Laminate, method for manufacturing laminate, and method for manufacturing flexible electronic device

A method using a silane coupling agent with an amino group and aqueous medium controls adhesive strength and minimizes blister defects in large-area laminates, enabling damage-free peeling of polymer films from inorganic substrates for flexible electronic devices.

JP2025120199APending Publication Date: 2025-08-15TOYOBO CO LTD
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Patent Information

Application Number
JP2025088532
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2020-08-11
Filing Date
2025-05-28
Publication Date
2025-08-15

AI Technical Summary

Technical Problem

Existing methods for bonding polymer films to inorganic substrates for flexible electronic devices face challenges in controlling adhesive strength uniformly over large areas, leading to issues like blister defects and difficulty in peeling the polymer film without damage, especially for substrates larger than 4.5th generation size.

Method used

A manufacturing method involving a silane coupling agent with an amino group and an aqueous medium to control adhesive strength between a heat-resistant polymer film and an inorganic substrate, ensuring a nitrogen element ratio of 3.5 to 11 atomic % on the peeled surface, with adhesive strength between 0.06 N/cm and 0.25 N/cm, and minimizing blister defects.

Benefits of technology

The method achieves uniform adhesive strength and reduces blister defects, allowing for large-area laminates and flexible electronic devices with controlled peeling without damage, suitable for substrates exceeding 4.5th generation size.

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Abstract

To provide a laminate that is useful as a temporary support for producing a large-area, high-definition, flexible electronic device, has a stably low adhesive strength between a heat-resistant polymer film and an inorganic substrate even in a case of a large surface area, and has few blister defects.SOLUTION: There is provided a laminate, comprising: an inorganic substrate; a silane coupling agent layer including an amino group; and a heat-resistant polymer film in the stated order, the laminate being characterized in that an elemental nitrogen component ratio in an inorganic-substrate-side peel surface after peeling the heat-resistant polymer film from the inorganic substrate at 90° is greater than 3.5 atomic% and 11 atomic% or less.SELECTED DRAWING: None
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