Operation method of semiconductor manufacturing apparatus

Abstract

To enable an operator to easily specify the cause of abnormality of a device, and to quickly restore the device for the abnormality.SOLUTION: An operation method of a semiconductor manufacturing apparatus includes the steps of: acquiring one or a plurality of status information on one or a plurality of treatment units in a semiconductor manufacturing apparatus; determining whether or not a predetermined operation step in the semiconductor manufacturing apparatus is performed, on the basis of the one or the plurality of status information; performing control so that the predetermined operation step is not performed, when having determined that the predetermined operation step is not performed; displaying the one or the plurality of status information by distinguishing it into the status information corresponding to an abnormal state and the status information corresponding to a normal state; and receiving user input specifying the status information corresponding to the abnormal state, and displaying an AR or MR screen for position guidance to the processing units corresponding to the specified status information among the one or plurality of processing units, on a portable terminal.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to an operation method of a semiconductor manufacturing apparatus.

Background Art

[0002] In order to cause a semiconductor manufacturing apparatus to perform an appropriate operation, interlock control is widely used (see, for example, Patent Document 1). Interlock control is a control method that, when attempting to perform a certain operation on the apparatus, does not execute the operation unless predetermined conditions are met. The conditions for interlock control vary depending on the type of operation. When an operation is not executed due to interlock control, the operator checks on a display screen or the like which condition was not satisfied and thus the target operation was not executed.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In such a case, it is desirable for the operator to easily identify the cause of the abnormality of the apparatus and to quickly return the apparatus from the abnormality.

Means for Solving the Problems

[0005] [Aspect 1] According to Aspect 1, there is an operation method for returning a semiconductor manufacturing apparatus from an abnormal state, including steps of obtaining one or more status information regarding one or more processing units in the semiconductor manufacturing apparatus, determining whether a predetermined operation step in the semiconductor manufacturing apparatus can be performed based on the one or more status information, where when at least one of the one or more status information indicates an abnormal state, it is determined that the predetermined operation step cannot be performed, a step of controlling so that the predetermined operation step is not performed when it is determined that the predetermined operation step cannot be performed, a step of separately displaying the one or more status information as corresponding to an abnormal state and a normal state, receiving a user input designating the status information corresponding to the abnormal state, and displaying an AR or MR screen for guiding the position to the processing unit corresponding to the designated status information among the one or more processing units on a mobile terminal.

[0006] [Aspect 2] According to Aspect 2, in the method of Aspect 1, it further includes a step of displaying an execution button for instructing the execution of the predetermined operation step on the AR or MR screen on the mobile terminal.

[0007] [Aspect 3] According to Aspect 3, in the method of Aspect 2, the execution button is displayed upon receiving that the abnormal state of the position-guided processing unit is released.

[0008] [Aspect 4] According to Aspect 4, in the method of Aspect 2, the execution button is disabled and displayed while the abnormal state of the position-guided processing unit continues, and the execution button is enabled and displayed upon receiving that the abnormal state of the position-guided processing unit is released.

[0009] [Aspect 5] According to Aspect 5, in the method of any one of Aspects 2 to 4, the one or a plurality of status information is obtained from sensors provided in the one or more processing units.

[0010] [Embodiment 6] According to Embodiment 6, in the method of Embodiment 5, the method further includes receiving, at an operation terminal of the semiconductor manufacturing apparatus, a user input for instructing implementation of the predetermined operation step in the semiconductor manufacturing apparatus, and in the obtaining step, the one or more status information is obtained from the sensor of the processing unit corresponding to the instructed operation step.

[0011] [Embodiment 7] According to Embodiment 7, in the method of Embodiment 6, the display of the one or more status information is performed at the operation terminal, and the user input for designating the status information corresponding to the abnormal state is received at the operation terminal.

[0012] [Embodiment 8] According to Embodiment 8, in the method of Embodiment 7, the operation terminal and the mobile terminal are communicably connected.

[0013] [Embodiment 9] According to Embodiment 9, in the method of Embodiment 8, the method further includes transmitting, from the mobile terminal to the operation terminal, an instruction that the execution button displayed on the mobile terminal has been operated.

[0014] [Embodiment 10] According to Embodiment 10, in the method of Embodiment 9, the method further includes controlling to implement the predetermined operation step in response to receiving, at the operation terminal, the instruction that the execution button has been operated.

Brief Description of the Drawings

[0015]

Figure 1

Figure 2

Figure 3

Figure 4A

Figure 4B

Figure 5

Figure 6

Figure 7

Mode for Carrying Out the Invention

[0016] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals, and redundant descriptions are omitted.

[0017] FIG. 1 is a perspective view showing the overall configuration of a plating apparatus 1000 according to an embodiment of the present invention. FIG. 2 is a plan view showing the overall configuration of the plating apparatus 1000 according to an embodiment of the present invention. The plating apparatus 1000 is an example of a semiconductor manufacturing apparatus. Hereinafter, embodiments of the present invention will be described with reference to the plating apparatus 1000, but the apparatuses and methods disclosed in this specification can be applied to any semiconductor manufacturing apparatus other than the plating apparatus. For example, in addition to the plating apparatus, the semiconductor manufacturing apparatus includes a polishing apparatus (e.g., a CMP (Chemical Mechanical Polishing) apparatus, etc.) for polishing a substrate (such as a semiconductor substrate or a glass substrate) or a thin film formed on the substrate, a film forming apparatus (e.g., a CVD (Chemical Vapor Deposition) apparatus, an evaporation apparatus, etc.) for forming a thin film on the substrate, an exposure apparatus for transferring a fine pattern to the thin film on the substrate, an etching apparatus for finely processing the substrate or the thin film on the substrate by etching, a substrate or Or it includes any device related to the manufacture of semiconductor products, such as an ion implantation device for implanting ions into a thin film on a substrate, a dicing device for cutting the substrate into chips, and various inspection devices (or measuring devices) for inspecting the final semiconductor product or intermediate product (including the substrate).

[0018] As shown in FIGS. 1 and 2, the plating apparatus 1000 includes a load port 100, a transfer robot 110, an aligner 120, a pre-wet module 200, a pre-soak module 300, a plating module 400, a cleaning module 500, a spin rinse dryer 600, a transfer device 700, and a control module 800.

[0019] The load port 100 is a module for loading a substrate stored in a cassette such as a FOUP (not shown) into the plating apparatus 1000 or unloading the substrate from the plating apparatus 1000 to the cassette. In this embodiment, four load ports 100 are arranged horizontally side by side, but the number and arrangement of the load ports 100 are arbitrary. The transfer robot 110 is a robot for transferring the substrate and is configured to transfer the substrate between the load port 100, the aligner 120, and the transfer device 700. When transferring the substrate between the transfer robot 110 and the transfer device 700, the transfer robot 110 and the transfer device 700 can transfer the substrate via a temporary placement table (not shown).

[0020] The aligner 120 is a module for aligning the positions such as the orientation flat and notch of the substrate in a predetermined direction. In this embodiment, two aligners 120 are arranged side by side horizontally, but the number and arrangement of the aligners 120 are arbitrary. The pre-wet module 200 wets the surface to be plated of the substrate before plating with a processing liquid such as pure water or degassed water, thereby replacing the air inside the pattern formed on the substrate surface with the processing liquid. The pre-wet module 200 is configured to perform a pre-wet process that makes it easier to supply the plating liquid inside the pattern by replacing the processing liquid inside the pattern with the plating liquid during plating. In this embodiment, two pre-wet modules 200 are arranged side by side vertically, but the number and arrangement of the pre-wet modules 200 are arbitrary.

[0021] The pre-soak module 300 is configured to perform a pre-soak process of etching and removing an oxide film with a large electrical resistance present on the surface of a seed layer formed on the surface to be plated of the substrate before plating, etc. with a processing liquid such as sulfuric acid or hydrochloric acid to clean or activate the plating base surface. In this embodiment, two pre-soak modules 300 are arranged side by side vertically, but the number and arrangement of the pre-soak modules 300 are arbitrary. The plating module 400 performs a plating process on the substrate. In this embodiment, there are two sets of 12 plating modules 400 arranged side by side in 3 rows vertically and 4 rows horizontally, for a total of 24 plating modules 400 provided, but the number and arrangement of the plating modules 400 are arbitrary.

[0022] The cleaning module 500 is configured to perform a cleaning process on the substrate to remove plating solution and the like remaining on the substrate after the plating process. In this embodiment, two cleaning modules 500 are arranged side by side in the vertical direction, but the number and arrangement of the cleaning modules 500 are arbitrary. The spin rinse dryer 600 is a module for drying the substrate by rotating it at high speed after the cleaning process. In this embodiment, two spin rinse dryers are arranged side by side in the vertical direction, but the number and arrangement of the spin rinse dryers are arbitrary. The transfer device 700 is a device for transferring the substrate between a plurality of modules in the plating apparatus 1000. The control module 800 is configured to control a plurality of modules of the plating apparatus 1000, and can be composed of, for example, a general computer or a dedicated computer having an input / output interface with an operator.

[0023] An example of a series of plating processes by the plating apparatus 1000 will be described. First, the substrate stored in the cassette is carried into the load port 1 00. Subsequently, the transfer robot 110 takes out the substrate from the cassette of the load port 100 and transfers the substrate to the aligner 120. The aligner 120 aligns the positions such as the orientation flat and notch of the substrate in a predetermined direction. The transfer robot 110 delivers the substrate whose direction has been aligned by the aligner 120 to the transfer device 700.

[0024] The transfer device 700 transfers the substrate received from the transfer robot 110 to the pre-wet module 200. The pre-wet module 200 performs a pre-wet process on the substrate. The transfer device 700 transfers the substrate on which the pre-wet process has been performed to the pre-soak module 300. The pre-soak module 300 performs a pre-soak process on the substrate. The transfer device 700 transfers the substrate on which the pre-soak process has been performed to the plating module 400. The plating module 400 performs a plating process on the substrate.

[0025] The transfer device 700 transfers the plated substrate to the cleaning module 500. The cleaning module 500 performs a cleaning process on the substrate. The transfer device 700 transfers the substrate subjected to the cleaning process to the spin rinse dryer 600. The spin rinse dryer 600 performs a drying process on the substrate. The transfer device 700 delivers the substrate subjected to the drying process to the transfer robot 110. The transfer robot 110 transfers the substrate received from the transfer device 700 to the cassette at the load port 100. Finally, the cassette containing the substrate is unloaded from the load port 100.

[0026] Note that the configuration of the plating apparatus 1000 described with reference to FIGS. 1 and 2 is merely an example, and the configuration of the plating apparatus 1000 is not limited to the configurations of FIGS. 1 and 2.

[0027] FIG. 3 is a configuration diagram of an exemplary system 10 for controlling the operation of a semiconductor manufacturing apparatus (e.g., a plating apparatus) 1000 according to an embodiment of the present invention. The system 10 includes a semiconductor manufacturing apparatus 1000, an operation computer 20, an apparatus controller 30, and a portable information terminal 40. In the system 10, the semiconductor manufacturing apparatus 1000, the operation computer 20, the apparatus controller 30, and the portable information terminal 40 are communicably connected to each other via a communication path such as a local area network (LAN).

[0028] The operation computer 20 is a computer for an operator of the system 10 to operate the semiconductor manufacturing apparatus 1000. For example, the operation computer 20 is installed in an operation room away from the installation location of the semiconductor manufacturing apparatus 1000, and the operator can operate the semiconductor manufacturing apparatus 1000 from the operation room using the operation computer 20. The operation computer 20 can be realized by a general-purpose computer having a processor and a memory, and is configured to perform a predetermined operation by the processor reading and executing a predetermined program stored in the memory. Specifically, the operation computer 20 receives an operation instruction for the semiconductor manufacturing apparatus 1000 from the operator of the system 10 (for example, receives data input via a user interface), and supplies the operation instruction to the apparatus controller 30. Further, the operation computer 20 receives status information regarding the operation status of each part of the semiconductor manufacturing apparatus 1000 from the apparatus controller 30, and notifies it to the operator (for example, displays it on the screen of a display).

[0029] The apparatus controller 30 is a computer configured to control the operation of the semiconductor manufacturing apparatus 1000. The apparatus controller 30 may be any computer having a processor and a memory. For example, as the apparatus controller 30, a PLC (Programmable Logic Controller) can be preferably used, but the apparatus controller 30 may be another type of computer. The apparatus controller 30 converts the operation instruction for the semiconductor manufacturing apparatus 1000 sent from the operation computer 20 into an instruction in a form understandable by each part of the semiconductor manufacturing apparatus 1000, and supplies the converted instruction to the semiconductor manufacturing apparatus 1000, thereby controlling the semiconductor manufacturing apparatus 1000. Further, the apparatus controller 30 collects status information regarding the operation status of each part from each part of the semiconductor manufacturing apparatus 1000, and provides it to the operation computer 20. Note that the control module 800 shown in FIGS. 1 and 2 may correspond to the apparatus controller 30 in FIG. 3. The operation computer 20 receives an operation instruction for the semiconductor manufacturing apparatus 1000 from the operator of the system 10 (for example, receives data input via a user interface), and supplies the operation instruction to the apparatus controller 30. Further, the operation computer 20 receives status information regarding the operation status of each part of the semiconductor manufacturing apparatus 1000 from the apparatus controller 30, and notifies it to the operator (for example, displays it on the screen of a display).

[0030] The portable information terminal 40 is an auxiliary computer terminal for an operator of the system 10 to operate the semiconductor manufacturing apparatus 1000. The portable information terminal 40 may be any type of information terminal that can be carried and used by an operator, such as a tablet terminal, a notebook computer, a smartphone, etc. The portable information terminal 40 is configured to communicate with the operation computer 20 via, for example, a wireless LAN, and exchange data necessary for the operator to operate the semiconductor manufacturing apparatus 1000 at a location other than the installation location of the operation computer 20 (for example, near the semiconductor manufacturing apparatus 1000) with the operation computer 20.

[0031] As shown in FIG. 3, the semiconductor manufacturing apparatus 1000 includes one or more processing units 1002. For example, when the semiconductor manufacturing apparatus 1000 is the plating apparatus described with reference to FIGS. 1 and 2, each processing unit 1002 in FIG. 3 may be any one of the load port 100, transfer robot 110, aligner 120, pre-wet module 200, pre-soak module 300, plating module 400, cleaning module 500, spin rinse dryer 600, and transfer device 700 shown in FIGS. 1 and 2. Alternatively, each processing unit 1002 may represent a lower-level element that constitutes these parts (100, 110, 120, 200, 300, 400, 500, 600, 700) (for example, any one of the plurality of elements that constitute the plating module 400). Further, when the semiconductor manufacturing apparatus 1000 is an apparatus other than a plating apparatus, it goes without saying that each processing unit 1002 in FIG. 3 may correspond to an element at any level that constitutes the semiconductor manufacturing apparatus according to the type of the semiconductor manufacturing apparatus.

[0032] Figures 4A and 4B are schematic diagrams showing an exemplary specific configuration of a certain processing unit 1002 for better understanding of the following description. In Figures 4A and 4B, the processing unit 1002 includes a moving body 1004, structures 1006A to 1006D, and sensors 1008A to 1008D. The moving body 1004 may be, for example, a substrate to be processed in the processing unit 1002, or an assembly of a substrate and a substrate holder holding the substrate. The moving body 1004 can be moved between a first position LOC1 and a second position LOC2 by a transport mechanism (not shown). For example, the first position LOC1 may be a position where the substrate is processed (e.g., plated) within the processing unit 1002, and the second position LOC2 may be a standby position before moving an unprocessed substrate to the first position LOC1 or after moving a processed substrate from the first position LOC1. The structures 1006A to 1006D may be, for example, a cover of a plating tank that opens during use, a clamp for fixing the substrate in the tank, etc. The structures 1006A to 1006D can be moved between an interference position and a retracted position by a transport mechanism (not shown). The interference position is a position where the moving body 1004 is prevented from moving between the first position LOC1 and the second position LOC2 due to the structures 1006A to 1006D being in that location. The retracted position is a position that does not prevent the movement of the moving body 1004 between the first position LOC1 and the second position LOC2. For example, in the arrangement example of Figure 4A, the structures 1006A and 1006B are in the retracted position, and the structures 1006C and 1006D are in the interference position. Also, in the arrangement example of Figure 4B, all the structures 1006A to 1006D are in the retracted position. The sensors 1008A to 1008D are sensors that respectively detect whether the corresponding structures 1006A to 1006D are in the interference position or the retracted position.

[0033] FIG. 5 is a flowchart showing the operation of a system 10 including a semiconductor manufacturing apparatus 1000 according to an embodiment of the present invention. The system 10 operates such that the operation computer 20, the apparatus controller 30, and the portable information terminal 40 cooperate to perform the processing of each step in the flowchart of FIG. 5, thereby performing interlock control when the semiconductor manufacturing apparatus 1000 is in an abnormal state and enabling an appropriate return from the abnormal state.

[0034] In step 502, the operation computer 20 receives an operation instruction for the semiconductor manufacturing apparatus 1000 from an operator of the system 10. For example, an operator of the system 10 can input a desired operation instruction for the semiconductor manufacturing apparatus 1000 via the user interface of the operation computer 20. The operation instruction may be, for example, to move the moving body 1004 in the processing unit 1002 of the semiconductor manufacturing apparatus 1000 from the first position LOC1 to the second position LOC2 (see FIGS. 4A and 4B). The operation instruction is transmitted from the operation computer 20 to the apparatus controller 30.

[0035] Next, in step 504, the apparatus controller 30 acquires the status information of the semiconductor manufacturing apparatus 1000. Specifically, the apparatus controller 30 acquires one or more status information from one or more processing units 1002 of the semiconductor manufacturing apparatus 1000. For example, the one or more status information may be the operating states of the processing unit 1002 detected by sensors 1008A to 1008D (see FIGS. 4A and 4B) provided in the processing unit 1002. For example, in the arrangement example of FIG. 4A, the apparatus controller 30 acquires status information (e.g., "ON") indicating that the structures 1006A and 1006B are in the retracted positions from the sensors 1008A and 1008B, respectively, and acquires status information (e.g., "OFF") indicating that the structures 1006C and 1006D are in the interference positions from the sensors 1008C and 1008D, respectively.

[0036] Next, in step 506, based on the status information acquired in step 504, the apparatus controller 30 determines whether it is possible to execute the operation process of the semiconductor manufacturing apparatus 1000 corresponding to the operation instruction from the operator in step 502. For example, continuing with the above example, based on the status information (e.g., the status information obtained from sensors 1008A to 1008D), the apparatus controller 30 determines whether it is possible to execute the operation process of moving the moving body 1004 of the processing unit 1002 from the first position LOC1 to the second position LOC2.

[0037] More specifically, for example, when each of the structures 1006A to 1006D in the processing unit 1002 is positioned as shown in FIG. 4A, the structures 1006C and 1006D are in a state (abnormal state) where they will come into contact with the moving body 1004 that has moved from the first position LOC1. From sensors 1008C and 1008D, status information "OFF" corresponding to such an abnormal state is acquired, and the apparatus controller 30 determines not to execute the operation process of moving the moving body 1004 (e.g., a substrate) from the first position LOC1 to the second position LOC2 in order to prevent damage to the moving body 1004 and the structures 1006C and 1006D. The apparatus controller 30 may determine not to execute the operation process of moving the moving body 1004 from the first position LOC1 to the second position LOC2 when at least one piece of status information is "OFF".

[0038] On the other hand, when each of the structures 1006A to 1006D of the processing unit 1002 is positioned as shown in FIG. 4B, contact between the moving body 1004 that has moved from the first position LOC1 and each of the structures 1006A to 1006D does not occur (normal state). In this case, status information "ON" corresponding to the normal state is acquired from all of the sensors 1008A to 1008D, and the apparatus controller 30 determines that it is possible to execute the operation process of moving the moving body 1004 from the first position LOC1 to the second position LOC2.

[0039] If it is determined in step 506 that the operation process of the semiconductor manufacturing apparatus 1000 can be performed, the process proceeds to step 508. In step 508, the apparatus controller 30 sends a command instructing the execution of the operation process (for example, the movement of the moving body 1004 from the first position LOC1 to the second position LOC2) to the semiconductor manufacturing apparatus 1000. Thereby, the semiconductor manufacturing apparatus 1000 executes the operation instructed by the operator in step 502.

[0040] If it is determined in step 506 that the operation process of the semiconductor manufacturing apparatus 1000 cannot be performed (is impossible to perform), the process proceeds to step 510. In step 510, the apparatus controller 30 controls the semiconductor manufacturing apparatus 1000 so as not to perform the operation process (for example, the movement of the moving body 1004 from the first position LOC1 to the second position LOC2). Specifically, a command instructing the execution of the operation process is not sent to the semiconductor manufacturing apparatus 1000. Therefore, the operation instructed by the operator in step 502 is not executed in the semiconductor manufacturing apparatus 1000. Thus, by the processing of steps 506 to 510, interlock control is realized in which the operation process of the semiconductor manufacturing apparatus 1000 is executed only when predetermined conditions are met (for example, the status information from all the sensors 1008A to 1008D is "ON").

[0041] Subsequent to step 510 (that is, when the operation process of the semiconductor manufacturing apparatus 1000 is not performed), in step 512, the apparatus controller 30 transmits the status information of the semiconductor manufacturing apparatus 1000 acquired in step 504 to the operation computer 20, and the operation computer 20 receives the status information and notifies the operator. Specifically, the operation computer 20 displays one or more pieces of status information obtained from the apparatus controller 30 on the display screen, distinguishing between those corresponding to the abnormal state and those corresponding to the normal state.

[0042] FIG. 6 is an example of a display screen of status information. In the example of FIG. 6, the display screen includes a list 602 of all sensors (e.g., sensors 1008A to 1008D) of the processing unit 1002 in which an abnormality has occurred, and an identification display 604 indicating whether the status information from each sensor is abnormal or normal. The identification display 604 may be represented, for example, by a round mark in a first color or brightness for the abnormal state and a round mark in a second color or brightness different from the first color or brightness for the normal state. In the example of FIG. 6, it is shown that the status information from sensors 1008C and 1008D is in an abnormal state, and the status information from sensors 1008A and 1008B is in a normal state. By viewing such a display screen on the display of the operation computer 20, the operator of the system 10 can easily grasp which processing unit 1002 in the semiconductor manufacturing apparatus 1000 has what kind of abnormality.

[0043] In the example of FIG. 6, the display screen further includes a "navigation display" button 606 corresponding to each sensor in the list. The "navigation display" button 606 is a button for performing a display that guides the operator of the system 10 to the location where the abnormality has occurred in the semiconductor manufacturing apparatus 1000 using the portable information terminal 40. The display screen may further include a "help" button 608 for displaying an explanation (such as an instruction manual) of the sensor that notified the abnormal state and / or the structure (e.g., structures 1006A to 1006D) corresponding to the sensor on the display of the operation computer 20.

[0044] In step 514 following step 512, the operation computer 20 determines whether a user input for specifying status information corresponding to the abnormal state has been made. This determination can be based on whether the "navigation display" button 606 on the display screen of the operation computer 20 has been pressed. For example, any of the identification displays 604 in the display screen example of FIG. 6 is different When the system 10 is in the normal state, the operator of the system 10 needs to go to the location where an abnormality has occurred in the semiconductor manufacturing apparatus 1000 to check the actual situation of the apparatus, and to adjust or maintain the abnormal location. In such a case, the operator presses the "Navigation Display" button 606 corresponding to the abnormal state on the display screen.

[0045] When the above user input (for example, the operation of the "Navigation Display" button 606) is performed, next in step 516, the operation computer 20 transmits the identification information of the processing unit 1002 related to the status information of the abnormal state specified by the user input (and / or the sensors and structures related to the abnormal state within the processing unit 1002) to the portable information terminal 40. The portable information terminal 40 displays, on the display of the portable information terminal 40, a navigation screen for guiding the operator to the position of the processing unit 1002 corresponding to the location where an abnormality has occurred in the semiconductor manufacturing apparatus 1000 (or the position of the sensor or structure within the processing unit 1002) based on the identification information. The navigation screen may be, for example, an AR (augmented reality) screen or an MR (mixed reality) screen.

[0046] FIG. 7 is an example of an AR navigation screen displayed on the portable information terminal 40. As shown in FIG. 7, the AR navigation screen includes a background image 702 and a guidance display 704. The background image 702 is a live image captured by a camera mounted on the portable information terminal 40. The guidance display 704 indicates the direction of the location where an abnormality has occurred in the semiconductor manufacturing apparatus 1000, which is the destination of the position guidance, by, for example, an arrow image. The portable information terminal 40 can detect the current position of the portable information terminal 40 and the direction in which the portable information terminal 40 is directed using well-known existing technologies, and use them to calculate the relative position and relative direction between the portable information terminal 40 and the location where an abnormality has occurred in the semiconductor manufacturing apparatus 1000, and update and display the guidance display 704 as needed according to the calculation results. The operator of the system 10 can quickly identify the location where an abnormality has occurred in the semiconductor manufacturing apparatus 1000 while looking at the guidance display 704 on the background image 702 of the real world.

[0047] The AR navigation screen further includes an "Execute" button 706 and a "Reset" button 708. The "Execute" button 706 is a button for executing the operation processes of the semiconductor manufacturing apparatus 1000 that were not executed by the interlock control in step 510 by an operation from the portable information terminal 40. The "Reset" button 708 is a button for resetting (for example, restarting) the entire semiconductor manufacturing apparatus 1000 or the processing unit 1002 in which an abnormality has occurred. The AR navigation screen may further include a "Help" button 710 similar to the "Help" button 608 on the display screen in FIG. 6, and handling instructions or the like corresponding to abnormal locations (such as sensors) may be displayable on the AR navigation screen.

[0048] When the operator of the system 10 arrives at the location where an abnormality has occurred in the semiconductor manufacturing apparatus 1000 (identifies the location where the abnormality has occurred) with reference to the navigation screen of the portable information terminal 40, the operator checks the details of the abnormality and adjusts and maintains the devices related to the abnormality (for example, sensors 1008A to 1008D and structures 1006A to 1006D).

[0049] In step 518, the operation computer 20 acquires the latest status information of the semiconductor manufacturing apparatus 1000 via the apparatus controller 30, and determines whether all the status information that was displayed as an abnormal state on the status information display screen (see FIG. 6) has been corrected to a normal state (for example, by adjustment and maintenance work by the operator). For example, in the examples of FIGS. 4A and 6 described above, the status information from sensors 1008C and 1008D was in an abnormal state. The operation computer 20 determines whether the status information from sensors 1008C and 1008D has both changed from an abnormal state to a normal state. When the status information from sensor 1008C and the status information from sensor 1008D both change from an abnormal state to a normal state, and the status information from all of the sensors 1008A to 1008D becomes a normal state, it means that it has become possible to perform the operation process of moving the moving body 1004 from the first position LOC1 to the second position LOC2.

[0050] When it is confirmed in step 518 that all the status information is in a normal state, the operation computer 20 may notify the mobile information terminal 40 of that fact, and the mobile information terminal 40 may display the "Execute" button 706 on the AR navigation screen upon receiving the notification (that is, the "Execute" button 706 is not displayed on the AR navigation screen before receiving the notification, and the "Execute" button 706 is displayed on the AR navigation screen only after receiving the notification). Alternatively, the "Execute" button 706 may be displayed in a disabled state on the AR navigation screen before receiving the notification, and the disabled "Execute" button 706 may be enabled upon receiving the notification. This makes it possible to prevent an operation process of the semiconductor manufacturing apparatus 1000 from being erroneously performed by operating the "Execute" button 706 on the mobile information terminal 40 even if the abnormal state has not been resolved.

[0051] The system 10 may include a plurality of portable information terminals 40, and a plurality of workers may be able to carry out work while holding a portable information terminal 40. In this case, restrictions may be implemented so that the "Execute" button 706 can be pressed only from one of the plurality of portable information terminals 40. For example, a "Operable" button may be displayed on the AR navigation screen of each portable information terminal 40 in addition to the "Execute" button 706 (at this point, the "Execute" button 706 cannot be pressed), and when the "Operable" button is pressed on any of the portable information terminals 40, the "Execute" button 706 can be pressed only on that portable information terminal 40 (the "Execute" button 706 remains unpressable on the other portable information terminals 40).

[0052] If it is determined in step 518 that all status information is in a normal state, the process proceeds to step 520, where the mobile information terminal 40 determines whether the "Execute" button 706 on the AR navigation screen has been pressed. If the "Execute" button 706 is pressed, the mobile information terminal 40 notifies the operation computer 20 to that effect. Next, in step 522, upon receiving the notification, the operation computer 20 instructs the apparatus controller 30 to execute the operation process of the semiconductor manufacturing apparatus 1000 (for example, the movement of the moving body 1004 from the first position LOC1 to the second position LOC2) that was not executed due to interlock control. As a result, the operation process is executed in the semiconductor manufacturing apparatus 1000. In this way, after the abnormal state is released, the operation process of the semiconductor manufacturing apparatus 1000 can be started by an operation from the mobile information terminal 40 (for example, without returning to the location where the operation computer 20 is installed).

[0053] As described above, embodiments of the present invention have been described based on several examples. However, the above-described embodiments of the invention are for facilitating the understanding of the present invention and do not limit the present invention. The present invention can be modified and improved without departing from its gist, and it goes without saying that equivalents of the present invention are included therein. Also, any combination or omission of each component described in the claims and the specification is possible within the scope of solving at least a part of the above-described problems or achieving at least a part of the effects.

Description of Reference Numerals

[0054] 100 Load Port 110 Transfer Robot 120 Aligner 200 Pre-Wet Module 300 Pre-Soak Module 400 Plating Module 500 Cleaning Module 600 Spin Rinse Dryer 700 Transfer Device 800 Control Module 10 System 20 Operating computer 30 Device controller 40 Portable information terminal 1000 Plating device 1002 Processing unit 1004 Moving body 1006 Structure 1008 Sensor

Claims

1. An operation method for returning a semiconductor manufacturing apparatus from an abnormal state, comprising: obtaining one or more status information regarding one or more processing units in the semiconductor manufacturing apparatus; determining, based on the one or more status information, whether a predetermined operation step in the semiconductor manufacturing apparatus can be performed, wherein when at least one of the one or more status information indicates an abnormal state, it is determined that the predetermined operation step cannot be performed; when it is determined that the predetermined operation step cannot be performed, controlling so that the predetermined operation step is not performed; displaying the one or more status information by distinguishing between those corresponding to an abnormal state and those corresponding to a normal state; receiving a user input designating status information corresponding to an abnormal state, and displaying an AR or MR screen for guiding the position to the processing unit corresponding to the designated status information among the one or more processing units on a mobile terminal; A method comprising the above.

2. The method according to claim 1, further comprising the step of displaying an execution button for instructing the execution of the predetermined operation step on the AR or MR screen on the mobile terminal.

3. The method according to claim 2, wherein the execution button is displayed upon receiving that the abnormal state of the position-guided processing unit is released.

4. The method according to claim 2, wherein the execution button is displayed in an invalidated state while the abnormal state of the position-guided processing unit continues, and the execution button is displayed in an enabled state upon receiving that the abnormal state of the position-guided processing unit is released.

5. The method according to any one of claims 2 to 4, wherein the one or more status information is obtained from sensors provided in the one or more processing units.

6. The method further comprises the step of receiving, at an operation terminal of the semiconductor manufacturing apparatus, a user input for instructing the execution of the predetermined operation step in the semiconductor manufacturing apparatus, wherein in the obtaining step, the one or more status information is obtained from the sensors of the processing unit corresponding to the instructed operation step. The method according to claim 5.

7. The display of the one or more status information is performed on the operation terminal. The user input for specifying status information corresponding to an abnormal state is received at the operation terminal. The method according to claim 6.

8. The method according to claim 7, wherein the operation terminal and the mobile terminal are communicably connected.

9. The method according to claim 8, further comprising the step of transmitting, from the mobile terminal to the operation terminal, an instruction that the execution button displayed on the mobile terminal has been operated.

10. The method according to claim 9, further comprising the step of controlling, in response to receiving that the instruction that the execution button has been operated has been received at the operation terminal, to perform the predetermined operation process.

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