap, and three sides are sealed with an adhesive layer.

[0088] The film 411 is folded at the portion indicated by the dotted line in Fig. 6(B) to obtain the state shown in Fig. 7(A).

[0089] Also, as shown in Fig. 7(B), a laminate of a positive current collector 412, a separator 413, and a negative current collector 414 that constitute a secondary battery is prepared. Also, as current collectors such as the positive current collector 412 and the negative current collector 4 14, metals such as stainless steel, gold, platinum, zinc, iron, nickel, copper, aluminum, titanium, tantalum, etc., and alloys thereof, which have high conductivity and do not alloy with carrier ions such as lithium ions, can be used. Also, aluminum alloys added with elements such as silicon, titanium, neodymium, scandium, molybdenum, etc. to improve heat resistance can be used. Also, it may be formed of a metal element that reacts with silicon to form a silicide. As metal elements that react with silicon to form a silicide, there are zirconium, titanium, hafnium, vanadium, niobium, tantalum, chromium, molyb denum, tungsten, cobalt, nickel, etc. Also, the current collector is in the form of a foil or a plate (sheet form). form). Shapes such as bar-shaped, net-shaped, cylindrical, coil-shaped, perforated metal-shaped, expanded metal-shaped, etc. can be used as appropriate. As the current collector, those with a thickness of 10 μm or more and 30 μm or less are used. Here, for the sake of simplicity of explanation, an example is shown in which the laminated combination of the positive electrode current collector 412, the separator 413, and the negative electrode current collector 414 is made into one and housed in the exterior body. However, to increase the capacity of the secondary battery, a plurality of combinations are stacked and housed in the exterior body.

[0090] And two lead electrodes 416 having a sealing layer 415 shown in FIG. 7(C) are prepared. The lead electrode 416 is also called a lead terminal and is provided to draw out the positive or negative electrode of the secondary battery to the outside of the exterior film.

[0091] Then, one lead electrode is electrically connected to the protruding portion of the positive electrode current collector 412 by ultrasonic welding or the like. And the other lead electrode is electrically connected to the protruding portion of the negative electrode current collector 414 by ultrasonic welding or the like.

[0092] Then, in order to leave one side for injecting the electrolytic solution, thermocompression bonding is performed on two sides of the film 411 to seal it. During thermocompression bonding, the sealing layer 415 provided on the lead electrode also melts and is fixed between the lead electrode and the film 411. Then, in a reduced-pressure atmosphere or an inert atmosphere, a desired amount of electrolytic solution is dropped inside the film 411 which has become bag-shaped. And finally, thermocompression bonding is performed on the periphery of the film that was left without performing thermocompression bonding to seal it.

[0093] In this way, the secondary battery 103 shown in FIG. 7(D) can be manufactured.

[0094] The obtained secondary battery 103 has a pattern with irregularities on the surface of the film 411 that serves as the exterior body. is in progress. Also, the region between the dotted line and the end face in Fig. 7(D) is the thermocompression bonding region 417, and that part also has a pattern with unevenness on the surface. Compared with the central part, the unevenness of the thermocompression bonding region 417 is small, but it can relieve the stress applied when the secondary battery is bent.

[0095] Also, an example of the cross-section cut along the chain line A - B in Fig. 7(D) is shown in Fig. 7(E).

[0096] As shown in Fig. 7(E), the unevenness of the film 411 is different in the region overlapping with the positive electrode current collector 412 and the thermocompression bonding region 417. As shown in Fig. 7(E), the positive electrode current collector 412, the positive electrode active material layer 418, the separator 413, the negative electrode active material layer 419, and the negative electrode current collector 414 are laminated in this order and are sandwiched between the bent films 411, and are further sealed with an adhesive layer 430 at the ends, and the other spaces have an electrolytic solution 420.

[0097] As the positive electrode active material used in the positive electrode active material layer 418, there are composite oxides having an olivine-type crystal structure, a layered rock salt-type crystal structure, or a spinel-type crystal structure, etc. As the positive electrode active material , for example, compounds such as LiFeO2, LiCoO2, LiNiO2, LiMn2O4, V2O5, Cr 2O5, and MnO2 are used.

[0098] Or, a composite material (general formula LiMPO4 (M is one or more of Fe(II), Mn(II), Co(II), Ni(II))) can be used. Representative examples of the general formula LiMPO4 include LiFePO4, LiNiPO4, LiCoPO4, LiMnPO4, LiFe a b Ni a PO4, LiFe b Co a PO4, LiFe a ​Mn b PO4, LiNi a Co b PO4, LiNi a Mn b PO4 (a + b is 1 or less, 0 < a < 1, 0 < b < 1), LiF e c Ni d Co e PO4, LiFe c Ni d Mn e PO4, LiNi c Co d Mn e PO 4 (c + d + e is 1 or less, 0 < c < 1, 0 < d < 1, 0 < e < 1), LiFe f Ni g C o h Mn i PO4 (f + g + h + i is 1 or less, 0 < f < 1, 0 < g < 1, 0 < h < 1, 0 <i < 1) and the like lithium compounds can be used as materials.

[0099] Or, a composite material such as the general formula Li (2-j) MSiO4 (M is one or more of Fe(II), Mn(II), Co( II), Ni(II), 0 ≦ j ≦ 2) and the like can be used. General formula Li (2-j) MSiO4 representative examples include Li (2-j) FeSiO4, Li (2 -j) NiSiO4, Li (2-j) CoSiO4, Li (2-j) MnSiO4, Li (2-j) Fe k Ni l SiO4, Li (2-j) Fe k Co l SiO4, Li (2-j ) Fe k Mn l SiO4, Li (2-j) Ni kCo l SiO4, Li (2-j) Ni k Mn l SiO4 (where k + l is 1 or less, 0 < k < 1, 0 < l < 1), Li (2-j) Fe m N i n Co q SiO4, Li (2-j) Fe m Ni n Mn q SiO4, Li (2-j) Ni m Co n Mn q SiO4 (where m + n + q is 1 or less, 0 < m < 1, 0 < n < 1, 0 < q < 1) , Li (2-j) Fe r Ni s Co t Mn u SiO4 (where r + s + t + u is 1 or less, 0 < r < 1, 0 < s < 1, 0 < t < 1, 0 < u < 1), etc., lithium compounds can be used as materials and so on.

[0100] Also, as the positive electrode active material, A x M2(XO4)3 (A = Li, Na, Mg, M = Fe, M n, Ti, V, Nb, Al, X = S, P, Mo, W, As, Si) represented by the general formula can be used. As the NASICON-type compound, there are Fe2(MnO4) 3, Fe2(SO4)3, Li3Fe2(PO4)3, etc. Also, as the positive electrode active material , compounds represented by the general formula Li2MPO4F, Li2MP2O7, Li5MO4 (M = Fe, Mn) , perovskite-type fluorides such as NaFeF3, FeF3, metal chalcogenides (sulfides, selenides, tellurides) such as TiS2, Mo S2, etc., oxides having an inverse spinel-type crystal structure such as LiMVO4, vanadium oxides (V2O5, V6O S2, etc.) S2, etc.)13 , Li Materials such as V3O8, manganese oxides, and organic sulfur compounds can be used.

[0101] In addition, when the carrier ion is an alkali metal ion or an alkaline earth metal ion other than a lithium ion, as the positive electrode active material, instead of lithium, an alkali metal (for example, sodium, potassium, etc.), an alkaline earth metal (for example, calcium, strontium, beryllium, magnesium, or barium, etc.) may be used.

[0102] As the separator 413, an insulator such as cellulose (paper) or a polypropylene provided with pores , polyethylene, etc. can be used.

[0103] The electrolyte uses a material having a carrier ion as the electrolyte. Representative examples of the electrolyte include lithium salts such as LiPF6, LiClO4, LiAsF6, LiBF4, LiCF3SO3, Li( (CF3SO2)2N, Li(C2F5SO2)2N, etc. These electrolytes may be used alone or in any combination and ratio of two or more.

[0104] In addition, when the carrier ion is an alkali metal ion or an alkaline earth metal ion other than a lithium ion, as the electrolyte, in the above lithium salts, instead of lithium, an alkali metal (for example, sodium, potassium, etc.), an alkaline earth metal (for example, calcium, strontium, beryllium, magnesium, or barium, etc.) may be used.

[0105] Also, as the solvent of the electrolyte, a material in which the carrier ion can move is used. The solvent of the electrolyte As for this, an aprotic organic solvent is preferable. Representative examples of the aprotic organic solvent include ethylene carbonate (EC), propylene carbonate, dimethyl carbonate, di ethyl carbonate (DEC), γ-butyrolactone, acetonitrile, dimethoxyethane , tetrahydrofuran, etc., and one or more of these can be used. Further, By using a polymer material that is gelled as the solvent of the electrolytic solution, the safety against liquid leakage, etc. is enhanced. Further, it is possible to make the storage battery thinner and lighter. Representative examples of the polymer material to be gelled include silicone gel, acrylic gel, acrylonitrile gel, polyethylene o xide, polypropylene oxide, fluorine-based polymer, etc. Further, as the solvent of the electrolytic solution By using one or more ionic liquids (room temperature molten salts) that are flame-retardant and hardly volatile, even if the internal temperature rises due to internal short circuit, overcharge, etc. of the storage battery, rupture or ignition of the storage battery etc. can be prevented. Note that an ionic liquid is a salt in a fluid state and has a high ion mobility (conductivity). Further, an ionic liquid contains a cation and an anion. Examples of the ionic liquid include an ionic liquid containing an ethylmethylimidazolium (EMI) cation, or an N- methyl-N-propylpiperidinium (PP ) cation-containing ionic liquid, etc. 13 .

[0106] Further, instead of the electrolytic solution, a solid electrolyte having an inorganic material such as a sulfide-based or oxide-based material, or a solid electrolyte having a polymer material such as a P EO (polyethylene oxide)-based material can be used. When using a solid electrolyte, it becomes unnecessary to install a separator or a spacer. Further, since the entire battery can be solidified, the risk of liquid leakage disappears and the safety is dramatically improved. ​​

[0107] In addition, as the negative electrode active material of the negative electrode active material layer 419, a material capable of lithium dissolution / precipitation or lithium ion insertion / desorption can be used, and lithium metal, carbon-based materials, etc. can be used.

[0108] Lithium metal has a low redox potential (-3.045 V vs. standard hydrogen electrode) and a large specific capacity per unit weight and volume (3860 mAh / g and 2062 mAh / cm 3 3, respectively), so it is preferable.

[0109] Examples of carbon-based materials include graphite, graphitizable carbon (soft carbon), non-graphitizable carbon (hard carbon), carbon nanotubes, graphene, carbon black, and the like.

[0110] Examples of graphite include artificial graphite such as mesocarbon microbeads (MCMB), coke-based artificial graphite, and pitch -based artificial graphite, and natural graphite such as spheroidized natural graphite.

[0111] Graphite exhibits a potential as low as that of lithium metal (0.1 - 0.3 V vs. Li / Li 2+) when lithium ions are inserted into graphite (when forming a lithium-graphite intercalation compound). + ) Due to this, lithium-ion secondary batteries can exhibit a high operating voltage. Furthermore, graphite has advantages such as a relatively high capacity per unit volume, small volume expansion, low cost, and high safety compared to lithium metal, so it is preferable.

[0112] As the negative electrode active material, a material capable of performing charge and discharge reactions through alloying / dealloying reactions with lithium can also be used. When the carrier ion is a lithium ion, for example, There is a material containing at least one of Al, Si, Ge, Sn, Pb, Sb, Bi, Ag, Au, Zn, Cd, In, Ga, etc. Such elements have a large capacity relative to carbon, and especially silicon has a theoretically extremely high capacity of 4200 mAh / g. Therefore, it is preferable to use silicon as the negative electrode active material. Examples of materials using such elements include, for example, SiO , Mg2Si, Mg2Ge, SnO, SnO2, Mg2Sn, SnS2, V2Sn3, F eSn2, CoSn2, Ni3Sn2, Cu6Sn5, Ag3Sn, Ag3Sb, Ni2 MnSb, CeSb3, LaSn3, La3Co2Sn7, CoSb3, InSb, Sb Sn, etc. Note that SiO refers to a powder of silicon oxide containing a silicon-rich part, and can also be expressed as SiO (2 > y > 0). For example, SiO includes a material containing one or more selected from Si2O3, Si3 O4, or Si2O, or a mixture of Si powder and silicon dioxide SiO2. Also, SiO may contain other elements (such as carbon, nitrogen, iron, aluminum , copper, titanium, calcium, manganese, etc.). That is, it refers to a material containing one or more selected from single-crystalline Si, amorphous y Si, polycrystalline Si, Si2O3, Si3O4, Si2O, SiO2, and SiO is a colored material. SiO that is not SiO (X is 2 or more) is colorless and transparent or white and can be distinguished. However, after manufacturing a secondary battery using SiO as the material of the secondary battery, by repeating charge and discharge, etc., when SiO is oxidized, it may be transformed into SiO2. In addition, as the negative electrode active material, titanium oxide (such as TiO2, etc.), lithium titanium oxide (Li4T x (X is 2 or more) is colorless and transparent or white and can be distinguished. However, after manufacturing a secondary battery using SiO as the material of the secondary battery, by repeating charge and discharge, etc., when SiO is oxidized, it may be transformed into SiO2.

[0113] Also, as the negative electrode active material, titanium oxide (TiO2, etc.), lithium titanium oxide (Li4T i5O12 etc.), lithium-graphite intercalation compounds (Li x C6 etc.), niobium oxides (Nb2O5 etc.), tungsten oxides (WO2 etc.), molybdenum oxides (MoO2 etc.), etc. of oxides can be used .

[0114] Also, as the negative electrode active material, Li3N-type structured Li 3-x M x N (M = Co, Ni, Cu) can be used. For example, Li 2.6 Co 0.4 N3 shows a large charge-discharge capacity (900 mAh / g, 1890 mAh / cm 3 ) and is preferable.

[0115] When using a lithium-transition metal complex nitride, since lithium ions are contained in the negative electrode active material, it can be preferably combined with materials such as V2O5 and Cr3O8 that do not contain lithium ions as the positive electrode active material. Even when using a material containing lithium ions for the positive electrode active material, by previously desorbing the lithium ions contained in the positive electrode active material, a lithium-transition metal complex nitride can be used as the negative electrode active material.

[0116] Also, a material that causes a conversion reaction can be used as the negative electrode active material. For example, transition metal oxides such as cobalt oxide (CoO), nickel oxide (NiO), and iron oxide (FeO) that do not undergo an alloying reaction with lithium may be used as the negative electrode active material. As materials that cause a conversion reaction, further, oxides such as Fe2O3, CuO, Cu2O, RuO2, and Cr2O 3, sulfides such as CoS , NiS, and CuS, nitrides such as Zn3N2, Cu3N, G 3, etc., can be used. 0.89 , NiS, CuS, etc., nitrides such as Zn3N2, Cu3N, G ​​​Nitrides such as e3N4, phosphides such as NiP2, FeP2, CoP3, and fluorides such as FeF3, BiF3 This also occurs with fluorides. Since the potential of the above fluorides is high, they can be used as the positive electrode active material .

[0117] In addition to the above-described negative electrode active material, the negative electrode active material layer 419 may also contain a binder for enhancing the adhesion of the active material, a conductive auxiliary agent for enhancing the conductivity of the negative electrode active material layer 419, etc.

[0118] For example, in the configuration of the secondary battery, the thickness of the separator 413 is about 25 μm, the positive electrode current collector 412 is about 20 μm or more and about 40 μm or less, the positive electrode active material layer 418 is about 100 μm, and the negative electrode active material layer 41 9 is about 100 μm, and the negative electrode current collector 414 is about 20 μm or more and about 40 μm or less. The thickness of the film 411 is 0.113 mm. Also, the depth of the embossing process on the film 411 is about 500 μm. When the depth of the embossing process on the film 411 is 2 mm or more, the overall thickness of the secondary battery becomes too thick. Therefore, the depth of the embossing process is 1 mm or less, preferably 500 μm or less. Note that in Fig. 7(E), the adhesive layer 430 is only partially shown . A layer made of polypropylene is provided on the surface of the film 411, and only the thermocompression-bonded portion becomes the adhesive layer 430.

[0119] Also, Fig. 7(E) shows an example in which the lower side of the film 411 is fixed and pressure-bonded . In this case, the upper side is greatly bent and a step is formed. Therefore, when a plurality of, for example, eight or more combinations of the above laminations are provided between the bent films 411 , the step becomes large , and there is a risk that too much stress is applied to the upper film 411. Also, for this reason, the upper ​​There is also a risk that the displacement between the end face of the film and the end face of the lower film will increase. In that case , a step may also be provided on the lower film so that there is no displacement at the end face, and it may be configured to be pressure-bonded at the center so that the stress is equalized .

[0120] Here, the flow of current during charging of the secondary battery will be described with reference to Fig. 7(F). When a secondary battery using lithium is regarded as a single closed circuit, the movement of lithium ions and the flow of current are in the same direction . In a secondary battery using lithium, the anode (positive electrode) and the cathode (negative electrode) are reversed during charging and discharging, and the oxidation reaction and the reduction reaction are reversed. Therefore, the electrode with a high reaction potential is called the positive electrode, and the electrode with a low reaction potential is called the negative electrode. Therefore, in this specification , whether during charging, discharging, or when a reverse pulse current is flowing, or when a charging current is flowing, the positive electrode is called the "positive electrode" or the "+ electrode (plus electrode)", and the negative electrode is called the "negative electrode" or the "- electrode (minus electrode)". When using terms such as anode (positive electrode) and cathode (negative electrode) related to oxidation reactions and reduction reactions, during charging and discharging , they will be reversed, which may cause confusion. Therefore, the terms anode (positive electrode) and cathode (negative electrode) will not be used in this specification. If the terms anode (positive electrode) and cathode (negative electrode) are used, it shall be specified whether it is during charging or discharging, and it shall also be noted which corresponds to the positive electrode (plus electrode) and the negative electrode (minus electrode). Therefore, the terms anode (positive electrode) and cathode (negative electrode) will not be used in this specification. If the terms anode (positive electrode) and cathode (negative electrode) are used, it shall be specified whether it is during charging or discharging, and it shall also be noted which corresponds to the positive electrode (plus electrode) and the negative electrode (minus electrode). If the terms anode (positive electrode) and cathode (negative electrode) are used, it shall be specified whether it is during charging or discharging, and it shall also be noted which corresponds to the positive electrode (plus electrode) and the negative electrode (minus electrode).

[0121] A charger is connected to the two terminals shown in Fig. 7(F), and the secondary battery 103 is charged. As the charging of the secondary battery 103 progresses, the potential difference between the electrodes increases. In Fig. 7(F), the secondary battery 1 ​Flowing from the external terminal of 03 toward the positive current collector 412, within the secondary battery 103, the positive flows from the positive current collector 412 toward the negative current collector 414, and the direction of the current flowing from the negative electrode toward the external terminal of the secondary battery 103 is defined as the positive direction. That is, the direction in which the charging current flows is defined as the direction of the current.

[0122] Also, FIG. 9 shows a perspective view of the bent lithium-ion secondary battery. Note that the bending direction is not limited to that shown in FIG. 9 and can be bent in other directions. The shape of the bent lithium-ion secondary battery is maintained by the embossed exterior body. The lithium-ion secondary battery shown in FIG. 9 retains its function as a secondary battery even when repeatedly bent. Also, when housing the bent lithium-ion secondary battery within the housing of an electronic device, it is preferable to provide a buffer layer above and below or around the bent lithium-ion secondary battery to mitigate the collision with other members (films and elements) when the electronic device is bent. with other members (films and elements) when the electronic device is bent.

[0123] In this embodiment, an example of applying to a lithium-ion secondary battery is shown, but one aspect of the present invention is not limited thereto. It is also applicable to various secondary batteries, for example, lead-acid batteries, lithium-ion polymer secondary batteries, nickel-metal hydride batteries, nickel-cadmium batteries, nickel- iron batteries, nickel-zinc batteries, silver oxide-zinc batteries, solid-state batteries, air batteries, etc. Or, it is applicable to various power storage devices, for example to primary batteries, capacitors, lithium-ion capacitors, etc.

[0124] This embodiment can be freely combined with other embodiments.

[0125] (Embodiment 4)​​​​​ In this embodiment, the configuration of an input / output device (display panel having a touch input sensor ) according to one aspect of the present invention will be described with reference to FIGS. 10 and 11.

[0126] FIG. 10 is a projection view for explaining the configuration of an input / output device according to one aspect of the present invention.

[0127] FIG. 10(A) is a projection view of an input / output device 500 according to one aspect of the present invention, and FIG. 10(B) is a projection view for explaining the configuration of a detection unit 20U included in the input / output device 500.

[0128] FIG. 11 is a cross-sectional view for explaining the configuration of an input / output device 500 according to one aspect of the present invention.

[0129] FIG. 11(A) is a cross-sectional view of the input / output device 500 according to one aspect of the present invention shown in FIG. 10 at Z1-Z2. sectional view.

[0130] Note that the input / output device 500 can also be referred to as a touch panel.

[0131] <Configuration Example 1 of Input / Output Device.> The input / output device 500 described in this embodiment includes a window portion 14 that transmits visible light and a plurality of detection units 20U arranged in a matrix pattern, a scanning line G1 electrically connected to the plurality of detection units 20U arranged in the row direction (indicated by an arrow R in the figure), a signal line DL electrically connected to the plurality of detection units 20U arranged in the column direction (indicated by an arrow C in the figure), and a flexible substrate 16 that supports the detection units 20U, the scanning line G1, and the signal line DL. The flexible input device 100 includes, and a display unit 501 including a plurality of pixels 502 that overlap the window portion 14 and are arranged in a matrix pattern, and a flexible substrate 510 that supports the pixels 502. (See FIGS. 10(A) to 10(C)). pixels 502 and a flexible substrate 510 that supports the pixels 502. have (see FIGS. 10(A) to 10(C)).

[0132] The detection unit 20U includes a detection element C that overlaps the window portion 14 and a detection circuit 19 that is electrically connected to the detection element C (see Fig. 10(B)).

[0133] The detection element C includes an insulating layer 23, a first electrode 21 and a second electrode 22 that sandwich the insulating layer 23 (see Fig. 11(A)).

[0134] The detection circuit 19 is supplied with a selection signal and supplies a detection signal D ATA based on the change in the capacitance of the detection element C.

[0135] The scanning line G1 can supply a selection signal, the signal line DL can supply a detection signal DATA, and the detection circuit 19 is arranged so as to overlap the gaps between the plurality of window portions 14.

[0136] Also, the input / output device 500 described in this embodiment includes a coloring layer between the detection unit 20U and the pixel 502 that overlaps the window portion 14 of the detection unit 20U.

[0137] The input / output device 500 described in this embodiment includes a flexible input device 100 having a plurality of detection units 20U each having a window portion 14 that transmits visible light, and a plurality of pixels 502 that overlap the window portion 14. It has a flexible display unit 501, and is configured to include a coloring layer between the window portion 14 and the pixel 502.

[0138] As a result, the input / output device can supply a detection signal based on a change in capacitance and position information of the detection unit that supplies the detection signal, display image information associated with the position information of the detection unit, and can be bent. As a result, a novel input / output device excellent in convenience or reliability can be provided. ​​​​​​​​

[0139] In addition, the input / output device 500 may include a flexible substrate FPC1 to which the signal supplied by the input device 100 is supplied and / or a flexible substrate FPC2 that supplies a signal including image information to the display unit 501.

[0140] Moreover, it may include a protective layer 17p that prevents the occurrence of scratches and protects the input / output device 500 and / or an antireflection layer 567p that weakens the intensity of external light reflected by the input / output device 500.

[0141] In addition, the input / output device 500 includes a scanning line driving circuit 503g that supplies a selection signal to the scanning lines of the display unit 501, a wiring 511 that supplies a signal, and a terminal 519 that is electrically connected to the flexible substrate FPC2.

[0142] Hereinafter, each element constituting the input / output device 500 will be described. Note that these configurations cannot be clearly separated, and there are cases where one configuration also serves as another configuration or includes a part of another configuration.

[0143] For example, the input device 100 having a colored layer at a position overlapping a plurality of window portions 14 is the input device 10 0 and also a color filter.

[0144] In addition, for example, the input / output device 500 in which the input device 100 is overlaid on the display unit 501 is the input device 100 and also the display unit 501.

[0145] The input / output device 500 includes an input device 100 and a display unit 501 (see Fig. 10(A)).

[0146] The input device 100 includes a plurality of detection units 20U and a flexible base material that supports the detection units. ​​​​​It includes 16. For example, a plurality of detection units 20U are arranged in a matrix of 40 rows and 15 columns on a flexible substrate 16.

[0147] The window portion 14 transmits visible light.

[0148] A colored layer that transmits light of a predetermined color is provided at a position overlapping the window portion 14. For example, a colored layer CFB that transmits blue light, a colored layer CFG that transmits green light, or a colored layer CFR that transmits red light (see FIG. 10(B)).

[0149] In addition to blue, green, and / or red, a colored layer that transmits white light or a colored layer that transmits yellow light and other colored layers that transmit light of various colors can be provided.

[0150] A metal material, a pigment, a dye, etc. can be used for the colored layer.

[0151] A light-shielding layer BM is provided so as to surround the window portion 14. The light-shielding layer BM transmits less light than the window portion 14 is.

[0152] Carbon black, metal oxides, composite oxides containing a solid solution of a plurality of metal oxides, etc. can be used for the light-shielding layer BM.

[0153] A scanning line G1, a signal line DL, a wiring VPI, a wiring RES, and a wiring VRES and a detection circuit 19 are provided at a position overlapping the light-shielding layer BM.

[0154] In addition, a light-transmissive overcoat layer that covers the colored layer and the light-shielding layer BM can be provided if possible.

[0155] The detection element C includes a first electrode 21, a second electrode 22, and the first electrode 21 and the second electrode 22 It has an insulating layer 23 therebetween (see Fig. 11(A)).

[0156] The first electrode 21 is formed, for example, in an island shape so as to be separated from other regions. In particular, in order for the user of the input / output device 500 not to identify the first electrode 21, it is preferable to arrange a layer that can be fabricated in the same process close to the first electrode 21. More preferably, the number of window portions 14 arranged in the gap between the first electrode 21 and the layer arranged close to the first electrode 21 should be minimized as much as possible. In particular, it is preferable not to arrange the window portion 14 in the said gap.

[0157] It includes a second electrode 22 so as to overlap with the first electrode 21, and an insulating layer 23 is provided between the first electrode 21 and the second electrode 22.

[0158] For example, when an object having a dielectric constant different from that of the atmosphere approaches the first electrode 21 or the second electrode 22 of the detection element C placed in the atmosphere, the capacitance of the detection element C changes. Specifically, when a finger or the like approaches the detection element C, the capacitance of the detection element C changes. Thus, it can be used as a proximity detector.

[0159] For example, the capacitance of the deformable detection element C changes as it deforms.

[0160] Specifically, when a finger or the like touches the detection element C, the distance between the first electrode 21 and the second electrode 22 becomes narrower, and the capacitance of the detection element C increases. Thus, it can be used as a contact detector.

[0161] Specifically, when the detection element C is bent, the capacitance between the first electrode 21 and the second electrode 22 ​​​​​​​​The gap becomes narrower. As a result, the capacitance of the detection element C increases. Thus, it can be used for the bending detector. It can be used.

[0162] The first electrode 21 and the second electrode 22 contain a conductive material.

[0163] For example, an inorganic conductive material, an organic conductive material, a metal, or a conductive ceramic can be used for the first electrode 21 and the second electrode 22.

[0164] Specifically, a metal element selected from aluminum, chromium, copper, tantalum, titanium, molybdenum, tungsten , nickel, silver, or manganese, an alloy containing the above-described metal element as a component, or an alloy combining the above-described metal elements can be used.

[0165] Alternatively, a conductive oxide such as indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, or zinc oxide added with gallium can be used.

[0166] Alternatively, graphene or graphite can be used. A film containing graphene can be formed, for example, by reducing a film containing graphene oxide formed in a film shape. As the reduction method, a method of applying heat or a method of using a reducing agent can be mentioned. As the reduction method, a method of applying heat or a method of using a reducing agent can be mentioned.

[0167] Alternatively, a conductive polymer can be used.

[0168] As shown in FIG. 12(A), the detection circuit 19 includes, for example, a first transistor M1 to a third transistor M3. The detection circuit 19 also includes wirings for supplying a power supply potential and a signal. For example, a signal line DL, a wiring VPI, a wiring CS, a scanning line G1, a wiring RES, a wiring VRES, etc. For example, a signal line DL, a wiring VPI, a wiring CS, a scanning line G1, a wiring RES, a wiring VRES, etc. It includes a nose. The specific configuration of the detection circuit 19 will be described in detail in Embodiment 5.

[0169] Note that the detection circuit 19 may be arranged in a region that does not overlap with the window portion 14. For example, by arranging wiring in a region that does not overlap with the window portion 14, it is possible to easily visually recognize what is on the other side from one side of the detection unit 20U.

[0170] For example, transistors that can be formed in the same process can be used for the first transistor M1 to the third transistor M3.

[0171] The first transistor M1 has a semiconductor layer. For example, an element of Group 4, a compound semiconductor, or an oxide semiconductor can be used for the semiconductor layer. Specifically, a semiconductor containing silicon, a semiconductor containing gallium arsenide, or an oxide semiconductor containing indium can be applied. A material having conductivity can be applied to the wiring.

[0172]

[0173] For example, an inorganic conductive material, an organic conductive material, a metal, or a conductive ceramic can be used for the wiring. Specifically, the same material as that which can be used for the first electrode 21 and the second electrode 22 can be applied.

[0174] Metal materials such as aluminum, gold, platinum, silver, nickel, titanium, tungsten, chromium, molybdenum, iron, cobalt, copper, or palladium, and alloy materials containing the metal materials can be used for the scanning line G1, the signal line DL, the wiring VPI, the wiring RES, and the wiring VRES.

[0175] The film formed on the base material 16 may be processed to form the detection circuit 19 on the base material 16.

[0176] ​​​​​​​​ Alternatively, the detection circuit 19 formed on another substrate may be transferred onto the substrate 16.

[0177] The method for manufacturing the detection circuit will be described in detail in Embodiment 5.

[0178] An organic material, an inorganic material, or a composite material of an organic material and an inorganic material can be used for the flexible substrate 16. This is possible.

[0179] A material having a thickness of 5 μm or more and 2500 μm or less, preferably 5 μm or more and 680 μm or less, more preferably 5 μm or more and 170 μm or less, still more preferably 5 μm or more and 45 μm or less, and even more preferably 8 μm or more and 25 μm or less can be used for the substrate 16.

[0180] In addition, a material with suppressed impurity permeation can be suitably used for the substrate 510. For example, , a material with a water vapor transmission rate of 10 -5 g / (m 2 ·day) or less, preferably 10 -6 g / (m 2

[0181] ·day) or less can be suitably used. In addition, a material having approximately the same linear expansion coefficient as the material constituting the substrate 510 can be suitably used for the substrate 16. For example, a material with a linear expansion coefficient of 1×10 -3 / K or less, preferably 5×10 -5 / K or less, and more preferably 1×10 -5 / K or less can be suitably used.

[0182] For example, an organic material such as a resin, a resin film, or a plastic film can be used for the substrate 16.

[0183] ​​​​For example, an inorganic material such as a metal plate or a thin glass plate with a thickness of 10 μm or more and 50 μm or less can be used for the base material 16.

[0184] For example, a composite material formed by laminating a metal plate, a thin glass plate, or a film of an inorganic material to a resin film or the like using a resin layer can be used for the base material 16.

[0185] For example, a composite material in which fibrous or particulate metal, glass, or inorganic material is dispersed in a resin or a resin film can be used for the base material 16.

[0186] For example, a thermosetting resin or an ultraviolet curable resin can be used for the resin layer.

[0187] Specifically, a resin film or a resin plate such as polyester, polyolefin, polyamide, polyimide, polycarbonate or acrylic resin can be used.

[0188] Specifically, non-alkali glass, soda lime glass, potassium glass, or crystal glass or the like can be used.

[0189] Specifically, a metal oxide film, a metal nitride film, or a metal oxynitride film or the like can be used For example, silicon oxide, silicon nitride, silicon oxynitride, an alumina film, etc. can be applied.

[0190] Specifically, SUS or aluminum or the like provided with an opening can be used.

[0191] Specifically, a resin having an acrylic, urethane, epoxy, or siloxane bond or the like can be used.

[0192] For example, a laminate in which a flexible base material 16b, a barrier film 16a that prevents diffusion of impurities, and a resin layer 16c that bonds the base material 16 b and the barrier film 16a are laminated can be suitably used for the base material 16 (see Fig. 11(A)).

[0193] Specifically, a film containing a laminated material in which a silicon oxynitride film with a thickness of 600 nm and a silicon nitride film with a thickness of 200 nm are laminated can be used for the barrier film 16a.

[0194] Specifically, a film containing a laminated material in which a silicon oxynitride film with a thickness of 600 nm, a silicon nitride film with a thickness of 200 nm, a silicon oxynitride film with a thickness of 20 0 nm, a silicon oxynitride film with a thickness of 140 nm, and a silicon oxynitride film with a thickness of 100 nm are laminated in this order can be used for the barrier film 16a. can be used.

[0195] Resin films such as polyester, polyolefin, polyamide, polyimide, polycarbonate, or acrylic resin, resin plates, or laminates can be used for the base material 16b . .

[0196] For example, materials containing resins such as polyester, polyolefin, polyamide (nylon, aramid, etc.), polyimide, polycarbonate, or acrylic, urethane, epoxy, or siloxane bonds can be used for the resin layer 16c.

[0197] A flexible protective base material 17 or / and a protective layer 17p can be provided. The flexible protective base material 17 or the protective layer 17p prevents the occurrence of scratches and protects the input device 100.

[0198] For example, polyester, polyolefin, polyamide, polyimide, polycarbonate, or ​Alternatively, a resin film such as an acrylic resin, a resin plate, a laminate, or the like may be used as the protective base material 17. This is possible.

[0199] For example, a hard coat layer or a ceramic coat layer can be used as the protective layer 17p. Specifically, a layer containing a UV curable resin or aluminum oxide may be formed at a position overlapping the second electrode 22. This may be formed at a position overlapping the second electrode 22.

[0200] The display unit 501 includes a plurality of pixels 502 arranged in a matrix (see Fig. 10(C)). (Reference)

[0201] For example, the pixel 502 includes a sub-pixel 502B, a sub-pixel 502G, and a sub-pixel 502R, and each sub-pixel includes a display element and a pixel circuit for driving the display element. Each of these sub-pixels includes a display element and a pixel circuit for driving the display element.

[0202] Note that the sub-pixel 502B of the pixel 502 is arranged at a position overlapping the coloring layer CFB, the sub-pixel 502G is arranged at a position overlapping the coloring layer CFG, and the sub-pixel 502R is arranged at a position overlapping the coloring layer CFR. The sub-pixel 502G is arranged at a position overlapping the coloring layer CFG, and the sub-pixel 502R is arranged at a position overlapping the coloring layer CFR. This is arranged at a position overlapping the coloring layer CFR.

[0203] In this embodiment, the case of applying an organic electroluminescence element that emits white light as the display element will be described, but the display element is not limited to this. For example, organic electroluminescence elements having different emission colors may be applied to each sub-pixel so that the color of the light emitted from each sub-pixel is different.

[0204] For example, organic electroluminescence elements having different emission colors may be applied to each sub-pixel so that the color of the light emitted from each sub-pixel is different. This may be applied to each sub-pixel.

[0205] Also, in the display unit, an active matrix method in which the pixel has an active element, or a passive matrix method in which the pixel does not have an active element can be used. This can be used.

[0206] In the active matrix method, as active elements (active elements, non-linear elements), not only transistors but also various active elements (active elements, non-linear elements) can be used. For example, it is possible to use MIM (Metal Insulator Metal), or TF D (Thin Film Diode), etc. Since these elements have few manufacturing steps, it is possible to reduce the manufacturing cost or improve the yield. Or, since these elements have a small element size, the aperture ratio can be improved, and low power consumption and high brightness can be achieved.

[0207] As something other than the active matrix method, it is also possible to use a passive matrix type that does not use active elements (active elements, non-linear elements). Since active elements (active elements, non-linear elements) are not used and there are few manufacturing steps, it is possible to reduce the manufacturing cost or improve the yield. Or, since active elements (active elements, non-linear elements) are not used, the aperture ratio can be improved, and low power consumption, high brightness, etc. can be achieved.

[0208] A material having flexibility can be used for the substrate 510. For example, the material that can be used for the base material 16 can be applied to the substrate 510.

[0209] For example, a laminate in which a flexible substrate 510b, an insulating layer 510a that prevents diffusion of impurities, and an adhesive layer 510c that bonds the substrate 5 10b and the insulating layer 510a are laminated can be suitably used for the substrate 510 (see Fig. 11(A)).

[0210] The sealing layer 560 bonds the base material 16 and the substrate 510. The sealing layer 560 has a refractive index greater than that of air. When extracting light from the sealing layer 560 side, the sealing layer 560 has the function of optical bonding.

[0211] The pixel circuit and the light-emitting element (for example, the light-emitting element 550R) are located between the substrate 510 and the base material 16.

[0212] The sub-pixel 502R includes a light-emitting module 580R.

[0213] The sub-pixel 502R includes a pixel circuit including the light-emitting element 550R and a transistor 502t capable of supplying power to the light-emitting element 550R. The light-emitting module 580R includes the light-emitting element 550R and an optical element (for example, a coloring layer CFR).

[0214] The light-emitting element 550R has a lower electrode, an upper electrode, and a layer containing a light-emitting organic compound between the lower electrode and the upper electrode.

[0215] The light-emitting module 580R has a coloring layer CFR in the light extraction direction. The coloring layer may be any layer that transmits light having a specific wavelength, for example, a layer that selectively transmits light exhibiting red, green, blue, etc. In addition, it may be arranged so that other sub-pixels overlap a window portion where the coloring layer is not provided, and the light emitted from the light-emitting element without passing through the coloring layer may be emitted.

[0216] When the sealing layer 560 is provided on the light extraction side, the sealing layer 560 is in contact with the light-emitting element 550R and the coloring layer CFR.

[0217] The coloring layer CFR is located at a position overlapping the light-emitting element 550R. Thereby, the light-emitting element 550R ​​​​​​​​​​A part of the emitted light passes through the colored layer CFR and is emitted outside the light-emitting module 58 in the direction of the arrow shown in the figure. to the outside of 0R.

[0218] There is a light-shielding layer BM surrounding the colored layer (for example, the colored layer CFR).

[0219] An insulating film 521 covering the transistor 502t included in the pixel circuit is provided. The insulating film 521 can be used as a layer for flattening the unevenness caused by the pixel circuit. Also, impurities A laminated film including a layer capable of suppressing the diffusion of can be applied to the insulating film 521. As a result it is possible to suppress a decrease in reliability of the transistor 502t and the like due to the diffusion of impurities.

[0220] A lower electrode is disposed on the insulating film 521, and a partition wall 528 is disposed on the insulating film 521 so as to overlap the end portion of the lower electrode. to be disposed on the insulating film 521.

[0221] The lower electrode sandwiches a layer containing a light-emitting organic compound between the upper electrode to form a light-emitting element (for example, the light-emitting element 550R). The pixel circuit supplies power to the light-emitting element.

[0222] Also, on the partition wall 528, there is a spacer for controlling the distance between the base material 16 and the substrate 510.

[0223] The scanning line driving circuit 503g(1) includes a transistor 503t and a capacitor 503c. In addition Transistors that can be formed on the same substrate in the same process as the pixel circuit can be used for the driving circuit can be used.

[0224] Various circuits that can convert the detection signal DATA supplied by the detection unit 20U and supply it to the FPC1 can be used for the converter CONV (see FIGS. 10(A) and 1 1(A)). 1(A)).

[0225] For example, as shown in FIG. 12(A), the fourth transistor M4 can be used in the converter CONV. This is possible.

[0226] <Other Configuration> The display unit 501 includes an antireflection layer 567p at a position overlapping the pixel. As the antireflection layer 567p, for example, a circularly polarized plate can be used. This is possible.

[0227] The display unit 501 includes a wiring 511 capable of supplying a signal, and a terminal 519 is provided on the wiring 511. Note that a flexible printed circuit board (FPC2) capable of supplying signals such as an image signal and a synchronization signal is electrically connected to the terminal 519.

[0228] Note that a printed wiring board (PWB) may be attached to the flexible printed circuit board FPC2. This is acceptable.

[0229] The display unit 501 has wirings such as scanning lines, signal lines, and power lines. Various conductive films can be used for the wirings. This is possible.

[0230] Specifically, a metal element selected from aluminum, chromium, copper, tantalum, titanium, molybdenum, tungsten, nickel, yttrium, zirconium, silver, or manganese, an alloy containing the above-described metal element as a component, or an alloy combining the above-described metal elements can be used. In particular, it is preferable to contain one or more elements selected from aluminum, chromium, copper, tantalum, titanium, molybdenum, and tungsten. In particular, an alloy of copper and manganese is suitable for microfabrication using a wet etching method.

[0231] Specifically, a two-layer structure in which a titanium film is laminated on an aluminum film, a titanium film on a titanium nitride film ​​​​​​​Two-layer structure with a tungsten film laminated on a titanium nitride film, two-layer structure with a tungsten film laminated on a titanium nitride film, A two-layer structure in which a tungsten film is laminated on a titanium film or a tungsten nitride film, a titanium film, A three-layer structure in which an aluminum film is layered on the titanium film, and a titanium film is then formed on top of that. etc. can be used.

[0232] Specifically, titanium, tantalum, tungsten, molybdenum, chromium, etc. are deposited on an aluminum film. , neodymium, scandium or a combination of two or more of these. A laminated structure in which multiple chemical films are laminated can be used.

[0233] In addition, a light-transmitting conductive material containing indium oxide, tin oxide, or zinc oxide may be used. good.

[0234] <Modifications of the display section> Various transistors can be used for the display portion 501 .

[0235] A configuration in which a bottom gate type transistor is applied to the display portion 501 is shown in FIG. This is illustrated in FIG. 11(B).

[0236] For example, a semiconductor layer including an oxide semiconductor, amorphous silicon, or the like is shown in FIG. The present invention can be applied to a transistor 502t and a transistor 503t.

[0237] For example, a semiconductor layer containing polycrystalline silicon crystallized by a process such as laser annealing is applied to the transistor 502t and the transistor 503t shown in FIG. It is possible.

[0238] A structure in which a top-gate transistor is applied to the display portion 501 is shown in FIG. Illustrate.

[0239] For example, a single-crystalline silicon film or the like transferred from a polycrystalline silicon or single-crystalline silicon substrate or the like The semiconductor layer including can be applied to the transistors 502t and 5 03t shown in FIG. 11(C).

[0240] Note that this embodiment can be appropriately combined with other embodiments shown in this specification 。

[0241] (Embodiment 5) In this embodiment, the configuration and driving method of a detection circuit that can be used for the detection unit of the input / output device according to one aspect of the present invention will be described with reference to FIG. 12 。

[0242] FIG. 12 is a diagram for explaining the configuration and driving method of a detection circuit 19 and a converter CONV according to one aspect of the present invention 。

[0243] FIG. 12(A) is a circuit diagram for explaining the configuration of a detection circuit 19 and a converter CONV according to one aspect of the present invention, and FIGS. 12(B-1) and 12(B-2) are timing charts for explaining the driving method 。

[0244] The detection circuit 19 according to one aspect of the present invention includes a first transistor M1 whose gate is electrically connected to the first electrode 21 of the detection element C, and the first electrode is electrically connected to a wiring VPI that can supply, for example, a ground potential (see FIG. 12(A)). 。

[0245] Further, the gate is electrically connected to a scanning line G1 that can supply a selection signal, the first electrode is electrically connected to the second electrode of the first transistor M1, and the second electrode is, for example, a detection A second transistor M2 that is electrically connected to a signal line DL capable of supplying a known signal DATA may be provided.

[0246] Further, the gate is electrically connected to a wiring RES capable of supplying a reset signal, the first electrode is electrically connected to the first electrode 21 of the detection element C, and the second electrode is electrically connected to a wiring VRES capable of supplying, for example, a ground potential. A third transistor M3 may be provided.

[0247] The capacitance of the detection element C changes, for example, when an object approaches the first electrode 21 or the second electrode 22, or when the distance between the first electrode 21 and the second electrode 22 changes. Thus, the detection unit 20U can supply a detection signal DATA based on the change in the capacitance of the detection element C.

[0248] Further, the detection unit 20U includes a wiring CS capable of supplying a control signal for controlling the potential of the second electrode 22 of the detection element C.

[0249] Note that a node where the first electrode 21 of the detection element C, the gate of the first transistor M1, and the first electrode of the third transistor M3 are electrically connected is referred to as node A.

[0250] The wiring VRES and the wiring VPI can supply, for example, a ground potential, and the wiring VPO and the wiring BR can supply, for example, a high power supply potential.

[0251] Further, the wiring RES can supply a reset signal, the scanning line G1 can supply a selection signal, and the wiring CS can supply a control signal for controlling the potential of the second electrode 22 of the detection element C. ​​​​​​It can be done.

[0252] Also, the signal line DL can supply the detection signal DATA, and the terminal OUT can supply the signal converted based on the detection signal DA TA.

[0253] Note that various circuits capable of converting the detection signal DATA and supplying it to the terminal OUT can be used in the converter CONV. For example, by electrically connecting the converter CONV to the detection circuit 19, a source follower circuit or a current mirror circuit can be configured as well.

[0254] Specifically, a source follower circuit can be configured using the converter CONV using the fourth transistor M4 (see Fig. 12(A)). Note that a transistor that can be fabricated in the same process as the first transistor M1 to the third transistor M3 can be used as the fourth transistor M 4.

[0255] Also, the first transistor M1 to the third transistor M3 have a semiconductor layer. For example , an element of Group 4, a compound semiconductor, or an oxide semiconductor can be used for the semiconductor layer. Specifically , a semiconductor containing silicon, a semiconductor containing gallium arsenide, or an indium-containing oxide semiconductor, etc. can be applied.

[0256] <Driving method of the detection circuit 19> The driving method of the detection circuit 19 will be described. <The first step > In the first step, after turning on the third transistor M3, a reset signal that turns it off is supplied to the gate, and the potential of the first electrode 21 of the detection element C is set to a predetermined potential (see period T1 in Fig. 12(B-1)).

[0257] ​​​​ Specifically, a reset signal is supplied to the wiring RES. The third transistor M3 to which the reset signal is supplied sets the potential of node A to, for example, the ground potential (see FIG. 12(A)).

[0258] 《Second Step》In the second step, the second transistor M2 is turned on, a selection signal is supplied to the gate, and the second electrode of the first transistor M1 is electrically connected to the signal line DL.

[0259] Specifically, a selection signal is supplied to the scanning line G1. The second transistor M2 to which the selection signal is supplied electrically connects the second electrode of the first transistor M1 to the signal line DL (see the period T2 in FIG. 12(B-1)).

[0260] 《Third Step》In the third step, a control signal is supplied to the second electrode 22 of the sensing element C, and a potential that changes based on the control signal and the capacitance of the sensing element C is supplied to the gate of the first transistor M1.

[0261] Specifically, a rectangular control signal is supplied to the wiring CS. The sensing element C to which the rectangular control signal is supplied to the second electrode 22 raises the potential of node A based on the capacitance of the sensing element C (see the latter half of the period T2 in FIG. 12(B-1)).

[0262] For example, when the sensing element C is placed in the air and an object with a higher dielectric constant than air is placed close to the second electrode 22 of the sensing element C, the capacitance of the sensing element C appears to increase.

[0263] As a result, the change in the potential of node A caused by the rectangular control signal is higher than that of the air in terms of dielectric constant. ​​​​​​​​​​​It becomes smaller compared to the case where the objects are not arranged close to each other (refer to the solid line in Fig. 12(B-2)). .

[0264] 《Fourth Step》In the fourth step, the signal caused by the change in the potential of the gate of the first transistor M1 is supplied to the signal line DL. Supply the signal resulting from the change in the potential of the gate of the first transistor M1 to the signal line DL.

[0265] For example, supply the change in current caused by the change in the potential of the gate of the first transistor M1 to the signal line D L.

[0266] The converter CONV converts the change in current flowing through the signal line DL into a change in voltage and supplies it.

[0267] 《Fifth Step》In the fifth step, a selection signal that turns the second transistor M2 off is supplied to the gate. Supply a selection signal that turns the second transistor M2 off to the gate.

[0268] In this embodiment, a structure in which a display element and a touch sensor element are provided between a pair of film substrates, i.e., an example of a so-called in-cell structure is shown, but it is not particularly limited. A display panel provided with a display element between a pair of film substrates and a film substrate having a touch sensor element may be overlapped with each other, i.e., a so-called on-cell structure. In the case of an on-cell structure, since one or two more film substrates are required compared to the in-cell structure, the thickness increases.

[0269] (Embodiment 6) In this embodiment, an example of an electronic device is shown in Fig. 13.

[0270] As an electronic device to which a power storage device having a flexible shape is applied, for example, a display device such as a head-mounted display or a goggle-type display (also referred to as a television or a television receiver), a personal computer such as a desktop type or a notebook type, a computer ... monitors for computers, digital cameras, digital video cameras, digital Voice input for tablet frames, electronic organizers, e-book terminals, electronic translators, toys, microphones, etc. Equipment, electric shavers, electric toothbrushes, microwave ovens and other high-frequency heating devices, electric rice cookers, Washing machines, vacuum cleaners, water heaters, electric fans, hair dryers, humidifiers, dehumidifiers and air conditioners Air conditioning equipment such as dishwashers, dish dryers, clothes dryers, futon dryers, electric refrigerators, Electric freezers, electric refrigerators and freezers, freezers for DNA storage, flashlights, power tools, smoke detectors, gas Alarm devices such as fire alarms and burglar alarms, industrial robots, hearing aids, cardiac pacemakers, X-ray equipment, radiation measuring equipment, health and medical equipment such as electric massagers and dialysis machines, Mobile telephones (also called mobile phones or mobile phone devices), portable game machines, portable information terminals, lighting equipment Desks, headphones, stereos, remote controllers, clocks such as table clocks and wall clocks, Mobile phones, transceivers, pedometers, calculators, digital audio players, etc. Examples of suitable devices include portable or stationary audio playback devices, and large game machines such as pachinko machines.

[0271] In addition, the flexible energy storage device can be attached to the inner or outer walls of a house or building, or to an automobile. It is also possible to install it along the curved surface of the interior or exterior of the car. It is advantageous to overlay a buffer layer on a flexible energy storage device.

[0272] FIG. 13A shows an example of a mobile phone. The mobile phone 7400 has a housing 740 In addition to the display unit 7402 incorporated in the 1, the operation buttons 7403, the external connection port 7404, The mobile phone 7400 includes a speaker 7405, a microphone 7406, and the like. It has an electric device 7407.

[0273] FIG. 13(B) shows a state in which the mobile phone 7400 is bent. When the mobile phone 74 00 is deformed by an external force to be bent as a whole, the power storage device 7407 provided therein is also bent. Also, the state of the bent power storage device 7407 at that time is shown in FIG. 13( C). The power storage device 7407 is a laminated structure battery (also called a stacked structure battery or a film-packaged battery). The power storage device 7407 is fixed in a bent state. Incidentally , the power storage device 7407 has a lead electrode 7408 electrically connected to a current collector 7409. For example, embossing is performed on the film of the exterior body of the power storage device 7407, and the reliability in the state where the power storage device 7407 is bent is high. Further, the mobile phone 7400 may be provided with a slot for inserting a SIM card, a connector portion for connecting USB devices such as a USB memory, and the like. 7400 may be provided with a slot for inserting a SIM card, a connector portion for connecting USB devices such as a USB memory, and the like. For example, embossing is performed on the film of the exterior body of the power storage device 7407, and the reliability in the state where the power storage

[0274] FIG. 13(D) shows an example of a bendable mobile phone. If it is bent into a shape that can be wound around the forearm, it can be made into a bangle-type mobile phone shown in FIG. 13(E). The mobile phone 7100 includes a housing 7101, a display unit 7102, operation buttons 7103, and a power storage device 71 04. Also, FIG. 13(F) shows the state of the power storage device 7104 that can be bent. When the power storage device 7104 is bent and worn on the user's arm, the housing is deformed and the curvature of part or all of the power storage device 7104 changes. Specifically, within a range where the radius of curvature is 10 mm or more and 1 50 mm or less, part or all of the main surface of the housing or the power storage device 7104 changes. When the power storage device 7104 is bent and worn on the user's arm, the housing is deformed and the curvature of part or all of the power storage device 7104 changes. Specifically, within a range where the radius of curvature is 10 mm or more and 1 The power storage device 7104 is connected to a current collector 7106 and a lead electrode 7105. For example, a plurality of projections and recesses are formed on the surface of the film of the exterior body of the power storage device 7104. The power storage device 7104 is bent many times while changing its curvature. The mobile phone 7100 is also designed to maintain high reliability even under extreme conditions. It has a slot for inserting cards and a connector for connecting USB devices such as USB memory. Also, when the central part of the mobile phone shown in FIG. In addition, the shape shown in FIG. 13(G) can be used. 13(H) to make the mobile phone smaller by folding it so that the ends overlap. It can be made small enough to fit in a user's pocket. The story is about a device that can take on multiple shapes, and there are a few things that go into making it happen. At least the housing 7101, the display portion 7102, and the power storage device 7104 are preferably flexible. In addition, between the housing 7101 and the display portion 7102, between the housing 7101 and the power storage device 7104, It is preferable to provide a buffer layer between the display portion 7102 and the power storage device 7104 or between the display portion 7102 and the power storage device 7104 .

[0275] In addition, the contents (or even a part of the contents) described in one embodiment may be used in the embodiment. Another content (or a part of the content) described in the embodiment, and / or one or more other embodiments The application, combination, or replacement of the contents (or part of the contents) described in the form It is possible to do the following:

[0276] The contents described in the embodiments are explained in detail with reference to various figures in each embodiment. It refers to the content described or the content described using the text described in the specification.

[0277] Note that in one embodiment, the figure (even a part thereof) described in that embodiment may be combined with another part of that figure, another figure (even a part thereof) described in that embodiment, and / or a figure (even a part thereof) described in one or more other embodiments to form even more figures.

[0278] Note that for the content not defined in the drawings or text in the specification, one aspect of the invention can be constituted by excluding that content. Or, for a certain value, when a numerical range indicated by an upper limit value and a lower limit value, etc. is described, by arbitrarily narrowing that range, or by excluding a point within that range, one aspect of the invention excluding a part of that range can be defined. Thus, for example, it can be defined that the prior art does not fall within the technical scope of one aspect of the present invention.

[0279] As a specific example, assume that a circuit diagram using first to fifth transistors is described in a certain circuit. In that case, it is possible to define as the invention that the circuit does not have a sixth transistor. Or, it is possible to define that the circuit does not have a capacitive element. Furthermore, the invention can be constituted by defining that the circuit does not have a sixth transistor having a certain specific connection structure. Or, the invention can be constituted by defining that the circuit does not have a capacitive element having a certain specific connection structure. For example, the gate is connected to the gate of the third transistor. It is possible to define the invention as not having the sixth transistor that is present. Also or, for example, it is possible to define the invention as not having a capacitive element in which the first electrode is connected to the gate of the third transistor.

[0280] As another specific example, for a certain value, for example, it is assumed that it is described that "it is preferable that a certain voltage is 3V or more and 10V or less". In that case, for example, it is possible to define one aspect of the invention as excluding the case where a certain voltage is -2V or more and 1V or less. Or, for example, it is possible to define one aspect of the invention as excluding the case where a certain voltage is 13V or more. It is also possible to define the invention as excluding the case where a certain voltage is 13V or more. Note that, for example, it is also possible to define the invention as the voltage being 5V or more and 8V or less. Note that, for example, it is also possible to define the invention as the voltage being approximately 9V. Note that, for example, it is also possible to define the invention as the voltage being 3V or more and 10V or less, but excluding the case where it is 9V. Note that for a certain value, even if it is described that "it is preferable to be within such a range", "it is preferable to satisfy these", etc. a certain value is not limited to those descriptions. That is, even if it is described as "preferable", "suitable", etc., it is not necessarily limited to those descriptions.

[0281] As another specific example, for a certain value, for example, it is assumed that it is described that "it is preferable that a certain voltage is 10V". In that case, for example, it is possible to define one aspect of the invention as excluding the case where a certain voltage is -2V or more and 1V or less. Or, for example, it is possible to define one aspect of the invention as excluding the case where a certain voltage is 13V or more.

[0282] ​​​​​​​​ As another specific example, regarding the properties of a certain substance, for example, it is assumed that it is described that "a certain film is an insulating film". In that case, for example, one aspect of the invention can be defined as excluding the case where the insulating film is an organic insulating film. Or, for example, one aspect of the invention can be defined as excluding the case where the insulating film is an inorganic insulating film. Or, for example, one aspect of the invention can be defined as excluding the case where the film is a conductive film. Or, for example, one aspect of the invention can be defined as excluding the case where the film is a semiconductor film. It is also possible to define one aspect of the invention.

[0283] As another specific example, regarding a certain laminated structure, for example, it is assumed that it is described that "a certain film is provided between film A and film B". In that case, for example, the invention can be defined as excluding the case where the film is a laminated film of four or more layers. Or, for example, the invention can be defined as excluding the case where a conductive film is provided between film A and that film.

[0284] Note that one aspect of the invention described in this specification and the like can be implemented by various people. However, the implementation may be carried out by a plurality of people. For example, in the case of a transmission and reception system, company A may manufacture and sell a transmitter, and company B may manufacture and sell a receiver. As another example, in the case of a light-emitting device having a transistor and a light-emitting element, the semiconductor device on which the transistor is formed is manufactured and sold by company A. And company B may purchase the semiconductor device and form a light-emitting element on the semiconductor device to complete a light-emitting device.

[0285] In such a case, an aspect of the invention that can claim patent infringement against either Company A or Company B can be configured. That is, an aspect of the invention that is only implemented by Company A can be configured, and as an aspect of another invention, an aspect of the invention that is only implemented by Company B can be configured. Also, an aspect of the invention that can claim patent infringement against Company A or Company B is clear and can be determined to be described in this specification and the like. For example, in the case of a transmission and reception system, even if there is no description in this specification and the like for the case of only a transmitter or the case of only a receiver, an aspect of the invention can be configured with only the transmitter, and an aspect of another invention can be configured with only the receiver, and an aspect of those inventions is clear and can be determined to be described in this specification and the like. As another example, in the case of a light-emitting device having a transistor and a light-emitting element, even if there is no description in this specification and the like for the case of only a semiconductor device in which the transistor is formed or the case of only a light-emitting device having a light-emitting element, an aspect of the invention can be configured with only the semiconductor device in which the transistor is formed, and an aspect of the invention can be configured with only the light-emitting device having a light-emitting element, and an aspect of those inventions is clear and can be determined to be described in this specification and the like. An aspect of the invention can be configured. That is, an aspect of the invention that is only implemented by Company A can be configured. It is possible to configure an aspect of the invention that is only implemented by Company B as an aspect of another invention. Also, an aspect of the invention that can claim patent infringement against Company A or Company B is clear and can be determined to be described in this specification and the like. It can be determined that an aspect of the invention that can claim patent infringement against either Company A or Company B is clear and is described in this specification and the like. For example, in the case of a transmission and reception system, even if there is no description in this specification and the like for the case of only a transmitter or the case of only a receiver, an aspect of the invention can be configured with only the transmitter, and an aspect of another invention can be configured with only the receiver, and an aspect of those inventions is clear and can be determined to be described in this specification and the like. Even if there is no description in this specification and the like for the case of only a transmitter or the case of only a receiver, an aspect of the invention can be configured with only the transmitter, and an aspect of another invention can be configured with only the receiver, and an aspect of those inventions is clear and can be determined to be described in this specification and the like. It is possible to configure an aspect of the invention with only the transmitter, and an aspect of another invention can be configured with only the receiver, and an aspect of those inventions is clear and can be determined to be described in this specification and the like. It can be determined that an aspect of those inventions is clear and is described in this specification and the like. As another example, in the case of a light-emitting device having a transistor and a light-emitting element, even if there is no description in this specification and the like for the case of only a semiconductor device in which the transistor is formed or the case of only a light-emitting device having a light-emitting element, an aspect of the invention can be configured with only the semiconductor device in which the transistor is formed, and an aspect of the invention can be configured with only the light-emitting device having a light-emitting element, and an aspect of those inventions is clear and can be determined to be described in this specification and the like. Even if there is no description in this specification and the like for the case of only a semiconductor device in which the transistor is formed or the case of only a light-emitting device having a light-emitting element, an aspect of the invention can be configured with only the semiconductor device in which the transistor is formed, and an aspect of the invention can be configured with only the light-emitting device having a light-emitting element, and an aspect of those inventions is clear and can be determined to be described in this specification and the like. It is possible to configure an aspect of the invention with only the semiconductor device in which the transistor is formed, and an aspect of the invention can be configured with only the light-emitting device having a light-emitting element, and an aspect of those inventions is clear and can be determined to be described in this specification and the like. It can be determined that an aspect of those inventions is clear and is described in this specification and the like. It can be determined.

[0286] In this specification and the like, for all terminals of active elements (such as transistors and diodes), passive elements (such as capacitor elements and resistor elements), etc., even if the connection destination is not specified, a person skilled in the art may be able to configure an aspect of the invention. That is, it can be said that an aspect of the invention is clear even if the connection destination is not specified. And when the connection destination is specified, even if the connection destination of all terminals of active elements (such as transistors and diodes), passive elements (such as capacitor elements and resistor elements), etc. is not specified, a person skilled in the art may be able to configure an aspect of the invention. That is, it can be said that an aspect of the invention is clear even if the connection destination is not specified. And when the connection destination is specified, When the content is described in this specification or the like, there may be a case where it is possible to determine that an aspect of the invention that does not specify the connection destination is described in this specification or the like. In particular, when there are multiple cases where the connection destination of the terminal is considered, it is not necessary to limit the connection destination of the terminal to a specific location. Therefore, for some terminals of active elements (such as transistors and diodes), passive elements (such as capacitive elements and resistive elements), etc., by specifying their connection destinations, there may be a case where an aspect of the invention can be constituted. In this specification or the like, for a certain circuit, at least if the connection destination is specified, a person skilled in the art may be able to specify the invention. Or, for a certain circuit, at least if the function is specified, a person skilled in the art may be able to specify the invention. That is to say, if the function is specified, it can be said that an aspect of the invention is clear. And there may be a case where it is possible to determine that an aspect of the invention with the function specified is described in this specification or the like. Therefore, for a certain circuit, even if the function is not specified, if the connection destination is specified, it is disclosed as an aspect of the invention and it is possible to constitute an aspect of the invention. Or, for a certain circuit, even if the connection destination is not specified, if the function is specified, it is disclosed as an aspect of the invention and it is possible to constitute an aspect of the invention. In this specification or the like, in a figure or text described in a certain embodiment, it is possible to extract a part of it to constitute an aspect of the invention. Therefore, when a figure or text describing a certain part is described, a part of the figure or text can be taken. Note that in this specification or the like, for a certain circuit, at least if the connection destination is specified, a person skilled in the art may be able to specify the invention. Or, for a certain circuit, at least if the function is specified, a person skilled in the art may be able to specify the invention. That is to say, if the function is specified, it can be said that an aspect of the invention is clear. And there may be a case where it is possible to determine that an aspect of the invention with the function specified is described in this specification or the like. Therefore, for a certain circuit, even if the function is not specified, if the connection destination is specified, it is disclosed as an aspect of the invention and it is possible to constitute an aspect of the invention. Or, for a certain circuit, even if the connection destination is not specified, if the function is specified, it is disclosed as an aspect of the invention and it is possible to constitute an aspect of the invention. In this specification or the like, in a figure or text described in a certain embodiment, it is possible to extract a part of it to constitute an aspect of the invention. Therefore, when a figure or text describing a certain part is described, a part of the figure or text can be taken. When the content is described in this specification or the like, there may be a case where it is possible to determine that an aspect of the invention that does not specify the connection destination is described in this specification or the like. In particular, when there are multiple cases where the connection destination of the terminal is considered, it is not necessary to limit the connection destination of the terminal to a specific location. Therefore, for some terminals of active elements (such as transistors and diodes), passive elements (such as capacitive elements and resistive elements), etc., by specifying their connection destinations, there may be a case where an aspect of the invention can be constituted.

[0287] In this specification or the like, for a certain circuit, at least if the connection destination is specified, a person skilled in the art may be able to specify the invention. Or, for a certain circuit, at least if the function is specified, a person skilled in the art may be able to specify the invention. That is to say, if the function is specified, it can be said that an aspect of the invention is clear. And there may be a case where it is possible to determine that an aspect of the invention with the function specified is described in this specification or the like. Therefore, for a certain circuit, even if the function is not specified, if the connection destination is specified, it is disclosed as an aspect of the invention and it is possible to constitute an aspect of the invention. Or, for a certain circuit, even if the connection destination is not specified, if the function is specified, it is disclosed as an aspect of the invention and it is possible to constitute an aspect of the invention. In this specification or the like, in a figure or text described in a certain embodiment, it is possible to extract a part of it to constitute an aspect of the invention. Therefore, when a figure or text describing a certain part is described, a part of the figure or text can be taken. Note that in this specification or the like, for a certain circuit, at least if the connection destination is specified, a person skilled in the art may be able to specify the invention. Or, for a certain circuit, at least if the function is specified, a person skilled in the art may be able to specify the invention. That is to say, if the function is specified, it can be said that an aspect of the invention is clear. And there may be a case where it is possible to determine that an aspect of the invention with the function specified is described in this specification or the like. Therefore, for a certain circuit, even if the function is not specified, if the connection destination is specified, it is disclosed as an aspect of the invention and it is possible to constitute an aspect of the invention. Or, for a certain circuit, even if the connection destination is not specified, if the function is specified, it is disclosed as an aspect of the invention and it is possible to constitute an aspect of the invention. In this specification or the like, in a figure or text described in a certain embodiment, it is possible to extract a part of it to constitute an aspect of the invention. Therefore, when a figure or text describing a certain part is described, a part of the figure or text can be taken. When the content is described in this specification or the like, there may be a case where it is possible to determine that an aspect of the invention that does not specify the connection destination is described in this specification or the like. In particular, when there are multiple cases where the connection destination of the terminal is considered, it is not necessary to limit the connection destination of the terminal to a specific location. Therefore, for some terminals of active elements (such as transistors and diodes), passive elements (such as capacitive elements and resistive elements), etc., by specifying their connection destinations, there may be a case where an aspect of the invention can be constituted. In this specification or the like, for a certain circuit, at least if the connection destination is specified, a person skilled in the art may be able to specify the invention. Or, for a certain circuit, at least if the function is specified, a person skilled in the art may be able to specify the invention. That is to say, if the function is specified, it can be said that an aspect of the invention is clear. And there may be a case where it is possible to determine that an aspect of the invention with the function specified is described in this specification or the like. Therefore, for a certain circuit, even if the function is not specified, if the connection destination is specified, it is disclosed as an aspect of the invention and it is possible to constitute an aspect of the invention. Or, for a certain circuit, even if the connection destination is not specified, if the function is specified, it is disclosed as an aspect of the invention and it is possible to constitute an aspect of the invention. In this specification or the like, in a figure or text described in a certain embodiment, it is possible to extract a part of it to constitute an aspect of the invention. Therefore, when a figure or text describing a certain part is described, a part of the figure or text can be taken. When the content is described in this specification or the like, there may be a case where it is possible to determine that an aspect of the invention that does not specify the connection destination is described in this specification or the like. In particular, when there are multiple cases where the connection destination of the terminal is considered, it is not necessary to limit the connection destination of the terminal to a specific location. Therefore, for some terminals of active elements (such as transistors and diodes), passive elements (such as capacitive elements and resistive elements), etc., by specifying their connection destinations, there may be a case where an aspect of the invention can be constituted. In this specification or the like, for a certain circuit, at least if the connection destination is specified, a person skilled in the art may be able to specify the invention. Or, for a certain circuit, at least if the function is specified, a person skilled in the art may be able to specify the invention. That is to say, if the function is specified, it can be said that an aspect of the invention is clear. And there may be a case where it is possible to determine that an aspect of the invention with the function specified is described in this specification or the like. Therefore, for a certain circuit, even if the function is not specified, if the connection destination is specified, it is disclosed as an aspect of the invention and it is possible to constitute an aspect of the invention. Or, for a certain circuit, even if the connection destination is not specified, if the function is specified, it is disclosed as an aspect of the invention and it is possible to constitute an aspect of the invention.

[0288] In this specification or the like, in a figure or text described in a certain embodiment, it is possible to extract a part of it to constitute an aspect of the invention. Therefore, when a figure or text describing a certain part is described, a part of the figure or text can be taken. In this specification or the like, for a certain circuit, at least if the connection destination is specified, a person skilled in the art may be able to specify the invention. Or, for a certain circuit, at least if the function is specified, a person skilled in the art may be able to specify the invention. That is to say, if the function is specified, it can be said that an aspect of the invention is clear. And there may be a case where it is possible to determine that an aspect of the invention with the function specified is described in this specification or the like. Therefore, for a certain circuit, even if the function is not specified, if the connection destination is specified, it is disclosed as an aspect of the invention and it is possible to constitute an aspect of the invention. Or, for a certain circuit, even if the connection destination is not specified, if the function is specified, it is disclosed as an aspect of the invention and it is possible to constitute an aspect of the invention. In this specification or the like, in a figure or text described in a certain embodiment, it is possible to extract a part of it to constitute an aspect of the invention. Therefore, when a figure or text describing a certain part is described, a part of the figure or text can be taken. The content presented is also disclosed as one aspect of the invention and constitutes one aspect of the invention. It shall be possible. And it can be said that one aspect of the invention is clear. Therefore, for example, in a drawing or text in which one or more active elements (such as transistors and diodes), wirings, passive elements (such as capacitor elements and resistor elements), conductive layers, insulating layers, semiconductor layers, organic materials, inorganic materials, components, devices, operation methods, manufacturing methods, etc. are described, it shall be possible to extract a part thereof to constitute one aspect of the invention. For example, from a circuit diagram composed of N (N is an integer) circuit elements (such as transistors and capacitor elements), M ( M is an integer and M < N) circuit elements (such as transistors and capacitor elements) are extracted to constitute one aspect of the invention. As another example, from a cross-sectional view composed of N (N is an integer) layers, M (M is an integer and M < N) layers are extracted to constitute one aspect of the invention. As yet another example, from a flowchart composed of N (N is an integer) elements, M (M is an integer and M < N) elements are extracted to constitute one aspect of the invention. As yet another example, from a text stating that "A has B, C, D, E, or F", some elements are arbitrarily extracted to form one aspect of the invention such as "A has B and E", "A has E and F", "A has C, E, and F", or "A has B, C, D, and E", etc. is possible.

[0289] In addition, in this specification, etc., in a drawing or text described in a certain embodiment, when at least one specific example is described, it is possible to derive the upper concept of the specific example. , which can be easily understood by those skilled in the art. Therefore, in one embodiment, when at least one specific example is described in the figure or text, the general concept of that specific example is also disclosed as one aspect of the invention and can constitute one aspect of the invention. And it can be said that one aspect of the invention is clear.

[0290] In addition, in this specification, etc., at least the content described in the figure (even a part in the figure) is disclosed as one aspect of the invention and can constitute one aspect of the invention. Therefore, for a certain content, if it is described in the figure, even if it is not described in the text, that content is disclosed as one aspect of the invention and can constitute one aspect of the invention. Similarly, for a figure obtained by extracting a part of the figure, it is also disclosed as one aspect of the invention and can constitute one aspect of the invention. And it can be said that one aspect of the invention is clear.

Description of Reference Numerals

[0291] 1 FPC 2 FPC 14 Window portion 16 Substrate 16a Barrier film 16b Substrate 16c Resin layer 17 Protective substrate 17p Protective layer 19 Detection circuit 20U Detection unit 21 Electrode 22 Electrode 23 Insulating layer 50 Film 51 Film 52 Film 53 Embossing roll 54 Roll 55 Embossing roll 56 Embossing roll 57 Embossing roll 58 Travel direction 100 Input device 101 Holding structure 102 Display unit 103 Secondary battery 104 Cover 107 Control board 300 Charger 410 Film 411 Film 412 Positive current collector 413 Separator 414 Negative current collector 415 Sealing layer 416 Lead electrode 417 Thermocompression bonding area 418 Positive electrode active material layer 419 Negative electrode active material layer 420 Electrolyte 430 Adhesive layer 500 Input / output device 501 Display unit 502 Pixel 502B Sub-pixel 502G Sub-pixel 502R Sub-pixel 502t Transistor 503c Capacitance 503g Scanning line drive circuit 503t Transistor 510 Substrate 510a Insulating layer 510b Substrate 510c Adhesive layer 511 Wiring 519 Terminal 521 Insulating film 528 Partition wall 550R Light-emitting element 560 Sealing layer 567p Anti-reflection layer 580R Light-emitting module 800 Finger 801 Buffer layer 802 Buffer layer 803 Buffer layer 804 Lead electrode 810 Connection part 813 Protective film 814 Input / output connector 815 Antenna 816 Power control circuit 817 Communication device 818 Wiring 819 FPC 820a IC 820b IC 820c IC 7100 Mobile phone 7101 Housing 7102 Display unit 7103 Operation button 7104 Power storage device 7105 Lead electrode 7106 Current collector 7400 Mobile phone 7401 Housing 7402 Display unit 7403 Operation button 7404 External connection port 7405 Speaker 7406 Microphone 7407 Power storage device 7408 Lead electrode 7409 Current collector

Claims

[Claim 1] a secondary battery having a curved portion provided on a holding structure having a curved portion; a buffer layer on the secondary battery; a protective film having a curved portion provided on the buffer layer; A display unit having a curved portion provided on the protective film; a touch input unit provided on the display unit and having a curved portion.

Images